Effect of P/Si polymeric silsesquioxane and the monomer compound on thermal properties of epoxy nanocomposite

The unique polymeric silsesquioxane/4,4′-diglycidyether bisphenol A (DGEBA) epoxy nanocomposites have been prepared by sol-gel method. The structure of nanocomposites was characterized by attenuated total reflectance (ATR) and solid state ²⁹Si NMR. The characteristic intensity of trisubstituted (T) structure was higher than that of tetrasubstituted (Q) structure from solid state ²⁹Si NMR spectra of 3-isocyanatopropyltriethoxysilane (IPTS) modified epoxy. The activation energies of curing reaction of epoxy system and IPTS modified epoxy system are 28-66 kJ/mol and 57-75 kJ/mol, respectively, by Ozawa’s and Kissinger’s methods. The triethyoxysilane side chain of IPTS modified epoxy might interfere the curing reaction of epoxy/amine and increase the activation energy of curing. The thermal degradation of nanocomposites was investigated by Thermogravimetric analysis (TGA). The char yield of nanocomposites was proportional to the 2-(diphenylphosphino)ethyltriethoxysilane (DPPETES) moiety content at high temperature. A higher char content could inhibit thermal decomposition dramatically and enhance the thermal stability. Moreover, the nanocomposites possess high optical transparency.     

Understanding of thermal/thermo-oxidative degradation kinetics of polythiophene nanoparticles

The polythiophene nanoparticles (nano-PT) were prepared with average diameter of 20–35 nm. The nanostructurals of polythiophene were confirmed by TEM and SEM analyzes. The kinetics of the thermal degradation and thermal oxidative degradation of nano-PT were investigated by thermogravimetric analysis. Kissinger method, Flynn–Wall–Ozawa method, and advanced isoconversional method have been used to determine the activation energies of nano-PT degradation. The results showed that the thermal stability of nano-PT in pure N₂ is higher than that in air atmosphere. The analyzes of the solid-state processes mechanism of nano-PT by Criado et al. method showed: the thermal degradation process of nano-PT goes to a mechanism involving second-order (F ₂ mechanism); otherwise, the thermo-oxidative degradation process of nano-PT is corresponding to a phase boundary controlled reaction mechanism (R ₂ mechanism).     

A thermal degradation mechanism of polyvinyl alcohol/silica nanocomposites

The thermal degradation mechanism of a novel polyvinyl alcohol/silica (PVA/SiO₂) nanocomposite prepared with self-assembly and solution-compounding techniques is presented. Due to the presence of SiO₂ nanoparticles, the thermal degradation of the nanocomposite, compared to that of pure PVA, occurs at higher temperatures, requires more reaction activation energy (E), and possesses higher reaction order (n). The PVA/SiO₂ nanocomposite, similar to the pure PVA, thermally degrades as a two-step-degradation in the temperature ranges of 300-450 °C and 450-550 °C, respectively. However, the introduction of SiO₂ nanoparticles leads to a remarkable change in the degradation mechanism. The degradation products identified by Fourier transform infrared/thermogravimetric analysis (FTIR/TGA) and pyrolysis-gas chromatography/mass spectrometric analysis (Py-GC/MS) suggests that the first degradation step of the nanocomposite mainly involves the elimination reactions of H₂O and residual acetate groups as well as quite a few chain-scission reactions. The second degradation step is dominated by chain-scission reactions and cyclization reactions, and continual elimination of residual acetate groups is also found in this step.     

Studies on thermal, mechanical and morphological behaviour of caprolactam blocked methylenediphenyl diisocyanate toughened bismaleimide modified epoxy matrices

Diglycidyl ether of bisphenol A epoxy resin (DGEBA, LY 556) was toughened with 5%, 10% and 15% (by wt) of caprolactam blocked methylenediphenyl diisocyanate (CMDI) using 4,4′-diaminodiphenylmethane (DDM) as curing agent. The toughened epoxy resin was further modified with chemical modifier N,N′-bismaleimido-4,4′-diphenylmethane (BMI). Caprolactam blocked methylenediphenyl diisocyanate was synthesized by the reaction of caprolactam with methylenediphenyl diisocyanate in presence of carbon tetrachloride under nitrogen atmosphere. Thermal properties of the developed matrices were characterized by means of differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), heat distortion temperature (HDT) and dynamic mechanical analysis (DMA). Mechanical properties like tensile strength, flexural strength and impact strength were tested as per ASTM standards. The glass transition temperature (T_g) and thermal stability were decreased with increase in the percentage incorporation of CMDI. The thermomechanical properties of caprolactam blocked methylenediphenyl diisocyanate toughened epoxy resin were increased by increasing the percentage incorporation of bismaleimide. The values of impact strength for epoxy resin were increased with increase in the percentage concentration of CMDI. The homogeneous morphology of CMDI toughened epoxy resin and bismaleimide modified CMDI toughened epoxy resin system were ascertained from scanning electron microscope (SEM).     

Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocomposites

Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol‐A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF₃MEA). BF₃MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and ²⁹Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF₃MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4′‐diaminodiphenysulfone (DDS). The thermal‐cured epoxy–nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA–DDS–BF₃MEA‐cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS‐cured epoxy–nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757–768, 2006     

Investigation on the thermal degradation of acrylic polymers with fluorinated side-chains

The thermal degradation of poly-2,2′,3,3′,4,4′,5,5′,6,6′,7,7′,7″-tridecafluoroheptylacrylate and poly-2,2′,3,3′,4,4′,5,5′,6,6′,7,7′-dodecafluoroheptylmethacrylate has been studied in isothermal conditions at 450-750 °C using pyrolysis-gas chromatography. The type and composition of the pyrolysis products give useful information about mechanism of thermal degradation. It was shown that the main thermal degradation process for both polymers is random main-chain scission. The major degradation products for fluorinated polyacrylate are monomer, dimer, saturated diester, trimer, and corresponding methacrylate. The fluorinated polymethacrylate gives monomer as the main product of thermal destruction. As a result of side-chain reaction, the thermal degradation of the fluorinated polyacrylate also produces remarkable amounts of alcohol. On the other hand, the respective alcohol is only a minor component among the pyrolysis products of the fluorinated polymethacrylate. For both polymers, the main nontrivial degradation product coming from the alkyl ester decomposition is the corresponding fluorinated cyclohexane. The formation of the fluorinated cyclohexanes may be accounted for a nucleophilic bimolecular substitution pathway.     

Effect of ZnO nanoparticles on the thermal and mechanical properties of epoxy-based nanocomposite

Effect of ZnO nanoparticles particles on the mechanical properties and the curing behavior of an epoxy nanocomposite were studied. Nanocomposites were prepared using different loadings of pre-dispersed ZnO nanoparticles having an average size of 40 nm. The surface topography and morphology of the nanocomposites were studied using atomic force microscope (AFM). The mechanical properties of nanocomposites were studied using analytical techniques including dynamic mechanical thermal analysis and micro-Vickers hardness. Effects of ZnO nanoparticles on the curing behavior of these nanocomposites were investigated utilizing isothermal and non-isothermal differential scanning calorimeter techniques. In addition, chemical compositions of coatings containing different ZnO nanoparticles contents were studied using a Fourier transform inferred. It was found that, ZnO nanoparticles can effectively influence the mechanical properties of epoxy coating. In addition, lower curing degrees, and therefore crosslinking density of epoxy coating including higher ZnO nanoparticles were obtained. This effect was completely different at low and high loadings of the particles.     

Kinetics studies on the accelerated curing of liquid crystalline epoxy resin/multiwalled carbon nanotube nanocomposites

A new class of nanocomposite has been fabricated from liquid crystalline (LC) epoxy resin of 4,4′‐bis(2,3‐epoxypropoxy) biphenyl (BP), 4,4′‐diamino‐diphenyl sulfone (DDS), and multiwalled carbon nanotubes (CNTs). The surface of the CNTs was functionalized by LC epoxy resin (ef‐CNT). The ef‐CNT can be blended well with the BP that is further cured with an equivalent of DDS to form nanocomposite. We have studied the curing kinetics of this nanocomposite using isothermal and nonisothermal differential scanning calorimetry (DSC). The dependence of the conversion on time can fit into the autocatalytic model before the vitrification, and then it becomes diffusion control process. The reaction rate increases and the activation energy decreases with increasing concentration of the ef‐CNT. At 10 wt % of ef‐CNT, the activation energy of nanocomposite curing is lowered by about 20% when compared with the neat BP/DDS resin. If the ef‐CNT was replaced by thermal‐insulating TiO₂ nanorods on the same weight basis, the decrease of activation energy was not observed. The result indicates the accelerating effect on the nanocomposite was raised from the high‐thermal conductivity of CNT and aligned LC epoxy resin. However, at ef‐CNT concentration higher than 2 wt %, the accelerating effect of ef‐CNTs also antedates the vitrification and turns the reaction to diffusion control driven. As the molecular motions are limited, the degree of cure is lowered. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys, 2011     

