Cure Kinetics Study of Two Epoxy Systems with Fourier Tranform Infrared Spectroscopy (FTIR) and Differential Scanning Calorimetry (DSC)

This work was aimed at the study of cure kinetics of two commercial thermosetting epoxy systems, Epikote resin 816 LV/Epikure F205 and Epikote resin 240/Epikure F205, by Fourier Tranform Infrared Spectroscopy (FTIR) and Differential Scanning Calorimetry (DSC). The studied systems consist of a resin (A), based on a diglycidyl ether of bisphenol A and a hardener (B) based on the Isophorodiamine (IPDA) a cycloaliphatic diamine. These systems are used for the building and civil engineering industries, e.g. flooring compounds, adhesives, mortars and grouts. FTIR spectroscopy was employed to investigate the isothermal curing kinetics at 30, 50 or 70°C and DSC analysis to study the non-isothermal curing kinetics at different heating rates 2.5, 5, 10 and 20°C/min, from 20 to 300°C. A kinetic model was employed to simulate the FTIR isothermal experimental data using two kinetic rate constants and incorporating also diffusion control at high degrees of conversion. Finally, the variation of the effective activation energy with the extent of curing was estimated using isoconversional analysis of non-isothermal DSC data.     

升温与等温法非模型动力学研究环氧树脂固化反应

基于DSC数据,采用以Vyazovkin积分法为基础的升温法非模型动力学和等温法非模型动力学对双酚A型环氧树脂E51/4,4′-二氨基二苯基砜(DDS)体系及多官能度环氧树脂AG80/DDS体系的固化过程进行了研究,并结合玻璃化转变温度的变化和原位红外测试技术,对比分析了升温与等温条件下的固化反应规律.结果表明,与传统的模型拟合法相比,非模型动力学更适合定量预测树脂固化反应过程,并能为固化过程中反应机理变化的研究提供重要依据;等温法非模型动力学能够更好地预测两种树脂体系在不同恒温条件下的固化反应历程,并且升温法与等温法非模型动力学所得到的反应活化能-固化度之间的变化关系不同,表明不同温度条件下树脂的反应机理不同,这与升温和恒温条件下玻璃化效应及环氧官能团的变化规律相吻合.     

TBBPAER/DDM的固化反应动力学

用等温差示扫描量热法研究了4，4’-二氨基二苯甲烷固化四溴双酚-A环氧树脂的反应动力学，测定了固化反应热，得出了不同温度下固化反应速率与反应程度、固化反应程度与反应时间的关系曲线．结果表明等温固化反应按自催化反应机理进行，用Kamal方程较好地描述了不同温度下其固化反应的自催化反应过程，并反映出不同温度下扩散作用的差别，其动力学参数k1、k2、m、n由非线性回归法拟合而出，k1、k2对应的反应表现活化能分别为52．2kJ·mol-1和46．5kJ·mol-1。     

Influence of the addition of erbium and ytterbium triflates in the curing kinetics of a DGEBA/<Emphasis Type="Italic">o</Emphasis>-tolybiguanide powder mixture

Solid bisphenol-A epoxy resin (DGEBA) of medium molecular mass was cured using o-tolylbiguanide (TBG) as cross-linking agent. In order to improve the kinetics of the reactive system, two Lewis acid catalysts (erbium(III) and ytterbium(III) trifluoromethanesulfonates) were added in proportions of 1 phr. The kinetic study was performed by dynamic scanning calorimetry (DSC) and the complete kinetic triplet (E, A and g(α)) determined. The kinetic analysis was performed with an integral isoconversional procedure (model-free), and the kinetic model was determined by the Coats-Redfern method and through the compensation effect (IKR). All the systems followed the m=1.5/n=0.5 isothermal curing model simulated from non-isothermal experiments. The addition of a little proportion of ytterbium or erbium triflates accelerated the curing process. In order to extract further information about the role of the lanthanide triflates added to epoxy/TBG systems, the kinetic results were compared with our previous kinetic studies made on DGEBA/lanthanide triflates initiated systems.     

