Thermal conductivity and thermal diffusivity of poly(acrylic acid) by transient hot wire technique

The paper describes a new transient hot wire instrument which employs 25.4 μm diameter tantalum wire with an insulating tantalum pentoxide coating. This hot-wire cell with a thin insulating layer is suitable for measurement of the thermal conductivity and the thermal diffusivity of electrically conducting and polar liquids. This instrument has been used for experimental measurement of the thermal conductivity and the thermal diffusivity of poly(acrylic acid) solution (50 mass%) in the temperature range of 299 to 368 K at atmospheric pressure. The thermal conductivity data is estimated to be accurate within ±4%. Thermal diffusivity measurements have a much higher uncertainty (±30%) and need further refinement.     

Thermal diffusivity and electrical conductivity of electropolymerized polypyrrole films

This article presents measurement of thermal diffusivity and electrical conductivity of polypyrrole films prepared by electropolymerization. Thermal diffusivity was measured by laser radiometry (former flash radiometry). Electrical conductivity was determined by a conventional four-probe method. Increase of thermal diffusivity is observed when increasing the supporting electrolyte concentration, which is also shared with the increase of electrical conductivity. Both thermal diffusivity and electrical conductivity significantly depended on the types of counter anion incorporating into polymer bulk. Thermal diffusivity of polypyrrole film is larger than that for common nonelectrical conductive polymers. Temperature profile of thermal diffusivity for as-grown polypyrrole films shows that thermal diffusivity increases with increasing temperature (first running profile), whereas remeasured temperature profile of thermal diffusivity (second or third running profiles) shows the decrease of thermal diffusivity with increasing temperature. Electrical conductivity monotonically increases until the significant decrease of it occurs at the temperature above 130°C. Investigation of these temperature profiles of thermal diffusivity and electrical conductivity has been made by corresponding to thermal analysis data. © 1994 John Wiley & Sons, Inc.     

Development of a thermal conductivity cell with nanolayer coating for thermal conductivity measurement of fluids

Various techniques and methodologies of thermal conductivity measurement have been based on the determination of the rate of directional heat flow through a material having a unit temperature differential between its opposing faces. The constancy of the rate depends on the material density, its thermal resistance and the heat flow path itself. The last of these variables contributes most significantly to the true value of steady-state axial and radial heat dissipation depending on the magnitude of transient thermal diffusivity along these directions. The transient hot-wire technique is broadly used for absolute measurements of the thermal conductivity of fluids. Refinement of this method has resulted in a capability for accurate and simultaneous measurement of both thermal conductivity and thermal diffusivity together with the determination of the specific heat. However, these measurements, especially those for the thermal diffusivity, may be significantly influenced by fluid radiation. Recently developed corrections have been used to examine this assumption and rectify the influence of even weak fluid radiation. A thermal conductivity cell for measurement of the thermal properties of electrically conducting fluids has been developed and discussed.     

Scanning thermal microscopy techniques for polymeric thin films using temperature contrast mode to measure thermal diffusivity and a novel approach in conductivity contrast mode to the mapping of thermally conductive particles

Advances in production are leading to increasing use of polymeric thin films in applications such as automotive bearings. Two approaches have been developed to study the thermophysical properties of these thin films: The first technique based on Flash theory uses a scanning thermal microscopy (SThM) tip in temperature contrast mode to measure thermal diffusivity over a nano-scale area. The SThM tip is in contact with the upper surface of the film to detect a heat pulse delivered by a microelectromechanical heater platform from the lower surface. The second technique is a conductivity contrast mode SThM based approach for measuring the size and distribution of thermally conducting particles in thin film polymeric coatings. Topographical and thermal conductivity data are combined to produce a “correlation analysis value” 3D particle map of the coating. Good practice and a case study are highlighted.     

Measurement of thermal diffusivity by the photoacoustic method

Analysis of the photoacoustic signalvs. the modulation frequency allows the determination of thermal diffusivity. Computer simulations have been carried out to determine the optimal conditions, in the case of rear surface illumination, for which the thermal diffusivity is accurately measured. In accordance with these conditions, measurements were performed on a reference sample (silicon).     