Curing reaction characteristics and phase behaviors of biphenol type epoxy resins with phenol novolac resins

Diglycidyl ether of 4,4′-dihydroxybiphenol (BPDGE) is a liquid crystalline epoxy. The biphenyl epoxy (diglycidyl ether of 3,3′,5,5′-tetramethyl-4,4′-biphenyl, TMBPDGE) has found great applications in plastic encapsulated semiconductor packaging. Phenol novolac (PN) was used as curing agent. The reaction kinetics of BPDGE/PN and TMBPDGE/PN systems in the presence of triphenylphosphine (TPP) were characterized by an isoconversional method under dynamic conditions using differential scanning calorimetry (DSC) measurements. The results showed that the curing of epoxy resins involves different reaction stages and the values of activation energy are dependent on the degree of conversion. The effects of curing temperature on their phase structure have been investigated with polarized optical microscopy and Wide-angle X-ray diffraction. With proper curing process, BPDGE showed a nematic phase when cured with PN.     

Kinetics and thermal properties of epoxy resins based on bisphenol fluorene structure

The fluorene-containing epoxy, diglycidyl ether of 9,9-bis(4-hydroxyphenyl) fluorene (DGEBF) was synthesized by a two-step reaction procedure. In order to investigate the relationship between fluorene structure and material properties, DGEBF and a commonly used diglycidyl ether of bisphenol A (DGEBA) were cured with 4,4-diaminodiphenyl methane (DDM) and 4,4-(9-fluorenylidene)-dianiline (FDA). The curing kinetics, thermal properties and decomposition kinetics of these four systems (DGEBA/DDM, DGEBF/DDM, DGEBA/FDA, and DGEBF/FDA) were studied in detail. The curing reactivity of fluorene epoxy resins was lower, but the thermal stability was higher than bisphenol A resins. The onset decomposition temperature of cured epoxy resins was not significantly affected by fluorene structure, but the char yield and T_g value were increased with that of fluorene content. Our results indicated that the addition of fluorene structure to epoxy resin is an effective method to improve the thermal properties of resins, but excess fluorene ring in the chain backbone can depress the curing efficiency of the resin.     

Benzoxazine modified diglycidyl ether of bisphenol-a/silicon/siliconized epoxy hybrid polymer matrices: Mechanical,thermal, electrical and morphological properties

Benzoxazines modified epoxy hybrid polymer matrices were developed using benzoxazines (CB_DDM and BMPB_DDM) and epoxy resins (DGEBA, SE and EP-HTPDMS) to make them suitable for high performance applications. The benzoxazine-epoxy hybrid polymer matrices were prepared via in-situ polymerization and were investigated for their thermal, thermo-mechanical, mechanical, electrical and morphological properties. Two types of skeletal modified benzoxazines namely 1,1-bis(3-methyl-4-hydroxyphenyl)cyclohexane benzoxazine (CB_DDM) and bis(4-maleimidophenyl) benzoxazine (BMPB_DDM) were synthesized by reacting paraformaldehyde and 4,4′-diaminodiphenylmethane with 1,1-bis (3-methyl-4-hydroxyphenyl)cyclohexane and N-(4-hydroxyphenyl)maleimide respectively. Epoxy resins viz., diglycidyl ether of bisphenol-A (DGEBA), silicon incorporated epoxy (SE) and siliconized epoxy resin (EP-HTPDMS) were modified with 5, 10 and 15 wt% of benzoxazines using 4,4′-diaminodiphenylmethane as a curing agent at appropriate conditions. The chemical reaction of benzoxazines with the epoxy resin was carried out thermally and the resulting product was analyzed by FT-IR spectra. The glass transition temperature, curing behavior, thermal stability, char yield and flame resistance of the hybrid polymers were analysed by means of DSC, TGA and DMA. Mechanical properties were studied as per ASTM standards. The benzoxazines modified epoxy resin systems exhibited lower values of dielectric constant and dielectric loss with an enhanced values of of arc resistance, glass transition temperatures, degradation temperatures, thermal stability, char yield, storage modulus, tensile strength, flexural strength and impact strength.     

