晶格匹配InAs/AlSb超晶格材料的分子束外延生长研究

InAs/GaSb超晶格是量子级联激光器(quantum cascade lase,QCL)和带间级联激光器(interband cascade lasers,ICL)结构中重要的组成,特别是作为ICL的上下超晶格波导层是由大量的超薄外延层(纳米量级)交替生长而成,细微的晶格失配便会直接导致材料晶体质量变差,而且每层的厚度和组分变化会强烈影响材料结构性能.论文研究验证了InAs/GaSb超晶格材料生长的最佳温度约在420℃.通过在衬底旋转的情况下生长40周期短周期GaSb/AlSb和InAs/GaSb超晶格,并采用XRD测量拟合获得了GaSb和AlSb层厚分别为5.448 nm和3.921 nm,以及InAs和GaSb层厚分别为8.998 nm和13.77 nm,误差在10%以内,获得了InAs/AlSb超晶格的生长最优条件.在GaSb衬底上生长晶格匹配的40周期的InAs/AlSb超晶格波导层,充分考虑飘逸As注入对InAs/AlSb超晶格平均晶格常数的影响,在固定SOAK时间为3 s的条件下,通过变化As压为1.7×10^-6 mbar来调整个超晶格的平均晶格常...     

InAs/GaInSb超晶格薄膜结构与电学性能

采用分子束外延(MBE)方法, 调节生长温度、Ⅴ/Ⅲ束流比等参数在(001)GaAs衬底上生长了InAs/GaInSb超晶格薄膜.结果表明:InAs/GaInSb超晶格薄膜的最佳生长温度在385~395 ℃, Ⅴ/Ⅲ束流比为5.7 :1~8.7 :1.高能电子衍射仪(RHEED)原位观测到清晰的GaAs层(4×2)、GaSb层(1×3)和InAs层(1×2)再构衍射条纹.获得的超晶格薄膜结构质量较好.随着温度的升高, 材料的载流子浓度和迁移率均上升.     

用RHEED强度振荡锁相外延控制Ge/Si超晶格的生长

观察了Ge,Ge/Si交替外延时的反射式高能电子衍射(RHEED)强度振荡现象,并由此研究了Si(100)和Si(111)衬底上分子束外延Ge,Ge/Si超薄叠层的生长行为和生长特性。利用RHEED强度振荡,锁相控制生长了Ge(2ML)/Si(2ML),Ge(4ML)/Si(4ML)超薄超晶格。 关键词：     

测定GaAs(001)衬底上InAs的生长速率

报道了间接测定InAs生长速率的方法.通过设置不同Ga源温度,固定In源温度;和固定Ga源温度,设置不同In源温度,在GaAs(001)衬底上生长GaAs与InGaAs,用RHEED强度振荡测定GaAs与InGaAs的生长速率.验证了InGaAs的生长速率为GaAs的生长速率与InAs的生长速率之和,得到了In源温度在845～880℃时InAs的生长速率曲线.     

Si衬底上分子束外延Ge,Si时的反射式高能电子衍射强度振荡观察

本文观察了在Si(100)和Si(111)衬底上分子束外延Si,Ge时的反射式高能电子衍射(RHEED)强度振荡现象。其振荡特性表明,外延一定厚度的缓冲层可以改善表面的平整性,较慢的生长速率或中断生长一段时间有利于外延膜晶体质量的提高。Si(100)上外延Si或Ge时,沿[100]和[110]方位观测到的振荡特性均为单原子模式,起因于表面存在双畴(2×1)再构;而Si(111)上外延Ge时,[112]方位观测到的振荡为双原子层模式,但在[110]方位观察到不均匀周期的强度振荡行为。两种衬底上保持RHEED     

Si(111)分子束外延生长时RHEED强度振荡的观察

本文报道用反射式高能电子衍射的强度振荡测量来观察Si(111)衬底上分子束外延的生长行为,观察到了双原子层的振荡模式。振荡的衰减和恢复特性不同于Si(100)衬底上的生长行为,而同GaAs分子束外延时的特性非常相似。 关键词：     

