液相外延碲镉汞材料组分均匀性改善

由碲镉汞薄膜材料的厚度不均匀性入手,改进水平滑舟液相外延工艺,从而改善了碲镉汞薄膜材料组分均匀性,使距薄膜边缘1.5 mm（衬底边缘2.5 mm）以内的薄膜材料组分均匀性得到了长足的提高,增大了薄膜材料用于制备焦平面器件的利用率。中波碲镉汞材料（?1/2(77 K)＝4.8?m）?x≤0.001,与国外水平相当。     

用椭圆偏振测量法分析碲镉汞的组分及其均匀性

简略介绍了椭偏仪的测量原理和测量装置。分析了Hg1-xCdxTe(MCT)的 组分与椭偏仪的参数Δ和ψ之间的关系,结果发现碲镉汞的组分x主要与椭偏仪的参数ψ有关,而且x与ψ的经验关系为ψ＝14．84－10.22x。最后椭圆偏振测量的方法分析了碲镉汞的横向和纵向组分均匀性。该方法具有非破坏性、有效、快捷的特点。     

碲镉汞的液相外延生长

设计了一种使用良好的石墨舟,建立了一套能进行开管液相外延的系统,并利用此系统在CdZnTe衬底上和在富Te的生长条件下生长了不同x值的HgCdTe外延薄膜.通过对外延生长工艺的控制,外延薄膜的表面形貌有很大的改善,残留母液大为减少,外延薄膜的组分比较均匀,其电学性能得到较大改善,HgCdTe外延薄膜与CdZnTe衬底之间的互扩散非常少,外延膜的晶体结构也较完整.     

碲镉汞的液相外延生长

设计了一种使用良好的石墨舟 ,建立了一套能进行开管液相外延的系统 ,并利用此系统在 Cd Zn Te衬底上和在富 Te的生长条件下生长了不同 x值的 Hg Cd Te外延薄膜 .通过对外延生长工艺的控制 ,外延薄膜的表面形貌有很大的改善 ,残留母液大为减少 ,外延薄膜的组分比较均匀 ,其电学性能得到较大改善 ,Hg Cd Te外延薄膜与Cd Zn Te衬底之间的互扩散非常少 ,外延膜的晶体结构也较完整 .     

液相外延碲镉汞贯穿型缺陷研究

液相外延碲镉汞材料的贯穿型缺陷会在后续器件制备中导致多个盲元的形成。采用共聚焦显微镜对该类缺陷的深度进行了表征,并对缺陷底部的成分进行了测试。使用聚焦离子束(Focused Ion Beam, FIB)将缺陷挖开后对其进行观察。对于贯穿型缺陷较多的碲锌镉衬底外延生长碲镉汞薄膜,统计后发现碲镉汞表面的贯穿型缺陷与衬底缺陷存在一定的对应关系,因此推测液相外延贯穿型缺陷起源于碲锌镉衬底缺陷。     

碲镉汞富碲垂直液相外延技术

研究了碲镉汞富碲垂直液相外延技术.在研究该关键技术的过程中,提出了一种方法以检查外延前(Hg1-xCdx)1-yTey母液的均匀性.并且,通过减小生长腔体中的自由空间,对气体的对流和汞回流进行了抑制,及通过改进工艺过程中的温度控制方式来应对因对流和汞回流而造成的生长温度不确定性.在解决上述关键技术后,实现了碲镉汞垂直液相外延工艺的稳定性,所外延的中波碲镉汞材料的组分可重复性做到了±0.005,厚度控制能力达到了±5μm ,40×30mm2外延材料的横向组分均匀性(相对均方差)小于1.3×10-3,同生长批次材料片与片之间的组分和厚度差异分别小于0.001和1μm.在10mm线度上,表面起伏小于1μm.经热处理后,中波汞空位p型材料在77K下具有较高的空穴迁移率.另外,和水平推舟技术相比,垂直碲镉汞液相外延在提供大批量和大面积相同性能材料方面具有明显的优势,这对于二代碲镉汞红外焦平面批生产技术和拼接型超大规模红外焦平面技术的发展都具有重要的意义.     

