Metal content determination in polymerization catalysts by direct methods

Metal contents in polymerization catalysts were comparatively determined by Rutherford backscattering spectrometry (RBS), X-ray photoelectron spectroscopy (XPS) and X-ray fluorescence (XRF) spectroscopy. Catalysts were prepared by grafting metallocene onto bare silica or onto silica chemically modified with methylaluminoxane (MAO). Catalysts were compressed as self-supporting pellets (RBS and XRF), or mounted on adhesive copper tape (XPS). The proximity of the mass of the atomic nuclei did not allow resolution by RBS of the signals corresponding to Zr and Nb, nor Si and Al in catalyst systems such as (nBuCp)₂ZrCl₂/Cp₂NbCl₂/MAO/SiO₂. On the other hand, Zr, Nb, Si and Al lines were completely resolved in an XRF spectrum. For supported metallocenes on bare silica, XPS measurement was ca. 40% higher than that obtained by RBS. Silica-supported zirconocene showed good agreement in Zr content determination by XRF and RBS.     

Summary of ISO/TC 201 Standard: XX ISO 18118: 2004 – Surface chemical analysis – Auger electron spectroscopy and X‐ray photoelectron spectroscopy – Guide to the use of experimentally determined relative sensitivity factors for the quantitative analysis of homogeneous materials

ISO 18118 provides guidance on the measurement and use of experimentally determined relative sensitivity factors for the quantitative analysis of homogeneous materials by Auger electron spectroscopy (AES) and X‐ray photoelectron spectroscopy (XPS). This article provides a brief summary of this International Standard. Copyright © 2005 John Wiley & Sons, Ltd.     

AES and XPS investigations of molybdenum‐sulfur‐iodine‐based nanowire‐type material

Nanowire‐type materials produced by single‐step synthesis were investigated by XPS and HR AES. A sufficient quantity of these materials was produced for the XPS analyses. AES analyses at selected spots or along selected lines on the surface of the bundles of the material were also performed. HR AES measurements on bundles of different thicknesses were performed and compared. All the types of spectroscopy measurements were quantified, especially with respect to the Mo, S, and I. The Mo : S : I stoichiometries thus determined, deviated from the nominal value. It was also found that the stoichiometry is approximately constant along an individual nanowire bundle, but less so from one bundle to another. However, it was not possible to show conclusively that the diameter of the bundle influences the stoichiometry. The stoichiometry obtained from XPS measurements differs significantly from the one obtained from the AES measurement as well as from the nominal one. A possible explanation for the differences in the stoichiometries measured by AES, XPS, and the nominal values is the influence of the AES analysis on the sample and the interaction between the characteristics of XPS technique and the sample structure. Copyright © 2008 John Wiley & Sons, Ltd.     

X‐ray photoelectron spectroscopy and the pattern recognition method—their application to surface studies in CoPd alloys

In the present work, polycrystalline CoPd alloys in varying range of bulk atomic percent composition (Co30Pd70, Co50Pd50 and Co70Pd30) are investigated by means of X‐ray photoelectron spectroscopy (XPS). The results of conventional XPS quantitative multiline (ML) approach are compared to the results obtained on the basis of XPS lines shape analysis, where the selected XPS or X‐ray induced Auger electron (XAES) transitions, are processed using the pattern recognition method known as the fuzzy k‐nearest neighbour (fkNN) rule. The fkNN rule is applied to the following spectra line shapes: Pd MNV, Co 2p, Co LMM, Pd 3d and valence band, analysing electrons in a varying range of selected kinetic energies. Both methods showed the surface segregation of Pd in Co30Pd70 and Co50Pd50 alloys. The results of the ML, the binding energy shift (ΔBE) analysis and the fkNN rule remained in agreement. Discrepancies in quantitative results obtained using different approaches are discussed within the accuracy of the applied methods, differences due to mean escape depth (MED) of electrons in considered transitions, their depth distribution function, the sensitivity of electron transition line shape on the environmental change (weaker effect for the inner shell transitions, and stronger effect for the outer shell transitions and Auger electron spectroscopy (AES) electrons transitions) and the non‐uniform depth profile concentrations. Copyright © 2005 John Wiley & Sons, Ltd.     

