A crack perpendicular to and terminating at a bimaterial interface

Using dislocation simulation approach, the basic equation for a finite crack perpendicular to and terminating at a bimaterial interface is formulated. A novel expansion method is proposed for solving the problem. The complete solution to the problem, including the explicit formulae for theT stresses ahead of the crack tip and the stress intensity factors are presented. The stress field characteristics are analysed in detail. It is found that normal stresses {ie27-1} and {ie27-2} ahead of the crack tip, are characterised byQ fields if the crack is within a stiff material and the parameters |p _T | and |q _T | are very small, whereQ is a generalised stress intensity factor for a crack normal to and terminating at the interface. If the crack is within a weak material, the normal stresses {ie27-3} and {ie27-4} are dominated by theQ field plusT stress. This work was supported by the Swedish Research Council for Engineering Sciences.     

Singular fields of a mode III interface crack in a power-law hardening bimaterial

A high order of asymptotic solution of the singular fields near the tip of a mode III interface crack for pure power-law hardening bimaterials is obtained by using the hodograph transformation. It is found that the zero order of the asymptotic solution corresponds to the assumption of a rigid substrate at the interface, and the first order of it is deduced in order to satisfy completely two continuity conditions of the stress and displacement across the interface in the asymptotic sense. The singularities of stress and strain of the zeroth order asymptotic solutions are −1/(n ₁+1) and −n/(n ₁+1) respectively. (n=n ₁,n ₂ is the hardening exponent of the bimaterials.) The applicability conditions of the asymptotic solutions are determined for both zeroth and first orders. It is proved that the Guo-Keer solution^[10] is limited in some conditions. The angular functions of the singular fields for this interface crack problem are first expressed by closed form. The project supported by National Natural Science Foundation of China     

Interaction of a conductive crack and of an electrode at a piezoelectric bimaterial interface

The interaction of a conductive crack and an electrode at a piezoelectric bi-material interface is studied. The bimaterial is subjected to an in-plane electrical field parallel to the interface and an anti-plane mechanical loading. The problem is formulated and reduced, via the application of sectionally analytic vector functions, to a combined Dirichlet–Riemann boundary value problem. Simple analytical expressions for the stress, the electric field, and their intensity factors as well as for the crack faces' displacement jump are derived. Our numerical results illustrate the proposed approach and permit to draw some conclusions on the crack–electrode interaction.     

Stress field near interface crack tip of double dissimilar orthotropic composite materials

In this paper, double dissimilar orthotropic composite materials interfacial crack is studied by constructing new stress functions and employing the method of composite material complex. When the characteristic equations＇ discriminants △1 〉 0 and △2 〉0, the theoretical formula of the stress field and the displacement field near the mode I interface crack tip are derived, indicating that there is no oscillation and interembedding between the interfaces of the crack.     

裂纹垂直于双相介质界面时的应力强度因子

本文利用Ｊ积分与应力强度因子的关系,采用有限元数值方法研究了当裂纹与双相介质的界面垂直时,其裂纹的近界面端和远界面端的应力强度因子随双相介质参数和裂纹端部到界面的距离的变化规律,同时还分析了当边裂纹逐渐扩展时,应力强度因子的变化特征。     

Finite boundary effects in problem of a crack perpendicular to and terminating at a bimaterial interface

In this paper, the problem of a crack perpendicular to and terminating at an interface in bimaterial structure with finite boundaries is investigated. The dislocation simulation method and boundary collocation approach are used to derive and solve the basic equations. Two kinds of loading form are considered when the crack lies in a softer or a stiffer material, one is an ideal loading and the other one fits to the practical experiment loading. Complete solutions of the stress field including the T stress are obtained as well as the stress intensity factors. Influences of T stress on the stress field ahead of the crack tip are studied. Finite boundary effects on the stress intensity factors are emphasized. Comparisons with the problem presented by Chen et al. (Int. J. Solids and Structure, 2003, 40, 2731–2755) are discussed also.The project supported by the National Natural Science Foundation of China (10202023 and 10272103), and the Key Project of CAS (KJCX2-SW-L2).     

Fracture analysis of mode-II crack perpendicular to imperfect bimaterial interface

The problem of a mode-II crack close to and perpendicular to an imperfect interface of two bonded dissimilar materials is investigated.The imperfect interface is modelled by a linear spring with the vanishing thickness.The Fourier transform is used to solve the boundary-value problem and to derive a singular integral equation with the Cauchy kernel.The stress intensity factors near the left and right crack tips are evaluated by numerically solving the resulting equation.Several special cases of the mode-II crack problem with an imperfect interface are studied in detail.The effects of the interfacial imperfection on the stress intensity factors for a bimaterial system of aluminum and steel are shown graphically.The obtained observation reveals that the stress intensity factors are dependent on the interface parameters and vary between those with a fully debonded interface and those with a perfect interface.     

