Synthesis and thermal characterization of phosphorus containing siliconized epoxy resins

Siliconized epoxy matrix resin was developed by reacting diglycidyl ethers of bisphenol A (DGEBA) type epoxy resin with hydroxyl terminated polydimethylsiloxane (silicone) modifier, using γ-aminopropyltriethoxysilane crosslinker and dibutyltindilaurate catalyst. The siliconized epoxy resin was cured with 4, 4-diaminodiphenylmethane (DDM), 1,6-hexanediamine (HDA), and bis (4-aminophenyl) phenylphosphate (BAPP). The BAPP cured epoxy and siliconized epoxy resins exhibit better flame-retardant behaviour than DDM and HDA cured resins. The thermal stability and flame-retardant property of the cured epoxy resins were studied by thermal gravimetric analysis (TGA) and limiting oxygen index (LOI). The glass transition temperatures (T_g) were measured by differential scanning calorimetry (DSC) and the surface morphology was studied by scanning electron microscopy (SEM). The heat deflection temperature (HDT) and moisture absorption studies were carried out as per standard testing procedure. The thermal stability and flame-retardant properties of the cured epoxy resins were improved by the incorporation of both silicone and phosphorus moieties. The synergistic effect of silicone and phosphorus enhanced the limiting oxygen index values, which was observed for siliconized epoxy resins cured with phosphorus containing diamine compound.     

Studies on curing kinetics of a novel combined liquid crystalline epoxy containing tetramethylbiphenyl and aromatic ester‐type mesogenic group with diaminodiphenylsulfone

The curing kinetics of a novel liquid crystalline epoxy resin with combining biphenyl and aromatic ester‐type mesogenic unit, diglycidyl ether of 4,4′‐bis(4‐hydroxybenzoyloxy)‐3,3′,5,5′‐tetramethyl biphenyl (DGE‐BHBTMBP), and the curing agent diaminodiphenylsulfone (DDS) was studied using the advanced isoconvensional method (AICM). DGE‐BHBTMBP/DDS curing system was investigated the curing behavior by means of differential scanning calorimetry (DSC) during isothermal and nonisothermal processes. Only one exothermal peak appeared in isothermal DSC curves. A variation of the effective activation energy with the extent of conversion was obtained by AICM. Three different curing stages were confirmed. In the initial curing stage, the value of E_a is dramatically decreased from ～90 to ～20 kJ/mol in the conversion region 0–0.2 for the formation of LC phase. In the middle stage, the value of E_a keeps about ～80 kJ/mol for cooperative effect of reaction mechanism and diffusion control. In the final stage, a significant increase of E_a from 84 to 136 kJ/mol could be caused by the mobility of longer polymer chains. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 3922–3928, 2007     

Study on curing reaction of epoxy resin modified with prepolymers containing spiro orthocarbonate

Prepolymers were prepared by the reaction of 3,9-dihydroxyethyl-3′9′-dibenzyl-1,5,7,11-tetraoxaspiro(5,5)undecane with 4,4′-diphenylmethane diisocyanate (MDI) and 1,6-hexa-methylene diisocyanate (HDI). The number-average molecular weights of the prepolymers can be controlled by changing the mole ratios of spiro compound and diisocyanates. Kinetic studies of the cure reaction for the epoxy resin system modified with or without prepolymers were followed by a HLX-1 dynamic torsional vibration apparatus. The results indicated that gel time (t_g) and activation energy (E_a) increased as the content of prepolymers in the epoxy resin system increased. A difference with the cure reaction of the pure epoxy resin, the second-order reaction for the epoxy resin modified with the prepolymers, was obtained. Rate constants (k) of the cure reaction are 0.231 min^?1 for the epoxy resin, and 0.312 min^?1 for the modified epoxy resin. The mechanism of the cure reaction was discussed. © 1995 John Wiley & Sons, Inc.     

Thermal cured epoxy resins using certain calixarenes and their esterified derivatives as curing agents

The acetyl esterified calixarene (CA) derivatives were prepared from calix[4]resorcinarene (CRA), and p‐tert‐butylcalixarene (BCA[n], n = 4, 6, 8), respectively. Using these CA derivatives as curing agents, the thermal curing reactions of two multifunctional epoxy resins (jER 828, 186 g/equiv., and ESCN, 193.7 g/equiv.) were investigated. The temperatures of glass transition (T_g) and decomposition (T) were measured by DSC and TGA, respectively. Based on the yields, T_gs, and T_ds of the thermal cured jER 828 epoxy resin with CRA‐E100, the curing conditions were optimized to be tetrabutylphosphonium bromide (TBPB) as catalyst in NMP at 160 °C for 15 h. Under this curing condition, the cured materials of jER 828 or ESCN using various CA derivatives as curing agents were prepared. Except for BCA4 derivatives, the yields of thermal curing reaction were higher than 90%. T_gs and Ts of the resultant cured materials were in the range of 113–248 °C and 363–404 °C, respectively. These results mean that the cured epoxy resins with excellent T_gs were successfully formed by using CA derivatives as curing agents. It was also found that the T_gs of cured epoxy resins were strongly affected by the degree of esterification of CA derivatives. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 1931–1942, 2010     

