The epoxy–polycarbonate blends cured with aliphatic amine—I. Mechanism and kinetics

Reaction mechanism of the PC–epoxy blends cured by aliphatic amine has been investigated by varying PC contents in the blends. The transamidation reaction tends to convert nearly all the carbonates into N-aliphatic aromatic carbamates even at ambient temperature before normal curing. The remaining amine proceeds the normal curing with epoxy at a higher temperature (80°C). For the PC–epoxy/aliphatic amine blend containing 6 wt % PC, the yielded N-aliphatic aromatic carbamate further reacts with amine to produce the urea structure. The urea undergoes substitution reaction with the hydroxyl formed from the normal curing to give the N-aliphatic aliphatic carbamate. For the blend containing 12 wt % PC, the N-aliphatic aromatic carbamate converts into the N-aliphatic aliphatic carbamate via two different routes. For the blend containing lower molecular weight of the aliphatic amine, the N-aliphatic aromatic carbamate reacts with hydroxyl to form the N-aliphatic aliphatic carbamate directly. For the blend containing higher molecular weight of aliphatic amine, the N-aliphatic aromatic carbamate decomposes into the aliphatic isocyanate accelerated by the presence of the residual oxirane. The isocyanate formed then reacts with hydroxyl to yield the N-aliphatic aliphatic carbamate. The activation energy (E_a) and preexponential factor (A) of the PC–epoxy/POPDA blends decrease with the increase of the PC content. Kinetic study by thermal analysis by the method of autocatalyzed model is able to correctly predict oxirane conversion vs. time relationship for the neat epoxy/aliphatic amine and the PC–epoxy/aromatic amine systems because the dominant reaction is the normal curing reaction between amine and oxirane. The model fails to predict the PC–epoxy/aliphatic amine system because the system is complicated by several other reactions besides the normal curing reaction. © 1997 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 35: 2169–2181, 1997     

Novel,environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan‐cured diglycidyl ether of bisphenol A epoxy

Tryptophan, an amino acid, has been used as a novel, environmentally friendly curing agent instead of toxic curing agents to crosslink the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The curing reaction of tryptophan/DGEBA mixtures of different ratios and the effect of the imidazole catalyst on the reaction have been evaluated. The optimum reaction ratio of DGEBA to tryptophan has been determined to be 3:1 with 1 wt % catalyst, and the curing mechanism of the novel reaction system has been studied and elucidated. In situ Fourier transform infrared spectra indicate that with the extraction of a hydrogen from NH₃⁺ in zwitterions from tryptophan, the formed nucleophilic primary amine and carboxylate anions of the tryptophan can readily participate in the ring‐opening reaction with epoxy. The secondary amine, formed from the primary amine, can further participate in the ring‐opening reaction with epoxy and form the crosslinked network. The crosslinked structure exhibits a reasonably high glass‐transition temperature and thermal stability. A catalyst‐initiated chain reaction mechanism is proposed for the curing reaction of the epoxy with zwitterion amino acid hardeners. The replacement of toxic curing agents with this novel, environmentally friendly curing agent is an important step toward a next‐generation green electronics industry. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 181–190, 2007     

Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120–150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between T_g and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested. © 1998 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 36: 773–783, 1998     

Isothermal cure kinetics of epoxy/phenol‐novolac resin blend system initiated by cationic latent thermal catalyst

The investigation of the cure kinetics of a diglycidyl ether of bisphenol A (DGEBA)/phenol‐novolac blend system with different phenolic contents initiated by a cationic latent thermal catalyst [N‐benzylpyrazinium hexafluoroantimonate (BPH)] was performed by means of the analysis of isothermal experiments using a differential scanning calorimetry (DSC). Latent properties were investigated by measuring the conversion as a function of curing temperature using a dynamic DSC method. The results indicated that the BPH in this system for cure is a significant thermal latent initiator and has good latent thermal properties. The cure reaction of the blend system using BPH as a curing agent was strongly dependent on the cure temperature and proceeded through an autocatalytic kinetic mechanism that was accelerated by the hydroxyl group produced through the reaction between DGEBA and BPH. At a specific conversion region, once vitrification took place, the cure reaction of the epoxy/phenol‐novolac/BPH blend system was controlled by a diffusion‐control cure reaction rather than by an autocatalytic reaction. The kinetic constants k₁ and k₂ and the cure activation energies E₁ and E₂ obtained by the Arrhenius temperature dependence equation of the epoxy/phenol‐novolac/BPH blend system were mainly discussed as increasing the content of the phenol‐novolac resin to the epoxy neat resin. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 2945–2956, 2000     