Thermo-oxidative degradation kinetics and mechanism of the system epoxy nanocomposite reinforced with nano-Al2O3

We have synthesized epoxy nanocomposites with various percents of nanoalumina by using ultrasonic dispersion treatment. Scanning calorimetry studies revealed that the composition having 1% nanoalumina results in the highest value of cross-link density as evidenced by the glass transition temperature (T _g). Thermal degradation of the systems consisting of diglycidyl ether bisphenol A (DGEBA)/1,3-Poropane diamine and with 1% and without nanoalumina were studied by thermogravimetry analysis to determine the reaction mechanism in air. The obtained results indicated that a relatively low concentration of nanoalumina led to an impressive improvement of thermal stability of epoxy resin. The Coats?CRedfern, Van Krevelen, Horowitz?CMetzger, and Criado methods were utilized to find the solid state thermal degradation mechanism. Analysis of our experimental results suggests that the reaction mechanism is depending on the applied thermal history. For the nanocomposite, the mechanism was recognized to be one-dimensional diffusion (D₁) reaction at low heating rates and it changes to be a random nucleation process with one nucleus on the individual particle (F₁) at high heating speeds. The results also indicated that the degradation mechanism of organic phase is influenced by the presence of inorganic nanofiller.     

Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized through a four-step procedure, which was then cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4′-diaminodiphenyl-methane (DDM). As comparison, a commercial available epoxy resin, bisphenol A diglycidyl ether (BADGE), cured with the same curing agents was also investigated. We found that the BGTF gave the exothermic starting temperature lower than BADGE no mater what kind of curing agents applied, implying the reactivity of the former is higher than the latter. The fully cured fluorinated BGTF epoxy resins have good thermal stability with glass transition temperature of 170-175 °C and thermal decomposition temperature at 5% weight loss of 370-382 °C in nitrogen. The fluorinated BGTF epoxy resins also showed the mechanical properties as good as the commercial BADGE epoxy resins. The cured BGTF epoxy resins exhibited improved dielectric properties as compared with the BADGE epoxy resins with the dielectric constants and the dissipation factors lower than 3.3 and dissipation 2.8 × 10⁻³, respectively, which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymer. The BGTF epoxy resins also gave low water absorption because of the existence of hydrophobic fluorine atom.     

Preparation of reflective and electrically conductive surface-silvered polyimide films from silver(I) complex and PMDA/ODA via an in situ single-stage technique

Optically reflective and/or electrically conductive surface-silvered polyimide films have been prepared by thermal curing of the (1,1,1-trifluoro-2,4-pentadionato) silver(I) (AgTFA)-containing poly(amic acid) derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (4,4′-ODA) in dimethylacetamide. Films with specular reflectivity of 20-40% and surface electrical resistivity less than 7 Ω/sq were obtained. Two different thermal curing cycles were applied for the imidization and silver reduction process, and film conductivity were only obtained under rapid thermal treatment. The metallized films exhibit mechanical properties close to that of the parent polyimide films. Films were characterized by dynamic mechanical thermal analysis, X-ray diffraction, transmission electron microscopy, atomic force microscopy and mechanical measurements.     

Effect of structure on thermal behaviour of epoxy resins

The paper deals with the curing behaviour of diglycidyl ether of bisphenol-A (DGEBA) using three novel multifunctional aromatic amines having phosphine oxide and amide-acid linkages. The amines were prepared by reacting tris(3-aminophenyl)phosphine oxide (TAP) with 1,2,4,5-benzenetetracarboxylic acid anhydride (P)/4,4^′-(hexafluoroisopropylidene)diphthalic acid anhydride (F)/3,3^′,4,4^′-benzophenonetetracarboxylic acid dianhydride (B). Amide-acid linkage in these amines is converted to thermally stable imide linkage during curing reaction. Curing temperatures of DGEBA were higher with phosphorylated amines than the conventional amine 4,4^′-diamino diphenyl sulphone (D). A decrease in initial decomposition temperature and higher char yields were observed when phosphorus containing amide-acid amines were used as curing agents for DGEBA.     

Chemical degradation of TGDDM/DDS epoxy resin in supercritical 1-propanol: Promotion effect of hydrogenation on thermolysis

Chemical decomposition of an epoxy system made of tetraglycidyl 4,4′-diaminodiphenylmethane (TGDDM) and 4,4′-diaminodiphenylsulfone (DDS) in supercritical 1-propanol was investigated under different reaction temperature and time. The GC–MS results suggested that the epoxy system was decomposed to the products including aniline, N-propylbenzenamine, and 4,4′-diaminodiphenylsulfone. The change of the products' yield with time was measured by GC. In addition, the formed chars were characterized by SEM, elemental analysis, Raman and XRD. The results implied the presence of some graphite microcrystals and disordered structure in the solid residue. Upon the addition of KOH, the Guerbet reaction of 1-propanol was promoted to generate more hydrogen. A possible free-radical reaction mechanism was proposed for the depolymerization of TGDDM/DDS epoxy resin. Hydrogenation of radicals had a promotion effect on thermolysis of TGDDM/DDS epoxy resin.     

