离子液体AlCl3/Et3NHCl中电沉积法制备金属铝

在AlCl3/Et3NHCl型离子液体中铝电极上通过恒电位电解沉积制备出金属铝. 测定了不同摩尔比的AlCl3/Et3NHCl离子液体在不同温度下的电导率, 考察了离子液体AlCl3/Et3NHCl摩尔比为2/1中Al电极上铝沉积的晶核成核过程, 以及恒电位电解沉积铝的工艺条件对电流效率和沉积铝表面形貌的影响. 结果表明, 不同比例AlCl3/Et3NHCl离子液体的电导率随温度升高而升高, 符合Arrhenius规律; 在Al电极上铝沉积的成核机理为三维瞬时成核过程; 恒电位电解沉积结果表明, 室温下在电位-2.4 V(vs Pt)和电解时间20 min条件下, 沉积铝的表面形貌比较平整致密,电流效率达73%, 沉积铝的纯度达96%(w).     

纳米Al_2O_3颗粒对镍电结晶过程的影响

借助循环伏安(CV)和计时安培(CA)研究了在不同电位下,纳米Al2O3微粒对镍由硫酸盐混合溶液在铜基底上电结晶沉积的影响.结果表明,Ni-Al2O3镀液体系电沉积的起始电位约为-740 mV.随着阶跃电位负移,Ni-Al2O3镀液体系电沉积成核时间tm逐渐缩短.与纯Ni镀液体系电沉积的tm相比,在-740~-830mV较低阶跃电位下,Ni-Al2O3镀液体系电沉积的成核时间tm明显缩短,表明Al2O3微粒有助于镍的电结晶成核.在-890 mV阶跃电位下,Ni-Al2O3镀液体系电沉积初始阶段的成核过程满足Scharifker-Hills三维瞬时成核模型.     

Na2SeO3在Fe电极上还原和吸附机理

采用循环伏安法、恒电势电解法、恒电流阶跃法及交流阻抗法研究Na2SeO3提高锌锰合金电沉积电流效率的作用机理.证明在锌锰合金电沉积的条件下，Na2SeO3 阴极被还原为Se32－并吸附在阴极表面上，从而阻止了氢原子在阴极表面的吸附，因而减少了氢离子的阴极还原.拟定了Na2SeO3的反应和吸附机理，用交流阻抗法进一步证明了所拟机理的正确性.     

铜电极表面铜锡合金电结晶机理

在弱酸性柠檬酸盐体系铜锡合金镀液中,采用线性扫描伏安(LSV)、循环伏安(CV)和计时安培实验方法,运用Scharifker-Hills(SH)理论模型和Heerman-Tarallo(HT)理论模型分析拟合实验结果,研究铜锡合金在铜电极上的电沉积过程与电结晶机理.结果表明,铜锡合金在铜电极表面实现共沉积并遵循扩散控制下三维瞬时成核的电结晶过程.电位阶跃从-0.80 V负移至-0.85 V(vs SCE),HT理论分析得到铜锡合金的成核与生长的动力学参数分别为成核速率常数(A)值从20.19 s-1增加至177.67 s-1,成核活性位点密度数(N0)从6.10×105cm-2提高至1.42×106cm-2,扩散系数(D)为(6.13±0.62)×10-6cm2s-1.     

采用AlCl_3-EMIC-MgCl_2室温离子液体电沉积制备铝-镁合金（英文）

采用恒电流和恒电位技术,以及路易斯酸氯化铝(III)-1-乙基-3-甲基咪唑氯化物离子液体中添加氯化镁(II),室温下在铂和铜阴极表面电沉积制备了铝-镁合金.合金层中镁的含量随离子液体中氯化镁浓度和所施加的阴极电流密度的增加而增加.采用X-射线衍射谱(XRD)、扫描电子显微镜(SEM)和能量散射X-射线谱(EDAX)技术,研究了不同电沉积实验条件得到的电沉积层的晶体结构及表面形貌.增加沉积电流密度,可以制备出致密、光亮和结合力良好的电沉积层.铝-镁合金电沉积的阴极电流效率可达99%.应用电化学石英晶体微天平(EQCM)技术研究了电沉积合金的组成.根据重声阻抗分析得到的质量-电荷(m-Q)曲线斜率计算了金属共沉积层的化学成分.     

