应用微波技术实现纳米精度微光学对准和实时粘合

本文讨论纳米精确度光学对准技术, 以用于采用热固化树脂的微光学包装.为了达到一个快速固化过程,直接将微波能量作用于需要进行光学粘合的地方.然而常规微波加热技术,依赖于树脂和元件之间的高质量比.为了改进微光学包装中微量粘合剂的热吸收率,我们先将接合面抛光, 再镀上金属薄层.这样一来, 微波能量将被镀层快速吸收.为防止接合面过热,采用一个红外(IR)温度传感器,以监测粘合剂的温度.根据温度的高低, 一个自动化的系统则可以调整微波的功率输出,以便达到相对恒定的固化温度.在快速固化过程中,预先调准好的微光系统,如光纤耦合器,将由于加热的不均匀性而不可避免地遭受干扰.为补偿这个副效应,开发了一个实时光学对准监控和反馈系统.以包装光纤耦合器为例,该系统可实时监测当粘合剂由微波固化时器件的插入损失(IL).我们采用的一种三维压电变换装置(PZT)可达到x-、y-和z-方向的的对准.该PZT的10nm调节精度可监测出0.004 dB 的IL敏感性.与常规的固化烤箱比较, 该系统的微光学包装效率可提高150倍.由于采用实时监控和反馈系统,批量生产中产品的合格率也将大大改善.     

光纤模斑谱传感器复合材料固化监测研究

提出利用一种新型光纤传感器，通过测量光纤末端近场模斑谱反映光纤埋置周围树脂折射率的变化．计算了随着树脂固化过程中折射率变化的功率谱密度分布，给出截止频率与折射率的近似关系．给出了利用这种传感器进行复合材料树脂固化监测的实验结果．发现这种光纤传感器的信号可以用来反映固化凝胶点和固化结束点．由于固化后光纤仍保持光波导特性，该光纤还可以用来监测结构受环境的扰动如温度变化、振动等．     

一种高抗振性能熔锥型光纤耦合器

随着光纤耦合器在军用光纤传感领域的广泛应用,普通熔锥型光纤耦合器抗振性能已不能完全满足军用设备的需求,现有的传统光纤耦合器制备工艺有待进一步改进和完善。为提高熔锥型光纤耦合器抗振性能,拓宽其应用领域和使用可靠性,文中给出了一种高抗振性能熔锥型光纤耦合器制备技术,该技术是通过在石英槽内填充低折射率介质,缩短或消除耦合锥区长度,达到提高光纤耦合器抗振性能的目的。对填充熔锥型光纤耦合器的光学性能、机械性能和温度性能进行测试,测试结果表明该器件基本保持了未填充光纤耦合器的光学性能和温度性能,同时较大地提高了光纤耦合器抗振性能。对50只器件进行机械冲击试验,冲击量级从500g/1 ms逐级调至2000 g/0.5 ms,无器件失效;对11只器件进行跌落试验,跌落高度由0.0 m调至3.0 m时,无器件失效。     

光纤陀螺捷联系统最优多位置对准

利用把线性时变系统作为分段定常系统来进行可观测性研究的方法，将初始对准的最优多位置法应用于光纤陀螺捷联系统，分析了多位置对准的可观测性，通过仿真说明将多位置法应用于光纤陀螺捷联系统是有效的。     

循环干涉型光纤陀螺及其光源

介绍了一种新型光纤陀螺及其关键器件。包括：（1）循环干涉型光纤陀螺的系统方案；（2）大功率超辐射发光二极管；（3）多功能光学发收模块，它们是国内光纤陀螺研制中急待解决的关键技术。采用模块化结构和微光电机系统（MOEMS）是国外光纤陀螺的发展方向。     

基于位置和速度观测的空间稳定系统快速对准

空间稳定系统是高精度长航时导航技术的关键,快速对准是其工程应用的重要功能之一。研究了基于位置和速度观测的系统快速对准方法。基于Wahba定姿原理设计平台姿态角的粗估计算法,研究了系统水平通道误差模型的短时可观测性,并据此设计一个可实时估计平台失准角初值、水平位置和速度误差的7维精对准Kalman滤波器。计算机仿真和动态试验结果表明,所述快速对准方法可估计较大的平台失准角(3°量级),同时适用于系泊和海上应急启动情况;在动态条件下精对准2 h,精度即满足指标要求,具有较强的工程应用价值。     