昆明物理研究所大面积水平推舟液相外延碲镉汞薄膜技术进展

报道了近年来昆明物理研究所在富碲水平推舟液相外延碲镉汞外延薄膜制备技术方面的进展。2019年以来,突破了?120 mm碲锌镉晶体定向生长技术,使碲锌镉衬底沉积相和夹杂相密度≤5×103 cm－2,位错腐蚀坑密度（EPD）≤4.0×104 cm－2,?120 mm（111）晶圆衬底的Zn组份分布极差≤0.36%。基于碲锌镉衬底技术的进步,液相外延碲镉汞薄膜的最大生长尺寸达到了70 mm×75 mm,薄膜位错腐蚀坑密度均值为5×104 cm－2,X射线双晶回摆曲线半峰宽（DCRC-FWHM）≤35 arcsec,部分可控制到25 arcsec以下;50 mm×60 mm尺寸长波碲镉汞薄膜的厚度极差≤±1.25 μm,室温截止波长极差≤±0.1 μm,中波碲镉汞薄膜相应指标分别为≤±1 μm、≤±0.05 μm。材料技术的进展促进了制冷型碲镉汞探测器产能提升和成本的降低,也支撑了高性能长波/甚长波探测器、高工作温度（HOT）探测器以及2048×2048、4096×4096等甚高分辨率高性能探测器的研制。     

液相外延原位Au掺杂碲镉汞薄膜材料的研究

通过液相外延方法,在碲锌镉衬底上制备了原位Au掺杂碲镉汞薄膜材料,采用金相显微镜、X光双晶衍射仪、二次离子质谱仪、Hall测试、少子寿命测试等手段对Au掺杂的碲镉汞薄膜材料进行了表征,外延片的表面形貌、晶格质量等和常规的碲镉汞外延材料基本相当,少子寿命较常规材料提高至少一个量级,芯片R0A提高至少5倍,并成功制备出了截止波长为10 μm的256×256探测器芯片,响应率非均匀性为2.85%,有效像元率为99.2%。     

碲镉汞外延晶膜的不稳定性

利用变温和变磁场霍尔测试对在空气室温环境长期存放的碲镉汞液相处延晶膜作了定期的检测，结果表明，晶膜的电学性质随时间有明显的改变，本文采用非均匀晶膜的层状模型对晶膜的不稳定性作了详细的分析。     

液相外延HgCdTe薄膜组分的均匀性

利用水平推舟液相外延法,以CdZnTe作为衬底,固态HgTe作为Hg补偿源,从富Te-HgCdTe溶液中外延生长大面积HgCdTe薄膜.通过选择合适的温度和生长速率,获得了组分均匀性和重复性较好的大面积长波HgCdTe薄膜.     

Surface structure of (111)A HgCdTe

The surface of (111)A HgCdTe has been studied by reflection high-energy electron diffraction and atomic force microscopy (AFM). The as-grown liquid-phase epitaxy (LPE) surface has bilayer (3.7 ± 0.2 Å) step/terrace structures, macro-steps, and cross-hatch patterns. Macro-steps occur about the $[11\bar 2]$ and are from 10–40 Å in height. AFM and x-ray measurements indicate the as-grown epilayer is ≈0.2° off-cut (random polar angle) from the (111). 〈110〉 cross-hatch lines consistent with bilayer (step height=3.9 ± 0.2 Å) {111} slip dislocation are observed. The native oxide/carbon layer for the as-grown LPE (111)A HgCdTe is ≈8 Å. The experimental results suggest that the as-grown LPE surface approximates an equilibrium vicinal crystal structure. The 0.1% Br:ethylene glycol wet chemically etched surfaces retained the macro-step structure, but numerous small protrusions (10–100 Å height, ≈300 Å diameter) developed. The plasma-etched (111)A HgCdTe surface is crystalline, but exhibits surface disorder and is roughened.     

Composition and thickness control of thin LPE HgCdTe layers using x-ray diffraction

Double-axis x-ray rocking curve measurements have been used to nondestructively characterize the composition profile of HgCdTe heterojunction photodiode structures grown by liquid phase epitaxy (LPE). In particular, the thickness and composition profile of the thin graded-composition cap layer are determined through an empirical correlation between rocking curve parameters and composition profiles measured by SIMS. Spatial maps of cap layer thickness and composition are generated from automated measurements of x-ray rocking curves across a wafer. X-ray mapping has been instrumental in improving the spatial uniformity of cap layers and in maintaining control of the growth process in Hg-rich LPE dipping reactors.     

液相外延HgCdTe薄膜组分均匀性的研究

用水平推舟液相外延的方法，以CdZnTe作衬底，固态HgTe作为Hg补偿源，从富Te-HgCdTe溶液中外延生长大面积HgCdTe薄膜。通过选择合适的温度控制和生长速率，获得组分均匀性和重复性较好的大面积长波HgCdTe薄膜。     

HgCdTe体晶的组份均匀性分析

利用ＳＰＲＩＴＥ探测器的截止波长研究了布里奇曼、Ｔｅ溶剂和固态再结晶３种方法制备的ＨｇＣｄＴｅ体晶组份的均匀性。实验结果表明：３种方法生长的ＨｇＣｄＴｅ晶片的组份均匀性大致相当。用任意一种材料研制的一个８条ＳＰＲＩＴＥ探测器,其任意２条的截止波长差不大于０．８μｍ的概率大于９８％。     