Investigation of molybdate–benzotriazole surface treatment against copper tarnishing

The synergistic effect of benzotriazole (BTAH) and molybdate on the inhibition of copper tarnish was studied in this paper. The antitarnish treatment of copper was conducted with BTAH solution containing molybdate. The surface morphology observation and composition analysis were investigated by SEM with energy dispersive X‐ray (EDX) spectroscopy. The addition of molybdate improved the protection of BTAH significantly. The BTAH + molybdate treated copper specimen has higher N concentration in its surface. The structure of the protective film was studied by XPS and AES measurements. It was characterized to be a complex of Cu(I)BTA. The antitarnish effect is certified by the formation of the protective Cu(I)BTA film. Molybdate does not participate in the formation of the protective film. The presence of molybdate promotes the passivation of copper. This facilitates the stabilization of the cuprous oxide film, and strengthens the adsorption of BTAH. Copyright © 2008 John Wiley & Sons, Ltd.     

Investigation of patinas formed on Chinese bronzes using modern multianalytical techniques

This paper presents an integrated study on nine natural Chinese bronze patinas without causing any damage to the bronze substrates, employing five modern analytical techniques including X‐ray diffraction (XRD), Fourier transform infrared (FT‐IR) and Raman spectroscopy, inductively coupled plasma atomic emission spectroscopy (ICP‐AES), and inductively coupled plasma mass spectrometry (ICP‐MS). Two artificial Chinese bronze patinas were also investigated by the same techniques for comparative purposes. As a result, XRD determined the chemical compositions of all selected samples and showed that the primary compound was malachite in natural soil environment under the general situation. Meanwhile, some interesting corrosion products such as gerhardtite and free copper were also observed. Three groups were classified according to the XRD results in order to provide a deeper insight into their spectroscopic characterization. Spectroscopic data of these patinas from FT‐IR and Raman spectroscopy are shown and interpreted in detail. ICP‐AES and ICP‐MS analyses provided valuable quantitative information, and made the study of the patinas more profound. Furthermore, all analytical results indicated that bronze patinas are extremely complex by virtue of the storage environment and their substrate alloys. The natural samples were rather heterogeneous and the artificial samples, especially the sample formed in the laboratory, were rather homogeneous of which the chemical constituents could be well defined. Copyright © 2007 John Wiley & Sons, Ltd.     

Interfacial characterization of chemical solution‐deposited thin films of PbSe on GaAs(100)

The microstructure and composition of the interfacial layer between chemically deposited PbSe and GaAs substrates were studied using high‐resolution transmission electron microscopy (HRTEM), Auger electron spectroscopy (AES), x‐ray photoelectron spectroscopy (XPS) and energy‐filtered TEM. The thickness of the interfacial layer varied significantly from direct contact of the film with the substrate to 5 nm in the thickest regions. The results established the presence of a discontinuous, amorphous intermediate layer of Ga₂O₃ at the PbSe/GaAs interface. Copyright © 2008 John Wiley & Sons, Ltd.     

Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood

Copper films were coated on beech wood substrates by electroless plating method. The influence of bath temperature on the copper films properties was studied by varying the bath temperatures 25, 35, 45 and 55 °C. Scanning electron microscopy (SEM) equipped with energy dispersive spectroscopy (EDS), X‐ray diffraction (XRD) pattern, X‐ray photoelectron spectroscopy (XPS), micro Raman spectroscopy and contact angle measurements were used to both characterize the physical and chemical copper films properties and understand the influence of bath temperature on the wettability of copper surface. In our studies, we have found that the gained copper mass significantly increased at 55 °C. The crystalline nature of the coated copper was confirmed by XRD. The presence of Cu₂O and CuO was observed by XPS and micro Raman techniques, which confirms the oxidization of the coated copper surface. Also these characterization techniques have shown the big influence of bath temperature on the morphology, grain size, chemical composition and the film thickness of the coated copper. The wettability was highly influenced by increasing CuO on the coated copper, which is increased by the bath temperature. The contact angle measurements have demonstrated the influence of C―O, O―C?O and CuO components of the surface on the wettability of the samples. Copyright © 2016 John Wiley & Sons, Ltd.     

Comparative investigation on copper oxides by depth profiling using XPS, RBS and GDOES

Depth profiling has been performed by using X-ray photoelectron spectrometry (XPS) in combination with Ar-ion sputtering, Rutherford backscattering spectrometry (RBS) and glow discharge optical emission spectrometry (GDOES). The data obtained by XPS have been subjected to factor analysis in order to determine the compositional layering of the copper oxides. This leads to two or three relevant components within the oxide layers consisting of Cu₂O or CuO dependent on the sample preparation. GDOES measurements show sputtering profiles which are seriously influenced by a varying sputter rate. To ensure the results obtained so far, RBS measurements of the oxide layers have been carried out in order to discover artefacts of the other methods used and to demonstrate the excellent suitability of RBS for quantitative analysis of these layers. Chemical analysis consisting of (1) carrier-gas fusion analysis (CGFA) and (2) selective dissolution of Cu₂O/CuO allows the determination of the total amount of oxygen and copper, respectively, and can serve as a cornerstone of quantitative analysis.     