High‐performance hexagonal boron nitride/bismaleimide composites with high thermal conductivity,low coefficient of thermal expansion,and low dielectric loss

High‐performance insulating materials have been increasingly demanded by many cutting‐edge fields. A new kind of high‐performance composites with high thermal conductivity, low coefficient of thermal expansion (CTE), and low dielectric loss was successfully developed, consisting of hexagonal boron nitride (hBN) and 2,2′‐diallylbisphenol A (DBA)‐modified 4,4′‐bismaleimidodiphenylmethane (BDM) resin. The effects of hBN and its content on the integrated properties, including curing behavior of uncured system, the CTE, thermal conductivity, dielectric properties, and thermal resistance of cured composites, are systematically investigated and discussed. Results show that there are amino groups on the surface of hBN, which supply desirable interfacial adhesion between hBN and BDM/DBA resin and a good dispersion of hBN in the resin. With the increase of the hBN content, the thermal conductivity increases linearly, whereas the CTE value decreases linearly; in addition, dielectric loss gradually decreases and becomes more stable over the whole frequency from 10 to 10⁹ Hz. In the case of the composite with 35 wt% hBN, its thermal conductivity, CTE in glassy state, and dielectric loss are about 3.3, 0.63, and 0.5 times of the corresponding value of BDM/DBA resin, respectively. These attractive integrated properties suggest that hBN/BDM/DBA composites are high‐performance insulating materials, which show great potential in applications, especially for electronics and aerospace industries. Copyright © 2011 John Wiley & Sons, Ltd.     

Degree of crystallinity and lattice thermal conductivity of polyethylene at low temperatures

The lattice thermal conductivity of a semicrystalline polymer was studied at low temperatures by calculating the total lattice thermal conductivities of four samples of polyethylene with different degrees of crystallinity between 0.43 and 0.81 and temperatures between 0.4 and 20 K. The contributions of the crystalline and noncrystalline natures and their percentage contributions were taken into account. The predicted lattice thermal conductivity of polyethylene was in fairly good quantitative agreement with the experimental value, and showed a strong crystallinity dependence, with a distinctive cross-over point at about 2 K.     

Effect of thermal decomposition processes on the thermal properties of carbon fiber reinforced cement composites in high-temperature range

Thermal conductivity, specific heat capacity, thermal diffusivity and linear thermal expansion coefficient of two types of carbon fiber reinforced cement composites are measured in the temperature range up to 800°C. Thermal conductivity and thermal diffusivity are also determined for the specimens exposed to thermal load up to 800°C before the measurement. Differential thermal analysis (DTA), mercury intrusion porosimetry (MIP), scanning electron microscopy (SEM) and X-ray diffraction analysis (XRD) are utilized for the assessment of thermal decomposition processes taking place in the high temperature range under consideration. The high temperature thermal properties of the studied materials are found to be positively affected by the application of the high alumina cement and in the case of the Portland cement based composite also by using the autoclaving procedure in the production process. Also, the randomly distributed carbon fibers that can reduce the damage of the pore structure by the thermal decomposition processes are identified as a positive factor in this respect. A comparison of thermal conductivity vs. temperature curves obtained for the specimens pre-heated to different temperatures is found to be a useful tool in the identification of major dynamic effects in the specimens due to the thermal decomposition reactions. The results are in a good agreement with the DTA, MIP, SEM and XRD analyses. The character of the thermal conductivity measurements that in fact includes the effects of convection and radiation into the thermal conductivity coefficient can be beneficial for a simple assessment of the influence of the fire on a dividing structure.     

