基于准连续介质方法模拟纳米多晶体Ni中裂纹的扩展

通过准连续介质方法模拟了纳米多晶体Ni中裂纹的扩展过程.模拟结果显示:裂纹尖端的应力场可以导致晶界分解、层错和变形孪晶的形成等塑性形变,在距离裂纹尖端越远的位置,变形孪晶越少,在裂纹尖端附近相同距离处,层错要远多于变形孪晶.这反映了局部应力的变化以及广义平面层错能对变形孪晶的影响.计算了裂纹尖端附近区域原子级局部静水应力的分布.计算结果表明:裂纹前端晶界处容易产生细微空洞,这些空洞附近为张应力集中区,并可能促使裂纹沿着晶界扩展.模拟结果定性地反映了纳米多晶体Ni中的裂纹扩展过程,并与相关实验结果符合得很好     

复合材料反平面切口端部奇性研究

基于复合材料切口尖端位移场的渐近展开,将切口的反平面平衡控制方程转化为关于切口奇性指数的特征微分方程,采用一种变换将其化为线性特征微分方程组,引入插值矩阵法计算相应边界条件下方程组的特征值以获取切口尖端的应力奇性指数.研究单相材料切口、双相材料切口及止于异质界面切口的奇异性,算例表明该方法可以一次性计算出多阶奇性指数.对所取得的非奇异指数尽管切口不表现出奇性状态,但却是描述切口尖端完整应力场必不可少的参量.     

弹性连续介质中氢致裂纹传播理论

弹性连续介质中的氢原子,在裂纹应力场的诱导下发生聚集,形成氢气团,本文计算了气团分布区平均氢浓度,并将该区看作沿裂纹尖端分布的弹性夹杂,确定了夹杂的本征应变,研究了夹杂的应力场P_ij对裂纹位错密度的影响,求得了裂纹尖端总的应力强度因子,认为氢脆机理是氢气团增大了裂纹尖端应力强度因子,最后还讨论了氢致开裂的物理过程及氢致裂纹扩展速率,所得结果与实验符合很好。 关键词：     

裂纹与夹杂物的互作用

本文求解了一个圆形夹杂物对裂纹尖端应力场的影响,计算了反平面切变问题经典的应力场和应力强度因数,进而求得了非局域应力场,得到非奇异的裂纹尖端应力的解析表达式,讨论了解的应用。 关键词：     

晶体相场法研究应力状态及晶体取向对微裂纹尖端扩展行为的影响

采用晶体相场模拟研究了单向拉伸作用下初始应力状态、晶体取向角度对单晶材料内部微裂纹尖端扩展行为的影响, 以(111)晶面上的预制中心裂纹为研究对象探讨了微裂纹尖端扩展行为的纳观机理, 结果表明: 微裂纹的扩展行为主要发生在<011>(111)滑移系上, 扩展行为与扩展方向与材料所处的初始应力状态及晶体取向紧密相关. 预拉伸应力状态将首先诱发微裂纹尖端生成滑移位错, 进而导致晶面解理而实现微裂纹尖端沿[011]晶向扩展, 扩展到一定程度后由于位错塞积, 应力集中, 使裂纹扩展方向沿另一滑移方向[101], 并形成锯齿形边缘; 预剪切应力状态下, 微裂纹尖端首先在[101]晶向解理扩展, 并诱发位错产生, 形成空洞聚集型长大的二次裂纹, 形成了明显的剪切带; 预偏变形状态下微裂纹尖端则直接以晶面解理形式[101]在上进行扩展, 直至断裂失效; 微裂纹尖端扩展行为随晶体取向不同而不同, 较小的取向角度会在裂纹尖端形成滑移位错, 诱发空位而形成二次裂纹, 而较大的取向角下的裂纹尖端则以直接解理扩展为主, 扩展方向与拉伸方向几近垂直.     

α-Fe纯I型裂纹扩展中位错形成过程的三维分子动力学模拟

通过分子动力学方法模拟了三维 α-Fe I型裂纹的单向拉伸实验中的裂纹扩展过程。研究了在不同温度下裂纹扩展时位错的形成过程和断裂机理。计算结果表明,裂纹扩展过程是位错不断发射的过程。 裂纹尖端附近先形成无位错区和层错,当裂纹处应力增加到KI=0.566 MPam1/2时,裂纹尖端附近的某一层原子会逐渐分叉形成两层原子,分层后的原子层继续分离形成位错;当应力KI 达到0.669MPam1/2时第一个位错发射。随着温度的升高,临界应力强度因子逐渐降低,同时位错发射也相应地加快。     