A transverse crack tip field in bimaterial

The asymptotic field near an interface crack tip is analyzed with the fully nonlinear theory. By dividing the crack tip field into narrowing sectors and an expanding sector, the asymptotic equations for the crack tip field are derived and solved. The singular characters of stress and strain near the crack tip are revealed.     

Elastic-plastic crack growth on plane strain bimaterial interface

Finite element computation are carried out to simulate plane strain crack growth on a bimaterial interface under the assumption of small scale yielding. The modified Gurson constitutive equation and the element vanish technique introduced by Tvergaard et al. are used to model the final formation of an open crack. It is found from the calculation that the critical fracture toughness for crack growth is much lower in bimaterials than that in homogeneous material. The critical fracture toughness is strongly dependent on material properties of the bimaterial pair and the mixed mode of remote loads. The interface crack grows in the more compliant (lower hardening) material or in the weaker (lower yield strength) material. In Mode-I loading, the crack grows zigzag along the interface. Project supported by Fok Ying-Tung Education Foundation and National Natural Science Foundation of China.     

The singularity behavior of an interface crack under a dynamic load

The singularity behavior of a crack on the interface of two different media under dynamic load is investigated. By introducing a small region in which the crack faces make frictionless contact and making use of a kind of integral equations with moving boundaries, it is proved that there are only square-root singularities near the interface crack tips in case that a dynamic load acts on it. Numerical results show that the normal stress in the contact region remains negative. The results of the stress intensity factor and the length of the crack face contact region are given to illustrate the dynamic behavior of the interface crack.This work is supported by the National Natural Science Foundation of China.     

On interface crack models with contact zones situated in an anisotropic bimaterial

Summary A boundary value problem for two semi-infinite anisotropic spaces with mixed boundary conditions at the interface is considered. Assuming that the displacements are independent of the coordinate x ₃, stresses and derivatives of displacement jumps are expressed via a sectionally holomorphic vector function. By means of these relations the problem for an interface crack with an artificial contact zone in an orthotropic bimaterial is reduced to a combined Dirichlet-Riemann problem which is solved analytically. As a particular case of this solution, the contact zone model (in Comninou's sense) is derived. A simple transcendental equation and an asymptotic formula for the determination of the real contact zone length are obtained. The classical interface crack model with oscillating singularities at the crack tips is derived from the obtained solution as well. Analytical relations between fracture mechanical parameters of different models are found, and recommendations concerning their implementation are given. The dependencies of the contact zone lengths on material properties and external load coefficients are illustrated in graphical form. The practical applicability of the obtained results is demonstrated by means of a FEM analysis of a finite-sized orthotropic bimaterial with an interface crack. Received 19 October 1998; accepted for publication 13 November 1998     

插值矩阵法分析与复合材料界面相交的平面裂纹奇异应力场

提出了用插值矩阵法分析与各向异性材料界面相交的平面裂纹应力奇异性。基于V形切口尖端附近区域位移场渐近展开,将位移场的渐近展开式的典型项代入线弹性力学基本方程,得到关于平面内与复合材料界面相交的裂纹应力奇异性指数的一组非线性常微分方程的特征值问题,运用插值矩阵法求解,获得了平面内各向异性结合材料中与界面以任意角相交的裂纹尖端的应力奇异性指数随裂纹角的变化规律,数值计算结果与已有结果比较表明,本文方法具有很高的精度和效率。     

Scattering of SH-waves by an interacting interface linear crack and a circular cavity near bimaterial interface

An analytical method is developed for scattering of SH-waves and dynamic stress concentration by an interacting interface crack and a circular cavity near bimaterial interface. A suitable Green‘s function is contructed, which is the fundamental solution of the displacement field for an elastic half space with a circular cavity impacted by an out-plane harmonic line source loading at the horizontal surface. First, the bimaterial media is divided into two parts along the horizontal interface, one is an elastic half space with a circular cavity and the other is a complete half space. Then the problem is solved according to the procedure of combination and by the Green‘s function method. The horizontal surfaces of the two half spaces are loaded with undetermined anti-plane forces in order to satisfy continuity conditions at the linking section, or with some forces to recover cracks by means of crack-division technique. A series of Fredholm integral equations of first kind for determining the unknown forces can be set up through continuity conditions as expressed in terms of the Green‘s function. Moreover, some expressions are given in this paper, such as dynamic stress intensity factor (DSIF) at the tip of the interface crack and dynamic stress concentration factor (DSCF) around the circular cavity edge. Numerical examples are provided to show the influences of the wave numbers, the geometrical location of the interface crack and the circular cavity, and parameter combinations of different media upon DSIF and DSCF.     

