球形压痕的残余变形分析

球形压痕技术在材料力学属性,诸如硬度,弹性模量等的测量中得到了广泛的应用.应用Twyman-Green及云纹干涉法并配合相移技术,本文对IN783合金进行了一系列的球形压痕实验研究,并对残余压痕的面内(u, v)及离面(w)变形场进行了定量测量和分析.应用面内变形测量结果,进一步对试件表面的应力-应变分布进行了分析和计算,并在离面变形场的基础上,确立了压痕周围的弹塑性边界,从而进一步应用面内的分析结果,得到材料的屈服强度.应用压痕实验的接触半径和压力并配合Tabor经验公式,本文进一步得到了材料的应力应变曲线.实验结果与已知的IN783合金相吻合.对所涉及的一系列压痕实验,本文也进行了二维有限元分析并得到了比较一致的结果.     

球形压痕的残余变形分析(英文)

球形压痕技术在材料力学属性,诸如硬度,弹性模量等的测量中得到了广泛的应用。应用Twyman-Green及云纹干涉法并配合相移技术,本文对IN783合金进行了一系列的球形压痕实验研究,并对残余压痕的面内(u, v)及离面( w)变形场进行了定量测量和分析。应用面内变形测量结果,进一步对试件表面的应力-应变分布进行了分析和计算,并在离面变形场的基础上,确立了压痕周围的弹塑性边界,从而进一步应用面内的分析结果,得到材料的屈服强度。应用压痕实验的接触半径和压力并配合Tabor经验公式,本文进一步得到了材料的应力应变曲线。实验结果与已知的IN783合金相吻合。对所涉及的一系列压痕实验,本文也进行了二维有限元分析并得到了比较一致的结果。     

二维数字图像相关测量中离面位移引起的误差分析

二维数字图像相关方法作为一种非接触全场变形测量的光学方法,在工程上有着广泛的应用.由于其假设物体只发生面内位移,而实验中往往存在离面位移,从而引起测量误差.本文针对这一问题利用了针孔模型,从理论上分析了离面位移对普通镜头测量结果的影响,通过铝块平移实验验证了理论分析的正确性.利用提出的理论模型修正橡胶材料的变形测量结果,并与远心镜头测量结果进行对比,发现修正后的普通镜头测量的结果更接近远心镜头测量的结果.最后,本文根据理论分析和实验验证,给出了减小或消除离面位移造成误差的方法.     

复合材料断裂力学参量的实验测定

本文采用三维云纹干涉仪同步测量含裂纹复合材料弯曲板的面内位移场及离面位移场，并对离面位移场云纹图进行计算机自动采集和处理，编制了云纹数字图像处理软件。文中推导了正交异性复合材料弯曲问题的离面位移场表达式，得到了弯曲板裂纹尖端位移w与应力场强度因子K1的关系式。通过实测位移，结合裂尖位移场推导出应力强度因子K1值。     

部分相干光云纹干涉法测三维位移场

本文提出了一种用部分相干光可同时获得面内位移和离面位移场的云纹干涉法。该法具有装置简单,无需防震,可用于观场测量等特点。文中论述了此法的基本原理,应用波前干涉理论和付里叶光学理论对变形前后波前的干涉、记录和再观进行了分析,导出了计算公式。实现了透射物体和反射物体表面的面内位移分量(U_0,V_(45),U_(90))和离面位移(w)的全场同时测量,典型实验证明,实验值与计算结果符合较好。     

纳米压痕法测磁控溅射铝薄膜屈服应力

为了在考虑残余应力下测量出磁控溅射铝薄膜的屈服应力,提出了一种实验测量方法,通过曲率测试法和球形压头纳米压痕法测出磁控溅射铝薄膜的屈服应力．建立球形压痕力学模型,并用ANSYS对球形压痕进行力学有限元仿真,利用直流磁控溅射技术在硅基上淀积一层1 μm厚的铝薄膜,首先通过曲率测试法测量膜内等双轴残余应力,再利用最小二乘曲线拟合法从薄膜/基底系统的球形压头纳米压痕实验数据中提取出铝薄膜的屈服应力,测得磁控溅射铝薄膜的屈服应力为371 MPa．该方法也可以用来研究其他材料的薄膜和小体积材料的力学特性．     

残余应力测定的围箍压痕法模拟

本文从同工量测方法得到启发，提出了一种新型的残余应力测试方法－围箍压痕法。采用轴对称弹塑性有限元计算模拟了围箍压痕法测量结构残余应力的力学过程，得到了围箍压痕时不同残余应力程度下材料的变形，塑性区和接触应力分布。     

