Synthesis of novel tri‐benzoxazine and effect of phenolic nucleophiles on its ring‐opening polymerization

A trifunctional benzoxazine, 1,3,5‐tris(3‐phenyl‐3,4‐dihydro‐2H‐benzo[1,3]oxazin‐6‐yl)benzene (T‐Bz) was synthesized and in an effort to reduce its curing temperature (curing maxima at 238 °C), it was mixed with various phenolic nucleophiles such as phenol (PH), p‐methoxy phenol (MPH), 2‐methyl resorcinol (MR), hydroquinone (HQ), pyrogallol (PG), 2‐naphthol (NPH), 2,7‐dihydroxy naphthalene (DHN), and 1,1'‐bi‐2‐naphthol (BINOL). The influence of these phenolic nucleophiles on ring‐opening polymerization temperature of T‐Bz was examined by DSC and FTIR analysis. T‐Bz undergoes a complete ring‐opening addition reaction in the presence of bi‐ and trifunctional phenolic nucleophiles (MR/HQ/PG/DHN) at 140 °C (heated for 3 h) and forms a networked polybenzoxazine (NPBz). The NPBzs showed a high thermal stability with T_d20 of 350–465 °C and char yield of 67–78% at 500 °C; however, a diminutive weight loss (6.9–9.8%) was observed at 150–250 °C (T_d5: 215–235 °C) due to degradation of phenolic end groups. This article also gives an insight on how the traces of phenolic impurities can alter the thermal properties of pure benzoxazine monomer as well as its corresponding polymer. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016 , 54, 2811–2819     

Study of molecular deformation mechanisms in the glassy state. I. Temperature effect on stress-birefringence and strain-birefringence responses of poly(methyl methacrylate)

In order to gain better understanding of the molecular deformation processes occurring in poly-(methyl methacrylate), a series of studies was carried out in uniaxial tension on the simultaneous stress and birefringence response in both constant-strain-rate and stress relaxation experiments. The former covered the temperature range ?120 to 75°C and the latter 0 to 90°C. Three deformation mechanisms, i.e., (i) change in intermolecular distance, (ii) distortion of the conformation of the COOCH₃ group from its thermal equilibrium state, and (iii) orientation of main-chain segments, are invoked to interpret the experimental results. It is concluded that, in the temperature range from ?120 to 75°C and possibly at higher temperatures as well, the polymer chains deform in the small-strain region by an orientation of those chain segments having lower potential-energy barriers to conformational changes and straining those chain segments having higher potential-energy barriers. Subsequent chain orientation of the already strained segments occur in the higher strain regions. Changes in intermolecular distances occur over the entire temperature range from ?120 to 90°C, but their magnitude decreases gradually as the temperature increases from ?40 to 40°C and then decreases sharply for temperatures above 40°C. Strain-induced distortion of the conformation of the COOCH₃ group may involve only rotation of the OCH₃ group around the C? O bond rather than rotation of the entire ester group itself.     

Influence of chemical structure on nonelastic mechanical properties in polystyryl-pyridine resins

We propose a micromechanical characterization of the chemical structure (i.e., the state of cure) of polystyryl-pyridine (PSP) resin. The nonelastic work-hardening rate K is measured in the preyield stage during compression tests at constant strain rate. The nonelastic deformation is analyzed from a metallurgical point of view; the parameter K varies as the inverse of the nucleation rate for dislocations and thus is a measure of the ability of the material to deform plastically. The comparison with high-resolution solid-state carbon-13 NMR experiments shows that, at room temperature, the ability of PSP resin to deform plastically depends mainly on the degree of crosslinking, whatever the length of prepolymer molecule; however, at high temperatures (T = 200°C) it is affected by the length of prepolymer molecule during curing, whatever the degree of crosslinking. Plastic deformation of PSP resin is easier at 200°C than at room temperature. The longer the duration of curing, the better the mechanical properties at high temperatures; PSP resin readily deforms plastically and has a sufficiently high elastic modulus.     