Synthesis of a novel phosphorus‐containing curing agent and its effects on the flame retardancy,thermal degradation and moisture resistance of epoxy resins

A novel phosphorus‐containing compound diphenyl‐(1, 2‐dicarboxylethyl)‐phosphine oxide defined as DPDCEPO was synthesized and used as a flame retardant curing agent for epoxy resins (EP). The chemical structure of the prepared DPDCEPO was well characterized by Fourier transform infrared spectroscopy, and ¹H, ¹³C and ³¹P nuclear magnetic resonance. The DPDCEPO was mixed with curing agent of phthalic anhydride (PA) with various weight ratios into epoxy resins to prepare flame retardant EP thermosets. The flame retardant properties, combustion behavior and thermal analysis of the EP thermosets were respectively investigated by limiting oxygen index (LOI), vertical burning tests (UL‐94), cone calorimeter measurement, dynamic mechanical thermal analysis and thermogravimetric analysis (TGA) tests. The surface morphologies and chemical compositions of the char residues for EP thermosets were respectively investigated by scanning electron microscopy and X‐ray photoelectron spectroscopy (XPS). The water resistant properties of the cured EP were evaluated by putting the samples into distilled water at 70°C for 168 hr. The results revealed that the EP/20 wt% DPDCEPO/80 wt% PA thermosets successfully passed UL‐94 V‐0 flammability rating and the LOI value was as high as 33.2%. The cone test results revealed that the incorporation of DPDCEPO effectively reduced the combustion parameters of the epoxy resin thermosets, such as heat release rate and total heat release. The dynamic mechanical thermal analysis test demonstrated that the glass transition temperature (Tg) decreased with the increase of DPDCEPO content. The TGA results indicated that the incorporation of DPDCEPO promoted the decomposition of epoxy resin matrix ahead of time and led to a higher char yield and thermal stability at high temperatures. The surface morphological structures and analysis of the XPS of the char residues of EP thermosets revealed that the introduction of DPDCEPO benefited the formation of a sufficient, compact and homogeneous char layer with rich flame retardant elements on the epoxy resin material surface during combustion. The mechanical properties and water resistance of the cured epoxy resins were also measured. After water resistance tests, the EP/20 wt% DPDCEPO/80 wt% PA thermosets retained excellent flame retardancy, and the moisture adsorption of the EP thermosets decreased with the increase of DPDCEPO content in EP thermosets because of the existence of the P–C bonds and the rigid aromatic hydrophobic structure in DPDCEPO. Copyright © 2015 John Wiley & Sons, Ltd.     

Synthesis and curing of liquid crystalline epoxy resin based on naphthalene mesogen

Aromatic liquid crystalline epoxy resin (LCE) based on naphthalene mesogen was synthesized and cured with aromatic diamines to prepare heat‐resistant LCE networks. Diaminodiphenylester (DDE) and diaminodiphenylsulfone (DDS) were used as curing agents. The curing reaction and liquid crystalline phase of LCE were monitored, and mechanical and thermal properties of cured LCE network were also investigated. Curing and postcuring peaks were observed in dynamic DSC thermogram. LCE network cured with DDE displayed liquid crystalline phase in the curing temperature range between 183 and 260°C, while that cured with DDS formed one between 182 and 230°C. Glass transition temperature of cured LCE network was above 240°C, and crosslinked network was thermally stable up to 330°C. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 419–425, 1999     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

One component photo‐curing agent for epoxy resins based on multifunctional photobase generators containing oxime–urethane groups

In order to develop a one‐component photo‐curing system for epoxy resin, the photo‐crosslinking reactions of the diglycidyl ether of bisphenol A (DGEBA) in the presence of a multifunctional photobase generator (PBG) containing oxime–urethane groups were studied. The cross‐linking of DGEBA films and adhesion properties of DGEBA formulations containing the PBG and benzophenone increased with irradiation dose, post‐exposure baking (PEB) time, PEB temperature, and the number of oxime–urethane groups in the PBG. A synergistic effect was observed between the PBG and a base amplifier on the film cross‐linking of DGEBA. A trifunctional PBG containing oxime–urethane groups was found to be the most efficient PBG in terms of the photo‐crosslinking and adhesion properties of the DGEBA‐based formulations. Moreover, the devised formulations, including the PBG and benzophenone, were stable for at least 1 month at room temperature. The photocuring system developed in this study appears to offer a one‐pack epoxy resin curing system with practical useful properties. Copyright © 2009 John Wiley & Sons, Ltd.     