Determination of amount of substance for nanometre‐thin deposits: consistency between XPS,RBS and XRF quantification

Quantification on the nanometre scale is a key task in quality control and for the development of new materials in nanotechnology. In this paper we have studied the consistency in the determination of the amount of substance found by XPS peak shape analysis, Rutherford backscattering spectroscopy (RBS) and x‐ray fluorescence spectrometry (XRF). To this end, ZnO was deposited by plasma‐enhanced chemical vapour deposition on the three substrates. Four different sets of samples were produced, with the amount of ZnO deposited in the range 1–10 nm. From XPS analysis it is found that ZnO grows in the form of islands on all three substrates. For each system, the analysis was done independently with two XPS peaks from the overlayer with widely different kinetic energy and one XPS peak from the substrate. The growth mechanism found from analysis of each of the three peaks was consistent and the total amount of determined ZnO material was identical to within 15%. The root‐mean‐square deviation from the XPS quantification of the relative AOS was 20% for XRF and 16% for RBS. Because the absolute amount of substance determined from analysis of the three XPS peaks for each sample was consistent, it is concluded that the energy dependence of the applied inelastic mean free paths (taken here from the empirical TPP‐2M formula) is correct. It was found that the absolute amounts of substance determined by RBS and XRF are consistently factors of 2.1 and 1.5 lower than the that determined by XPS peak shape analysis. It is suggested that the main reason for this large discrepancy is inaccuracy in the applied ‘effective’ inelastic electron mean free path. Copyright © 2003 John Wiley & Sons, Ltd.     

Critical review of the current status of thickness measurements for ultrathin SiO2 on Si Part V: Results of a CCQM pilot study

Results are reported from a pilot study under the Consultative Committee for Amount of Substance (CCQM) to compare measurements of and resolve any relevant measurement issues in the amount of thermal oxide on (100) and (111) orientation silicon wafer substrates in the thickness range 1.5–8 nm. As a result of the invitation to participate in this activity, 45 sets of measurements have been made in different laboratories using 10 analytical methods: medium—energy ion scattering spectrometry (MEIS), nuclear reaction analysis (NRA), RBS, elastic backscattering spectrometry (EBS), XPS, SIMS, ellipsometry, grazing—incidence x‐ray reflectometry (GIXRR), neutron reflectometry and transmission electron microscopy (TEM). The measurements are made on separate sets of 10 carefully prepared samples, all of which have been characterized by a combination of ellipsometry and XPS using carefully established reference conditions and reference parameters. The results have been assessed against the National Physical Laboratory (NPL) data and all show excellent linearity. The data sets correlate with the NPL data with average root‐mean‐square scatters of 0.15 nm, half being better than 0.1 nm and a few at or better than 0.05 nm. Each set of data allows a relative scaling constant and a zero thickness offset to be determined. Each method has an inherent zero thickness offset between 0 nm and 1 nm and it is these offsets, measured here for the first time, that have caused many problems in the past. There are three basic classes of offset: water and carbonaceous contamination equivalent to ～ 1 nm as seen by ellipsometry; adsorbed oxygen mainly from water at an equivalent thickness of 0.5 nm as seen by MEIS, NRA, RBS and possibly GIXRR; and no offset as seen by XPS using the Si 2p peaks. Each technique has a different uncertainty for the scaling constant and consistent results have been achieved. X‐ray photoelectron spectroscopy has large uncertainties for the scaling constant but a high precision and critically, if used correctly, has zero offset. Thus, a combination of XPS and the other methods allows the XPS scaling constant to be determined with low uncertainty, traceable via the other methods. The XPS laboratories returning results early were invited to test a new reference procedure. All showed very significant improvements. The reference attenuation lengths thus need scaling by 0.986 ± 0.009 (at an expansion factor of 2), deduced from the data for the other methods. Several other methods have small offsets and, to the extent that these can be shown to be constant or measurable, these methods will also show low uncertainty. Recommendations are provided for parameters for XPS, MEIS, RBS and NRA to improve their accuracy. Copyright © 2004 John Wiley & Sons, Ltd.     