双参考光全息—散斑干涉术的原理和实验

本文用统计光学方法对双参考光全息——散斑干涉术进行了详尽的理论分析,给出了全息和散斑干涉场区域平均光强分布与光学系统主要参数及三维变形场各分量之间关系的解析表达式,进而讨论了离面位移和面内位移测量的上、下限,最后还给出了有关的实验结果。     

单个弹丸撞击316L不锈钢引起的变形场

运用金属材料表面纳米化试验机对单个弹丸撞击316L不锈钢表面进行了撞击实验;采用激光共聚焦显微镜观察了弹坑的三维形貌,测量不同振动频率下弹坑的直径及离面位移;采用云纹干涉法对弹坑周围的面内应变场进行测量,并分析振动频率及撞击方式对弹坑尺寸、塑性应变大小以及塑性应变区范围的影响;采用有限元方法对单个弹丸垂直撞击试件表面的应变场进行数值模拟,与实验结果进行比较,分析了弹坑周围残余应力的分布。结果表明:随振动频率的增加,弹坑直径和离面位移都增加,频率在50~55Hz,弹坑直径有突变,离面位移和振动频率呈线性关系;振动频率越大,塑性应变越大,塑性应变分布范围均大于弹坑直径的2倍;同一振动频率下弹丸垂直撞击比倾斜撞击的塑性应变大,而塑性应变分布范围相差不大;面内残余应变场的数值模拟结果和实验结果吻合较好,最大误差小于10%。     

结合数码显微镜的数字散斑相关方法精度分析及应用

结合数字散斑相关方法和一种新型的显微镜数码显微镜,提出了一种测量多晶材料晶粒尺度面内变形的新方法,并通过零变形校准实验、重聚焦实验和平移实验等一系列验证实验分析了该方法的精度和实用性.作为应用实例,对一种镍基合金试件进行了单向拉伸和疲劳实验,得到了晶粒尺度下具有较大应变梯度的应变分布图像.结果表明,该方法能够得到精确的位移测量数据,是一种理想的测量晶粒尺度变形的光测方法.     

A Transparent Indenter Measurement Method for Mechanical Property Evaluation

An optical Transparent Indenter Measurement (TIM) method was developed for measurement of material surface mechanical properties. During the spherical indentation test, in-situ measurements of indentation-induced surface out-of-plane displacements were obtained using an integrated phase-shifting Twyman-Green interferometer. Based on elastic recovery theory and 2D finite element analyses, a procedure was developed to determine the material Young's modulus using the measured surface out-of-plane displacements. During the spherical indentation test, contact radii were also measured and used to estimate the material post-yielding true stress-strain curve using Tabor's empirical relation. An experimental TIM apparatus was assembled to test on two engineering alloys and the results showed good agreement with known material properties.     

Blind-hole residual stress determination using optical interferometry

The in-plane method and the out-of-plane method are used to analyze blind-hole residual stress as measured by optical interferometry. The in-plane method, which constructs a relation between the in-plane displacement field and the residual stress released from blind-hole drilling, is applicable when the sensitivity vector of the interferometer used in the measuring system is parallel to the object surface. Three in-plane displacements obtained from one interference pattern are sufficient to determine the residual stress. The out-of-plane method, which establishes a new relation between the out-of-plane displacement field and the released residual stress, is suggested when the sensitivity vector is perpendicular to the object surface. Two relative out-of-plane displacements extracted from one interference pattern are sufficient to determine the residual stress. With the adoption of these two methods, interpolating calculation is not needed to determine the fringe order of each data point, since the selections of the required data points are flexible using these two methods. Two experiments, one for the in-plane method and the other for the out-of-plane method, were carried out to illustrate the applicability and usefulness of these two methods.     

