Properties of Ge-doped,high-quality bulk GaN crystals fabricated by hydride vapor phase epitaxy

We investigated the properties of Ge-doped, high-quality bulk GaN crystals with Ge concentrations up to 2.4×10¹⁹ cm⁻³. The Ge-doped crystals were fabricated by hydride vapor phase epitaxy with GeCl₄ as the dopant source. Cathodoluminescence imaging revealed no increase in the dislocation density at even the highest Ge concentration, with values as low as 3.4×10⁶ cm⁻². The carrier concentration, as determined by Hall measurement, was almost identical to the combined concentration of Ge and unintentionally incorporated Si. The electron mobilities were 260 and 146 cm² V⁻¹ s⁻¹ for n=3.3×10¹⁸ and 3.35×10¹⁹ cm⁻³, respectively; these values are markedly larger than those reported in the past for Ge-doped GaN thin films. The optical absorption coefficient was quite small below the band gap energy; it slightly increased with increase in Ge concentration. Thermal conductivity, estimated by the laser-flash method, was virtually independent of Ge concentration, maintaining an excellent value around 2.0 W cm⁻¹ K⁻¹. Thermal expansion coefficients along the a- and m-axes were approximately constant at 5.0×10⁻⁶ K⁻¹ in the measured doping concentration range.     

A simple method to synthesize α-Si3N4, β-SiC and SiO2 nanowires by carbothermal route

α-Si₃N₄ nanowires, β-SiC nanowires and SiO₂ amorphous nanowires are synthesized via the direct current arc discharge method with a mixture of silicon, activated carbon and silicon dioxide as the precursor. The α-Si₃N₄ nanowires, β-SiC nanowires and SiO₂ amorphous nanowires are about 50–200 nm in stem diameter and 10–100 μm in length. α-Si₃N₄ nanowires and β-SiC nanowires consist of a solid single-crystalline core along the [0 0 1] and [1 1 1] directions, respectively, wrapped within an amorphous SiO_x layer. The direct current arc plasma-assisted self-catalytic vapor–solid and/or vapor–liquid–solid (VLS) growth processes are proposed as the growth mechanism of the nanowires.     

Improvement of crystal quality in ammonothermal growth of bulk GaN

Several key improvements in crystal quality of bulk GaN grown by the ammonothermal method are presented. Full width at half maximum of (0 0 2) X-ray rocking curve was reduced to 53 and 62 arcsec for Ga-side and N-side, respectively. Transparent bulk GaN crystal was also demonstrated. Oxygen and sodium concentrations were reduced to mid-10¹⁸ and mid-10¹⁵ cm⁻³, respectively. We are currently searching for a growth condition that produces transparent bulk GaN with high structural quality and low impurities. Small-sized, semi-transparent GaN wafers were fabricated by slicing the grown bulk GaN crystals, which demonstrate the high feasibility of ammonothermal growth for production of GaN wafers.     

Assessment of defect reduction methods for nonpolar a-plane GaN grown on r-plane sapphire

This work assesses the relative effectiveness of four techniques to reduce the defect density in heteroepitaxial nonpolar a-plane GaN films grown on r-plane sapphire by metalorganic vapour phase epitaxy (MOVPE). The defect reduction techniques studied were: 3D–2D growth, SiN_x interlayers, ScN interlayers and epitaxial lateral overgrowth (ELOG). Plan-view transmission electron microscopy (TEM) showed that the GaN layer grown in a 2D fashion had a dislocation and basal-plane stacking fault (BSF) density of (1.9±0.2)×10¹¹ cm⁻² and (1.1±0.9)×10⁶ cm⁻¹, respectively. The dislocation and BSF densities were reduced by all methods compared to this 2D-grown layer (used as a seed layer for the interlayer and ELOG methods). The greatest reduction was achieved in the (0 0 0 1) wing of the ELOG sample, where the dislocation density was <1×10⁶ cm⁻² and BSF density was (2.0±0.7)×10⁴ cm⁻¹. Of the in-situ techniques, SiN_x interlayers were most effective: the interlayer with the highest surface coverage that was studied reduced the BSF density to (4.0±0.2)×10⁵ cm⁻¹ and the dislocation density was lowered by over two orders of magnitude to (3.5±0.2)×10⁸ cm⁻².     