α-Fe纯I型裂纹扩展中位错形成过程的三维分子动力学模拟

通过分子动力学方法模拟了三维 α-Fe I型裂纹的单向拉伸实验中的裂纹扩展过程。研究了在不同温度下裂纹扩展时位错的形成过程和断裂机理。计算结果表明,裂纹扩展过程是位错不断发射的过程。 裂纹尖端附近先形成无位错区和层错,当裂纹处应力增加到KI=0.566 MPam1/2时,裂纹尖端附近的某一层原子会逐渐分叉形成两层原子,分层后的原子层继续分离形成位错;当应力KI 达到0.669MPam1/2时第一个位错发射。随着温度的升高,临界应力强度因子逐渐降低,同时位错发射也相应地加快。     

正交各向异性材料切口尖端热弹奇性特征分析

研究正交各向异性平面V形切口,计算其热弹奇性特征.通过引入切口尖端物理场的渐近级数展开式,将应力和热流平衡方程转化为关于奇性指数的特征常微分方程组,采用插值矩阵法求解,获取切口尖端的热流、应力奇性指数和对应的特征角函数.算例表明,该法精度高适应性强.     

体心立方金属钽Ⅱ型裂纹尖端缺陷萌生的多尺度分析

本文采用多尺度准连续介质法(quasi-continuum method, QC)模拟体心立方(body-centered-cubic, bcc)金属钽(Ta)Ⅱ型裂纹尖端位错的形核与发射过程,获得位错发射位置与应力强度因子关系曲线,分析裂纹尖端缺陷萌生过程,研究全位错分解以及扩展位错形成机理. 位错活动在不同阶段表现出不一致的特征,新位错的发射对于位错运动具有促进作用. 研究表明,裂纹扩展初始阶段首先萌生点缺陷,点缺陷随着加载强度增加会萌生新的点缺陷,点缺陷最终运动到边界,导致Ⅱ型断裂破坏. 在全位错发射之前有不全位错的形核与发射表明全位错的分解分步进行,从势能曲线上来看,也就是两个极小值点的形成机理不同. 关键词： 多尺度 准连续介质法 Ⅱ型裂纹 扩展位错     

钛金属应力腐蚀机理电子理论研究

为从理论上揭示钛金属应力腐蚀行为的本质，建立了α钛晶粒及位错塞积形成的微裂纹原子 集团模型，利用递归法(recursion)计算了裂纹及晶粒内的电子结构参量(费米能级、结构能 、表面能、团簇能、环境敏感镶嵌能). 计算结果表明：氢在裂纹处的环境敏感镶嵌能较低 ，易于偏聚在裂纹处，且氢在钛金属裂纹处团簇能为正值不能形成团簇，具有有序化倾向， 趋于形成氢化物. 氢在裂纹处偏聚降低裂纹的表面能，使裂纹容易扩展. 裂纹尖端处费米能 级高于裂纹其他区域，使电子从裂纹尖端流向裂纹其他区域造成电位差，在电解质作用下裂 关键词： 递归法 电子结构 钛 应力腐蚀     

Dislocation-crack interaction

In this paper, recent developments in the understanding of the dislocation-crack interaction and its relationship to the phenomena of crack tip deformation and fracture toughness are reviewed. An enhanced research activity in this area began with successful observations of the behavior of crack tip dislocations by various techniques, namely etch pits technique, X-ray topography and transmision electron microscopy. The advantages and limitations of these techniques are compared and the information obtained from these experiments are discussed. The results show that dislocations are emitted from a crack tip when the applied stress is sufficiently high. During crack propagation, dislocations are also generated from other bulk sources and the number of these dislocations relative to those from the crack tip may be an important parameter. The elastic theory of the interaction between dislocations and a crack is presented by considering the force on the dislocations. The theory is applied to derive a dislocation emission condition, which may be expressed in terms of a critical stress intensity factor. It is concluded that the dislocations emitted from a crack tip are repelled from the crack tip and this repulsive interaction is responsible for the formation of a dislocation-free zone. These dislocations shield the crack tip from the applied stress and hence contribute to an increase in the fracture toughness. The physical origin of the dislocation-free zone lies in the presence of a barrier to dislocation emission from the crack tip. One of the barriers to dislocation emission is the image stress. With the dislocation-free zone, the crack tip can maintain a finite stress intensity factor following crack tip deformation. The lattice theories of dislocation-crack interaction indicate that the results are consistent with those of the continuum theory.     