Thermal conductivity of high strength polyethylene fiber in low temperature

High strength polyethylene fiber (Toyobo, Dyneema® fiber, hereinafter abbreviated to DF) used as reinforcement of fiber‐reinforced plastics for cryogenic use has a high thermal conductivity. To understand the thermal conductivity of DF, the relation between fiber structure and thermal conductivity of several kinds of polyethylene fibers having different modulus from 15 to 134 GPa (hereinafter abbreviated to DFs) was investigated. The mechanical series‐parallel model composed of crystal and amorphous was applied to DFs for thermal conductivity. This mechanical model was obtained by crystallinity and crystal orientation angle measured by solid state NMR and X‐ray. Thermal conductivity of DF in fiber direction was dominated by that of the continuous crystal region. The thermal conductivity of the continuous crystal part estimated by the mechanical model increases from 16 to 900 mw/cmK by the increasing temperature from 10 to 150K, and thermal diffusivity of the continuous crystal part was estimated to about 100 mm²/s, which is almost temperature independent. The phonon mean free path of the continuous crystal region of DF obtained by thermal diffusivity is almost temperature independent and its value about 200 Å. With the aforementioned, the mechanical series‐parallel model composed of crystal and amorphous regions could be applied to DFs for thermal conductivity. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 1495–1503, 2005     

Effect of pressure on the thermal conductivity of polymers

The thermal conductivity of polyolefins and halogen-substituted polymers was studied in a broad temperature interval spanning both solid and melt states, in the range of pressures from 0.1 up to 100 MPa with the aid of a high-pressure-calorimeter in the continuous heating regime. Treatment of data on the pressure dependence of the thermal conductivity of melts in terms of Barker's equation yielded the values of quasilattice Grueneisen parameter _B which exhibited the same dependence on molecular structure of a polymer as the parameter 3C/p from the Simha-Somcynsky equation of state (number of external degress of freedom per chain repeat unit). Analysis of the dependence of the thermal conductivity of polyethylene on the degree of crystallinity revealed the inadequacy of the current two-phase model which does not account for the microheterogeneity of the amorphous phase. It was concluded that interchain heat transfer makes the dominant contribution to the thermal conductivity of polymers both in amorphous and in crystalline states.

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Zusammenfassung Mit Hilfe eines Hochdruck-- Kalorimeters mit kontinuierlicher Aufheizung wurde im Druckintervall 0,1 bis 100 MPa und in einem breiten Temperaturbereich, in den sowohl feste als auch flüssige Zustände gehören, die Wärmeleitfähigkeit von Polyolefinen und halogenierten Polymeren untersucht. Drückt man die Druckabhängigkeit der Wärmeleitfähigkeit der Schmelzen mit Hilfe der Barkerschen Gleichung aus, erhält man die Werte für den Quasigitter Grueneisen-Parameter_b, der die gleiche Abhängigkeit von der Molekular-struktur eines Polymers zeigt, wie der Parameter 3C/p aus der Gleichung von Simha-Somcynsky (Zahl der externen Freiheitsgrade geteilt durch Kettenstruktureinheit). Eine Untersuchung der Abhängigkeit der Wärmeleitfähigkeit von Polyethylen von Kristallinitäts-grad zeigt die Mängel dieses Zwei-Phasen-Modelles, was die Mikroheterogenität der amorph-en Phase nicht erklärt. Man zog die Schlußfolgerung, daß ein Wärmetransport zwischen den Ketten sowohl im amorphen als auch im kristallinen Zustand den entscheidenden Beitrag zur Wärmeleitfähigkeit von Polymeren liefert.

     

Thermosets containing benzoxazole units: Liquid‐crystalline behavior and thermal conductivity

A series of liquid‐crystalline (LC) thermosetting monomers containing benzoxazole (BO) units were synthesized to evaluate the thermal conductivities (λ) of their cured resins. A BO‐containing bisnadiimide system showed LC behavior during the heating process. However, the thermal cure of the bisnadiimide provided a film without optical anisotropy; consequently, the cured film exhibited normal levels of thermal diffusivity (α) and thermal conductivity (λ). The disappearance of the optically anisotropic ordered structures during thermal curing is likely related to the temperature gaps between the cure reaction ranges and LC ranges (T_cure‐T_LC gap). In addition, epoxy resins consisting of bisepoxides and BO‐containing diamines were investigated because of their high flexibility in terms of molecular design that can be used to reduce the T_cure‐T_LC gap. The combination of a terephthalylidene‐type bisepoxide and BO‐containing diamine with a controlled flexible chain length resulted in the smallest T_cure‐T_LC gap among the epoxy resin systems examined herein. The cured epoxy resin film exhibited an appreciably increased λ value (0.257 W m^?1 K^?1) in the Z direction. This indicated the importance of the T_cure‐T_LC gap for enhancing the α and λ values of the cured films. This epoxy resin system was cured under a continuous DC electric field during polarizing optical microscopy. A prompt response with deformation of the LC domains was observed in harmony with temporal ON/OFF switching of the DC power supply. As expected, the cured film exhibited a significantly enhanced λ value (0.488 W m^?1 K^?1) in the Z direction.     