Czochralski-growth of germanium crystals containing high concentrations of oxygen impurities

Oxygen-containing germanium (Ge) single crystals with low density of grown-in dislocations were grown by the Czochralski (CZ) technique from a Ge melt, both with and without a covering by boron oxide (B₂O₃) liquid. Interstitially dissolved oxygen concentrations in the crystals were determined by the absorption peak at 855 cm⁻¹ in the infrared absorption spectra at room temperature. It was found that oxygen concentration in a Ge crystal grown from melt partially or fully covered with B₂O₃ liquid was about 10¹⁶ cm⁻³ and was almost the same as that in a Ge crystal grown without B₂O₃. Oxygen concentration in a Ge crystal was enhanced to be greater than 10¹⁷ cm⁻³ by growing a crystal from a melt fully covered with B₂O₃; with the addition of germanium oxide powder, the maximum oxygen concentration achieved was 5.5×10¹⁷ cm⁻³. The effective segregation coefficients of oxygen in the present Ge crystal growth were roughly estimated to be between 1.0 and 1.4.     

Thick homoepitaxial GaN with low carrier concentration for high blocking voltage

High voltage GaN Schottky diodes require a thick blocking layer with an exceptionally low carrier concentration. To this aim, a metal organic chemical vapor deposition process was developed to create a (14 μm) thick stress-free homoepitaxial GaN film. Low temperature photoluminescence measurements are consistent with low donor background and low concentration of deep compensating centers. Capacitance–voltage measurements performed at 30 °C verified a low level of about 2×10¹⁵ cm⁻³ of n-type free carriers (unintentional doping), which enabled a breakdown voltage of about 500 V. A secondary ion mass spectrometry depth profile confirms the low concentration of background impurities and X-ray diffraction extracted a low dislocation density in the film. These results indicate that thick GaN films can be deposited with free carrier concentrations sufficiently low to enable high voltage rectifiers for power switching applications.     

The impact of an intermediate temperature buffer on the growth of GaN on an AlN template by hydride vapor phase epitaxy

The present study focused on the effect of an intermediate-temperature (IT; ∼900 °C) buffer layer on GaN films, grown on an AlN/sapphire template by hydride vapor phase epitaxy (HVPE). In this paper, the surface morphology, structural quality, residual strain, and luminescence properties are discussed in terms of the effect of the buffer layer. The GaN film with an IT-buffer revealed a relatively lower screw-dislocation density (3.29×10⁷ cm⁻²) and a higher edge-dislocation density (8.157×10⁹ cm⁻²) than the GaN film without an IT-buffer. Moreover, the IT-buffer reduced the residual strain and improved the luminescence. We found that the IT-buffer played an important role in the reduction of residual strain and screw-dislocation density in the overgrown layer through the generation of edge-type dislocations and the spontaneous treatment of the threading dislocation by interrupting the growth and increasing the temperature.     

Structural,electrical and optical properties of SnO2 films deposited on Y-stabilized ZrO2 (1 0 0) substrates by MOCVD

SnO₂ films have been deposited on Y-stabilized ZrO₂ (YSZ) (1 0 0) substrates at different substrate temperatures (500–800 °C) by metalorganic chemical vapor deposition (MOCVD). Structural, electrical and optical properties of the films have been investigated. The films deposited at 500 and 600 °C are epitaxial SnO₂ films with orthorhombic columbite structure, and the HRTEM analysis shows a clear epitaxial relationship of columbite SnO₂(1 0 0)||YSZ(1 0 0). The films deposited at 700 and 800 °C have mixed-phase structures of rutile and columbite SnO₂. The carrier concentration of the films is in the range from 1.15×10¹⁹ to 2.68×10¹⁹ cm⁻³, and the resistivity is from 2.48×10⁻² to 1.16×10⁻² Ω cm. The absolute average transmittance of the films in the visible range exceeds 90%. The band gap of the obtained SnO₂ films is about 3.75–3.87 eV.     

Preparation,crystal structure,spectrographic characterization,thermal and third order nonlinear optical properties of benzyltriethylamine bis(2-thioxo-1,3-dithiole-4,5-dithiolato)nickel(III)

The preparation and crystal structure of a novel nonlinear optical organometallic crystal, benzyltriethylamine bis(2-thioxo-1,3-dithiole-4,5-dithiolato)nickel(III) (BTEANDT), are described. The crystal was characterized by elemental analyses, infrared and X-ray powder diffraction spectroscopy, thermal analysis and optical absorption. The third order nonlinear optical properties of crystal were investigated by using the Z-scan technique at 1064 nm with 20 ps. A self-focusing effect and a saturable absorption were observed. The nonlinear refraction coefficient (n₂) and the nonlinear absorption coefficient (β) have been found to be 7.311×10⁻¹⁸ m²/W and −6.064×10⁻¹¹ m/W when the on-axis irradiance at focus (I₀) is 3.025 GW/cm². The relationship between β and I₀ was studied, which has revealed that the former is proportional to the latter. The result has been explained with the theory of absorption cross-section.     