Cure of epoxy resins with cyanoacetamides

Cyanoacetamides are a novel class of curing agents for epoxy resins. Since reaction products of epoxy compounds with cyanoacetamides have not yet been described, we investigated the reaction of phenyl-glycidylether (PGE) and N-isobutylcyanoacetamide (NICA) under the conditions of the epoxy cure (120–150°C). Twenty-two fractions of the reaction product have been separated by preparative TLC and characterized by FD and MS mass spectroscopy. The structures of 10 reaction product have been elucidated by MS, NMR, and IR techniques. They belong to the classes of cyclic urethanes, spiro-dilactones, cyclo-oxa-1-hepten-4-one-2, pyrimidones, aminocrotononitrile, and tertiary amine. This complex model reaction mixture does not enable us to propose a curing mechanism. However practical cure of Bisphenol A diglycidylether (BADGE) yields clear and tough solids with a glass transition temperature up to 200°C, good mechanical strength, and high adhesion to metal surface. Cyanoacetamides are latent hardeners requiring a curing initiator. Since N-4-chlorophenyl-N′-dimethylurea is a latent initiator, liquid, homogeneous, storage stable “one shot” systems can be formulated which harden quickly above 120°C. Heat aging properties of cured specimens are reported. A series of novel liquid, resinous, and crystalline cyanoacetamides and their potential as curing agent are described.     

Thermal latent curing agent for epoxy resins from neutralization of 2‐methylimidazole with a phosphazene‐containing polyfunctional carboxylic acid

A novel thermal latent curing agent, 2MZS, was obtained through the reaction of 2‐methylimidazole (2MZ) and a symmetrically carboxyl‐functionalized star‐shaped molecule based on cyclotriphosphazene (N₃P₃‐COOH). In the complex, the resonance of N₃P₃‐COOH reduced the activity of lone electron pairs on the pyridine‐type nitrogen atom of imidazole ring, suppressing the nucleophilic attack and crosslinking reaction between 2MZ and epoxy resin. As a result, the storage stability was improved distinctly for the one‐pot epoxy compound, which could be steadily stored at room temperature for nearly 1 month. Nonisothermal DSC revealed a delayed initiation curing mechanism of the prepared one‐pot system, and which could undergo rapid curing reaction upon raising the temperature. Moreover, the introduction of terminally polyfunctional star‐shaped phosphazene derivative could promote the curing process at elevated temperature, as well as improve the chain rigidity of the cured resin by chemical incorporation into the cross‐linked network, thus endowing the cured resin with enhanced glassy storage modulus. The epoxy thermoset exhibited the highest glass transition temperature and thermal degradation temperature when 20 wt% of 2MZS was used. It is suggested that the novel latent curing agent is potential for high‐performance one‐pot epoxy compound, particularly recommended for application in electronic packaging fields.     

Exploitation of introducing of catalytic centers into layer galleries of layered silicates and related epoxy nanocomposites. I. Epoxy nanocomposites derived from montmorillonite modified with catalytic surfactant‐bearing carboxyl groups

Montmorillonite (MMT) was modified with the acidified cocamidopropyl betaine (CAB) and the resulting organo‐montmorillonite (O‐MMT) was dispersed in an epoxy/methyl tetrahydrophthalic anhydride system to form epoxy nanocomposites. The intercalation and exfoliation behavior of the epoxy nanocomposites were examined by X‐ray diffraction and transmission electron microscopy. The curing behavior and thermal property were investigated by in situ Fourier transform infrared spectroscopy and DSC, respectively. The results showed that MMT could be highly intercalated by acidified CAB, and O‐MMT could be easily dispersed in epoxy resin to form intercalated/exfoliated epoxy nanocomposites. When the O‐MMT loading was lower than 8 phr (relative to 100 phr resin), exfoliated nanocomposites were achieved. The glass‐transition temperatures (T_g's) of the exfoliated nanocomposite were 20 °C higher than that of the neat resin. At higher O‐MMT loading, partial exfoliation was achieved, and those samples possessed moderately higher T_g's as compared with the neat resin. O‐MMT showed an obviously catalytic nature toward the curing of epoxy resin. The curing rate of the epoxy compound increased with O‐MMT loading. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1192–1198, 2004     

Curing of linear and crosslinked epoxy systems: A fluorescence study with dansyl derivatives