Improving the scratch resistance of sol–gel metal oxide coatings cured at 250 °C through use of thermogenerated amines

Scratch resistant sol–gel metal oxide coatings typically require a thermal post-treatment step (curing process) at temperatures between 400 and 700 °C. In this report, we demonstrate that the in situ generation of amines within sol–gel films facilitates the preparation of scratch resistant metal oxide coatings at a curing temperature of 250 °C. A selected series of carbamates was added to sol–gel formulations and included in the resulting xerogel films. During the curing process, the carbamates decomposed to liberate primary amines. These catalysed the curing process, finally leading to scratch resistant metal oxide coatings at low cure temperature.     

Phenolic resins bearing maleimide groups: Synthesis and characterization

Novel phenolic novolac resins, bearing maleimide groups and capable of undergoing curing principally through the addition polymerization of these groups, were synthesized by the polymerization of a mixture of phenol and N‐(4‐hydroxy phenyl)maleimide (HPM) with formaldehyde in the presence of an acid catalyst. The polymerization conditions were optimized to get gel‐free resins. The resins were characterized by chemical, spectral, and thermal analyses. Differential scanning calorimetry and dynamic mechanical analysis revealed an unexpected two‐stage curing for these systems. Although the cure at around 275°C was attributable to the addition polymerization reaction of the maleimide groups, the exotherm at around 150 to 170°C was ascribed to the condensation reaction of the methylol groups formed in minor quantities on the phenyl ring of HPM. Polymerization studies of non‐hydroxy‐functional N‐phenyl maleimides revealed that the phenyl groups of these molecules were activated toward an electrophilic substitution reaction by the protonated methylol intermediates formed by the acid‐catalyzed reaction of phenol and formaldehyde. On a comparative scale, HPM was less reactive than phenol toward formaldehyde. The presence of the phenolic group on N‐phenyl maleimide was not needed for its copolymerization with phenol and formaldehyde. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 641–652, 2000     

Dynamic mechanical properties of poly-α-olefins containing ring structures in side chains

Dynamic loss modulus curves have been determined over a temperature range beginning at liquid nitrogen temperature for poly-α-olefin polymers containing various ring structures, i.e., phenyl, cyclohexyl, cyclopentyl, and naphthyl, in the side chain. Glass transition and appropriate secondary relaxation temperatures were observed for each polymer. Separation of each pendant ring structure from the main backbone chain by successive additions of methylene units results in lower glass-transition temperatures. Comparison of polymers with similar side chains and different ring structures shows that the respective glass-transition temperatures decrease in the order naphthyl > cyclohexyl > phenyl > cyclopentyl. Secondary relaxation peaks were obtained at about ?150°C for polymers containing the cyclohexyl and cyclopentyl rings. A similar peak was observed for the polymer possessing a phenyl ring separated from the main chain backbone by two methylene units. The comparable polymer containing the naphthyl ring structure exhibited a broad secondary relaxation peak centered at ?20°C. The polymers possessing cyclohexyl rings separated from the main chain backbone by one or two methylene units had an additional low temperature peak at ?80°C. The molecular mechanism associated with this relaxation may be related to intramolecular transformations of the cyclohexyl ring between its “chair–chair” conformations.     

Synthesis and thermal stability of the resins prepared from the reactions of 1,4-bis(2,2-dicyanovinyl)benzene with aromatic diamines and electrical conductivity of the resulting materials following pyrolysis

New thermosetting resins were prepared from the reaction of 1,4-bis(2,2-dicyanovinyl)benzene with aromatic diamines in varying molar ratios. The thermal stability of these resins was correlated with their composition and the curing conditions. They were stable in N₂ up to 370–448°C and afforded anaerobic char yields of 73–84% at 800°C after curing at 300°C for 20–60 h. The temperature dependence of the electrical resistivity of all resins pyrolyzed at 700°C for 15 h was studied in the temperature range from ?173–327°C (100–600 K). The results showed that at room temperature the unpyrolyzed polymers have insulating properties, whereas a dramatic decrease in the electrical resistivity is observed following pyrolysis. The temperature dependence of the electrical resistivity suggests that all of the materials studied have semiconducting properties. The observed electrical conductivity is thermally activated with activation energies ranging from 0.03–0.06 eV. © 1994 John Wiley & Sons, Inc.     

