ANTI-PLANE FRACTURE ANALYSIS OF FUNCTIONALLY GRADIENT MATERIAL INFINITE STRIP WITH FINITE WIDTH

The special case of a crack under mode III conditions was treated, lying parallel to the edges of an infinite strip with finite width and with the shear modulus varying exponentially perpendicular to the edges. By using Fourier transforms the problem was formulated in terms of a singular integral equation. It was numerically solved by representing the unknown dislocation density by a truncated series of Chebyshev polynomials leading to a linear system of equations. The stress intensity factor (SIF) results were discussed with respect to the influences of different geometric parameters and the strength of the non-homogeneity. It was indicated that the SIF increases with the increase of the crack length and decreases with the increase of the rigidity of the material in the vicinity of crack. The SIF of narrow strip is very sensitive to the change of the non-homogeneity parameter and its variation is complicated. With the increase of the non-homogeneity parameter, the stress intensity factor may increase, decrease or keep constant, which is mainly determined by the strip width and the relative crack location. If the crack is located at the midline of the strip or if the strip is wide, the stress intensity factor is not sensitive to the material non-homogeneity parameter.     

Magnetostrictive/electrostrictive fracture of the piezomagnetic and piezoelectric layers in a multiferroic composite: Anti-plane case

The main purpose of the present work is to study the influences of magnetostriction, electrostriction and piezomagnetic/piezoelectric stiffening on the fracture behavior of a layered multiferroic composite. For comparison, it is assumed that there is a crack, parallel to the interface, in each layer. Methods of cosine transform and Cauchy singular integral equations are used to solve the crack problem. Numerical results of the stress intensity factor (SIF) are provided and the computational accuracy is demonstrated. Discussion on the numerical results indicates that the multiferroic composite consisting of cobalt ferrite and barium titanate layers are more prone to fracture under electric loading than under magnetic loading. In the case of magnetostriction, to increase the shear modulus of the piezomagnetic layer would raise the SIF; but to increase that of the piezoelectric layer would reduce the SIF; in the case of electrostriction, inverse results are obtained. Piezomagnetic stiffening can affect the SIF when the composite is under electrostriction; piezoelectric stiffening can influence the SIF if the composite is under magnetostriction. In addition, it is also revealed that two parallel equal cracks may shield each other even if an interface exists between them.     

Fracture analysis on the arc-shaped interfacial crack between a homogeneous cylinder and its coating

The mechanical model is established for a mode I arc-shaped crack along the interface between a functionally graded layer and a homogeneous cylinder. The displacement and stress fields are expressed in the form of infinite series by the method of variable separation. By introducing two dislocation density functions, the mixed boundary conditions of the crack are recast into a system of Cauchy singular integral equations, which are then solved numerically. Parametric studies on the stress intensity factors (SIFs) yield two aspects of guidelines for engineering designs. (a) The SIFs depend on the ratio between the outer and inner radii rather than their respective values, and 1.5 seems to be an optimal value for this ratio. (b) The outer graded layer should be stiffer than the inner homogeneous cylinder and large non-homogeneity parameter is beneficial to SIF reduction.     

Anti-plane fracture analysis for the weak-discontinuous interface in a non-homogeneous piezoelectric bi-material structure

The concept of weak discontinuity is extended to functionally graded piezoelectric bi-material interface, and fracture analysis for the weak discontinuous interface is performed by the methods of Fourier integral transform and Cauchy singular integral equation. Numerical results of the total energy release rate (TERR) and the mechanical strain energy release rate (MSERR) are obtained to show the effects of non-homogeneity parameters, geometrical parameters and loads. Parametric studies yield three conclusions: (1) To reduce the weak-discontinuity of the interface is beneficial to resisting interfacial fracture. The effect of the weak-discontinuity of the interface on TERR and MSERR still depends on the strip width. The wider the strip, the more sensitive the TERR and MSERR will be to the weak-discontinuity of the interface. (2) To predict the effect of electric load on crack propagation, MSERR is more appropriate than TERR to be used as a fracture parameter. To predict the effect of mechanical load on crack propagation, both of them could be used as fracture parameters, and MSERR is more conservative. (3) Mechanical load and negative electric displacement load would promote crack propagation, but positive electric displacement load would retard it. For the structure applied by combined mechanical and positive electric displacement loads, crack propagation may be impeded by appropriately selecting the strip width and the ratio of non-homogeneity parameters.     