The curing of diglycidyl ether of bisphenol A (DGEBA) with N,N′-dimethylethylenediamine (N,N′-DMEDA) or ethylenediamine (EDA) was monitored by fluorescence spectroscopy and Fourier transform infrared (in the near-infrared region). 5-Dimethylamino-naphthalene-1-sulfonamide (DNS) derivatives were used as probes (fluorophores added to the reaction mixture) and labels (fluorophores attached by covalent bonds to diglycidyl reactants). The term containing the ratio of the reaction rate constants for the addition of the secondary and primary amine hydrogens to the epoxide was included in the reduced reaction rate term for the autocatalyzed and catalyzed epoxide curing reactions. The changes in the integrated fluorescence intensities of the labels during the epoxy group conversion indicated, in some cases, the most important changes in the chemical transformations of the reaction mixture: the epoxy group conversion, during which a rapid increase in the tertiary amino group concentration was first observed; the gel point (for EDA); and the entry of the system into the glassy state (for N,N′-DMEDA and EDA). The fluorescence probes monitored neither the gel point nor the threshold of the glassy state. For the DGEBA–N,N′-DMEDA system, a wavy dependence of the integrated fluorescence intensities of the DNS labels on the epoxy group conversion might reflect the molar concentrations of polymer homologues (referred to the initial number of moles in the system) in the reaction mixtures of the diepoxide and secondary diamine. © 2003 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 64–78, 2004     

Preparation and thermomechanical properties of epoxy resins modified by octafunctional cubic silsesquioxane epoxides

The thermomechanical properties of octafunctional cubic silsesquioxane‐modified epoxy resins associated with dicycloaliphatic hardener (4,4′‐dimethyldiaminodicyclo hexyl methane) were studied using thermogravimetric analysis, differential scanning calorimetry, and dynamic mechanical analysis. The structures of epoxy resin containing cubic silsesquioxane epoxides were characterized by Fourier transform infrared spectroscopy and wide‐angle X‐ray scattering techniques. In this work, octa(dimethylsiloxybutylepoxide) octasilsesquioxane (OB), and octa(glycidyldimethyl‐siloxyepoxide) octasilsesquioxane (OG), were synthesized and used as additives to improve the properties of a commercial epoxy resin by exploring the effects of varying the ratio of OB or OG. The commercial Ciba epoxy resin (Araldite LY5210/HY2954) was used as a standard. It was found, by thermogravimetric analysis and dynamic mechanical analysis, that the highest thermal stability was observed at N = 0.5 (N = number of amine groups/number of epoxy rings). No glass transition temperature was observed by adding 20 mol % OB to the Ciba epoxy resin, indicating the reduction of chain motion in the presence of octafunctional cubic silsesquioxane epoxide. The storage modulus of the OB‐modified epoxy resin also increased, especially at higher temperatures, compared with the Ciba epoxy resin under identical curing conditions. Fourier transform infrared data elucidated the preservation of cubic silsesquioxane structure after curing at high temperature. In contrast, the OG/Araldite LY5210/HY2954 systems gave poorer thermomechanical properties. The low viscosity of OB at room temperature (～ 350 cPs) makes it suitable for composite processing and, when used in conjunction with the Ciba epoxy, lowers the viscosity of this system as well. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 3490–3503, 2004     

Spectroscopic characterization of the matrix–silane coupling agent interface in fiber-reinforced composites

The copolymerizations of anhydride-cured epoxy resin on fiberglass surfaces treated with a N-methylaminopropyltrimethoxysilane coupling agent has been investigated using Fourier-transform infrared spectroscopy. The structure of the interface of the silane and the resin in fiber-reinforced composites is composed of copolymers of the epoxy resin with the organofunctionality of the deposited silanes. The number of interfacial bonds formed depends on the amount of silane coupling agent deposited on the fiberglass and the reaction conditions. The silane induces additional esterification and increases the curing density of the epoxy matrix near the fiber surface by about 5–10% relative to the bulk resin.     

Acceleration of amine/epoxy reactions with N‐methyl secondary amines

Kinetic studies established that the monomethylation of a primary amine leads to significantly higher reaction rates with glycidyl ethers. The relative rates for approximately 25 amines were determined in an alcohol solvent under pseudo‐first‐order conditions (excess epoxy). The rates were referenced to aniline. For the aliphatic amines, reactivity consistently increased upon going from a primary amine to the corresponding N‐methyl secondary amine. This acceleration effect was not seen for aniline. The enhanced reactivity was also seen in curing systems, both with pure methylated amine curing agents and with complex mixtures obtained from the partial methylation of polyamines. Economically viable partially methylated amine curing agents were obtained by the reductive alkylation of commercial polyamines with formaldehyde and by the reaction of monomethylamine with 3‐(N‐methylamino)propionitrile in the presence of hydrogen and a hydrogenation catalyst. Although actual cure performance is based on a complex combination of several factors, the acceleration due to monomethylation could be a useful tool for enhancing amine/epoxy curing reactions. © 2000 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 38: 921–930, 2000     

Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

THE CURING BEHAVIOR OF DIGLYCIDYL-4, 5-EPOXYCYCLOHEXANE-1,2-DICARBOXYLATE

The curing behavior of diglycidyl-4, 5-epoxycyclohexane-1, 2-dicarboxylate with m-phenylenediamine has been studied by using torsional braid analysis. It is shown that the whole curing processproceeds in two stages, that is, curing reaction at temperatures below 100℃mainly occurs at the ali-phatic epoxy rings, whereas a rapid increase in reaction rate of the remaining cycloaliphatic epoxy ringoccurs only at temperatures above 130℃. Between the temperature range from 100℃to 130℃, the"full reaction" of the aliphatic epoxy rings is approximated, while the reaction rate of the cycloaliphaticepoxy ring begins to increase gradually. The maximum glass transition temperature (T_(g∞)) of the systemdoes not emerge before 220℃. The apparent activation energy is 13 .2 kcal/mole.     

Facile preparation of novel epoxy curing agents and their high‐performance thermosets

Two flame‐retardant epoxy curing agents, 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐tris(4‐hydroxyphenyl)methane (1) and 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐yl‐ (4‐aminophenyl)‐bis(4‐hydroxyphenyl)methane (2), were prepared by a facile, economic, one‐pot procedure. The structures of the curing agents were confirmed by IR, high‐resolution mass, 1‐D, and 2‐D NMR spectra. A reaction mechanism was proposed for the preparation, and the effect of electron withdrawing/donating effects on the stabilization of the carbocation was discussed. (1‐2) served as curing agents for diglycidyl ether of bisphenol A (DGEBA), dicyclopentadiene epoxy (HP‐7200), and cresol novolac epoxy (CNE). Properties such as glass transition temperature, coefficient of thermal expansion, thermal decomposition temperature, and flame retardancy of the resulting epoxy thermosets were evaluated. The resulting epoxy thermosets show high T_g, low thermal expansion, moderate thermostability, and excellent flame retardancy. The bulky biphenylene phosphinate pendant makes polymer chains difficult to rotate, explaining the high T_g and low thermal expansion characteristic. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7898–7912, 2008     

Advanced flame‐retardant epoxy resins from phosphorus‐containing diol

Phosphorus‐containing epoxy systems were prepared from isobutylbis(hydroxypropyl)phosphine oxide (IHPO) and diglycidyl ether of bisphenol A (DGEBA). Diethyl‐N,N‐bis(2‐hydroxyethyl) aminomethyl phosphonate (Fyrol 6) could not be incorporated into the epoxy backbone by a reaction with either epichlorohydrin or DGEBA because intramolecular cyclization took place. The curing behavior of the IHPO–DGEBA prepolymer with two primary amines was studied, and materials with moderate glass‐transition temperatures were obtained. V‐0 materials were obtained when the resins were tested for ignition resistance with the UL‐94 test. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3510–3515, 2005     

Thermal cured epoxy resins using certain calixarenes and their esterified derivatives as curing agents

The acetyl esterified calixarene (CA) derivatives were prepared from calix[4]resorcinarene (CRA), and p‐tert‐butylcalixarene (BCA[n], n = 4, 6, 8), respectively. Using these CA derivatives as curing agents, the thermal curing reactions of two multifunctional epoxy resins (jER 828, 186 g/equiv., and ESCN, 193.7 g/equiv.) were investigated. The temperatures of glass transition (T_g) and decomposition (T) were measured by DSC and TGA, respectively. Based on the yields, T_gs, and T_ds of the thermal cured jER 828 epoxy resin with CRA‐E100, the curing conditions were optimized to be tetrabutylphosphonium bromide (TBPB) as catalyst in NMP at 160 °C for 15 h. Under this curing condition, the cured materials of jER 828 or ESCN using various CA derivatives as curing agents were prepared. Except for BCA4 derivatives, the yields of thermal curing reaction were higher than 90%. T_gs and Ts of the resultant cured materials were in the range of 113–248 °C and 363–404 °C, respectively. These results mean that the cured epoxy resins with excellent T_gs were successfully formed by using CA derivatives as curing agents. It was also found that the T_gs of cured epoxy resins were strongly affected by the degree of esterification of CA derivatives. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 48: 1931–1942, 2010     

Benzoxazine modified diglycidyl ether of bisphenol-a/silicon/siliconized epoxy hybrid polymer matrices: Mechanical,thermal, electrical and morphological properties