基于正逆向与降噪的捷联惯导改进快速对准方法（英文）

针对捷联惯性导航系统(INS)的快速对准问题,基于双向过程和惯性传感器的降噪方法,提出了一种改进的对准方法。利用双向过程(前向和逆向)反复处理保存的惯性测量单元(IMU)的数据序列实现快速对准,推导了一种新的前向与逆向对准关系。为了减少角随机游走误差的影响,基于小波变换的降噪方法抑制光纤陀螺(FOGs)和加速度计噪声,给出陀螺罗经回路的改进方法的整个流程,并在自研的光纤陀螺捷联惯导系统上进行测试。实测数据实验结果表明,经正逆向与降噪改进后的快速对准方法具有更快的收敛速度,能在不到3 min内完成对准任务,同时也具有更好的对准精度。     

基于准分布式FBG传感器的均质材料内部应变测试的试验研究

采用环氧树脂材料作为试验载体,使用没有任何保护性封装的、运用波分复用技术在同一光纤上刻入三个布拉格光栅的基础FBG传感器,来监测液体树脂流动及固化成型的全过程,并使用固化成型的环氧树脂板进行三点弯曲试验。将所得数据与有限元模拟数值解进行比较,来验证在去除封装、将传感器自身应变影响降到最低的情况下,FBG传感网络是否依然能够有效地反映出试验对象在各种情况下的内部应变。本文给出了FBG光纤光栅在逐级静力荷载加载下材料内部三点弯曲的应变图,并通过数值计算分析了未封装光纤在复合材料内部受力过程中的力学性能。     

船用光纤陀螺航姿系统动态对准

为提高船用航姿系统的对准精度和对准速度，提出了摇摆条件下的两位置对准方案。应用分段线性定常系统理论和可观测度的奇异值分解法，分析了动基座下航姿系统的可观测性和可观测度，并在摇摆台上进行了光纤陀螺航姿系统的两位置对准试验。理论分析结果表明，两位置对准可以提高系统状态变量的可观测度，尤其对加速度计误差和方位失准角的可观测度提高作用明显。摇摆试验的结果则表明，两位置对准可以使方位角对准精度提高3倍以上，同时加快了卡尔曼滤波器的收敛速度。摇摆条件下的两位置对准为船用航姿系统动态对准提供了新的途径。     

硅基光子集成芯片光纤陀螺

光纤陀螺用于敏感载体旋转角速率,是惯性导航系统的核心传感器之一。未来军用及民用领域对小体积、低成本的光纤陀螺需求巨大。利用光子集成芯片代替传统光纤分立器件,借助集成光学光刻工艺大规模批量生产的优势,降低生产成本,提高出货量,是光纤陀螺发展的重要方向。因此,在充分考虑目前国内微纳加工水平基础上,提出了一种工艺实现相对简单、可快速工程化的硅基光子集成芯片光纤陀螺设计方案。基于开环光纤陀螺架构,设计并加工了硅基光子芯片,实现了陀螺全部无源器件的片上集成,光子芯片尺寸约4 mm×3 mm;设计加工了四通道超细径保偏光纤阵列,实现波导与光纤多个耦合点的一次对准,大幅提高耦合封装效率;实现了光子集成芯片光纤陀螺样机25°C时零偏稳定性达到0.2°/h,性能优于相同结构的传统全光纤器件光纤陀螺。     

升温条件下偏高岭土基地质聚合物粘结剂的粘结性能研究

结构加固中应用的环氧树脂等有机粘结剂的耐高温性不足,升温条件下易丧失力学性能导致结构失效。本文以偏高岭土基地聚物作为无机粘结剂,通过不同温度下的钢-钢拉伸剪切试验和表层嵌贴CFRP-混凝土拔出试验,考察地聚物粘结剂在升温条件下的粘结性能变化规律。试验结果表明:在常温环境下,树脂粘结剂的粘结性能优于地质聚合物粘结剂的粘结性能;但在本文试验设置的升温条件下,树脂粘结剂试件的粘结承载力明显下降,而地质聚合物粘结剂试件的粘结承载力则基本不受温度变化的影响。对粘结界面的粘结滑移本构关系的分析表明,随着温度升高,树脂粘结剂的最大粘结应力逐渐降低,其对应的滑移量也有所增大;与之相比,地聚物粘结剂的最大粘结应力及滑移均未随温度升高发生显著变化,证明了地聚物粘结剂的粘结性能对本文试验温度不敏感。这表明地质聚合物具有较好的耐高温性能,有发展无机粘结剂的潜力。     