Interface edge crack in a multiferroic semicylinder

The purpose of the present work is to study the interface edge cracking problem in a semicircular cylindrical multiferroic composite theoretically by the methods of infinite series and singular integral equation. Numerical results of the stress intensity factor (SIF) are obtained and the computational accuracy is demonstrated. Discussion on the numerical results indicates that: (a) in order to reduce the SIF the inner piezoelectric layer should be softer and the outer piezomagnetic layer be stiffer; (b) the piezoelectric stiffening affect the SIF notably, but the piezomagnetic stiffening can only influence it very little.     

The mixed mode crack problem in an FGM layer bonded to a homogeneous half-plane

In this paper, the plane elasticity problem of an arbitrarily oriented crack in a FGM layer bonded to a homogeneous half-plane is considered. The problem is modeled by assuming that the elastic properties of the FGM layer are exponential functions of the thickness coordinate and are continuous at the interface of the FGM layer and the half-plane.The Fourier transform technique is used to reduce the problem to the solution of a system of Cauchy-type singular integral equations, which are solved numerically. The stress intensity factors are computed for various crack orientations, crack locations and material parameters. The results show that crack length, crack orientation and the non-homogeneity parameter of the strip material have significant effect on the fracture of the FGM layer.     

Mechanical modeling and fracture analysis for a non-homogeneous weldment with a crack perpendicular to the interface

A new mechanical model is established for a non-homogeneous weldment with HAZs and fusion zones treated as functionally graded materials. The interface-perpendicular anti-plane fracture problems are analyzed for the HAZ and the weld metal, respectively, by the methods of Fourier integral transform and Cauchy singular integral equation. Lobatto–Chebyshev collocation method put forth by Erdogan and Gupta is employed to obtain numerical results of stress intensity factor (SIF). Parametric studies yield three conclusions: (1) overmatching is more beneficial than undermatching to the reduction of the SIF of a HAZ crack, however, the latter is more effective than the former in reducing the SIF of a weld-metal crack; (2) the optimum value of mismatch factor is 1.0, and values too greater or too smaller than this should be avoided in engineering design; (3) when the mismatch factor is unequal to 1.0, the SIF could be reduced by increasing the absolute value of the non-homogeneity parameters of HAZs.     

含非完整界面的功能梯度压电材料Ⅲ型裂纹问题

本文研究了含非完整界面的功能梯度压电复合材料的Ⅲ型裂纹问题．此裂纹垂直于非完整界面,采用弹簧型力电耦合界面模型模拟非完整界面．界面两侧材料的性质,如弹性模量、压电常数和介电常数均假定呈指数函数形式且沿着裂纹方向变化．运用积分变换法将裂纹面条件转换为奇异积分方程,并使用Gauss-Chebyshev方法对其进行数值求解．根据算例结果讨论了一些退化问题并分析了裂纹尖端强度因子与材料的非均匀系数和非完整界面参数的关系．     

Why traction-free? Piezoelectric crack and Coulombic traction

The non-zero traction condition is introduced in piezoelectric crack problems with the unknown Coulombic traction acting on the crack surfaces. An analytical solution under this condition is obtained by means of the generalized Stroh formalism and by accounting for the permittivity of medium inside the crack gap. As the crack in such materials can be thought of as a low-capacitance medium carrying a potential drop, the Coulombic traction always pulls the two opposite surfaces of the crack together. It is proved that under relatively larger mechanical loading and relatively smaller electrical field, the Coulombic traction may be negligible and the previous investigations under the traction-free crack condition may be accepted in a tolerant way, otherwise the Coulombic traction may lead to some erroneous results with over 10% relative errors. It is also shown that, unlike the traction-free crack condition, the applied electric field does change the Mode I stress intensity factor (SIF) for a central crack in an infinite plane piezoelectric material, and in this way may significantly influence piezoelectric fracture. It is also concluded that the variable tendencies of the normalized SIF and the ERR against the applied electric field depend on the mechanical loading levels. This load-dependence feature may lead to a transformation of the normalized SIF and the ERR from an even functional dependence to an odd functional dependence on the applied electric field.     