镍钨硼合金电沉积机理及镀层微晶尺寸

应用循环伏安、恒电位阶跃和X射线衍射 (XRD)等方法研究了Ni_W_B合金电沉积特点和镀层微晶尺寸 .结果表明 ,在以柠檬酸铵为络合剂的溶液中 ,Ni_W_B合金沉积层较Ni_W合金有较低的电化学活性 .电位阶跃i～t曲线分析表明 ,在玻碳电极上Ni_W_B合金电结晶过程遵循扩散控制瞬时成核三维成长模式 ,且随过电位的增加 ,电极表面晶核数增多 .XRD测试结果表明 ,随沉积电流密度提高 ,合金镀层微晶尺寸逐渐增大 ,说明电流密度提高将更加有利于Ni_W_B合金电结晶过程中的晶核生长 .     

NaCl-KCl熔盐体系中AlF3氟化Tb4O7电化学制备Al-Tb合金

在NaCl-KCl-Tb₄O₇-AlF₃体系中为了制备Al-Tb合金,首先对熔盐中的上清液和沉淀物进行了分析,X射线衍射（XRD）结果确定了Tb₄O₇能被AlF₃氟化生成TbF₃。采用一系列的电化学方法对NaCl-KCl-AlF₃-Tb₄O₇体系在Mo电极上的电化学行为进行了研究。循环伏安、方波伏安、计时电位和开路计时电位等电化学方法的研究结果表明Tb（III）在预先沉积的Al电极上发生欠电位沉积。在不同条件下进行恒电流电解制备了Al-Tb合金,并对所得合金样品进行XRD和扫描电镜-能量散射谱（SEM-EDS）表征。结果表明在-2.5 A进行恒电流电解得到的Al-Tb合金是由Al和Al₃Tb两相组成。采用电感耦合等离子体-原子发射光谱仪（ICP-AES）对实验所得沉积物的组成进行分析,研究了电解条件对合金组成和电流效率的影响。在电流强度为-1.5 A进行恒电流电解2 h,电流效率可达76.5%。     

CuCl2硅溶胶和水溶液中铜的电化学行为研究

采用循环伏安法和计时安培法研究了CuCl2硅溶胶和水溶液中铜在玻碳电极上的电沉积和电结晶行为.结果表明在两种CuCl2电解质中,铜的电沉积分两个步骤完成,Cu2+还原为Cu+在硅溶胶中较水溶液中容易;采用吸附-成核模型解析电流-时间暂态曲线,并确定铜的电结晶机理为扩散控制下的连续成核三维生长(3DP),Cu2+在水溶液中的扩散系数较硅溶胶中的大,但相同电位下在硅溶胶中的饱和成核数密度高于水溶液中.     

锂离子电池Sn-Co-Zn合金负极材料电沉积及其储锂性能

运用电沉积技术制备出Sn-Co-Zn合金电极材料.采用X射线衍射(XRD)和扫描电子显微镜(SEM)分析了该合金材料的相结构和表面形貌.通过循环伏安和电位阶跃实验研究了Sn-Co-Zn合金的电沉积机理,实验表明,Sn-Co-Zn合金电沉积按扩散控制连续成核和三维生长方式进行.XRD结果表明,该合金由CoSn3、Co3Sn2和Zn组成.电化学性能测试表明:Sn-Co-Zn合金电极首次放电(脱锂)容量达751mAh·g-1,首次循环的库仑效率为88%;30周循环之后放电容量为510mAh·g-1.该Sn-Co-Zn合金电极良好的电化学储锂性能可能归因于材料的多相结构.     

基于氯化胆碱离子液体的铜电沉积研究（英文）

采用恒电流和恒电位方法,基于含有氯化铜溶液的乙二醇-氯化胆碱或硫脲-氯化胆碱离子液体,室温下在钢阴极上进行了铜的电沉积. 利用扫描电子显微镜和X-射线衍射技术研究了各种实验条件对电沉积的影响以及沉积层的形貌. 结果表明,室温下施加不超过-0.45 V的沉积电位和不超过-4.0 A·m^-2的沉积电流密度,可以同时从氯化胆碱基乙二醇和硫脲离子液体中沉积得到非常光滑、有光泽、致密且具有良好结合力、色泽鲜艳的铜金属涂层. 铜的电沉积阴极电流效率约为97%.     

