窄脉宽激光诱导背向选择性去除金属薄膜制备微电路(特邀)EI北大核心CSCD

为了在透明基板上制备出导电性能良好的微电路,研究了窄脉宽激光正向和背向选择性去除金属薄膜制备的微结构形貌特征,开展了纳秒激光选择性去除Cu薄膜(厚度为150 nm)的实验和温度场仿真研究,揭示了正、背面去除的烧蚀机理和材料的喷射机制。实验结果表明,当激光脉冲能量为0.270~0.542μJ,扫描速度为2 mm/s时,激光诱导背向去除金属薄膜在加工质量方面优于正向加工,其去除几何精度高,轮廓边缘平整,几乎没有溅射。采用优化后的纳秒激光加工工艺参数,激光脉冲能量为0.403μJ,扫描速度2 mm/s,扫描线间距为3μm,制备出均匀分布的铜阵列图案。在相同参数下对玻璃基板上的铜薄膜背向选择性去除,得到具有良好导电性和粘附性的微电路。     

准分子激光电化学刻蚀金属的研究

为了探寻准分子激光电化学刻蚀工艺的特性,采用功率密度大的248nm准分子激光聚焦照射浸在溶液中的金属表面,实现了一种激光电化学刻蚀复合工艺。在实验的基础上,通过对激光电化学刻蚀金属和硅的基本形貌进行比较和分析,研究了该工艺的工艺特性。研究结果表明,该复合工艺为激光直接刻蚀和激光热诱导电化学刻蚀。其中激光热诱导电化学刻蚀是通过激光的光热效应和由激光诱导的冲击波来实现对腐蚀液和材料的冲击、微搅拌等作用的。     

准分子激光电化学刻蚀镍的特性研究

提出一种新的准分子激光电化学加工工艺,在阳极钝化区内,通过准分子激光照射,以实现无屏蔽的各向异性的微加工。对该工艺进行了可行性分析,并对其进行了初步试验,证实在钝化区,准分子激光导致刻蚀电流增加的幅度比较明显,在此基础上,深入研究了在准分子脉冲激光作用过程中,刻蚀电流与脉冲数、脉冲频率之间的关系。表明准分子激光在钝化区具有增强电化学特性的能力。     

基于激光毛化技术的5052铝合金粘接试验研究

为了提高5052铝合金的粘接性能,利用脉冲光纤激光的短脉冲和高峰值功率的特性,对铝合金试件进行了激光毛化试验研究。通过正交实验法,研究了平均功率、扫描速度、脉冲频率和脉冲宽度等工艺参数对激光毛化质量的影响,以及各工艺参数的影响权重,并求得最佳工艺参数,最佳工艺参数为平均功率90 W、扫描速度10 mm/s、脉冲频率1000 kHz、脉冲宽度200 ns。根据优化后的工艺参数,加工获得了粗糙度2.35 μm,然后对激光毛化后的铝合金试件进行单搭接拉伸试验,研究发现粘接强度随着粗糙度的增大而增大,当粗糙度到达一定程度时,粘接强度反而会随着粗糙度的增大而减小。另外,粘接强度还跟铝合金表面的微织构的类型及疏密程度都有很大关系。     

飞秒激光烧蚀氟化钙晶体表面特性

采用飞秒激光对氟化钙晶体表面进行加工。通过调控激光参数,采用静止聚焦和动态扫描两种方式在晶体表面加工出一系列微结构(烧蚀孔和烧蚀线)。分别对两种加工方式烧蚀后的氟化钙晶体表面微结构进行系统研究,包括参数依赖关系、材料表面烧蚀阈值等。计算结果表明:在静止聚焦情况下,累积因子为0.0033;在动态扫描情况下,当扫描方向与激光偏振方向垂直或平行时,累积因子分别为0.0043和0.0052。飞秒激光加工过程中的脉冲累积效应能够对晶体的烧蚀产生重要影响。     

短脉冲红外激光诱导等离子体微刻蚀单晶高温高压金刚石

采用短脉冲激光诱导等离子体辅助加工技术加工金刚石微结构,研究短脉冲红外激光的光强、脉宽、重复频率、靶材与金刚石基片之间的距离等加工参数对金刚石的加工线宽、槽深以及加工效果的影响.当用脉冲宽度大于4 ns的激光作用在方向良好的单晶金刚石上时,光热作用明显,诱导产生金属等离子团的能量密度达到一定阈值且复合短脉冲激光能量作用...     