Measurement of thermal diffusivity in polymer melts using forced Rayleigh light scattering

Thermal diffusivity measurements on three polymer melts were made using the Forced Rayleigh Light Scattering technique. The polymers, which were tested at room temperature where they are in the molten state, included a polydimethylsiloxane and two polyisobutylenes. The optical setup and procedures developed in this study to conduct thermal Forced Rayleigh Light Scattering experiments are shown to be capable of producing thermal diffusivity data with a high degree of accuracy and precision. From measurements on a reference fluid (ethanol), experimental error was estimated to be no greater than 2%, and could be reduced to less than 1% by appropriate design of a series of experiments. Discrepancies of 4 and 14% in thermal diffusivity data on the polymer samples between measured values and those found in the literature were observed. It is suggested that these deviations are attributable to either sample variations or to errors in the techniques used in previous investigations. © 1999 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 37: 1069–1078, 1999     

Epoxy nanocomposites with high thermal conductivity and low loss factor: Realize 3D thermal conductivity network at low content through core-shell structure and micro-nano technology

Dielectric polymers with high thermal conductivity are very promising in the fields of aerospace and electronic device packaging. However, composites with excellent dielectric properties usually have low thermal conductivity. It is usually to fill the polymer with thermal conductivity particles to improve the thermal conductivity, but the high content of filler often reduces the mechanical properties of the polymer. In this paper, the traditional insulating polymer epoxy resin was used as the matrix, by covering the surface of silicon carbide with graphene to form a core-shell structure and co-filled with nano diamonds to achieve the preparation of high-performance epoxy resin at low content. The results showed that at the filling content of 30 wt%, the thermal conductivity of epoxy nanocomposites showed a dramatic thermal conductivity enhancement of 1263%, the energy storage modulus increased by 1.1 GPa, and the dielectric loss remained unchanged at 50 Hz. The advantages of the composite are the structural design and surface modification of the filler, which not only take advantage of its inherent advantages, but also improve the interface area with the epoxy matrix. The composite materials with excellent properties are expected to provide theoretical guidance for the application of high thermal conductivity dielectric materials.     

Effect of treatment on the thermal conductivity and thermal diffusivity of oil‐palm‐fiber‐reinforced phenolformaldehyde composites

The thermal conductivity and thermal diffusivity of oil‐palm‐fiber‐reinforced untreated (Sample 1) and differently treated composites were measured with the transient plane source technique at room temperature and under normal pressure. All the composites were 40% oil‐palm fiber by weight. The fibers were treated with alkali (Composite 2), silane (Composite 3), and acetic acid (Composite 4) and reinforced in a phenolformaldehyde matrix. The thermal conductivity and thermal diffusivity of the composites increased after treatment to different extents. The thermal conductivity of the treated fibers as well as of the untreated fibers was calculated theoretically. The model results show that the thermal conductivity of the untreated fiber was smaller than the thermal conductivity of the treated fibers. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 916–921, 2000     

New approach to calibrating conductivity meters in the low conductivity range

There is currently a major issue with the calibration of conductivity meters used for high purity water: the lack of availability of a reference material or reference methods for low conductivity ranges (conductivity below 1 S cm^–1 at 25.0 °C, resistivity >1 M cm at 25.0 °C). This paper describes the current status of conductivity measurements in high purity water. A new and improved approach, currently being investigated, should allow us to make the calibration of conductivity meters used for low conductivity ranges traceable to the SI.Milipore, Milli-Q and Elix are registered trademarks of Millipore Corporation.     