Anodic behavior of nickel-based alloys in the electrolytic production of NF3

The Ni-based alloys, such as Ni-Co, Ni-Mn, Ni-Ag, Ni-Cu, Ni-Al and Ni-Si, prepared by hot isostatic pressing (HIP) at 1000 °C under 2 × 10⁸ Pa for 2 h were employed as the anodes for electrolytic production of NF₃. The current efficiencies for NF₃ formation were 42-38, 52-40, 52-47, 63-62, 50 and 41% for Ni-Co, Ni-Mn, Ni-Ag, Ni-Cu, Ni-Al and Ni-Si alloys, respectively. The current efficiencies only on Ni-Cu alloys with Cu concentrations lower than 10 mol% were almost the same as those on Ni sheet and HIPed Ni anodes, whereas those on the other alloys used in this study were smaller compared with those on both Ni anodes. On the other hand, the current losses caused by anodic dissolution of Ni-Co, Ni-Mn, Ni-Ag, Ni-Cu, Ni-Al and Ni-Si alloy electrodes were 7.95-4.42, 6.40-7.02, 5.60-6.30, 3.34-6.33, 5.10 and 0.18%, respectively. The anode consumptions of Ni-5 mol% Cu and Ni-5 mol% Si alloys were almost the same or smaller compared with those of Ni sheet and HIPed Ni electrodes, though those of other alloys used were large compared with those of both Ni anodes. Consequently, addition of Cu to the nickel matrix is available for a cheaper cost of anode with keeping a same current efficiency as that on the Ni anode and addition of Si to the nickel matrix is effective for decreasing anode consumption largely. A Ni sheet electrode containing a trace of impurities, such as Co, Mn, Ag and Al, is also favorable as the anode for electrolytic production of NF₃.     

Electrodeposition of Aluminum from AlCl3/Et3NHCl Ionic Liquids

Aluminum was successfully electrodeposited on Al electrodes from aluminum chloride (AlCl₃)/triethylamine hydrochloride (Et₃NHCl) ionic liquids by the constant potential electrolysis. Electrical conductivities of AlCl₃/Et₃NHCl ionic liquids were measured as a function of the temperature and composition. The nucleation processes and the influence of experimental conditions on the current efficiency and surface morphology of aluminum electrodeposits were studied on Al electrodes from 2:1 molar ratio AlCl₃/Et₃NHCl ionic liquid. The electrical conductivities of ionic liquids increased as the electrolyte temperature increased, following the Arrhenius behavior. Analyses of the chronoamperograms indicated that the deposition process of aluminum on Al substrates was controlled by instantaneous nucleation with diffusion-controlled growth. Constant potential deposition experiments showed that the electrodeposits obtained on Al electrodes were dense, continuous, and well adherent, and the current efficiency was 73% at −2.4 V(vs Pt) for 20 min electrolysis at room temperature. The purity of aluminum electrodeposits on Al electrodes was above 96% (w).     

Scanning electrochemical microscopy and video microscopy investigations of Tiron-mediated polypyrrole nucleation on AA2024-T3

Scanning electrochemical microscopy (SECM) and video microscopy have been used to examine the mediated electrodeposition of polypyrrole on AA2024-T3. Of particular interest is the role of surface heterogeneity (namely, copper-rich secondary phase particles) on electrodeposition mediated by 4,5-dihydroxy-1,3-benzenedisulfonic acid (Tiron). SECM shows that polymer nucleation occurs exclusively on the aluminum matrix of the alloy. Video microscopy shows this to be true on a model alloy (a pure Al substrate with an embedded Cu wire) as well, and also suggests that polymer growth is directional toward the copper-rich sites in the absence of sulfate in the deposition solution. A model is presented in which polymer deposition on the copper-rich sites is inhibited either by CuSO₄-induced passivation or by the loss of mediator due to Cu–Tiron complex formation.     

新型固定床Raney Ni制备过程中晶相结构的转化

以拟薄水铝石制备粘结剂，加入镍铝合金粉和田菁粉捏合、成型，在空气中高温焙烧，然后用苛性碱溶液充分浸取，制备出可应用于固定床加氢的活性Raney Ni催化剂。采用XRD和TG-DTA分析了催化剂制备过程中晶相结构的转化，结果表明，成型合金焙烧过程中，富铝合金相（如Al₃Ni-Al和Al₃Ni）逐渐转变为贫铝合金相（如Al₃Ni₂和AlNi），释放出的金属铝依次发生氧化，同时抑制金属镍的氧化；在高于1 123～1 133K焙烧时金属铝氧化生成α-Al₂O₃，使催化剂获得较高的颗粒强度。苯加氢活性评价结果表明，该新型固定床Raney Ni催化剂活性高于负载型镍催化剂，也高于参照专利方法制备的有机聚合物粘结的同类型催化剂，并且具有较好的低温加氢活性。     

Electrodeposition mechanism of nickel films on polycrystalline copper from dilute simple sulphate solutions

In this paper, we have studied the mechanism of nucleation and growth of nickel from a simple sulfate bath on polycrystalline copper (Cu) substrate. Cyclic voltammetry technique and current transients recorded during electrodeposition of nickel on Cu were used to evaluate the electrochemical deposition of nickel on copper. Results show that nickel starts to grow on copper from a typical potential of −0.7 V vs. Ag/AgCl. Increasing scan rate of cyclic voltammograms shifts the reduction peaks towards a more negative values. We plotted non-dimensional graphs according to the Scharifker-Hills theory and concluded an instantaneous nucleation and growth mechanism for nickel elecrodeposited on copper based on our experimental conditions.     