The microwave radiation effect on the polymerization of styrene

Styrene was cured by microwave radiation at two different powers: 300 and 500 W. The temperature profile of the sample during the microwave curing process was determined to select a suitable temperature for comparison with the conventional method of cure. The results indicate a similar comparable temperature of about 80°C irrespective of the microwave power used. The percentage conversion of the cure was followed by Fourier transform infrared (FTIR) spectroscopy. The thermal polymerization at 79(±1)°C displayed a gradual increase in the rate of reaction at the gel effect from about 30 to 50% conversion of the reaction. The microwave cure at 300 and 500 W displayed a large and sharp gel effect from about 20 to 69 and 64% conversion of the reaction, respectively. The limiting conversion decreased with increase in microwave power which was also observed in the polymerization of methyl methacrylate (MMA). Based on similarity in temperature and reaction conditions, the 500 W cure was found to show a reaction rate enhancement of 190% and the 300 W cure 120%. A comparison of microwave induced reactions with thermal methods, therefore, must also specify the microwave power used. © 1996 John Wiley & Sons, Inc.     

Polycarbonate-modified epoxies. I. Studies on the reactions of epoxy resin/polycarbonate blends prior to cure

An epoxy resin based upon the diglycidyl ether of bisphenol-A was modified with poly(bisphenol A carbonate) (PC). Prior to aromatic amine cure, the possible reactions in the epoxy resin/PC blend were investigated using GPC and FTIR techniques. It was shown that at 150°C, the epoxy resin acted as a plasticizer and promoted the crystallization of PC. In addition, a transesterification between the secondary hydroxyl groups in the epoxy resin with the carbonate groups in PC occurred. This reaction resulted in degraded PC chains with phenolic hydroxyl end groups. There was no evidence of reaction of epoxide groups at 150°C in this blend. At 200°C, the secondary hydroxyl groups acted as a catalyst converting most of the aromatic–aromatic carbonates to the aromaticndash;liphatic and aliphaticndash;aliphatic carbonates through transesterification. At this elevated temperature, the secondary hydroxyl groups were regenerated by the addition reaction between the epoxide groups and the phenolic hydroxyl end groups, either from the transesterification or the hydrolysis of PC. This addition reaction combining the PC chains and epoxy chains eventually resulted in a crosslinked polymer if the extent of reaction was high. Thus, by using a melt blending process at high temperature, e.g., 200°C, a copolymer network structure of PC-modified epoxy could be formed. The fracture toughness should be increased by increasing the capability for plastic deformation due to the incorporation of PC chains into the network; results will be reported in a future study. © 1996 John Wiley & Sons, Inc.     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Reversible catenation of coordination rings with Pd(II) and/or Pt(II) metal centers: Chirality induction through catenation

A Pd(II)-linked coordination ring is reversibly transformed into its catenanted dimer at room temperature through the efficient organic stacking of the component rings. An analogous Pt(II)-linked ring is also catenated only at high temperature (100 °C), but not at room temperature because of the kinetic inertness of Pt(II)-ligand interaction. Interestingly, the combination of the Pd(II)- and the Pt(II)-linked coordination rings selectively gives a Pd(II)/Pt(II) cross-catenane, because the kinetically inert Pt(II) ring can be catenated only via the dissociation of the kinetically labile Pd(II) ring. Planer conformation of the monomer rings is twisted upon catenation, inducing helical chirality in the catenated structure. Thus, induced circular dichroism (ICD) is observed in the catenation when chiral-1,2-cyclohexandiamine is attached as a chiral auxiliary on the metal centers. The ICD decreases with increasing temperature due to less effective chiral aromatic stacking at higher temperature. The Pd(II) ring shows higher ICD than the Pt(II) ring, probably due to the more flexible conformation of the Pd(II) ring that can adopt chiral orientation easily. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 3478–3485, 2003     

Crystal Structure of Calix［4］（dioxo） crown－6 Acetonitrile（1：3） Inclusion Complex

ＣｒｙｓｔａｌＳｔｒｕｃｔｕｒｅｏｆＣａｌｉｘ［４］（ｄｉｏｘｏ）ｃｒｏｗｎ－６Ａｃｅｔｏｎｉｔｒｉｌｅ（１：３）ＩｎｃｌｕｓｉｏｎＣｏｍｐｌｅｘＺＨＯＮＧＺｈｅｎ－Ｌｉｎ；ＣＨＥＮＹｕａｎ－Ｙｉｎ；ＬＵＸｕｅ－Ｒａｎ（ＤｅｐａｒｔｍｅｎｔｏｆＣｈｅ...     