InAs和InAs/GaSb异质结的MOCVD生长和表征

以三甲基铟(TMIn)、砷烷(AsH3)、三甲基镓(TMGa)和三甲基锑(TMSb)为源,用水平常压MOCVD技术,在较低的Ⅴ/Ⅲ比的条件下(1.5～4)于GaAs和GaSb衬底上成功地生长了InAs合金和InAs/GaSb异质结。实验表明,生长温度在500℃～620℃范围内,InAs外延生长是扩散控制的。在Ⅴ/Ⅲ比为2.5时,生长效率(相对Ⅲ族源)为3×103μm/mol.不掺杂InAs外延层为n型的,室温迁移率为2000cm2/V.s.InAs/GaSb异质结的12KPL谱为一个在375meV处较宽的与杂质相关的跃迁峰,和一个在417meV附近的几乎被杂质峰湮没的带边峰.     

关于RHEED振荡技术优化GaAs(110)量子阱生长的研究

在GaAs(110)衬底上生长的半导体材料有诸多优良性能，使得在非极性GaAs(110)衬底上获得高质量各类异质结材料，成为近年来分子束外延生长关注的课题.考虑GaAs(110)表面是Ga和As共面，最佳生长温度窗口很小；反射式高能电子衍射的(1×1)再构图案对生长温度和V/Ⅲ束流比不敏感，难于通过观察再构图案的变化，准确地找到最佳生长条件.作者在制备GaAs(110)量子阱过程中，观察到反射式高能电子衍射强度振荡呈现出的单双周期变化.这意味着不同工艺条件下，在 GaAs(110)衬底上量子阱有单层和双层两种生长模式.透射电子显微镜和室温光致荧光光谱测量结果表明：在双层生长模式下量子阱样品光学性能较差，而在单层生长模式下量子阱光学性能较好，但是界面会变粗糙.利用这一特点，我们采用反射式高能电子衍射强度振荡技术，找到了一种在GaAs(110)衬底上生长高质量量子阱的可行方法. 关键词： 反射高能电子衍射 量子阱 分子束外延     

采用AlSb缓冲层生长2.3μm InGaAsSb/AlGaAsSb多量子阱结构

针对常见的GaSb衬底的InGaAsSb/AlGaAsSb多量子阱结构进行了设计和外延生长。样品通过X-射线测试,有多级衍射卫星峰出现,表明量子阱结构的均匀性和界面质量较好,引入AlSb缓冲层可以降低衬底与外延层之间的界面自由能,使AlSb起到了一个滤板的作用,抑制了位错的扩散。光荧光谱测试表明,室温下量子阱结构中心发光波长在2.3μm附近。     

Si(111)分子束外延的生长动力学过程研究

本文用反射式高能电子衍射(RHEED)强度振荡研究了不同生长温度下Si(111)分子束外延的生长动力学过程,生长温度高于520℃(生长速率约0.15?/S)时,Si(111)外延为“台阶流”生长模式,生长温度低于475℃时,外延为“二维成核”双原子层生长模式,在较低温,甚至室温时,其外延仍为双原子层模式,但是镜向弹性散射束振荡和非弹性散射束振荡的叠加会造成RHEED强度在生长的最初阶段出现“类单原子层”模式的振荡特性。 关键词：     

Surface preparation effect of GaAs(110) substrates on the ZnSe epitaxial layer grown by molecular beam epitaxy