Effects of flame‐retardant ramie fiber on enhancing performance of the rigid polyurethane foams

Ramie fiber (RF) with excellent tensile strength was treated by a flame retardant and obtained the modified RF (MRF) that is incombustible. Then, MRF was used to improve the performance of rigid polyurethane foams (RPUF). The mechanical properties of the composite were investigated by compressive strength test and shear stress test. The fire characteristics were studied using a cone calorimeter. And the thermal decomposition and flammable properties were further evaluated using thermogravimetric analysis and limiting oxygen index. The results showed that MRF improve the mechanical properties of RPUF and eliminate the harm of flammability of RF on the RPUF.     

Study of temperature profile and specific heat capacity in temperature modulated DSC with a low sample heat diffusivity

One important application of temperature modulated DSC (TMDSC) is the measurement of specific heat of materials. When the sample has very good thermal conductivity as in the case of metals, the temperature gradient is not normally an important factor and can be ignored most of the time. However, in the case of materials with poor heat transfer properties, for example, polymers, the thermal conductivity is only in the order of 1/1000 or so of that of metals. This could have a major effect on the test results. In this paper, a round analytical solution is given and a numerical model is used to analyze the effects of thermal diffusivity on temperature distribution inside the test sample and specific heat measurement by TMDSC, PET sample test results are presented to demonstrate the effects of material thermal diffusivity.     

Measurement of thermal diffusivity and specific heat capacity of polymers by laser flash method

We measured thermal diffusivity and heat capacity of polymers by laser flash method, and the effects of measurement condition and sample size on the accuracy of the measurement are discussed. Thermal diffusivities of PTFE films with thickness 200–500 μm were the same as those data that have been reported. But, the data for film thickness less than 200 μm have to be corrected by an equation to cancel thermal resistance between sample film and graphite layers for receiving light and detecting temperature. Thermal diffusivity was almost unaffected by the size of area vertical to the direction of laser pulse, because heat flow for the direction could be negligible. Specific heat capacity of polymer film was exactly measured at room temperature, provided that low absorbed energy (< 0.3 J) and enough sample mass (> 25 mg) were satisfied as measuring conditions. Thermal diffusivity curve of PS or PC versus temperature had a terrace around T_g, whereas that of PE decreased monotonously with increasing in temperature until T_m. Further, we estimated relative specific heat capacity (RC_p) by calculating ratios of heat capacities at various temperatures to the one at 299 K. RC_p for PS obtained by laser flash method was larger than that obtained by DSC method, whereas the RC_ps for PE obtained by the both methods agreed with one another until T_m (305 K). RC_p for PS decreased linearly, with increase in temperature after it increased linearly until T_g (389 K), showing similarity to temperature dependency of thermal conductivity. RC_p for PE also decreased until T_m, similar to thermal conductivity. ©1995 John Wiley & Sons, Inc.     

Relation between thermal conductivity and molecular alignment direction of free‐standing film aligned with rubbing method

The liquid crystal acryl compounds, in which the molecular directions were aligned by the rubbing method, were polymerized by UV irradiation, to provide the free‐standing aligned films of 200‐μm thickness. The relation between the thermal conductivity and the aligned molecular direction of the films was investigated. The homogeneous film showed the largest magnitude of the thermal conductivity at the direction along the molecular long axis (0.69 W/m K). This was 3.6 times greater than that of poly(methyl methacrylate). The thermal conductivity was dependent on the rotation angle and the concentration of the homogeneous molecular long axis fractions in the networks. These relations were investigated with the twisted film. © 2005 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 3591–3599, 2005     

Radiation contribution to the thermal conductivity of plastic foams

The validity of two approaches widely used to determine the radiant thermal conductivity in plastic foams is discussed. While one approach is based on the solution of a geometric model, the other is derived from the experimental determination of the extinction coefficient. A comparison to recently reported experimental data shows that the geometric approach predicts values that are in good agreement. In contrast, values deduced from measurements of the mean extinction coefficient significantly underestimate the radiant thermal conductivity, an effect that can be traced to the way that the extinction coefficient is measured. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 43: 190–192, 2005