NEW MATERIALS DERIVED FROM POLY(4-HYDROXYSTYRENE) AS LITHIUM BATTERY CELL COMPONENTS

A new class of polyethers has been prepared by the Mitsunobu coupling of poly(4-vinyl phenol), P4VP, with low molecular weight poly(ethylene glycol)methyl ether. These comb-like polymers, having ca. 20–30% residual phenols, were characterized by IR, DSC, and TGA. Results of thermal analysis on the polymers suggest thermal stability to at least 300°C and a glass transition temperature in the range ?30 to ?40°C. Complexes with LiPF₆ gave conductivities of ca. 1 × 10^?5 S/cm at room temperature. The polymers were blended with plasticized poly(vinylidene fluoride) (PVDF) to prepare porous films and subsequently infiltrated with lithium salts and ethylene and ethyl methyl carbonate. Ionic conductivities of these hybrid films were measured from ?20°C to 40°C. Conductivities as high as 2.4 × 10^?3 S/cm are observed at room temperature. The electrochemical stability of hybrid materials was studied by cyclic voltammetry.     

Solid state photopolymerization of acrylic acid at low temperature

Near‐infrared spectroscopy was used to investigate the kinetic characteristics of acrylic acid photopolymerized at ?70°C and room temperature, respectively. The obtained results showed that at ?70°C the double bond conversion increased with increase in the initiator's concentration. Addition of soft chain component polyethylene glycol 400 (PEG400) could lead to high conversion in the solid state, and then high final double bond conversion after post‐curing. The introduction of water at low temperature also contributed largely to the enhancement in the initial and final double bond conversion in solid state. SEM photographs showed that more pores came up in the cured films with the increase in the water content in the reaction system. The change in the photoinitiator concentration, amount of PEG400, and content of water had significant effect on samples cured at lower temperature than at room temperature under the same conditions. Different kinds of photoinitiators showed different contributions to the initial and final double bond conversion on photopolymerization of acrylic acid at low temperature. Significant post‐curing phenomena for photopolymerization of acrylic acid at low temperature could be observed as well. Copyright © 2009 John Wiley & Sons, Ltd.     

Conformational analysis of some 11, 12-dihydrodibenz[B,F][1, 5]oxazocin-6-one derivatives by NMR spectroscopy

A variable temperature 200 MHz ¹H NMR investigation of some N-acylsubstituted 11, 12-dihydrodibenz[b, f][1, 5]oxazocin-6-ones showed the presence at room temperature of at least two conformationally restricted diastereomers (and their enantiomers) which molecular mechanics calculations strongly suggested to be a boat-like structure (major conformer) and a pseudo-chair and/or twistboat-like structure (minor conformer). The diastereomersinterconvert through a bond rotation mechanism just above room temperature (51-54°C, depending upon the nature of the N-acyl substituent), and the boat enantiomers interconvert at higher temperatures (75-95°C, depending upon the nature of the N-acyl substituent and the substitution pattern of the aromatic rings) via a ring inversion process. The N-acyl groups exocyclic to the eight-membered ring are shown to wholly exist - probably as a result of severe dipole: dipole interactions - in the sterically disfavoured conformation where the alkyl substituent bonded to the exocyclic carbonyl carbon atom is trans to the benzylic methylene group. Corresponding N-unsubstituted derivatives exhibit rapid ring inversion on the NMR time scale at room temperature.     