激光应用 激光化学

O644．8 2005053422 准分子激光电化学刻蚀镍的特性研究=Experimental study on characteristic of Ni in excimet-laser induced elec- trochemical etching[刊,中]／周月豪(华中科技大学机械与 工程学院．湖北,武汉(430074)),柳海鹏…∥光学技术．- 2005,31(3)．-323-325,329 提出一种新的准分子激光电化学加工工艺,在阳极钝 化区内,通过准分子激光照射,以实现无屏蔽的各向异性 的微加工。对该工艺进行了可行性分析,并对其进行了初 步试验,证实在钝化区,准分子激光导致刻蚀电流增加的 幅度比较明显。在此基础上,深入研究了在准分子脉冲激 光作用过程中,刻蚀电流与脉冲数、脉冲频率之间的关系。 表明准分子激光在钝化区具有增强电化学特性的能力。 图4参8(严寒)     

镍金属表面双光束激光干涉直写研究

利用波长为351 nm的半导体抽运全固态脉冲激光器,采用双光束干涉方法,对金属镍板表面直接刻蚀形成微光栅结构的方法进行了实验研究.通过改变激光功率和激光脉冲数等实验参量,研究其对制备的微光栅结构槽形和一级衍射效率的影响.利用扫描电镜和原子力显微镜测量光栅槽形,测得光栅周期为1.25 μm,光栅槽深为10～280 nm,并测量了相应的衍射效率.发现当采用激光单脉冲能量为1.2 mJ,采用10个脉冲加工时,测得槽深为280 nm,一级衍射效率最高（18%）的微光栅结构.利用光栅的衍射理论对衍射效率变化进行了分析.该研究拓展了纳秒激光在加工微结构方面的应用,为在金属材料表面制作纳米压印模版提供了一种新方法.     

贴膜条件下飞秒激光诱导硅基表面锥状微结构

利用波长为800 nm的飞秒脉冲激光,对表面贴有聚对苯二甲酸乙二醇酯透明膜的单晶硅片进行扫描,研究了不同激光制备参数对微结构形成的影响.结果表明,锥状微结构是否形成取决于激光能量密度,能量密度太小时不能形成锥状结构,能量密度太大时易破坏锥状突起;而激光扫描速度可直接影响锥状微结构的质量,扫描速度太小时也易破坏锥状结构突起,扫描速度太大时,由于作用深度太浅使得锥状结构轮廓不分明.在此基础上对实验参数进行优化,得到了较理想的锥状微结构.最后通过分析指出,贴膜条件下锥状微结构的形成是由激光烧蚀作用和氧化作用共同引起的,且激光烧蚀作用占主导.     

非晶硅薄膜太阳能电池的紫外激光刻蚀工艺

为提高电池的光电转换效率,通过改善激光刻蚀工艺,采用355 nm紫外纳秒激光分别进行了ZnO:Al薄膜（AZO）刻蚀（P1）、非晶硅薄膜（-Si）刻蚀（P2）和背电极刻蚀（P3）研究。采用万用表测量P1隔离电阻,采用电子扫描显微镜（SEM）和三维激光扫描仪测量刻槽的微结构和三维成像,激光拉曼散射光谱检测非晶硅薄膜刻蚀边缘的晶化。实验结果表明,当刻蚀速度600 mm/s,重复频率40 kHz,功率1.74 W的紫外激光刻蚀ZnO:Al薄膜时,刻槽的隔离效果最佳,达20 M; 紫外激光刻蚀能够有效地减小激光热效应引起的热影响和刻槽边缘的晶化范围,提高非晶硅薄膜电池的性能。     