The effect of the surface preparation of the GaAs(110) substrate on the ZnSe epitaxial layer grown by molecular beam epitaxy (MBE) was investigated by means of etch-pit density (EPD) measurements, surface morphology observation, and reflection high-energy electron diffraction (RHEED) analysis. The ZnSe epitaxial layer grown on a GaAs(110) surface prepared by cleaving the (001)-oriented wafer in ultrahigh vacuum (UHV) showed about 5×10⁴ cm^-2 of EPD. This value is much lower than that observed from both the samples grown on the mechanically polished surface with and without a GaAs buffer layer. Due to the non-stoichiometric surface after thermal evaporation of the surface oxide, three-dimensional growth can easily occur on the mechanically polished GaAs(110) substrate. These results suggest that the stoichiometric and atomically flat substrate surface is essential for the growth of low-defect ZnSe epitaxial layers on the GaAs(110) non-polar surface. Received: 21 August 1998 / Accepted: 19 October 1998 / Published online: 28 April 1999     

GaSb/GaAs复合应力缓冲层上自组装InAs量子点的生长

研究了GaSb/GaAs复合应力缓冲层上自组装生长的InAs量子点.在2ML GaSb/1ML GaAs复合应力缓冲层上获得了高密度的、沿［100］方向择优分布量子点.随着复合应力缓冲层中GaAs层厚度的不同,量子点的密度可以在1.2×10¹⁰cm^-2和8×10¹⁰cm^-2进行调控.适当增加GaAs层的厚度至5ML,量子点的发光波长红移了约25nm,室温下PL光谱波长接近1300nm. 关键词： 自组装量子点 分子束外延 Ⅲ-Ⅴ族化合物半导体     

Impact of ZnTe buffer on the electrical properties of n-type GaSb:Te films

We have investigated on the molecular beam epitaxy (MBE) of Te-doped GaSb films on ZnTe buffer. Te-doped GaSb (GaSb:Te) films with and without ZnTe buffer were grown on (0 0 1) GaAs substrates. GaSb:Te/ZnTe/GaAs film revealed higher mobility (=631 cm²/V s) in comparison to GaSb:Te/GaAs film (=249 cm²/V s). To explain the higher mobility of GaSb:Te on ZnTe buffer, dislocation density and temperature dependence of Hall measurement results were analyzed. Temperature dependence of Hall measurement shows strong influence of the dislocation scattering, which indicates that dislocation reduction by the ZnTe buffer enhances the carrier mobility of GaSb films.     

Electron microscopy study of the structural defect formation in ZnS under irradiation by electrons with energy of 400 keV

ZnS crystals grown form the vapor phase and ZnS/(001)GaAs epitaxial structures grown by metalorganic vapor phase epitaxy are studied by transmission electron microscopy after in situ irradiation in an electron microscope at an electron energy of 400 keV and intensity of (1–4) × 10¹⁹ electrons/cm² s. It is shown that irradiation leads to the formation of small (2.5–45 nm) dislocation loops with a density of 1.4 × 10¹¹ cm^–2, as well as voids and new phase inclusions ≤10 nm in size. Using the moire fringe contrast analysis, these inclusions were identified as ZnO and ZnO₂.     

Role of beryllium doping in strain changes in II-type InAs/GaSb superlattice investigated by high resolution X-ray diffraction method

We have studied the influence of the beryllium doping on strain in the II-type InAs/GaSb superlattices (SLs) by means of high-resolution X-ray diffraction (HRXRD). Three analyzed superlattices were grown by molecular beam epitaxy. One of the examined superlattices was undoped. Two others structures, called doped SLs, composed of two superlattices: Be-doped and undoped which were grown one on the top of each other. The doping concentration was determined by secondary ion mass spectroscopy. The doping level was 1×10¹⁷ cm^?3 and 2×10¹⁹ cm^?3. For doped superlattices, the HRXRD measurements showed splitting of satellite (ST) peaks. Furthermore, the separation of ST peaks increase with doping level. In contrast, for undoped superlattice, the splitting of the ST peaks was not observed. Sometimes the separation of ST peaks can be caused by change of thickness period of superlattice or partial relaxation of the structure. However, we claim that in our experiment the splitting is caused by another mechanism: The presence of Be atoms in SL causes the change of average lattice constant of the superlattice. The influence of Be dopant on lattice parameter of superlattice was confirmed by theoretical simulations. Furthermore, the change of the lattice constant (Δa/a) of the GaSb:Be buffer was examined. The reduction of lattice parameter of GaSb was noticed. It was caused by the presence of Be doping and unintentionally incorporated As-atoms in the GaSb layer. It is very important to know that even very small Be concentration (1×10¹⁷ cm^?3) causes the change of average lattice parameter of SL.     