Recent developments of high-complexity HgCdTe focal plane arrays at leti infrared laboratory

In this article, we present recent developments of the research in France at LETI infrared laboratory in the field of complex third-generation HgCdTe IRCMOS focal plane arrays (FPAs). We illustrate this with three prototypes of FPAs made at LETI, which have involved some technological improvements from the standard process today in production at Sofradir. We present, using molecular-beam epitaxy (MBE) growth, a 128 × 128 dual-band infrared (photodetector)-complementary metal oxide semiconductor (IRCMOS) with a pitch of 50 μm operating within 2–5 μm. Using the more conventional liquid-phase epitaxy (LPE) growth, we show a new generation of high-performance long linear arrays (1500 × 2; pitch, 30 μm) operating in medium-wavelength infrared (MWIR) or long-wavelength infrared (LWIR) bands based on a modular architecture of butted HgCdTe detection circuit and SiCMOS multiplexers. Finally, we present for the first time a megapixel (1000 × 1000) FPA with a pitch of 15 μm operating in the MWIR band that exhibits a very high performance and pixel operability.     

Te-rich liquid phase epitaxial growth of HgCdTe on Si-based substrates

The growth of high quality (111)B oriented HgCdTe layers on CdZnTe/GaAs/Si and CdTe/Si substrates by Te-rich slider liquid phase epitaxy (LPE) is reported. Although the (111) orientation is susceptible to twinning, a reproducible process yielding twin-free layers with excellent surface morphology has been developed. The electrical properties and dislocation density in films grown on these substrates are comparable to those measured in HgCdTe layers grown on bulk CdTe substrates using the same LPE process. This is surprising in view of the large lattice mismatch that exists in these systems. We will report details of both the substrate and HgCdTe growth processes that are important to obtaining these results.     

Investigation of HgCdTe p-n device structures grown by liquid-phase epitaxy

The microstructure of p-n device structures grown by liquid-phase epitaxy (LPE) on CdZnTe substrates has been evaluated using transmission electron microscopy (TEM). The devices consisted of thick (∼21-μm) n-type layers and thin (∼1.6-μm) p-type layers, with final CdTe (∼0.5 μm) passivation layers. Initial observations revealed small defects, both within the n-type layer (doped with 8×10¹⁴/cm³ of In) and also within the p-type layer but at a much reduced level. These defects were not visible, however, in cross-sectional samples prepared by ion milling with the sample held at liquid nitrogen temperature. Only isolated growth defects were observed in samples having low indium doping levels (2×10¹⁴/cm³). The CdTe passivation layers were generally columnar and polycrystalline, and interfaces with the p-type HgCdTe layers were uneven. No obvious structural changes were apparent in the region of the CdTe/HgCdTe interfaces as a result of annealing at 250°C.     

From Long Infrared to Very Long Infrared Wavelength Focal Plane Arrays Made with HgCdTe n + n ?/ p Ion Implantation Technology

This paper aims at studying the feasibility of very long infrared wavelength (VLWIR) (12–18 μm) focal plane arrays using n-on-p planar ion-implanted technology. To explore and analyze the feasibility of such VLWIR detectors, a set of four Cd _x Hg_1−x Te LPE layers with an 18 μ cutoff at 50 K has been processed at Defir (LETI/LIR–Sofradir joint laboratory), using both our “standard” n-on-p process and our improved low dark current process. Several 320 × 256 arrays, 30-μm pitch, have been hybridized on standard Sofradir readout circuits and tested. Small dimension test arrays characterization is also presented. Measured photonic currents with a 20°C black body suggest an internal quantum efficiency above 50%. Typical I(V) curves and thermal evolution of the saturation current are discussed, showing that standard photodiodes remain diffusion limited at low biases for temperatures down to 30 K. Moreover, the dark current gain brought by the improved process is clearly visible for temperatures higher than 40 K. Noise measurements are also discussed showing that a very large majority of detectors appeared background limited under usual illumination and biases. In our opinion, such results demonstrate the feasibility of high-performance complex focal plane arrays in the VLWIR range at medium term.     

HgCdTe液相外延材料组分分布的红外透射光谱评价技术

对红外透射光谱法测定HgCdTe液相外延材料纵向组分分布技术进行了深入的研究.红外透射光谱的理论计算采用了王庆学提出的组分分布模型,并考虑了光穿越组分梯度区时产生的干涉效应.通过测量同一样品在不同外延层厚度下的一组红外透射光谱,该方法的有效性得到了实验验证.进一步对组分模型中参数(即外延总厚度、组分互扩散区厚度、材料表面组分和HgCdTe层组分梯度)的拟合方法进行了讨论,并确定了各拟合参数的拟合精度.结果显示,该方法可作为测定HgcdTe液相外延材料组分特性的一种有效的测试评价技术.