Benzoxazines modified epoxy hybrid polymer matrices were developed using benzoxazines (CB_DDM and BMPB_DDM) and epoxy resins (DGEBA, SE and EP-HTPDMS) to make them suitable for high performance applications. The benzoxazine-epoxy hybrid polymer matrices were prepared via in-situ polymerization and were investigated for their thermal, thermo-mechanical, mechanical, electrical and morphological properties. Two types of skeletal modified benzoxazines namely 1,1-bis(3-methyl-4-hydroxyphenyl)cyclohexane benzoxazine (CB_DDM) and bis(4-maleimidophenyl) benzoxazine (BMPB_DDM) were synthesized by reacting paraformaldehyde and 4,4′-diaminodiphenylmethane with 1,1-bis (3-methyl-4-hydroxyphenyl)cyclohexane and N-(4-hydroxyphenyl)maleimide respectively. Epoxy resins viz., diglycidyl ether of bisphenol-A (DGEBA), silicon incorporated epoxy (SE) and siliconized epoxy resin (EP-HTPDMS) were modified with 5, 10 and 15 wt% of benzoxazines using 4,4′-diaminodiphenylmethane as a curing agent at appropriate conditions. The chemical reaction of benzoxazines with the epoxy resin was carried out thermally and the resulting product was analyzed by FT-IR spectra. The glass transition temperature, curing behavior, thermal stability, char yield and flame resistance of the hybrid polymers were analysed by means of DSC, TGA and DMA. Mechanical properties were studied as per ASTM standards. The benzoxazines modified epoxy resin systems exhibited lower values of dielectric constant and dielectric loss with an enhanced values of of arc resistance, glass transition temperatures, degradation temperatures, thermal stability, char yield, storage modulus, tensile strength, flexural strength and impact strength.     

Novel pyridinium salts as cationic thermal and photoinitiators and their photosensitization properties

Novel pyridinium salts [N‐(α‐phenylbenzyl)‐, N‐(1‐naphthylmethyl)‐, or N‐cinnamyl p‐ or o‐cyanopyridinium hexafluoroantimonates] were synthesized by the reaction of p‐ or o‐cyanopyridine and the corresponding bromides followed by anion exchange with KSbF₆. These pyridinium salts polymerized epoxy monomers at lower temperatures than previously reported for N‐benzyl‐2‐cyanopyridinium hexafluoroantimonate. The o‐substituted pyridinium salts showed higher activity than the p‐substituted ones, and the crosslinked epoxy polymers cured with these initiators showed higher glass‐transition temperatures. These pyridinium salts photoinitiated radical polymerization as well as cationic polymerization. The photopolymerization was accelerated by the addition of aromatic ketones as photosensitizers. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1037–1046, 2002     

Synthesis and characterization of an epoxy based thermoset containing a fluorinated thermoplastic

A novel fluorinated thermoplastic (FT) was synthesized from diglycidyl ether of bisphenol A (DGEBA), and 3‐(trifluoromethyl)aniline. FT was found to be miscible with DGEBA as shown by the existence of a single glass transition temperature (T_g) within the whole composition range. On the basis of several experimental techniques, it was found that upon heating etherification reaction takes place between FT and DGEBA. A DGEBA‐aromatic diamine (4,4′‐methylenebis(3‐chloro 2,6‐diethylaniline) formulation was modified with the FT. The influence of FT on the epoxy‐amine kinetics was investigated. Both structural parameters, gelation, and vitrification, were found to be affected by etherification reaction between epoxy and hydroxyls groups belonging to FT. The presence of ether linkages induced system stoichiometry modification. In addition, the curing conditions influence on FT migration towards the surface was studied on samples prepared with 20 wt % of modifier. SEM–EDX analysis confirmed that modified systems exhibits notable fluorine enrichment within the uppermost 200 μm. © 2007 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 45: 2781–2792, 2007     

Preparation and properties of high performance epoxy–silsesquioxane hybrid resins prepared using a maleimide–alkoxysilane compound as a modifier

An alkoxysilane compound possessing maleimide moiety (MSM) was prepared from N‐(4‐hydroxyphenyl)maleimide and 3‐glycidoxypropyltrimethoxysilane and was used as a modifier of epoxy resins. In situ curing epoxy resins with MSM resulted in epoxy resins with good homogeneity. Just 5–10 wt % of MSM is sufficient to yield high glass transition temperature (165 °C), good thermal stability above 360 °C, and high flame retardancy (LOI = 30) to bisphenol‐A‐based epoxy resins. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 5787–5798, 2005