Non-destructive evaluation of the interface between silicon dies and copper leadframes in integrated circuit packaging

The silicon die and copper leadframe in integrated circuit (IC) packaging are bonded together by die attach adhesive, and the quality of the interface is a critical issue in the reliability of IC packaging. Common defects such as cracks and delaminations can be detected using the C-scan ultrasonic microscopy method with sufficient confidence. However, weak interfaces due to weak adhesion and poor cohesion have often gone undetected, to subsequently become potential defective areas. In this paper we present experimental work to evaluate the quality of the interfaces that typically exist in IC packages using longitudinal ultrasonic wave propagation with contact transducers. Three different conditioning processes, varying curing, moisture exposure and pre-curing moisture contamination, are used to degrade the interface bonding the silicon die and copper leadframe. Ultrasonic reflection coefficients from the interface are then measured. The results show that the reflection coefficient depends strongly on the interface quality, and can be used as a quantitative indicator to characterize the bond quality.     

On the simulation of panel distortions due to hot curing adhesives

Hot curing one-part adhesives are often used to bond car body shells. The cure process of the adhesive, however, can lead to distortions, i.e. unwanted, visible deformations of the adherends. In case of outer car panels, these distortions are considered as visual defects, even though the structural integrity might not be affected. In order to avoid distortions by a proper control of the bonding process, a thorough understanding of the development of distortions is necessary. Finite element simulations can help to gain insight into this development. In this work, a simulation model is proposed and used to study the appearance of distortions in a steel sheet over different temperature cycles. The model takes chemical shrinkage and thermal deformation as well as gelation and stress relaxation into account. It was found that the heating rate can affect distortions. Lowering the cure temperature only lowers distortions for high temperature rates. Low heating rates can reduce distortions.     

CFRP-混凝土界面粘结的疲劳性能试验研究

外贴FRP是重要的混凝土结构加固技术,但目前对外贴FRP加固混凝土结构的疲劳性能研究尚不充分,尤其对FRP-混凝土粘结界面的疲劳退化规律和破坏模式的研究更为缺乏。本文采用双面剪切试件,通过2个静载试件和4个疲劳试件的试验研究,考察了粘结长度和胶层厚度等因素对FRP-混凝土界面粘结疲劳性能的影响。通过分析沿粘结长度的FRP应变分布在疲劳循环过程中和疲劳后静载过程中的变化情况,讨论了不同粘结长度和粘结胶层厚度条件下的粘结界面疲劳退化规律和疲劳后静载性能。试验结果表明:胶层树脂-混凝土粘结界面是发生疲劳剥离破坏的薄弱环节;胶层厚度增大时,由于疲劳引起的界面损伤累积发展显著减小,疲劳后静载中胶层厚度较大试件的粘结承载力也更大;粘结长度增大时,界面粘结呈现更为明显的损伤退化,但由于试验粘结长度小于有效粘结长度,疲劳后的静粘结承载力仍更大。     

复合材料层合板单搭胶接力学性能检测技术与分析

胶接工艺缺陷对单搭胶接接头的拉伸剪切性能有着重要的影响。为了研究不同单搭接胶接层厚度对不同材质复合材料层合板胶接性能的影响规律,通过喷水穿透法超声C扫描对试样的剪切区域进行无损检测,并分别采用1mm、2mm、4mm的胶层厚度,以碳纤维/玻璃纤维复合材料层合板为被粘物,进行单搭胶接拉伸剪切性能试验。检测及试验结果表明:当胶层厚度h1mm时,对于相同材料的被粘物,胶层厚度越大,试件胶接接头剪切强度越小;相同的粘接剂厚度,以碳纤维增强复合材料板为被粘物的试件胶接接头剪切强度大于以玻纤增强复合材料板为被粘物的试件胶接接头强度;胶粘剂与碳纤维被粘物表面的润湿效果要优于胶粘剂与玻纤被粘物表面的润湿效果。     