Unidirectional growth of l-asparagine monohydrate single crystal: First time observation of NLO nature and other studies of crystalline perfection,optical, mechanical and dielectric properties

L-asparagine monohydrate (LAM), a new amino acid single crystal, was grown by slow evaporation solution technique (SEST) as well as by recently invented Sankaranarayanan–Ramasamy (SR) method in aqueous medium. Using SR method, LAM single crystal of diameter ∼18 mm and length ∼52 mm was grown for the first time. The growth conditions were optimized and the maximum growth rate of 1.0 mm per day was observed for the SR crystal. The crystal structure was confirmed by powder XRD. The crystalline perfection was assessed by high resolution XRD and etching studies and found that the quality of the SR crystal is better than the SEST crystal. The UV–vis–NIR spectroscopic study revealed that the SR crystal has good optical transparency than that of SEST crystal. The relative second harmonic generation efficiency was measured and found to be ∼0.35 times to that of KDP. The laser damage threshold (LDT) was measured and found that the SR crystal has higher LDT value (5.76 GW cm⁻²) than SEST crystal (4.75 GW cm⁻²). The Vickers’s microhardness and dielectric studies were also carried out and discussed.     

GaP:Mg layers grown on GaN by MOCVD

We have investigated the growth of magnesium-doped GaP (GaP:Mg) layers on GaN by metalorganic chemical vapor deposition. The hole carrier concentration increased linearly from 0.8×10¹⁸ to 4.2×10¹⁸ cm⁻³ as the Bis(cyclopentadienyl) magnesium (Cp₂Mg) mole flow rate increased from 1.2×10⁻⁷ to 3.6×10⁻⁷ mol/min. However, the hole carrier concentration decreased when the CP₂Mg mole flow rate was further increased. The double crystal X-ray diffraction (DCXRD) rocking curves showed that the GaP:Mg layers were single crystalline at low CP₂Mg molar flow. However, the GaP:Mg layers became polycrystalline if the CP₂Mg molar flow was too high. The decrease in hole carrier concentration at high CP₂Mg molar flow was due to crystal quality deterioration of the GaP layer, which also resulted in the low hole mobility of the GaP:Mg layer.     

Growth of undoped and Zn-doped GaN nanowires

Undoped and Zn-doped GaN nanowires were synthesized by chemical vapor deposition (CVD), and the effects of substrates, catalysts and precursors were studied. A high density of GaN nanowires was obtained. The diameter of GaN nanowires ranged from 20 nm to several hundreds of nm, and their length was about several tens of μm. The growth mechanism of GaN nanowires was discussed using a vapor–liquid–solid (VLS) model. Furthermore, room-temperature cathodoluminescence spectra of undoped and Zn-doped GaN nanowires showed emission peaks at 364 and 420 nm, respectively.     

Bulk GaN crystals grown by HVPE

We succeeded in preparing very thick c-plane bulk gallium nitride (GaN) crystals grown by hydride vapor phase epitaxy. Growth of the bulk GaN crystals was performed on templates with 3 μm GaN layer grown by metal organic chemical vapor deposition on (0 0 0 1) sapphire substrates. Colorless freestanding bulk GaN crystals were obtained through self-separation processes. The crystal's diameter and thickness were about 52 and 5.8 mm, respectively. No surface pits were observed within an area of 46 mm diameter of the bulk GaN crystal. The dislocation density decreased with growth direction (from N-face side to Ga-face side) and ranged from 5.1×10⁶ cm⁻² near the N-face surface to 1.2×10⁶ cm⁻² near the Ga-face. A major impurity was Si, and other impurities (O, C, Cl, H, Fe, Ni and Cr) were near or below the detection limits by SIMS measurements.     

Growth and photoluminescence properties of vertically aligned SnO2 nanowires

Vertically aligned SnO₂ nanowires (NWs) were grown for the first time by a vapor–liquid–solid method on c-sapphire with gold as a catalyst under Ar gas flow. Electron backscatter diffraction analysis indicated the NWs are single crystalline having the rutile structure, grow vertically along the [1 0 0] direction, and exhibit a consistent epitaxial relationship where lattice mismatch is estimated to be 0.3% along the SnO₂ [0 1 0] direction. The growth of these NWs is sensitive to many parameters, including growth duration, substrate type, source vapor concentration, and the thickness of the catalyst layer. Photoluminescence measurements at room temperature showed that the vertically aligned NWs exhibit an intense transition at 3.64 eV, a near band-edge transition which is rarely observed in SnO₂.     