DSC study of cure kinetics of DGEBA-based epoxy resin with poly(oxypropylene) diamine

Summary A kinetic study of cure kinetics of epoxy resin based on a diglycidyl ether of bisphenol A (DGEBA), with poly(oxypropylene) diamine (Jeffamine D230) as a curing agent, was performed by means of differential scanning calorimetry (DSC). Isothermal and dynamic DSC characterizations of stoichiometric and sub-stoichiometric mixtures were performed. The kinetics of cure was described successfully by empirical models in wide temperature range. System with sub-stoichiometric content of amine showed evidence of two separate reactions, second of which was presumed to be etherification reaction. Catalytic influence of hydroxyl groups formed by epoxy-amine addition was determined.     

Studies on the curing kinetics of epoxy resins using silicon containing amide-amines

Curing kinetics of diglycidyl ether of bisphenol-A (DGEBA) in the presence of novel silicon containing amide-amines were investigated by the dynamic differential scanning calorimetry. Silicon containing amide-amines were prepared by reacting 2.5 moles of 4,4'-diaminodiphenyl ether (E)/4,4'-diaminodiphenyl methane (M)/3,3'-diaminodiphenyl sulfone (mS)/bis(m-aminophenyl) methyl phosphine oxide (B) with one mole of bis(4-chlorobenzoyl) dimethyl silane. The multiple heating rate method (5, 10, 15 and 20°C min^-1) was used to study the curing kinetics of epoxy resins in the presence of stoichiometric amounts of amide-amines having molecular masses in the range of 660 to 760 g mol^-1. The peak exotherm temperature depends on the heating rate as well as on the structure of amide-amines. Activation energy of curing reaction as determined in accordance to the Ozawa's method was found to be dependent on the structure of amine. The thermal stability of the isothermally cured resins was also evaluated using dynamic thermogravimetry in a nitrogen atmosphere. The char yield was the highest in case of resins cured with amide-amines having both phosphorus and silicon atoms. This revised version was published online in July 2006 with corrections to the Cover Date.     

A novel halogen‐free co‐curing agent with linear multi‐aromatic rigid structure as flame‐retardant modifier in epoxy resin

A novel halogen‐free 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO)‐containing co‐curing agent, 6,6′‐(1,4‐phenylenebis(((4‐(phenylamino)phenyl)amino)methylene))bis(dibenzo[c,e][1,2]oxaphosphinine 6‐oxide) (DPN) was synthesized via a simple 1‐pot or 2‐step procedure with yield of 86.2% and 70.8%, respectively. The molecular structures of 4,4′‐((1,4‐phenylenebis(methanylylidene))bis(azanylylidene))bis(N‐phenylaniline) (DPN intermediate) and DPN are characterized by FTIR, NMR, and MS. TGA tests show that the char yield of DPN/EP composites raises to 30.9% when the molar ratio of DPN to 4,4‐diaminodiphenyl methane(DDM) is 20:80. T_g values of DPN/EP composites tested by DSC and DMA are similar to neat epoxy resin (EP), which is due to the secondary amine in DPN that participates in the cross‐linking reaction of epoxy resin. The storage modulus in the rubber stage (E′‐190 °C) of flame‐retardant epoxy resin is close to that of neat EP, while their tanδ's are lower, which indicates the similarity of samples' cross‐linking density due to the participation of DPN in the cross‐linking reaction. The results show that when the molar ratio of DPN and DDM is 5:95, the epoxy has a higher T_g value and better mechanical properties than other samples. The introduction of DPN efficiently improves the flame‐retardant properties of epoxy resin with V‐0 rating of UL‐94 vertical burning test, non‐dripping, 41% of limit oxygen index (LOI) value, low peak heat release rate (PHRR), and total heat release (THR).     