Understanding delamination in microelectronic devices using AES,XPS and chemometrics

The recent development of XPS instrumentation with near‐micron spatial resolution has advanced the capability of elemental and chemical‐state imaging accompanied by small‐area analysis (down to 15 µm). In this paper, the combined use of X‐ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES) at enhanced spatial resolution is shown to have significantly improved the understanding of interfacial delamination and related problems encountered in the production of electronic devices in the field of microelectronics. An example of the application of surface analysis for ITO/Mo adhesion problems will be presented. The mathematical procedure using principal component analysis (PCA) in the reduction of noise in XPS images will also be described. The dramatic improvements in the image contrast and chemical component determination from multispectral image data sets will be presented. This study is intended to explore the contributions given by advanced surface analysis tools to solve real‐world problems. Copyright © 2007 John Wiley & Sons, Ltd.     

Evaluation of elastic‐scattering cross sections for electrons and positrons over a wide energy range

Quantification of surface‐ and bulk‐analytical methods, e.g. Auger‐electron spectroscopy (AES), X‐ray photoelectron spectroscopy (XPS), electron‐probe microanalysis (EPMA), and analytical electron microscopy (AEM), requires knowledge of reliable elastic‐scattering cross sections for describing electron transport in solids. Cross sections for elastic scattering of electrons and positrons by atoms, ions, and molecules can be calculated with the recently developed code ELSEPA (Elastic Scattering of Electrons and Positrons by Atoms) for kinetic energies of the projectile from 10 eV to 50 eV. These calculations can be made after appropriate selection of the basic input parameters: electron‐density distribution, a model for the nuclear‐charge distribution, and a model for the electron‐exchange potential (the latter option applies only to scattering of electrons). Additionally, the correlation‐polarization potential and an imaginary absorption potential can be considered in the calculations. We report comparisons of calculated differential elastic‐scattering cross sections (DCSs) for silicon and gold at selected energies (500 eV, 5 keV, 30 keV) relevant to AES, XPS, EPMA, and AEM, and at 100 MeV as a limiting case. The DCSs for electrons and positrons differ considerably, particularly for medium‐ and high‐atomic‐number elements and for kinetic energies below about 5 keV. The DCSs for positrons are always monotonically decreasing functions of the scattering angle, while the DCSs for electrons have a diffraction‐like structure with several minima and maxima. A significant influence of the electron‐exchange correction is observed at 500 eV. The correlation‐polarization correction is significant for small scattering angles at 500 eV, while the absorption correction is important at energies below about 10 keV. Copyright © 2005 John Wiley & Sons, Ltd.     

Enrichment,incorporation and oxidation of copper during anodising of aluminium–copper alloys

Porous anodic oxides generated on copper‐containing aluminium alloys are less regular than anodic oxides generated on pure aluminium. Specifically, a porous oxide morphology comprising layers of embryo pores, generated by a cyclic process of oxide film growth and oxygen evolution, is generally observed. In this work, the relation between the oxidation behaviour of copper during anodising and the specific porous oxide film morphology was investigated by electrochemical techniques, transmission electron microscopy and Rutherford backscattering spectroscopy (RBS). It was found that the anodising potential determines the oxidation behaviour of copper, and the latter determines the porous oxide morphology. At low voltage, relatively straight pores with continuous cell walls were obtained on Al? Cu alloys, but selective oxidation of aluminium atoms resulted in the occlusion of copper‐containing metallic nanoparticles in the anodic film. At higher potentials, copper oxidation promoted oxygen evolution within the barrier layer, and generation of a less regular film morphology. RBS, performed on Al? Cu alloy specimens, revealed a high volume fraction of copper atoms in the anodic films generated at low potentials and a reduced amount of copper atoms in the anodic oxide films generated at high potentials. Copyright © 2009 John Wiley & Sons, Ltd.     

Characterization of molybdenum carbide nanoparticles formed on Au(111) using reactive-layer assisted deposition

Temperature programmed desorption (TPD), Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and scanning tunneling microscopy (STM) have been used to characterize molybdenum carbide nanoparticles prepared on a Au(111) substrate. The MoC(x) nanoparticles were formed by Mo metal deposition onto a reactive multilayer of ethylene, which was physisorbed on a Au(111) substrate at low temperatures (<100 K). The resulting clusters have an average diameter of approximately 1.5 nm and aggregate in the fcc troughs located on either side of the elbows of the reconstructed Au(111) surface. Core level XPS shows that the electronic environment of the Mo and C atoms in the nanoparticles is similar to that found in Mo(2)C(0001) single crystals and carburized Mo metal surfaces. Peak intensities in XPS and AES spectra were used to estimate an average Mo/C atomic ratio of 1.2 +/- 0.3 for nanoparticles annealed above 600 K.     