Zur Sauerstoffoxidation von Kreosolderivaten in alkalisch-wäßriger Lösung

Creosol (1), bicreosol (4) and other monomeric and dimeric creosols are oxidized in 0.25M-NaOH (5 equivalents base per phenolic hydroxyl group) by molecular oxygen at 70°C. Creosol is fragmented under these conditions to low molecular weight products without previous dimerization. The importance of fragmentation processes without cleavage of the C?C-bond between the oxygen substituted ring atoms in the case of bicreosol, and its considerable stability against oxidation compared with other compounds investigated can be explained by the ability of the monoanion of4 to exist in a conformation allowing hydrogen bonding between the phenolic oxygens of the two rings.     

Sustainable,fire‐resistant phthalonitrile‐based glass fiber composites

The sustainable resveratrol‐based phthalonitrile was used in the preparation of E‐glass fiber‐reinforced phthalonitrile composite panels fabricated by hot pressed prepreg consolidation with bis[4‐(3‐aminophenoxy)phenyl]sulfone (m‐BAPS) as the curing additive. This amorphous monomer exhibited excellent viscosities at temperatures below 200 °C, which is applicable to standard processing conditions. Rheometric measurements were used to evaluate the cure of the composite as a function of the postcure conditions. The composite retains >95% of its room temperature storage modulus up to 450 °C based on these postcuring parameters. More importantly, flammability performance of the composite—which was determined in terms of ignitability, heat release, and mass loss rate—excels over other state‐of‐the‐art polymer/glass composites. Even under the most extreme heat fluxes (e.g., 100 kW⋅m⁻²), the composite performs exceptionally well suggesting that resveratrol‐based phthalonitrile composites can be used in fire‐resistant applications. Published 2018.^† J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 1128–1132     

Effect of temperature and volume on the tensile and adhesive properties of photocurable resins

Knowing the mechanical properties of UV‐curable resins at cryogenic conditions is important to ongoing fusion‐energy research and to emerging aerospace applications. The tensile and interfacial shear strengths of two commercially available UV‐curable resins were measured at room‐temperature and cryogenic conditions for both bulk and reduced (subnanoliter) specimen volumes. The tensile properties of cured specimens are remarkably sensitive to both testing temperature and specimen size. For one type of resin, the cold (?150 °C) tensile strength of subnanoliter specimens is ～9× larger (179 ± 19 MPa) than bulk values at room temperature. The interfacial shear strength between SiC fibers and small volumes of resin volumes is comparable to the bulk, room‐temperature tensile strength, but it varies over a wide range at ?150 °C (15–53 MPa). All resins were fully cured, and an analysis of fractured surfaces revealed microstructural features. The enhanced strength in microscopic specimens may be related to inhomogeneous stress fields that develop during cure. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014 , 52, 936–945     

New force-field parameters for use in molecular simulations of s-triazine and cyanurate-containing systems. 1 — derivation and molecular structure synopsis

Cyanate ester resins are an emerging family of high performance polymers that are being studied for a variety of technological applications. The structure of the aromatic sym-triazine ring formed during cure of these polymers is investigated here by analysis of X-ray crystallographic data from a number of model compounds. The data show a preferred conformation of the ring structure with alternating internal bond angles of ca. 112° at nitrogen (C–N–C) and 128° at carbon (N–C–N). The C–N bond lengths are also shorter than those found in pyridine or pyrimidine, leading to a non-planar ring conformation. Force constants for the bond stretch, bend and torsional motions of the sym-triazine ring have also been calculated, using mopac, the semi-empirical quantum mechanics package.     

Study on curing of novolac epoxy resin

The optimization of proportions of novolac epoxy resin, Dobeckot E4 and polyamide hardener, EH411 has been established by DSC and the data indicates that resin-polyamide, 100∶40 and 100∶50, appear to be optimum where ‘extent of cure’ is maximum. The kinetic parameters for these formulations have been evaluated using isothermal and dynamic modes by employing DSC. The rate constants have been evaluated for curing process of these formulations using isothermal DSC mode in the temperature range of 70°–90°C. These have also been predicted at 20°±1°C (room temperature) by extrapolating the data obtained at elevated temperatures. A comparison of the predicted values with the experimental values shows that there is a good agreement between them.