硅衬底GaN基LED N极性n型欧姆接触研究

在Si衬底GaN基垂直结构LED的N极性n型面上,利用电子束蒸发的方法制作了Ti/Al电极,通过了I-V曲线研究了有无AlN缓冲层对这种芯片欧姆接触的影响.结果显示,去除AlN缓冲层后的N极性n型面与Ti/Al电极在500到600 ℃范围内退火才能形成欧姆接触.而保留AlN缓冲层的N极性n型面与Ti/Al电极未退火时就表现为较好的欧姆接触,比接触电阻率为2×10^-5 Ω·cm²,即使退火温度升高至600 ℃,也始终保持着欧姆接触特性.因此,AlN缓冲层的存在是Si衬底GaN基垂直结构LED获得高热稳定性n型欧姆接触的关键. 关键词： 硅衬底 N极性 AlN缓冲层 欧姆接触     

PLD法生长n-Zn1-xCoxO/p-Si异质结的电学性能研究

用高功率脉冲激光轰击Zn1-xCoxO,得到锌、钴和氧的原子、分子和团簇等混合体,并在p型单晶Si表面反应生成n型Zn1-xCoxO.X射线衍射(XRD)、原子力显微镜(AFM)研究表明,这层材料是结构致密均匀、呈c轴高度择优取向的薄膜,与p型Si材料形成n-Zn1-xCoxO/p-Si异质结.在Zn1-xCoxO中加入H,生成了Co-H-Co聚合体,异质结的势垒高度随着Co含量的增加而增加,同时深能级的Co-d轨道捕获作为浅施主的间隙H提供的电子,造成的体系n型半导体层的载流子浓度降低,电阻率提高,使得n-Zn1-xCoxO/p-Si异质结在6.5V时漏电流降致6×10-3 mA,反向击穿电压超过20V,电学性能得到显著改进.     

硼掺杂金刚石薄膜同质外延生长及肖特基势垒二极管制备

采用微波等离子体气相沉积(MPCVD)在商用3mm×3mm×1 mm高温高压合成(HPHT)Ib型(100)金刚石衬底上同质外延生长B掺杂金刚石薄膜,并在此材料的基础上用磁控溅射和电子束蒸镀技术制备了不同结构参数金刚石肖特基势垒二极管。测试结果表明:所生长的金刚石薄膜表面非常平整,可以看到比较明显的原子台阶;所制备的器件具有明显的整流特性,肖特基电极直径100μm,肖特基电极和欧姆电极间距10μm,外加电压-15V,300K时测得器件正向导通电阻20Ω,反向饱和电流近似为10-6 A,反向击穿电压大约103.5V;电极间距越大,反向击穿电压越高,器件正向电流越小。     

InAlN材料表面态性质研究

运用电流-电压(I-V), 变频电容-电压(C-V)和原子力显微镜 (AFM) 技术研究In组分分别为15%, 17%和21%的Ni/Au/-InAlN肖特基二极管InAlN 样品表面态性质 (表面态密度、时间常数和相对于InAlN 导带底的能级位置). I-V和变频 C-V方法测量得到的实验结果表明, 随着In组分增加, 肖特基势垒高度逐渐降低, 表面态密度依次增加. 变频 C-V特性还表明,随着测试频率降低, C-V曲线有序地朝正电压方向移动, 该趋势随着In组分的增加而变得更加明显, 这可能归结于InAlN表面态的空穴发射. AFM表面形貌研究揭示InAlN 表面粗糙度增加可能是表面态密度增加的主要原因. 关键词： 不同In组分的InAlN材料 表面态 电流-电压特性 变频电容-电压特性     

金属/多孔硅/单晶硅(M/PS/Si)微结构的电学特性

采用双槽电化学腐蚀法制备多孔硅层,然后在多孔硅表面沉积形成金属电极,制备出M/PS/Si微结构.利用SEM分析多孔硅的表面形貌,通过测试其I-V特性分析M/PS/Si微结构的电学特性.结果表明:由Pt做电极形成的M/PS/Si结构,表现出非整流特性.M/PS/Si结构的I-V曲线由线性区和非线性区组成,多孔硅孔隙率越高的M/PS/Si结构的I-V特性曲线线性区越宽.由Cu做电极形成的M/PS/Si结构,表现出整流特性.其整流比随多孔硅孔隙率增加而减小. 关键词： M/PS/Si微结构 孔隙率 I-V特性')" href="#">I-V特性 欧姆接触     

具有p-GaN岛状埋层耐压结构的横向AlGaN/GaN高电子迁移率晶体管

GaN基高电子迁移率晶体管(HEMT)相对较低的击穿电压严重限制了其大功率应用.为了进一步改善器件的击穿特性,通过在n-GaN外延缓冲层中引入六个等间距p-GaN岛掩埋缓冲层(PIBL)构成p-n结,提出一种基于p-GaN埋层结构的新型高耐压AlGaN/GaN HEMT器件结构.Sentaurus TCAD仿真结果表明,在关态高漏极电压状态下,p-GaN埋层引入的多个反向p-n结不仅能够有效调制PIBL AlGaN/GaN HEMT的表面电场和体电场分布,而且对于缓冲层泄漏电流有一定的抑制作用,这保证了栅漏间距为10μm的PIBL HEMT能够达到超过1700 V的高击穿电压(BV),是常规结构AlGaN/GaN HEMT击穿电压(580 V)的3倍.同时,PIBL结构AlGaN/GaN HEMT的特征导通电阻仅为1.47 m?·cm~2,因此获得了高达1966 MW·cm~(-2)的品质因数(FOM=BV~2/R_(on,sp)).相比于常规的AlGaN/GaN HEMT,基于新型p-GaN埋岛结构的HEMT器件在保持较低特征导通电阻的同时具有更高的击穿电压,这使得该结构在高功率电力电子器件领域具有很好的应用前景.     