Growth of AlN single crystalline boules

We have obtained high-quality, crack-free AlN wafers using a convex thermal field inside the growth chamber. Free-standing AlN boules of 15 mm in height and 15 mm in diameter were grown. The carbon concentration was found to be similar in all parts of the boule (∼8×10¹⁸ cm⁻³) while the initial O concentration was higher (∼1×10¹⁹ cm⁻³) and slightly decreased during growth. It was found that O incorporated differently on different crystallographic faces. High resolution XRD showed a continuous improvement in crystal quality as a function of boule length. The full width at half maximum (FWHM) of the double crystal rocking curves decreased from 78 in at the beginning of growth to 13 in at the growth end. To the best of our knowledge, this is the first report on impurity incorporation on different crystallographic facets obtained from the same boule.     

One-sidewall-seeded epitaxial lateral overgrowth of a-plane GaN by metalorganic vapor-phase epitaxy

The selective regrowth of GaN during sidewall-seeded epitaxial lateral overgrowth was performed. In addition to adjusting the V/III ratio, control of offset angle of the sidewall was found to be effective for realizing one-sidewall-seeded a-plane (1 1 2¯ 0) GaN on r-plane (1 1¯ 0 2) sapphire. The number of coalescence regions on the grooves was reduced, and threading-dislocation and stacking-fault densities as low as 10⁶–10⁷ cm⁻² and 10³–10⁴ cm⁻¹, respectively, were successfully realized.     

Compensation effect of Mg-doped a- and c-plane GaN films grown by metalorganic vapor phase epitaxy

The electrical and optical properties of Mg-doped a- and c-plane GaN films grown by metalorganic vapor phase epitaxy were systematically investigated. The photoluminescence spectra of Mg-doped a- and c-plane GaN films exhibit strong emissions related to deep donors when Mg doping concentrations are above 1×10²⁰ cm⁻³ and 5×10¹⁹ cm⁻³, respectively. The electrical properties also indicate the existence of compensating donors because the hole concentration decreases at such high Mg doping concentrations. In addition, we estimated the N_D/N_A compensation ratio of a- and c-plane GaN by variable-temperature Hall effect measurement. The obtained results indicate that the compensation effect of the Mg-doped a-plane GaN films is lower than that of the Mg-doped c-plane GaN films.     

Defect reduction in nonpolar and semipolar GaN using scandium nitride interlayers

Nonpolar (1 1 2¯ 0) and semipolar (1 1 2¯ 2) GaN films were grown on sapphire by metalorganic vapour phase epitaxy using ScN interlayers of varying thicknesses. A 5 nm interlayer reduced basal plane stacking fault (BSF) densities in nonpolar films by a factor of 2 and threading dislocation (TD) densities by a factor of 100 to (1.8±0.2)×10⁹ cm⁻². An 8.5 nm interlayer reduced BSF densities in semipolar films by a factor of 5 and reduced TD densities by a factor of 200 to (1.5±0.3)×10⁸ cm⁻². Nonpolar film surface roughnesses were reduced by a factor of 20.     

Growth of GaN based structures on Si(1 1 0) by molecular beam epitaxy

The growth of GaN based structures on Si(1 1 0) substrates by molecular beam epitaxy using ammonia as the nitrogen precursor is reported. The structural, optical and electrical properties of such structures are assessed and are quite similar to the ones obtained on Si(1 1 1) in-spite of the very different substrate surface symmetry. A threading dislocation density of 3.7×10⁹ cm⁻² is evaluated by transmission electron microscopy, which is in the low range of typical densities obtained on up to 2 μm thick GaN structures grown on Si(1 1 1). To assess the potential of such structure for device realization, AlGaN/GaN high electron mobility transistor and InGaN/GaN light emitting diode heterostructures were grown and their properties are compared with the ones obtained on Si(1 1 1).     

In2O3 nanorod arrays grown at grain-boundary triple junctions of Cu–Sn alloy substrate

In this article, an alternative method for site-specific growth of In₂O₃ nanorod arrays, which relies on the vapor–liquid–solid growth mechanism, is demonstrated using Cu–Sn (5 at% Sn) alloy as substrate. By annealing Cu–Sn alloy slightly below the solidus line, grain-boundary triple junctions can be wetted preferentially. As a result, the catalyzing Cu droplets will be present at the sites of grain-boundary triple junctions, which will control the growth of In₂O₃ nanorods at defined locations. This growth technique provides a cost-effective and simple approach to fabricate ordered nanorod arrays with the sites controlled, which may benefit nanorod device applications.