锗-硼硅玻璃局部加热低温封接温度场研究

在光学读出非制冷红外热像仪焦平面阵列(FPA,Focal Plane Array)真空封装结构中,硼硅玻璃和双面镀增透膜的锗片分别作为透可见光和透红外光的窗口材料.由于锗窗上增透膜不能承受高温(<250℃),同时FPA也不能承受高温(<100℃),因此封装过程须在低温下进行,并对锗窗上的增透膜及FPA进行保护.本文提出了一种用于锗-硼硅玻璃低温扩散焊接的局部加热方法.该方法从导热系数较大的锗窗外表面加热(200℃),而导热系数较小的硼硅玻璃窗口外表面维持低温(60℃).有限元模拟计算结果表明,该加热过程稳态情况下待焊接区域温度约200℃,满足低温焊接的温度要求.锗窗上温度(200℃)低于250℃,且FPA区域的温升在75℃以下.用实验方法对模拟结果进行了验证,实验结果同模拟结果一致,证明该方法能够有效地保护FPA及锗窗上的增透膜.     

Experimental investigation of interface curing stresses between PMMA and composite using digital speckle correlation method

This paper studies the interface curing stresses between polymethyl methacrylate (PMMA) and composite by means of digital speckle correlation method (DSCM). A new method by combining DSCM with the marker points is developed to measure the interface curing stresses, and the measurement principle is introduced. The interface curing stresses between PMMA and composite with different curing bonding conditions are measured and analyzed, this indicates that the residual stress for furnace heating and furnace cooling is the smallest. Finally, the measurement error is discussed by means of finite element method, the influences of glass microsphere between adhesive and PMMA can be ignored.     

Nondestructive evaluation of model adhesive joints by PVDF piezoelectric film sensors

Metallized poly(vinylidene fluoride) (PVDF) films can be etched into nondestructive evaluation (NDE) sensor devices. Since these sensors are relatively inexpensive, thin and lightweight, they can be attached permanently to adhesively bonded joints, laminated composites, and other structures to measure structural integrity. The present study has addressed techniques to design, attach, and utilize such sensors for adhesive joint and laminated composite applications. PVDF sensors have been successfully used as NDE transducers in pulse-echo, through-transmission, and acousto-ultrasonic techniques to monitor curing, and to detect porosity and crack propagation in different model joint geometries. Feasibility of several applications has been demonstrated, although several problems remain. The potential of using these techniques for practical bonded structures is also suggested.     

微电子封装中导电胶连接可靠性研究

导电胶连接是近年来发展起来的新技术,其连接可靠性对于连接器件的长期稳定运行至关重要.本文基于导电胶互连失效模式的分析,介绍了各向异性导电胶膜的力学性能,综述了外力载荷、环境因素和组件性能对导电胶连接可靠性影响的研究进展,给出了导电胶粘接接触电阻、粘接强度和失效概率的理论分析,以及连接器件界面残余应力和疲劳寿命的研究.最后,针对导电胶连接可靠性研究中涉及的主要方面进行了展望.     

Balanced and unbalanced patching of cracked lap joints using weighted adhesive plate element

First order shear deformation theory is applied to analyze the behavior of one-side (unbalanced) and two-side (balanced) patched lap joints containing initial through cracks. The joints are made of adherends bonded together by adhesives. An adhesive interface plate element is introduced; it consists of an adhesive layer weighted by influence of the adherend. The thin adhesive layer is assumed to behave elastically and modelled as a simple tension-shear spring. The mathematical model contains layers of adherend and weighted adhesive layer.Finite elements are employed to model the adherend with an 8-node isoparametric plate element and interface layer with a 16-node plate element. Numerical results are obtained for one-side and two-side patches the width of which could be narrower or wider than the crack length. The former leads to bulging and possible peeling while the latter provides better bonding. Stresses and crack-tip stress intensity factors are calculated for different patch thickness. Effectiveness of the weighted adhesive layer model is exhibited by comparing the present results with those found in previous work where the adhesive is modelled as an individual layer.