Experimental analysis for singularities in crack normal to bimaterial interface

Three kinds of the model of crack normal to the bimaterial interface are studied by an experimental method. The highly sensitive moire interferometry technique is employed to obtain the displacement fields near the crack tip. The singularities of the three kinds of model are determined and analyzed by the experimental method and compared and discussed.     

An electrically conducting interface crack with a contact zone in a piezoelectric bimaterial

A plane problem for an electrically conducting interface crack in a piezoelectric bimaterial is studied. The bimaterial is polarized in the direction orthogonal to the crack faces and loaded by remote tension and shear forces and an electrical field parallel to the crack faces. All fields are assumed to be independent of the coordinate co-directed with the crack front. Using special presentations of electromechanical quantities via sectionally-analytic functions, a combined Dirichlet–Riemann and Hilbert boundary value problem is formulated and solved analytically. Explicit analytical expressions for the characteristic mechanical and electrical parameters are derived. Also, a contact zone solution is obtained as a particular case. For the determination of the contact zone length, a simple transcendental equation is derived. Stress and electric field intensity factors and, also, the contact zone length are found for various material combinations and different loadings. A significant influence of the electric field on the contact zone length, stress and electric field intensity factors is observed. Electrically permeable conditions in the crack region are considered as well and matching of different crack models has been performed.     

A study on stress intensity factors and singular stress fields of three-dimensional interface crack

By using the finite-part integral concepts and limit technique, the hypersingular integrodifferential equations of three-dimensional (3D) planar interface crack were obtained; then the dominant-part analysis of 2D hypersingular integral was further used to investigate the stress fields near the crack front theoretically, and the accurate formulae were obtained for the singular stress fields and the complex stress intensity factors. After that, a numerical method is proposed to solve the hypersingular integrodifferential equations of 3D planar interface crack, and the problem of elliptical planar crack is then considered to show the application of the method. The numerical results obtained are satisfactory. Project supported by the Foundation of Solid Mechanics Open Research Laboratory of State Education Commission at Tongji University and the National Natural Science Foundation.     

Penetration direction of a crack terminating at a bi-material interface obliquely

Crack penetration direction at a bi-material planar interface has been investigated numerically as a function of primary crack obliquity. Crack penetration angle prefers to follow the normal direction to the interface unless the crack obliquity is overly high. The retarded offset of the penetration angle from the direction normal to the interface is more apparent as Dunders’ parameter α decreases to −0.9, whereas the increase in α toward 0.9 fosters the offset of the penetration angle from the direction normal to the interface. This behavior has been well explained qualitatively in terms of the phase angle of the primary crack.     

A general solution method for an anti-plane shear crack dynamically accelerating along a bimaterial interface

We develop a general solution method for a dynamically accelerating crack under anti-plane shear conditions along the interface between two different homogeneous isotropic elastic materials. The crack is initially at rest, and after loading is applied the crack-tip speed which may accelerate up to the shear wave speed of the more compliant material. The analysis includes an exact, closed-form expression for the stress intensity factor for an arbitrary time-dependent crack-face traction, as well as expressions for computing the crack-face displacements and the stress in front of the crack. We also present some numerical examples for fixed loads and for loads moving with the crack tip, using a stress intensity factor fracture criterion, in order to examine the predicted effect of material mismatch on interfacial fracture.     

Contact zone assessment for a fast growing interface crack in an anisotropic bimaterial

Summary A plane strain problem for a crack with a frictionless contact zone at the leading crack tip expanding stationary along the interface of two anisotropic half-spaces with a subsonic speed under the action of various loadings is considered. The cases of finite and infinite-length interface cracks under the action of a moving concentrated loading at its faces are considered. A finite-length crack for a uniform mixed-mode loading at infinity is considered as well. The associated combined Dirichlet-Riemann boundary value problems are formulated and solved exactly for all above-mentioned cases. The expressions for stresses and the derivatives of the displacement jumps at the interface are presented in a closed analytical form for an arbitrary contact zone length. Transcendental equations are obtained for the determination of the real contact zone length, and the associated closed form asymptotic formulas are found for small values of this parameter. It is found that independently of the types of the crack and loading, an increase of the crack tip speed leads to an increase of the real contact zone length and the correspondent stress intensity factor. The latter increase significantly for an interface crack tip speed approaching the Ragleigh wave speed.     

Isotropic/orthotropic two-layered strips containing cracks terminating at and going through an interface

Crack problems for isotropic/orthotropic two-layered strips have been investigated. A system of two singular integral equations can be derived by using Fourier integral transformation and boundary conditions of crack problems. After stress singularities at crack tips or other special points are determined for internal and edge cracks, and for cracks terminating at and going through the interface, the system of singular integral equations is solved numerically by Gauss-Jacobi or Gauss-Chebyshev integration formulas for stress intensity factors at the tips and other singular points of cracks. Finally, possible crack growth behavior for cracks approaching and going through the interface is discussed.