Fabrication of type-II InAs/GaSb superlattice long-wavelength infrared focal plane arrays

In this paper, we present an InAs/GaSb type-II superlattice (SL) with the M-structure for the fabrication of a long-wavelength (10 μm range) infrared (LWIR) focal plane arrays (FPA), which are grown by molecular beam epitaxy (MBE). The M-structure is named for the shape of the band alignment while the AlSb layer is inserted into the GaSb layer of InAs/GaSb SL. A 320 × 256 LWIR FPA has been fabricated with low surface leakage and high R₀A product of FPA pixels by using anodic sulfide and SiO₂ physical passivation. Experiment results show that the devices passivated with anodic sulfide obviously have higher R₀A than the un-sulphurized one. The 50% cutoff wavelength of the LWIR FPA is 9.1 μm, and the R₀A is 224 Ω cm² with the average detectivity of 2.3 × 10¹⁰ cm Hz^1/2 W⁻¹.     

A kinetic study of the initial oxidation of the Ni(110) surface by RHEED and X-ray emission

Nickel (110) surfaces, prepared by a combination of high temperature oxidation, argon ion bombardment and hydrogen reduction, were oxidized in pure O₂. The structural aspects of this interaction were studied by reflection high energy electron diffraction (RHEED) and the corresponding kinetics determined by electron excited X-ray emission spectroscopy. On exposure to oxygen the surface was observed to go through three ordered two-dimensional structures. These were a (2 × 1), a (3 × 1) and finally a (9 × 4) structure containing 0.015 microg/cm² of oxygen. From this surface NiO was produced in a (001) epitaxy which was compressed 4.5% in the plane of the surface. With oxidation beyond 0.060 microg/cm² the oxide strain was relieved and a complex oxide epitaxy developed which has been tentatively identified as a (117) oxide parallel to the nickel (110) surface. The kinetics have been explained on the basis of three distinct processes. (i) An initial chemisorption stage (0 to 0.015 microg/cm²) associated with the two-dimensional structures, (ii) Oxide nucleation and spreading to cover the surface, associated with the (001)-NiO epitaxy (0.015 to 0.06 microg/cm²), (iii) Logarithmic film thickening above 0.060 0.06 microg/cm² associated with the development of (117) epitaxy.     

Suppressing the spread length of threading dislocations in AlSb/GaSb superlattice grown on (001) InP substrate

Two designed structures of ternary Al_0.5Ga_0.5Sb and AlSb/GaSb superlattice (SL) buffers were prepared by molecular beam epitaxy. Double crystal X-Ray diffraction (XRD) and transmission electron microscopy (TEM) were used to characterize the material quality and observe the threading dislocation (TD) spreading behaviors. It was found that despite the wider full width at half-maximum (FWHM) of the w-rocking curve obtained in the SL buffer compared with the AlGaSb buffer, the stronger the TD filter ability enabled the SL buffer to block the defects to beneath the thickness around 500 nm. This result suggests the AlSb/GaSb SL buffer possessed the superiority in the fabrication of antimony (Sb) based microelectronic devices.     

调制掺杂GaAs/N-AlGaAs异质结的制备及输运性质

本文报道利用垂直束源式的分子束外延设备,生长了高质量的调制掺杂GaAs/N-AIGaAs异质结构,液氦温度下的二维电子迁移率达4.26×10⁵cm²/V·s(非光照)、5.9×10⁵cm²/V·S(光照)。用脉冲磁场下的磁声子共振测量,得到了二维电子的有效质量,并研究了异质结构中二维电子的低场迁移率增强特性及低温强磁场下的量子霍耳效应。 关键词：