An Out-of-Plane Motion Compensation Strategy for Improving Material Parameter Estimation Accuracy with 2D Field Measurements

In-plane surface displacements, when measured with 2D Digital Image Correlation (2D-DIC), are very sensitive to out-of-plane displacement components. Any out-of-plane motion of the surface can pollute the measured field by introducing artificial displacements. These displacements are difficult to separate from the underlying response of the surface and thereby limit the application of 2D-DIC in inverse problems where the test specimen has significant motion in the out-of-plane direction. In the context of inverse problems, we propose to partially relax this condition of no out-of-plane motion in 2D-DIC. With this approach, only the out-of-plane rigid-body motion of the specimen surface, which is initially in-plane, needs to be avoided while the requirement of surface deformations to be primarily in-plane is essentially waived. Compensation, based on the pinhole camera model, for out-of-plane displacements of the surface in response to applied load is included within the error function of the minimization problem. The improvements in material parameter estimation, obtained by using the proposed compensation strategy, are demonstrated by an example. The proposed technique makes it possible to utilize 2D-DIC with a simple conventional lens for an increased number of inverse problems; and in the process avoiding the computational and experimental difficulties associated with 3D measurement methods as well as the high cost and magnification limitations of a telecentric lens.     

Quantification of Three-Dimensional Surface Deformation using Global Digital Image Correlation

A novel method is presented to experimentally quantify evolving surface profiles. The evolution of a surface profile is quantified in terms of in-plane and out-of-plane surface displacements, using a Finite Element based Global Digital Image Correlation procedure. The presented method is applied to a case study, i.e. deformation-induced surface roughening during metal sheet stretching. The surface roughness was captured in-situ using a confocal optical profiler. The Global Digital Image Correlation method with linear triangular finite elements is applied to track the three-dimensional material movement from the measured height profiles. The extracted displacement fields reveal the full-field kinematics accompanying the roughening mechanism. Local deviations from the (average) global displacements are the result of the formation, growth, and stretching of hills and valleys on the surface. The presented method enables a full-field quantitative study of the surface height evolution, i.e. in terms of tracked surface displacements rather than average height values such as Root-Mean-Square or height-height correlation techniques. However, the technique does require that an initial surface profile, i.e. contrast, is present and that the contrast change between two measurements is minimal.     

3D Strain Field Evolution and Failure Mechanisms in Anisotropic Paperboard

Background

Experimental analyses of the 3D strain field evolution during loading allows for better understanding of deformation and failure mechanisms at the meso- and microscale in different materials. In order to understand the auxetic behaviour and delamination process in paperboard materials during tensile deformation, it is essential to study the out-of-plane component of the strain tensor that is, in contrast to previous 2D studies, only achievable in 3D.

Objective

The main objective of this study is to obtain a better understanding of the influence of different out-of-plane structures and in-plane material directions on the deformation and failure mechanisms at the meso- and microscale in paperboard samples.

Methods

X-ray tomography imaging during in-situ uniaxial tensile testing and Digital Volume Correlation analysis was performed to investigate the 3D strain field evolution and microscale mechanical behaviour in two different types of commercial paperboards and in two material directions. The evolution of sample properties such as the spatial variation in sample thickness, solid fraction and fibre orientation distribution were also obtained from the images. A comprehensive analysis of the full strain tensor in paperboards is lacking in previous research, and the influence of material directions and out-of-plane structures on 3D strain field patterns as well as the spatial and temporal quantification of the auxetic behaviour in paperboard are novel contributions.

Results

The results show that volumetric and deviatoric strain, dominated by the out-of-plane normal strain component of the strain tensor, localize in the out-of-plane centre already in the initial linear stress-strain regime. In-plane strain field patterns differ between samples loaded in the Machine Direction (MD) and Cross Direction (CD); in MD, strain localizes in a more well-defined zone close to the notches and the failure occurs abruptly at peak load, resulting in angular fracture paths extending through the stiffer surface planes of the samples. In CD, strain localizes in more horizontal and continuous bands between the notches and at peak load, fractures are not clearly visible at the surfaces of CD-tested samples that appear to fail internally through more well-distributed delamination.

Conclusions

In-plane strain localization preceded a local increase of sample thickness, i.e. the initiation of the delamination process, and at peak load, a dramatic increase in average sample thickening occurred. Different in-plane material directions affected the angles and continuity of the in-plane strain patterns as well as the sample and fracture properties at failure, while the out-of-plane structure affected how the strain fields distributed within the samples.

     

Diffraction Assisted Image Correlation: A Novel Method for Measuring Three-Dimensional Deformation using Two-Dimensional Digital Image Correlation

Digital Image Correlation (DIC) provides a full-field non-contact optical method for accurate deformation measurement of materials, devices and structures. The measurement of three-dimensional (3D) deformation using DIC in general requires imaging with two cameras and a 3D-DIC code. In the present work, a new experimental technique, namely, Diffraction Assisted Image Correlation (DAIC) for 3D displacement measurement using a single camera and 2D-DIC algorithm is presented. A transmission diffraction grating is placed between the specimen and the camera, resulting in multiple images which are then used to obtain apparent in-plane displacements using 2D-DIC. The true in-plane and out-of-plane displacements of the specimen are obtained from the apparent in-plane displacements and the diffraction angle of the grating. The validity and accuracy of the DAIC method are demonstrated through 3D displacement measurement of a small thin membrane. This technique provides new avenues for performing 3D deformation measurements at small length scales and/or dynamic loading conditions.     