Synthesis of a caged bicyclic phosphates derived anhydride and its performance as a flame‐retardant curing agent for epoxy resins

A novel curing and flame‐retardant agent (PEPA‐TMAC) was successfully synthesized. The chemical structure was characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance (NMR). Use of PEPA‐TMAC as part of the curing agent in combination with another anhydride for a commercial epoxy resin (EP) was studied. Results of differential scanning calorimetry (DSC) indicated that PEPA‐TMAC was an effective curing agent for EP. The dynamic mechanical analysis (DMA) results showed that the glass transition temperature (T_g) and cross‐linking density (V_e) of EP composites exhibited an increase trend with the addition of PEPA‐TMAC. The limiting oxygen index (LOI) value of EP composites reached 26.9%, and the cone calorimeter results indicated that peak heat release rate (PHRR), total heat release (THR), smoke produce rate (SPR), and total smoke produce (TSP) remarkably decreased with increasing PEPA‐TMAC content. TGA data showed that the addition of PEPA‐TMAC greatly increased the amount of residual char during combustion. The morphology of the residual char was studied by SEM and showed that the addition of PEPA‐TMAC greatly increased the stability of EP composites. The thermogravimetric analysis (TGA), energy‐dispersive X‐ray spectroscopy (EDS), and FTIR results revealed the flame‐retardant mechanism that PEPA‐TMAC can promote the formation of charred layers with the phospho‐carbonaceous complexes in the condensed phase during burning of EP composites.     

Synthesis and characterization of itaconic‐based epoxy resins

A trifunctional epoxy resin from itaconic acid (TEIA) was synthesized from a renewable resource‐based itaconic acid by allylation of itaconic acid to form diallyl itaconate by using m‐chloroperoxybenzoic acid as oxidizing agents followed by epoxidation of allylic C═C bond of diallyl itaconate methylhexahydropthalic anhydride as curing agent in the presence of 2‐methyl imidazole as a catalyst. The chemical structure of the synthesized resins was confirmed by Fourier transform infrared and nuclear magnetic resonance (¹H‐NMR and ¹³C‐NMR) spectroscopy analysis. The mechanical, thermal, and rheological performances of the TEIA were also investigated and compared with diglycidyl ether of bisphenol A and a plant‐based epoxidized soybean oil bioresin cured with the same curing agent. The higher epoxy value of 1.02, lower viscosity (0.96 Pa s at 25°C), higher mechanical, and higher curing reactivity toward methylhexahydropthalic anhydride of TEIA as compared with epoxidized soybean oil and comparable with diglycidyl ether of bisphenol A demonstrated significant evidence to design and develop a novel bio‐based epoxy resin with high performance to substitute the petroleum‐based epoxy resin.     

The revival of electron beam irradiation curing of epoxy resin—materials characterization and supportive cure studies

Polymeric composite manufacturing is a large, rapidly growing and energy consuming industry, where there is an obvious and compelling need for innovative curing technologies conforming to energy efficiency and environmental protection trends. This has led to many research efforts to consider, or in some cases re‐consider, irradiation curing of polymer composites. However, there is still a stifling lack of knowledge of the fundamental mechanisms to obtain homogeneity in the irradiation curing of composites. The key issue of the irradiation curing process, i.e. homogeneous curing affected by electron beam dose and initiator concentration for an epoxy resin is the focus of this paper. The temperature profiles, microstructure, curing degree gradient, and thermomechanical properties of electron beam‐ irradiated epoxy resin were profiled and analyzed, and the results indicated that curing degree in the epoxy resin showed a relatively steady region and an accelerated decrease along the depth direction. It is revealed that there existed an optimal range of concentration of the initiator for irradiation curing of an epoxy resin system. The inhomogeneity in the irradiation‐induced crosslinking structure could be abated by adopting the properly applied irradiation energy and the matching between the irradiation dose and the concentration of the initiator. It can be deduced that for most of the composite products with large thickness, layer upon layer irradiation or irradiation from two sides could be more efficient to obtain a homogeneous crosslinking structure. Copyright © 2009 John Wiley & Sons, Ltd.     

Synthesis,characterization of novel interacting blends of acrylated poly(ester-amide)s containing epoxy residues with vinyl ester resin

Unsaturated bisamic acids were prepared by reaction between maleic anhydride and different aromatic diamines. Unsaturated poly(ester-amide) resin (UPEAs) was prepared by reaction of diglycidylether of bisphenol-A (DGEBA) with unsaturated bisamic acids. Acrylation of Unsaturated poly(ester-amide)s (UPEAs) was carried out to afford acrylated UPEAs resin (i.e., AUPEAs). Interacting blends of Acrylated unsaturated poly(ester-amide)s (AUPEAs) with vinyl ester epoxy (VE) resin were prepared. APEAs and AUPEAs were characterized by elemental analysis, molecular weight determined by vapor pressure osmometer and by IR spectral study and by thermogravimetry. The curing of interacting blends was monitored on differential scanning calorimeter (DSC). Based on DSC data in situ glass reinforced composites of the resultant blends have been prepared and characterized for mechanical, electrical and chemical properties. Unreinforced blends were characterized thermo-gravimetrically (TGA).     