Effects of electric field on crack growth for a penny-shaped dielectric crack in a piezoelectric layer

The assumptions of impermeable and permeable cracks give rise to significant errors in determining electro-elastic behavior of a cracked piezoelectric material. The former simply imposes that the permittivity or electric displacement of the crack interior vanishes, and the latter neglects also the effects of the dielectric of an opening crack interior. Considering the presence of the dielectric of an opening crack interior and the permeability of the crack surfaces for electric field, this paper analyzes electro-elastic behavior induced by a penny-shaped dielectric crack in a piezoelectric ceramic layer. In the cases of prescribed displacement or prescribed stress at the layer surfaces, the Hankel transform technique is employed to reduce the problem to Fredholm integral equations with a parameter dependent nonlinearly on the unknown functions. For an infinite piezoelectric space, a closed-form solution can be derived explicitly, while for a piezoelectric layer, an iterative technique is suggested to solve the resulting nonlinear equations. Field intensity factors are obtained in terms of the solution of the equations. Numerical results of the crack opening displacement intensity factors are presented for a cracked PZT-5H layer and the effect of applied electric field on crack growth are examined for both cases. The results indicate that the fracture toughness of a piezoelectric ceramic is affected by the direction of applied electric fields, dependent on the elastic boundary conditions.     

裂纹垂直于双相介质界面时的应力强度因子

本文利用Ｊ积分与应力强度因子的关系,采用有限元数值方法研究了当裂纹与双相介质的界面垂直时,其裂纹的近界面端和远界面端的应力强度因子随双相介质参数和裂纹端部到界面的距离的变化规律,同时还分析了当边裂纹逐渐扩展时,应力强度因子的变化特征。     

The mixed-mode fracture mechanics analysis of an embedded arbitrary oriented crack in a two-dimensional functionally graded material plate

Mixed-mode fracture mechanics analysis of an embedded arbitrarily oriented crack in a two-dimensional functionally graded material using plane elasticity theory is considered. The material properties are assumed to vary exponentially in two planar directions. Then, employing Fourier integral transforms with singular integral equation technique, the problem is solved. The stress intensity factors (SIFs) at the crack tips are calculated under in-plane mechanical loads. Finally, the effects of crack orientation, material non-homogeneity, and other parameters are discussed on the value of SIF in mode I and mode II fracture.     

Thermostressed state of a piezoelectric bodywith a plane crack under symmetric thermal load

The paper addresses a thermoelectroelastic problem for a piezoelectric body with an arbitrarily shaped plane crack in a plane perpendicular to the polarization axis under a symmetric thermal load. A relationship between the intensity factors for stress (SIF) and electric displacement (EDIF) in an infinite piezoceramic body with a crack under a thermal load and the SIF for a purely elastic body with a crack of the same shape under a mechanical load is established. This makes it possible to find the SIF and EDIF for an electroelastic material from the elastic solution without the need to solve specific problems of thermoelasticity. The SIF and EDIF for a piezoceramic body with an elliptic crack and linear distribution of temperature over the crack surface are found as an example __________ Translated from Prikladnaya Mekhanika, Vol. 44, No. 3, pp. 96–108, March 2008.     

Interaction of microcracks with a macrocrack yielded in a narrow strip

Plastic zone growth of collinear cracks has had a longstanding interest in ductile fracture. This work further considers yield zone growth in an isotropic, homogeneous elastic–perfectly plastic infinite plate containing a macrocrack with several neighboring microcracks. Normal loading is considered at distances far away from the cracks. The strip yield is adopted where the plastic zone is assumed to be confined to two narrow strips extending from the ends of a finite length crack while the microcracks are assumed to be elastic. The plastic zone length and crack opening displacement are found from asymptotic solution and compared with finite element solution.     

A piezoelectric-elastic body with inhomogeneities and a crack under plane electrical and anti-plane mechanical loads

Summary  In this paper, we study a two-dimensional electroelastic problem of an infinite piezoelectric body with two circular piezoelectric inhomogeneities, one of which contains a crack. We formulate the stress intensity factor (SIF) analytically and investigate it numerically. The problem is solved based on Bueckner's principle, and is reduced to a problem of a singular integral equation of the first kind with respect to the distribution function of screw dislocation. The effect of interaction between the two inhomogeneities and the crack on the electroelastic field as well as the control of the SIF by electrical loads is investigated. Received 18 April 2000; accepted for publication 24 October 2000     