Kinetic studies of the polymerization of an epoxy resin modified with rhodamine B

Novel fluorescent materials were satisfactorily synthesized. With this aim, an epoxy resin based on diglycidyl ether of bisphenol A (DGEBA) was reacted with a laser dye, rhodamine B (RB), to achieve an epoxy-based prepolymer. Then, a diamine, m-xylylenediamine (MXDA), was used as hardener with the purpose of obtaining a crosslinked polymer. The curing conditions strongly influence the intended final properties and the optimization of the curing requires a reliable kinetic model. For that reason, this work presents the kinetic study of the polymerization of the epoxy resin by differential scanning calorimetry (DSC) in isothermal mode as well as by Fourier transform infrared spectroscopy (FTIR). DSC data were fitted using a Kamal autocatalytic equation. Conversion as a function of reaction time curves obtained by means of both techniques agreed well. In addition, the synthesized epoxy-based materials were characterized by proton nuclear magnetic resonance spectroscopy (¹H NMR) and their fluorescent properties were also analysed.     

Chemorheology and Curing Kinetics of a New RTM Benzoxazine Resin

The chemorheology and curing kinetics of a new high performance resin transfer molding benzoxazine resin was investigated. A chemorheological model based on a modified Arrhenius equation that describes the resin viscosity as a function of temperature and time was proposed. The model, which agreed well with the experimental data, can provide theoretical support for the mold-filling stage in the resin transfer molding process. The average activation energies of the polymerization reaction were obtained by means of gelation times at different temperatures based on the Arrhenius equation and from dynamic differential scanning calorimetry (DSC) results based on the Kissinger and Ozawa methods; the values were 96.0,84.0 and 87.8 KJ/mol, respectively. A plot of activation energy vs. conversion in the curing process was obtained using the Flynn-Wall-Ozawa model. The reaction orders were estimated from isothermal DSC based on a modified Kamal kinetics model which can describe both the autocatalytic and diffusion-controlled curing mechanism.     

2-乙基-4-甲基咪唑固化环氧树脂体系动力学模型

由2-乙基-4-甲基咪唑(2,4-EMI)固化双酚A二缩水甘油醚型环氧树脂(DGEBA)的等温差示扫描量热(DSC)实验结果发现固化反应分两阶段进行,催化聚合反应有一诱导期.由DSC测试结果求得催化聚合反应的速率常数.从反应机理出发,以诱导期为边界,建立两阶段的微观固化动力学模型.从扩散的角度在模型中引入临界固化度(αc)和扩散因子,进一步建立扩散控制固化动力学模型,对不同2,4-EMI含量和固化温度(Tc)的体系,计算得到αc.研究发现扩散因素对固化动力学影响较大,固化反应前期由化学动力学控制,后期由扩散因素控制;αc主要由体系的玻璃化转变决定,Tc越高,体系玻璃化转变时对应的固化度越大,cα越大.     

Synthesis and curing behavior of a novel liquid crystalline epoxy resin

This article described the synthesis and mesomorphic behavior transition of a novel liquid crystalline (LC) epoxy resin 4-(2,3-epoxypropoxy)biphenyl,4″-(2,3-epoxypropoxy)phenyl-4′carboxylate (EBEPC), which combined a hydroxyl benzoic aromatic ester and biphenol rigid-rod group. EBEPC showed a clear nematic schlieren texture under curtain conditions. The reaction kinetics of EBEPC cured by 4,4′-diaminodiphenyl-methane (DDM) was studied by using an isoconversional method under isothermal conditions with differential scanning calorimetry (DSC). The isothermal DSC data can be fitted reasonably by an autocatalytic curing model. Smectic phases had been observed in the EBEPC/DDM curing system. The results of DSC showed that the formation of the LC phase had pronounced influence on the curing reaction.     

Study on curing of novolac epoxy resin

The optimization of proportions of novolac epoxy resin, Dobeckot E4 and polyamide hardener, EH411 has been established by DSC and the data indicates that resin-polyamide, 100∶40 and 100∶50, appear to be optimum where ‘extent of cure’ is maximum. The kinetic parameters for these formulations have been evaluated using isothermal and dynamic modes by employing DSC. The rate constants have been evaluated for curing process of these formulations using isothermal DSC mode in the temperature range of 70°–90°C. These have also been predicted at 20°±1°C (room temperature) by extrapolating the data obtained at elevated temperatures. A comparison of the predicted values with the experimental values shows that there is a good agreement between them.     