Preparation,thermal properties,and flame retardance of epoxy–silica hybrid resins

A novel epoxy system was developed through the in situ curing of bisphenol A type epoxy and 4,4′‐diaminodiphenylmethane with the sol–gel reaction of a phosphorus‐containing trimethoxysilane (DOPO–GPTMS), which was prepared from the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO) with 3‐glycidoxypropyltrimethoxysilane (GPTMS). The preparation of DOPO–GPTMS was confirmed with Fourier transform infrared, ¹H and ³¹P NMR, and elemental analysis. The resulting organic–inorganic hybrid epoxy resins exhibited a high glass‐transition temperature (167 °C), good thermal stability over 320 °C, and a high limited oxygen index of 28.5. The synergism of phosphorus and silicon on flame retardance was observed. Moreover, the kinetics of the thermal oxidative degradation of the hybrid epoxy resins were studied. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2354–2367, 2003     

Synthesis of a novel epoxy resin containing diphenylether moiety and thermal properties of its cured polymer with phenol novolac

A new type of epoxy resin containing 4,4′-diphenylether moiety in the backbone (2) was synthesized, and was confirmed by gel permeation chromatography, infrared spectroscopy, and ¹H nuclear magnetic resonance spectroscopy. In addition, in order to evaluate the influence of 4,4′-diphenylether moiety in the structure, epoxy resins having 4,4′-biphenylene moiety (4) and having 1,4-phenylene moiety (6) in place of 4,4′-diphenylether moiety were synthesized. The cured polymer obtained through the curing reaction between the new diphenylether-containing epoxy resin and phenol novolac was used for making a comparison of its thermal and physical properties with those obtained from 4, 6, and bisphenol-A (4,4′-isopropylidenediphenol) type epoxy resin. The cured polymer obtained from 2 showed markedly higher anaerobic char yield at 700°C of 44.0 wt %, higher fracture toughness, and higher mechanical strength and modulus. © 1999 John Wiley & Sons, Inc. J Polym Sci A: Polym Chem 37: 3687–3693, 1999     

Syntheses,structure, reactivity,and thermal properties of new cyclic phosphine oxide epoxy resins cured by diamines

A new type of epoxy resin which contained cyclic phosphine oxide group in the main chain was synthesized. The structure of the new type of epoxy resin was confirmed by elemental analyses (EA), infrared spectroscopy (IR), and ¹H-NMR and ¹³C-NMR spectroscopies. In addition, compositions of the new synthesized cyclic phosphine oxide epoxy resin (EPCAO) with three curing agents, e.g., bis(3-aminophenyl)methylphosphine oxide (BAMP), 4,4′-diamino-diphenylmethane (DDM), and 4,4′-diaminodiphenylsulfone (DDS), were used for making a comparison of its curing reactivity, heat, and flame retardancy with that of Epon828 and DEN438. The reactivities were measured by differential scanning calorimetry (DSC). Through the evaluation of thermal gravimetric analysis (TGA), those polymers which were obtained through the curing reactions between the new epoxy resin and three curing agents (BAMP, DDM, DDS) also demonstrated excellent thermal properties as well as a high char yield. © 1996 John Wiley & Sons, Inc.     

Synthesis and thermal decomposition of a novel hyperbranched polyphosphate ester used for flame retardant systems

A novel hyperbranched polyphosphate ester (HPPE) was synthesized via the polycondensation of bisphenol-A as an A₂ monomer and phosphoryl trichloride as a B₃ monomer at 100 °C, without gelation. The initial molar ratio of A₂ to B₃ was set to be 1.5:1. The final product was precipitated from methanol. ³¹P NMR spectroscopy was used to monitor the reaction. The formed HPPE was characterized by FTIR and ¹H NMR to confirm its end groups. Differential scanning calorimetry data revealed that the cured bisphenol-A epoxy resin with HPPE as a curing agent possessed improved glass transition temperature. Dynamic mechanical thermal analysis also showed the increase in the glass transition temperature. The thermal degradation properties and flame retardancy were investigated by thermogravimetric analysis and limiting oxygen index (LOI). The results showed that the incorporation of HPPE into bisphenol-A epoxy resin increased its thermal stability and char yield during the decomposition by raising the second stage decomposition temperature. The LOI value increased from 23 to 31 when HPPE, instead of bisphenol-A, was used as a curing agent.