Preparation and characterization of phosphorus‐containing Mannich‐type bases as curing agents for epoxy resin

Two novel phosphorus‐containing Mannich‐type bases, [(2‐{[(diethoxy‐phosphoryl)‐phenyl‐methyl]‐amino}‐ ethylamino)‐phenyl‐methyl]‐phosphonic acid diethyl ester (PEDA) and ({2‐[2‐(2‐{[(diethoxy‐phosphoryl)‐phenyl‐methyl]– amino}‐ethylamino)‐ethylamino]‐ethylamino}‐phenyl‐methyl)‐phosphonic acid diethyl ester (PTTA) were prepared and employed as curing agents in an attempt to prepare flame retardant epoxy systems. Through a curing reaction, phosphorus was incorporated in the backbone of the epoxy polymer. The processing characteristic of these systems was studied in terms of gel time at different temperatures. Thermal and flame retardancy properties of the cured epoxy thermosets were characterized by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and flammability test. The degradation activation energy was calculated by Kissinger's model. The results showed that the gel time of the phosphorus‐containing epoxy systems was prolonged; the glass transition temperature (T_g) was increased due to the introduction of phosphorus and the initial degradation activation energy of phosphorus‐containing epoxy systems was lower than phosphorus‐free epoxy systems. High char yield (23–27 wt%) and limiting oxygen index (LOI) values of 28–30 were observed for the phosphorus‐containing epoxy thermosets, indicating their improvement in flame retardancy. Copyright © 2008 John Wiley & Sons, Ltd.     

Synthesis and characterization of new poly(arylene ether)s containing heterocyclic units. II.

A series of new poly(arylene ether)s, containing naphthalene, pyridine, and quinoline units have been prepared by solution condensation polymerization. The synthesis involves nucleophilic displacement of aromatic dihalides with aromatic potassium bisphenates in an anhydrous dipolar aprotic solvent at elevated temperatures. The polymers, having inherent viscosity from 0.24 to 1.32 dL/g, were obtained in quantitative yield, have excellent thermal stability as shown by 10% weight loss temperatures in nitrogen and air (above 450 and 430°C, respectively) and high glass transition temperatures (in the range of 150–220°C). The introduction of quinoline moieties in the polymer backbone positively influences the thermal properties, such as high T_g/T_m ratios. © 1995 John Wiley & Sons, Inc.     

水性环氧树脂的研制及其固化性能研究

采用端甲氧基聚乙二醇、马来酸酐、E-44环氧树脂合成了反应型环氧树脂乳化剂MeO-PEG-Ma-E-44,以相反转乳化技术制备E-44水性环氧树脂,研究了工艺条件对其性能的影响。结果表明:酯化率达98.5%的MeO-PEG-Ma-E-44,用量为E-44的ω=16.5%-20%得到的水性环氧树脂乳液最稳定。DSC和TG分析结果表明:乳化前后的E-44环氧树脂都能室温条件2h内很好的固化,固化后热性能基本不变,分解温度约在380℃,热失重率89%,其玻璃转变温度有所降低,韧性有所提高,其它性能基本不受影响。     

Synthesis and characterization of novel phenolic resins containing aryl‐boron backbone and their utilization in polymeric composites with improved thermal and mechanical properties

In the present study, a novel aryl‐boron‐containing phenolic resin named as PBPR has been synthesized from phenol and formaldehyde in the presence of phenylboronic acid. The chemical structure of the PBPR was confirmed by Fourier transform infrared, nuclear magnetic resonance and X‐ray photoelectron spectroscopy. The molecular weight, viscosity and curing behavior were examined to demonstrate that PBPRs have better processability than common boric acid‐modified phenolic resin. The thermal stability and fracture toughness of the cured PBPRs were greatly enhanced, where the char yield at 1000°C (nitrogen atmosphere) and the glass transition temperature reached 70.0% and 218°C, respectively. The excellent mechanical and ablative properties of the PBPR composites may have benefited from the good interfacial adhesion between the resin matrix and the reinforced fiber. The flexural strength and the linear ablative rate are 436.8 ± 5.2 MPa and 0.010 mm/sec, respectively. This study opens a new window for the preparation of high‐performance ablative composites by designing a resin matrix containing an aryl‐boron backbone. Copyright © 2013 John Wiley & Sons, Ltd.