Chemorheological study of the curing kinetics of a phenolic resol resin gelled

The changes in the resin viscosity, conductivity, mass, and enthalpy during curing reactions have been studied to obtain kinetic parameters that allow modeling of the resin behavior throughout its industrial application. In this work, isothermal rheological tests of a phenolic resol resin were performed in order to study its complex viscosity during crosslinking reactions. Samples were prepared by a precuring treatment in a heated plate press to reach gel point of the resin. Rheological analyses of resol resin curing were carried out at five different temperatures (80-100 °C), and the kinetic models of Arrhenius and Kiuna were applied. The resol resin curing presented an activation energy of 72.1 kJ/mol according to the Arrhenius model. The Kiuna model was proposed to fit the non-linear evolution of the resin’s complex viscosity at the highest temperatures. This kinetic model was suitable for predicting the changes in the complex viscosity of the resol resin after its gelation, and the process activation energy obtained for the second order polynomial applied in this model was 88.1 kJ/mol. In addition, the profile for the degree of curing of resol resin was determined from measurements of the material’s elastic modulus.     

酸酐固化环氧树脂/蒙脱土复合材料的等温固化动力学

用等温差示扫描量热法(DSC)研究了酸酐固化环氧树脂/蒙脱土复合材料的等温固化过程，考察了未处理的蒙脱土(MMT)和有机蒙脱土(OMMT)对环氧树脂固化动力学的影响. 实验表明， 环氧树脂的固化过程包含自催化机理，加入蒙脱土没有改变固化反应机理. 用Kamal方程对该体系的固化过程进行拟合，得到反应级数m、n，反应速率常数k1、k2，总反应级数(m + n)在2.4～3.0之间. MMT的加入使环氧树脂体系的k1、k2有所降低，而OMMT的加入对体系的k1、k2影响较为复杂，加入蒙脱土对环氧树脂固化体系的活化能影响较小.     

碳纤维/双马树脂预浸料体系的固化动力学

A new isothermally based cure kinetic model for the prepreg was presented using an industrially supplied prepreg rather than neat resin. The matrix resin was bismaleimide（BMI）resin,and the reinforcement was carbon fiber T700-12S. A series of isothermal Differential Scanning Calorimetry（DSC）tests were performed and analyzed by the proposed nth-order reaction model. An increase in the cure rate was observed at the higher temperature in both neat and prepreg. After reaching the peak value,the cure rate of resin dropped off faster in prepreg,resulting in a lower average value of the ultimate heat of reaction. The presence of carbon fiber was found to significantly impact the curing behavior of the resin,leading to significant changes from the neat resin kinetic parameters. The carbon fibers imposed restrictions on the molecular mobility of reactive species,reduced the extent of polymerization within the system and did not change the cure mechanism of resin.     

聚氧硫杂蒽树脂固化特性及其动力学的研究

以DSC、TG等技术手段研究了聚氧硫杂蒽树脂 (POSPF)的固化特性及其动力学 .结果表明 ,用六次甲基四胺 间二氯苄作固化剂 ,加热至 10 5～ 2 2 5℃能使POSPF树脂固化 ,在固化过程树脂中的活性羟甲基和固化剂参与反应生成亚甲基桥从而形成网状体型结构 ;动态DSC曲线上出现宽的固化放热峰 ,用T β外推法确定其凝胶温度Ti=10 0 0℃、固化温度Tp=181 5℃、后固化温度Tf=2 2 5 7℃ .固化后树脂具有优良的耐热性 ,失重 5 %时热分解温度高达 4 0 3℃ .     

Simulation of isothermal cure of A powder coating

The curing of a thermosetting powder coating was studied by means of differential scanning calorimetry (DSC). The isothermal cure was simulated by non-isothermal experiments. The results of the simulation were compared with experimental isothermal data. From non-isothermal isoconversional procedures (free model), it was concluded that these permit simulation of the isothermal cure but do not enable us to determine the complete kinetic triplet (A preexponential factor, E activation energy, f(a) and/or g(a) function of conversion). Non-isothermal procedures based on a single heating rate or on master curves present difficulties for determination of all the kinetic parameters, due to the compensation effect between preexponential factor and activation energy. The kinetic triplet can be determined by a combination of various non-isothermal methods or by using experimental isothermal data in addition to non-isothermal data. This revised version was published online in July 2006 with corrections to the Cover Date.     