Analysis of machining characteristics in electrochemical etching using laser masking

Electrochemical etching using laser masking (EELM), which is a combination of laser beam irradiation for masking and electrochemical etching, allows the micro fabrication of stainless steel without photolithography technology. The EELM process can produce various micro patterns and multilayered structures. In this study, the machining characteristics of EELM were investigated. Changes in characteristics of recast layer formation and the protective effect of the recast layer according to the laser masking conditions and electrochemical etching conditions were investigated by field emission scanning electron microscopy (FE-SEM), focused ion beam (FIB) and X-ray photoelectron spectroscopy (XPS). The oxidized recast layer with a thickness of 500 nm was verified to yield a superior protective effect during electrochemical etching and good form accuracy. Finally, micro patterns and structures were fabricated by EELM.     

Study of laser carving three-dimensional structures on ceramics: Quality controlling and mechanisms

Three-dimensional (3D) laser carving is a new, very flexible process and is very useful for machining the hard and/or brittle materials such as ceramics, carbide and hardened steel with high precision, excellent productivity and surface quality. In this paper, the effects of laser processing parameters on single-layer carving depth and surface quality are analyzed by laser carving on an Al₂O₃ ceramic with different processing parameters. The mechanisms of laser carving are also studied. A mathematical model of the relationship between the laser processing parameters and the laser carving depth is established, which is useful in obtaining the best machining parameters with the shortest time. Finally, a 3D pattern is successfully carved using the optimum parameters.     

Development of the new IC decapsulation technology

An IC is generally decapsulated with wet etching technology. The influences of environment and worker's health in usage and waste of the chemicals are seen as problems. Improvement of processing time is also needed. In order to overcome them, the laser processing technology is applied to IC decapsulation. In this paper, the relationship between processing condition and the processed surface quality is reported to select a suitable laser source. In addition, the new IC decapsulation technology, which is the combination of laser and wet etching, is proposed. To achieve the complex machining, firstly, the method of measuring the reflection light intensity of the laser is proposed to estimate the residual molding thickness. Secondly, the relationship between intensity of reflected laser and mold thickness to IC is shown to construct a mold thickness monitoring system. Finally, processing time and the volume of chemical solution used a process are compared with a conventional wet etching process.     

Precise etching of fused silica for refractive and diffractive micro-optical applications

One of the challenges of current laser material processing is the high-quality etching of transparent materials for micro-optical applications. The ablation of transparent materials with UV-, ultrashort pulse and even of VUV-lasers is characterized by a high etch rate and a high laser fluence and causes considerable surface roughness evolution. The combination of specific laser processing techniques, e.g., scanning contour mask technique and direct writing with a small laser spot, with laser-induced backside wet etching (LIBWE) allows the direct machining of dielectric materials with an almost optical quality for the fabrication of diffractive as well as refractive topographic features. The etching of multi-level elements, gratings with variable depth, micro-lenses as well as free-form surface topographies with PV-values from some 100 nm to a few micrometers, a nanometer depth accuracy and a low roughness of less than 10 nm rms is presented and demonstrates the capabilities of this approach for precision engineering.     

The study of the solution concentration influencing on laser-induced electrochemical etching silicon

The laser electrochemical etching process, which combines the laser direct etching process and the electrochemical etching process, is a compound etching technique. In order to further understand the solution concentration influencing on the laser-induced electrochemical etching of silicon; a 248 nm excimer laser as a light source and KOH solution as an electrolyte were adopted in this study. The experiments of micromachining silicon by laser-induced electrochemical etching were carried out. On the basis of the experiments results, the solution concentration influencing on the etching rates in the process of laser electrochemical etching of silicon was researched. The reasons of the etching phenomena were analyzed in detail. The experimental results indicate that the solution concentration influencing on the etching process is mainly rooted in the absorption of different concentration solutions to laser. In general, less absorption and low solution concentration are good for the etching role in the process of laser electrochemical etching.     