Surface effects in the deformation of an anisotropic elastic material with nano-sized elliptical hole

We examine the effect of surface energy on an anisotropic elastic material weakened by an elliptical hole. A closed-form, full-field solution is derived using the standard Stroh formalism. In particular, explicit expressions for the hoop stress, normal, in-plane tangential and out-of-plane displacement components along the edge of the hole are obtained. These expressions clearly demonstrate the effect of elastic anisotropy of the bulk material on the corresponding field variables. When the material becomes isotropic, the hoop stress agrees with the well-known result in the literature while both the in-plane tangential and out-of-plane displacements vanish and the normal displacement is constant along the entire boundary of the elliptical hole.     

聚氨酯(PU)在力学性能测试中的摩擦效应与变形均匀性研究

作为防弹玻璃夹层材料,PU的动态力学性能一直受到学者们的关注。为准确表征其动态力学性能,本文采用ABAQUS有限元软件对不同摩擦系数下的单轴压缩试验进行数值仿真,分析试样加载端面的摩擦效应和几何尺寸对单轴压缩试验结果的影响;结合高速摄影技术(HSP)与数字图像相关技术(DIC)观测到试样在拉伸试验中的动态变形场和应变场,探讨标距段的应力均衡性;同时对PU材料在不同应变率下的单轴压缩、拉伸力学性能进行测试。结果表明:压缩试样的端面摩擦效应限制横向变形,影响了试样内部的受力分布,使得测量得到的应力值偏大;试样长径比越小,端面摩擦效应的影响越大;在单轴动态拉伸试验中,板状拉伸试样的标距段选取应当考虑两端倒角尺寸。通过测试PU的拉、压力学性能,发现材料具有显著的应变率敏感性。     

非稳态纯滚动接触弹塑性分析

建立了二维弹塑性非稳态循环纯滚动接触有限元模型.材料本构采用一种较好的循环塑性模型,并通过材料用户子程序在通用有限元软件ABAQUS中自定义该本构模型.通过在弹塑性无限半空间表面上重复移动随时间按简谐规律变化的赫兹法向载荷来模拟非稳态循环纯滚动接触过程.通过数值模拟,得到接触表面附近的残余累积变形、应变和残余应力.不同的最大赫兹接触压力对残余应力和残余应变影响较大.在简谐变化的法向接触载荷作用下接触表面的变形呈波浪形,随着滚动次数的增加,该波状表面沿载荷移动相反方向逐渐移动,但移动速率要衰减.波状表面波谷处的残余应力、应变和变形大于波峰处.随滚动次数的增加,残余应力增大但很快趋于稳定,残余应变也增大但增大速率衰减.     

石墨烯及其复合材料纳米力学研究进展

石墨烯是一种由碳原子构成的二维晶体,是目前已知最薄但却有着极高强度的纳米材料。由于在强度、导热性、电子输运和光学上显示出不同寻常的特性,石墨烯迅速成为材料科学、物理、化学和力学等学科的研究热点。与此同时,石墨烯复合材料的研究也迅速兴起。本文综述了近年来石墨烯及其复合材料的力学特性的研究进展。根据力学行为的差异,我们主要阐述了石墨烯面内力学特性、离面力学特性、原子尺度修饰和石墨烯复合材料力学特性的研究进展：石墨烯的面内拉伸力学特性通过纳米压痕等技术得到了测量,其断裂行为在微纳尺度下不能完全使用连续介质力学模型进行解释,在多层石墨烯情况下会出现超润滑现象;石墨烯的可控离面位移对于改变其物理特性有重要的意义,石墨烯上的屈曲受到手性和尺度的影响,在高频器件中存在着非连续性的离面响应;适当的原子尺度修饰可以改善石墨烯的拉伸和扭转力学特性;石墨烯可以改善复合材料的力学特性,如提高强度、韧性等,其主要强化效应是通过与基体材料的离面、面内力学行为结合产生的。最后,本文对石墨烯及其复合材料的力学研究进行了总结和展望。