Initial stages of Ni–P electrodeposition: growth morphology and composition of deposits

The evolution of growth morphology and composition of deposits during the initial stages of Ni–P electrodeposition is studied using atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). Combined electrochemical and surface analytical measurements show that the deposition process starts at relatively low cathodic potentials by instantaneous formation and growth of hemispherical centres. The phosphorus content of deposits in the initial deposition stages is found to increase gradually with the deposition time. Additional electrochemical and XPS measurements, carried out on Ni substrates under same polarisation conditions in a Ni²⁺ ion free electrolyte solution, show the occurrence of a time dependent Ni–P surface alloy formation indicating a strong Ni–P interaction. It is suggested that the very early stages of Ni–P electrodeposition involve a primary instantaneous nucleation of Ni followed by a Ni–P alloy formation induced by the strong Ni–P interaction. AFM images show that in advanced deposition stages the coalescence of growing Ni–P centres leads to formation of larger growth mounds. The evolution of the resulting surface roughness is analysed on the basis of the so-called dynamic scaling concept. The estimated values for the roughness exponent and the growth exponent (α=1.07±0.05 and β=0.28±0.05) correspond to a model involving a smoothing of the growing surface driven by surface diffusion.     

Electrodeposition of nanocrystalline Ni–Cu alloy from environmentally friendly lactate bath

A new environmentally friendly electroplating bath for Ni–Cu alloy deposition was developed. Lactic acid was used as a complexing agent. The influence of bath composition, current density, pH and temperature on cathodic polarization, cathodic current efficiency and alloy composition was studied. Different proportions of the two metals were obtained by using different deposition parameters, but at all [Ni²⁺] / [Cu²⁺] ratios studied, preferential deposition of Cu occurred and regular co‐deposition took place. The Ni content of the deposit increased with Ni²⁺ content and current density and decreased with temperature. The surface morphology of the deposited Ni–Cu alloy was investigated using scanning electron microscopy. The crystal structure was examined using the X‐ray diffraction technique. The results showed that the deposits consisted of a single solid solution phase with a face‐centered cubic structure. The crystallite size lies in the range of 12 to 25 nm for as‐plated alloys. Copyright © 2014 John Wiley & Sons, Ltd.     

泡沫镍负载Pd-Ir作为Al-H_2O_2半燃料阴极的研究

以泡沫镍为基体,应用电化学沉积法制备Pd-Ir/Ni复合催化剂.由SEM、XPS分析样品的表面形态、组成以及各组分的价态.电化学测试表明该催化剂对H2O2电还原具有较高的催化性能,当过氧化氢的浓度为0.4 mol/L时,极限电流密度可超过318 mA/cm2.以纯铝或其合金作阳极、Pd-Ir/Ni作阴极组装Al-H2O2半燃料电池,得出其最大放电功率可达198 mW/cm2.     

Electrodeposition of aluminum–hafnium alloy from the Lewis acidic aluminum chloride-1-ethyl-3-methylimidazolium chloride molten salt

The electrochemistry of Hf(IV) and the electrodeposition of Al–Hf alloys were examined in the Lewis acidic 66.7–33.3 mol% aluminum chloride-1-ethyl-3-methylimidazolium chloride molten salt containing HfCl₄. When cyclic staircase voltammetry was carried out at a platinum disk electrode in this melt, the deposition and stripping waves for Al shifted to negative and positive potentials, respectively, suggesting that aluminum stripping is more difficult due to the formation of Al–Hf alloys. Al–Hf alloy electrodeposits containing ~13 at.% Hf were obtained on Cu rotating wire and cylinder electrodes. The Hf content in the Al–Hf alloy deposits depended on the HfCl₄ concentration in the melt, the electrodeposition temperature, and the applied current density. The deposits were composed of dense crystals and were completely chloride-free. The chloride-induced pitting corrosion potential of the resulting Al–Hf alloys was approximately +0.30 V against pure aluminum when the Hf content was above 10 at.%.