压电复合材料粘接界面断裂有限元模拟

根据数字化FRMM(Fix-Ratio Mix-Mode)断裂试验,得到了压电复合材料试件的断裂韧性和位移及应变场。本文在试验的基础上,通过非线性有限元软件ABAQUS及用户子程序UMAT进行了模拟分析,采用基于损伤力学的粘聚区模型(CZM)对压电复合材料界面的起裂和脱胶扩展进行了分析,并与VCCT方法进行了比较。计算得到的荷载位移曲线更接近于试验结果,但在裂纹扩展路径上的吻合需要对粘聚区法则进一步修正。通过进一步对CZM参数进行分析,表明界面粘结强度和界面刚度对计算结果的影响很大。研究结果表明,粘聚区模型可以很好地表征压电复合材料弱粘接界面脱胶断裂问题。     

A piezoelectric material strip with a crack perpendicular to its boundary surfaces

A cracked piezoelectric material strip under combining mechanical and electrical loads is considered. The crack is vertical to the top and bottom edges of the strip. The edges of the strip are parallel to the x-axis and perpendicular to the z-axis. When a piezoelectric ceramic is poled, it exhibits transversely isotropic behavior. Among many possible poled axis orientations, a particular orientation when the poling direction lies parallel to x-axis is examined in this paper. Both impermeable crack and permeable crack assumptions are considered. Numerical results are included for three kinds of fracture mechanics specimens, namely an edge-cracked strip, a double edge-cracked strip, and a center-cracked strip, subjected to uniform tensions and uniform electric displacement loads simultaneously, at the far ends. In addition, an edge-cracked strip under pure bending and uniform electric displacement loads at the far ends is also investigated in this paper.     

Fracture analysis on a piezoelectric sensor with a viscoelastic interface

Fracture analysis is performed on a layered piezoelectric sensor possessing a Kelvin-type viscoelastic interface. An electrically permeable anti-plane crack is situated in the piezoelectric layer and perpendicular to the interface. The crack problem is solved by the methods of integral transform and Cauchy singular integral equation. The variations of the dynamic stress intensity factor (DSIF) vs. physical and geometrical parameters are investigated. At the beginning of creep and relaxation, larger viscosity coefficient always induces smaller DSIF. With time elapsing, the effect of viscosity coefficient becomes weaker and weaker. When time approaches infinity, the viscous effect disappears, and the DSIF converges to a value corresponding to the case of an elastic interface. The effect of the viscoelastic interface on the fracture behavior of the piezoelectric layer also depends on the substrate thickness. To some extent, thicker substrate may intensify the effect of the interface.     

Discrete modeling of crack bridging by a discontinuous platelet with a controlled interface

Crack bridging by discontinuous fibers can make brittle materials tougher by transferring stresses from the crack tip to elsewhere in the matrix material. One important aspect of crack bridging is the nature of the interface between the fibers and the matrix material. In this paper, a two-dimensional numerical model of bridging a Mode I loaded crack by linear elastic discontinuous platelets is developed for two different types of interfaces. The first type is a perfectly bonded interface. The second type is an imperfect interface described as a stick–slip interface. A shear-lag model to predict platelet pullout is developed in detail to verify the numerical implementation of the stick–slip interface. An example of a crack tip bridged by a platelet is examined for both interfaces. The perfectly bonded interface will reduce the Stress Intensity Factor (SIF) of the crack greatly but introduces new stress concentrations at the platelet ends. The stick–slip interface can be tailored to also reduce the SIF while not introducing new stress concentrations.     

Analysis of a Griffith crack at the interface of two piezoelectric materials under anti-plane loading

The main objective of this work is the contribution to the study of the piezoelectric structures which contain preexisting defect (crack). For that, we consider a Griffith crack located at the interface of two piezoelectric materials in a semi-infinite plane structure. The structure is subjected to an anti-plane shearing combined with an in-plane electric displacement. Using integral Fourier transforms, the equations of piezoelectricity are converted analytically to a system of singular integral equations. The singular integral equations are further reduced to a system of algebraic equations and solved numerically by using Chebyshev polynomials. The stress intensity factor and the electric displacement intensity factor are calculated and used for the determination of the energy release rate which will be taken as fracture criterion. At the end, numerical results are presented for various parameters of the problem; they are also presented for an infinite plane structure.