Comparative investigation on copper oxides by depth profiling using XPS,RBS and GDOES

Depth profiling has been performed by using X-ray photoelectron spectrometry (XPS) in combination with Ar-ion sputtering, Rutherford backscattering spectrometry (RBS) and glow discharge optical emission spectrometry (GDOES). The data obtained by XPS have been subjected to factor analysis in order to determine the compositional layering of the copper oxides. This leads to two or three relevant components within the oxide layers consisting of Cu(2)O or CuO dependent on the sample preparation. GDOES measurements show sputtering profiles which are seriously influenced by a varying sputter rate. To ensure the results obtained so far, RBS measurements of the oxide layers have been carried out in order to discover artefacts of the other methods used and to demonstrate the excellent suitability of RBS for quantitative analysis of these layers. Chemical analysis consisting of (1) carrier-gas fusion analysis (CGFA) and (2) selective dissolution of Cu(2)O/CuO allows the determination of the total amount of oxygen and copper, respectively, and can serve as a cornerstone of quantitative analysis.     

Carbon film growth on iron substrates by a CVD method

Carbon film coatings have been produced by a hot‐wall chemical vapor deposition (CVD) method under moderate conditions from pyrolysis of a mixture of propane and argon on an Fe(110) substrate at temperatures of 800–900 °C for different deposition times. The effects of temperature and reaction time on the growth of the carbon films were studied. Field‐emission scanning electron microscopy (FESEM), Raman microscopy, Auger electron spectroscopy (AES) and x‐ray diffraction methods have been performed to study the surface morphologies, growth features and microstructures of the carbon film coatings. The FESEM analyses indicated that carbon films on an Fe substrate consisted of flat‐layer and filamentous morphologies. Raman and AES analyses showed that the carbon initially was crystalline but the degree of disorder in the top layer of the carbon film increased with increasing deposition temperature. High‐resolution transmission electron microscopy studies are also in agreement with Raman results. The same trend was observed when the deposition time was increased from 5 to 30 min. Copyright © 2005 John Wiley & Sons, Ltd.     

Adhesion of an aromatic thermosetting copolyester with copper foils

Copper foils have been widely used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO₂, polyimide, is crucial to high performance of these devices. The adhesion between a new high temperature adhesive, aromatic thermosetting copolyester (ATSP), and various copper foils, namely, zinc(Zn)‐coated copper foil, copper foil and nickel (Ni)‐coated copper foil was characterized by a 90° peel strength test. It was found that the peel strength of Zn‐coated copper foil to ATSP was 1050 N/m, which was more than three times higher than copper foil and five times that of Ni‐coated copper foil. Scanning electron microscopy (SEM), atomic force microscopy (AFM) and X‐ray photoelectron spectroscopy (XPS) studies indicated that this higher adhesion results from the stronger mechanical interlocking due to the rougher surface of Zn‐coated copper foil, and from chemical reactions at the interface which occur during the curing process of ATSP on the Zn‐coated copper surface. In contract to the adhesive failure at the ATSP/Cu and ATSP/Ni interfaces, the failure mechanism of ATSP/Zn is both cohesive and adhesive. Copyright © 2004 John Wiley & Sons, Ltd.     

Surface Characterisation of Cerium-Doped Silica Coatings Obtained by Sol-Gel

The chemical composition of cerium-doped silica coatings prepared via sol-gel were studied using X-ray photoelectron spectroscopy (XPS) in conjunction with Ar⁺-ion sputtering, Rutherford back-scattering spectroscopy (RBS) and photoluminescence (PL) spectroscopy. XPS results showed that cerium was incorporated in the silica network as Ce(III). The absence of PL emissions from Ce(III) was explained by a clustering of the ions producing a quenching of the luminescence. XPS combined with Ar⁺ and RBS showed that the distribution of Ce is not uniform across the coating, showing a maximum concentration in an inner layer of the coating.     

Copper Oxide Nanoparticle Modified Sol–Gel‐Derived Carbon Ceramic by Microwave Irradiation,and Its Application for Determination of Adenine at Very Low Potential

In this work the copper oxide nanoparticles simultaneous with sol–gel‐derived carbon ceramic production were synthesized and doped in ceramic by microwave irradiation in a few minutes without using any catalyst and organic solvent. The ceramic composition was characterized by X‐ray diffraction (XRD), X‐ray photoelectron spectroscopy (XPS) and Fourier transforms infrared (FT‐IR), and its surface morphology was investigated by scanning electron microscopy (SEM). The proposed ceramic with detection limit of 0.1 µM, was used for electrocatalytic determination of adenine at potential about 700 mV lower than its usual oxidation potential.