数值模拟980nm锥形半导体激光器输出特性

具有高功率及高亮度激光特性的锥形半导体激光器在激光加工、自由空间通信、医疗等领域具有广泛的应用前景.本文基于广角差分光束传播法(WA-FD-BPM),对980 nm锥形半导体激光器进行了仿真模拟,详细分析了不同结构参数(脊形区刻蚀深度、锥形角度、不同脊形区/锥形区长度比、锥形区刻蚀深度、前腔面反射率)对器件光束质量和P...     

Chemically assisted femtosecond laser machining for applications in LiNbO3 and LiTaO3

We introduce and optimize a fabrication procedure that employs both femtosecond laser machining and hydrofluoric acid etching for cutting holes or voids in slabs of lithium niobate and lithium tantalate. The fabricated structures have 3 μm lateral resolution, a lateral extent of at least several millimeters, and cut depths of up to 100 μm. Excellent surface quality is achieved by initially protecting the optical surface with a sacrificial silicon dioxide layer that is later removed during chemical etching. To optimize cut quality and machining speed, we explored various laser-machining parameters, including laser polarization, repetition rate, pulse duration, pulse energy, exposure time, and focusing, as well as scanning, protective coating, and etching procedures. The resulting structures significantly broaden the capabilities of terahertz polaritonics, in which lithium niobate and lithium tantalate are used for terahertz wave generation, imaging, and control. The approach should be applicable to a wide range of materials that are difficult to process by conventional methods.     

Electrochemical machining of super-hydrophobic Al surfaces and effect of processing parameters on wettability

Super-hydrophobic aluminum (Al) surfaces were successfully fabricated via electrochemical machining in neutral NaClO₃ electrolyte and subsequent fluoroalkylsilane (FAS) modification. The effects of the processing time, processing current density, and electrolyte concentration on the wettability, morphology, and roughness were studied. The surface morphology, chemical composition, and wettability of the Al surfaces were investigated using scanning electron microscopy (SEM) equipped with energy-dispersive spectroscopy (EDS), white-light interferometry, roughness measurements, X-ray diffraction (XRD), Fourier-transform infrared spectrometry (FTIR), and optical contact angle measurements. The results show that hierarchical rough structures and low surface energy films were present on the Al surfaces after electrochemical machining and FAS modification. The combination of the rough structures and the low surface energy materials plays a crucial role in achieving super-hydrophobicity. Compared with the anodic oxidation and chemical etching method, the method proposed in our work does not require strong acid or alkali, and causes less harm to the environment and operators but with high processing efficiency. The rough structures required by the super-hydrophobic surfaces were obtained at 30-s processing time and the best super-hydrophobicity with 164.6^° water contact angle and 2^° tilting angle was obtained at 360 s. The resulting super-hydrophobic Al surfaces have a long-time stability in air and an excellent resistance to corrosive liquids.     

Crackless linear through-wafer etching of Pyrex glass using <Emphasis Type="Italic">liquid-assisted</Emphasis> CO<Subscript>2</Subscript> laser processing

Pyrex glass etching is an important technology for the microfluid application to lab-on-a-chip devices, but suffers from very low etching rate and mask-requiring process in conventional HF/BOE wet or plasma dry etching as well as thermal induced crack surface by CO₂ laser processing. In this paper, we applied the liquid-assisted laser processing (LALP) method for linear through-wafer deep etching of Pyrex glass without mask materials to obtain a crackless surface at very fast etching rates up to 25 μm/s for a 20 mm long trench. The effect of laser scanning rate and water depth on the etching of the 500 μm thick Pyrex glass immersed in liquid water was investigated. The smooth surface without cracks can be achieved together with the much reduced height of bulge via an appropriate parameter control. A mechanism of thermal stress reduction in water and shear-force-enhanced debris removal is discussed. The quality improvement of glass etching using LALP is due to the cooling effect of the water to reduce the temperature gradient for a crackless surface and natural convection during etching to carry away the debris for diminishing bulge formation. An erratum to this article can be found at