The curing kinetics and mechanical properties of epoxy resin composites reinforced by PEEK microparticles

In this paper, a polyether-ether-ketone (PEEK)/epoxy composite was prepared by using PEEK microparticles as the reinforcement. The nonisothermal differential scanning calorimetry (DSC) test was used to evaluate the curing reaction of PEEK/epoxy resin system. The curing kinetics of this system were examined utilizing nonisothermal kinetic analyses (Kissinger and Ozawa), isoconversional methods (Flynn-Wall-Ozawa and Kissinger-Akahira-Sunose) and an autocatalytic reaction model. During these analyses, the kinetic parameters and models were obtained, the curing behavior of PEEK/epoxy resin system under dynamic conditions was predicted. The results show that isoconversional methods can adequately interpret the curing behavior of PEEK/epoxy resin system and that the theoretical DSC curves calculated by the autocatalytic reaction model are in good agreement with experimental data. Furthermore, the tensile elongation at break, tensile strength, flexural strength, compression strength and compression modulus increased by 81.6%, 33.66%, 36.53%, 10.98% and 15.14%, respectively, when PEEK microparticles were added in epoxy resin composites.     

Estimation of kinetic parameters for curing of epoxy-anhydride compositions by DSC

The kinetics of the curing process of epoxy resin (ED-22) in the presence of the anhydride hardeners (iso-methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and dodecylsuccinic anhydride) and accelerators (2-methyl imidazole and n-butyltriphenylphosphonium bromide) has been investigated by DSC method in the dynamic mode. Processing of experimental DSC thermograms recorded at different heating rates was carried out within the frameworks of isoconvertional analysis in two versions, namely "model-free" method of Friedman and the Ozawa—Flynn—Wall method. The possibility to describe the kinetics of epoxy compositions curing in the frameworks of one-step autocatalytic reaction model has been demonstrated. Obtained kinetic parameters were used to predict the curing kinetics under isothermal conditions and for comparative analysis of the compositions.     

咪唑固化不同类型环氧树脂的固化特征、固化动力学及其反应活性

以咪唑为固化剂,对缩水甘油醚型、缩水甘油酯型环氧树脂(简称链型环氧树脂)及脂环环氧树脂的固化特征、固化动力学及反应活性进行了研究.DSC实验结果表明,固化过程均分两阶段进行,链型环氧树脂固化反应表观活化能低于脂环环氧树脂.各树脂第一阶段的表观反应活化能均低于第二阶段活化能.当脂环环氧树脂中混入不同比例的链型环氧树脂后,固化反应速率均较脂环环氧树脂单独固化时快,当链型环氧树脂量大于50％时,更为明显.     

Kinetic models for the SR1500 and LY556 epoxies under manufacturer’s recommended cure cycles

The kinetic behaviours of two commercial epoxy resin systems subjected to manufacturer’s recommended cure cycles (MRCC) were studied in detail. The two systems were characterized through differential scanning calorimetry (DSC) using both isothermal and dynamic test conditions. The kinetic parameters were determined and two original kinetic models were established for these resin systems subjected to the “real” processing conditions. In this paper the experimental procedure is described, together with its results and the original kinetic models developed.     

环氧树脂/桐油酸酐/蒙脱土纳米复合材料固化动力学

环氧树脂/桐油酸酐/蒙脱土纳米复合材料固化动力学;固化反应;DSC     

Calorimetric investigation of polymerization reactions. III. Curing reaction of epoxides with amines

The curing reactions of epoxy resin with aliphatic diamines and the reaction of phenyl glycidyl ether with butylamine as a model for the curing reactions were investigated with a differential scanning calorimeter (DSC) operated isothermally. The heat of reaction of phenyl glycidyl ether with butylamine is equal to 24.5 ± 0.6 kcal/mole. The rate of reaction was followed over the whole range of conversion for both model and curing reactions. The reactions are accelerated by the hydrogen-bond donor produced in the system. The rate constants based on the third-order kinetics were determined and discussed for the model reaction and for the chemically controlled region of curing reactions. The activation energies for these rate constants are 13-14 kcal/mole. At a later stage of conversion, the curing reactions become controlled by diffusion of functional groups. The final extent of conversion is short of completion for most isothermally cured and even for postcured samples because of crosslinking. It was quantitatively indicated that the final conversion of isothermal cure corresponds to the transition of the system from a viscous liquid to a glass on the basis of the theory of glass transition temperature of crosslinked polymer systems.