Dynamic caustics and its applications

For the study of elastodynamic problems of propagating cracks it is necessary to evaluate the dynamic stress intensity factor K^d_I which depends on the form of expressions for the stress components existing at the running crack tip at any instant of the propagation of the crack and the corresponding dynamic mechanical and optical properties of the material of the specimen under identical loading conditions. In this paper the distortion of the form of the corresponding reflected caustic from the lateral faces of a dynamically loaded transparent and optically inert specimen containing a transverse crack running under constant velocity was studied on the basis of complex potential elasticity theory and the influence of this form on the value of the dynamic stress intensity factor was given. The method was applied to the study of a propagating Mode I crack in a PMMA specimen under various propagation velocities and the corresponding dynamic stress intensity factor K^d_I evaluated. Also, crack propagation behaviour of notched composites in dynamic loading modes are reviewed and evaluated. A relatively large data base using metal-epoxy particulates, rubber-toughened poly(methyl methacrylate), and Sandwich plates are given. In all cases, a combination of high-speed photography and the optical method of dynamic caustics has been used. Results on the dynamic crack propagation mode, fracture toughness and crack propagation velocities of several rubber-modified composite models are presented. The composite models studied include specimens with one and/or two ‘complex’ two-stage inclusions, i.e. PMMA round inclusions surrounded by concentric rubber rings, one and/or press-fifting inclusions without rubber interface, all under dynamic loading. In all cases both qualitative and quantitative results were obtained. Also, results on crack propagation mode, crack propagation velocity, stress intensity factors and on the influence of the sandwich phases on crack propagation mode are presented.     

Mean stress effect in fatigue crack propagation

Crack propagation rates in three different grades of mild steel and two types of age hardening aluminium alloys have been measured for different stress ratios. The results show a pronounced stress ratio effect for all these materials. A model of fatigue crack propagation is formulated in terms of the size of the cyclic plastic instability zone at the crack tip rather than the zone of plastic yielding. The micro-plastic instability zone is measured by a parameter involving the ratio of the maximum stress intensity and the stress level at which macro-plastic instability occurs in the $\text{S}\text{N}$ curve of plain fatigue test pieces. Such a parameter provides a means of normalizing crack propagation results obtained for various stress ratios.     

Thermal stress cleaving of silicon wafer by pulsed Nd：YAG laser

The applied laser energy absorbed in a local area in laser thermal stress cleaving of brittle materials using a controlled fracture technique produces tensile thermal stress that causes the material to separate along the moving direction of the laser beam. The material separation is similar to crack extension, but the fracture growth is controllable. Using heat transfer theory, we establish a three-dimensional （3D） mathematical thermoelastic calculational model containing a pre-existing crack for a two-point pulsed Nd：YAG laser cleaving silicon wafer. The temperature field and thermal stress field in the silicon wafer are obtained by using the finite element method （FEM）. The distribution of the tensile stress and changes in stress intensity factor around the crack tip are analyzed during the pulse duration. Meanwhile, the mechanism of crack propagation is investigated by analyzing the development of the thermal stress field during the cleaving process.     

Hot cracks in rubber: origin of the giant toughness of rubberlike materials

We study crack propagation in rubberlike materials and show that the nonuniform temperature distribution which occurs in the vicinity of the crack tip has a profound influence on the crack propagation, and may strongly enhance the crack propagation energy G(v) for high crack velocities v. At very low crack-tip velocities, the heat produced at the crack tip can diffuse away, but already at moderate crack-tip velocities a very large temperature increase occurs close to the crack tip resulting in a "hot-crack" propagation regime. The transition between the low-speed regime and the hot-crack regime is very abrupt and may result in unstable crack motion, e.g., stick-slip motion or catastrophic failure.     

An extensive 3D dislocation dynamics investigation of stage-I fatigue crack propagation

Stage-I fatigue crack propagation is investigated using 3D discrete dislocation dynamics (DD) simulations. Slip-based propagation mechanisms and the role of the pre-existing slip band on the crack path are emphasized. Stage-I crack growth is found to be compatible with successive decohesion of the persistent slip band/matrix interface rather than a mere effect of plastic irreversibility. Corresponding crack tip slip displacement magnitude and the associated crack growth rate are evaluated quantitatively at various tip distances from the grain boundary. This shows that grain boundaries systematically amplify slip dispersion ahead of the crack tip and consequently, slow down the stage-I crack growth rate. The results help in developing an original crack propagation model, accounting for the boundary effects relevant to polycrystals. The crack growth trend is then evaluated from calculations of the energy changes due to crack length increments. It is shown that the crack necessarily propagates by increments smaller than 10 nm.