小尺寸应变Si nMOSFET物理模型的研究

本文运用高斯定律得出多晶SiGe栅应变Si nMOSFET的准二维阈值电压模型,并从电流密度方程出发建立了小尺寸应变Si nMOS器件的I-V特性模型.对所得模型进行计算分析,得出沟道Ge组分、多晶Si_1-yGe_y栅Ge组分、栅氧化层厚度、应变Si层厚度、栅长以及掺杂浓度对阈值电压的影响.运用二维器件模拟器对器件表面势和I-V特性进行了仿真,所得结果与模型仿真结果一致,从而证明了模型的正确性. 关键词： 多晶SiGe栅 高斯定理 阈值电压 速度过冲     

新型缓冲层分区电场调制横向双扩散超结功率器件

为了突破传统横向双扩散金属-氧化物-半导体器件(lateral double-diffused MOSFET)击穿电压与比导通电阻的极限关系,本文在缓冲层横向双扩散超结功率器件(super junction LDMOS-SJ LDMOS)结构基础上,提出了具有缓冲层分区新型SJ-LDMOS结构.新结构利用电场调制效应将分区缓冲层产生的电场峰引入超结(super junction)表面而优化了SJ-LDMOS的表面电场分布,缓解了横向LDMOS器件由于受纵向电场影响使横向电场分布不均匀、横向单位耐压量低的问题.利用仿真分析软件ISE分析表明,优化条件下,当缓冲层分区为3时,提出的缓冲层分区SJ-LDMOS表面电场最优,击穿电压达到饱和时较一般LDMOS结构提高了50%左右,较缓冲层SJ-LDMOS结构提高了32%左右,横向单位耐压量达到18.48 V/μm.击穿电压为382 V的缓冲层分区SJ-LDMOS,比导通电阻为25.6 mΩ·cm2,突破了一般LDMOS击穿电压为254 V时比导通电阻为71.8 mΩ·cm2的极限关系.     

基于Alq3的有机发光器件的发光特性

以Alq₃作为发光层,在OLED串联型制作系统上成功制备出ITO/TPD/Alq₃/LiF/Al结构的有机发光器件,并建立了一套OLED电流(J)、电压(V)、亮度(B)自动测试系统,在氮气和空气环境下测试并分析了OLED的发光特性。结果表明,基于Alq₃的双层OLED的正向J-V特性可以用陷阱电荷限制流来描述;反向工作时,低压下的反偏电流可能是针孔产生的漏电流,高压下反偏OLED的J-V特性应满足F-N隧穿机制。随着电流进入快速增长阶段,B-J曲线近似地呈线性关系;在低场下,发光效率随电压升高而增大,在高场下,发光效率随电压升高而减小。实验中,还观察到了在电压V=4V左右时,器件具有明显的负阻特性(NDR),进一步的分析表明,由针孔引起的丝状电流可能是负阻特性的成因。     

嵌入Ag纳米颗粒层的DNA忆阻器

构建了具有“Al/DNA-CTMAB/Ag NPs/DNA-CTMAB/ITO”结构的有机忆阻器件, 并对其电流-电压 (I-V)曲线进行测量. 结果表明, 嵌入Ag纳米颗粒层, 不仅可以增强器件的导电性, 而且忆阻特性也显著提高. 当颗粒粒径在15–20 nm范围时, 开-关电流比I_ON/I_OFF能够达到10³. 器件的I-V特性受扫描电压幅值V_A的影响, 随着V_A的增大, 高阻态的电流变化较小, 而低阻态的电流明显增大, 开(或关)电压V_SET (V_RESET)和I_ON/I_OFF增加. 实验还发现, 器件高低阻状态的相互转换取决于外加电场的方向, 说明该忆阻器具有极性.     

Characterization of vertical Au/β-Ga_2O_3 single-crystal Schottky photodiodes with MBE-grown high-resistivity epitaxial layer

High-resistivity β-Ga_2O_3 thin films were grown on Si-doped n-type conductive β-Ga_2O_3 single crystals by molecular beam epitaxy(MBE).Vertical-type Schottky diodes were fabricated,and the electrical properties of the Schottky diodes were studied in this letter.The ideality factor and the series resistance of the Schottky diodes were estimated to be about1.4 and 4.6×10~6 Ω.The ionized donor concentration and the spreading voltage in the Schottky diodes region are about4×10~(18)cm~(-3) and 7.6 V,respectively.The ultra-violet(UV) photo-sensitivity of the Schottky diodes was demonstrated by a low-pressure mercury lamp illumination.A photoresponsivity of 1.8 A/W and an external quantum efficiency of8.7 ×10~2%were observed at forward bias voltage of 3.8 V,the proper driving voltage of read-out integrated circuit for UV camera.The gain of the Schottky diode was attributed to the existence of a potential barrier in the i-n junction between the MBE-grown highly resistive β-Ga_2O_3 thin films and the n-type conductive β-Ga_2O_3 single-crystal substrate.     

Electronic conduction properties of Au/C60/p-Si and C60/Au/p-Si sandwich structures: I–V and transducer characteristics

Gold-fullerite [C₆₀]-silicon (p-type) sandwich structures have been fabricated in order to investigate intrinsic cross-sectional and planar electronic conductive properties, in particular the C₆₀/p-Si p–n heterojunction. The turn-on voltage of this p–n heterojunction lies in the range 0.25–0.27 V. The I–V characteristics of the Au/C₆₀/p-Si structure are mostly defined by the bulk specific resistance of the fullerite crystal film itself (6×10⁷ Ω cm). I–V curves in the C₆₀/Au/p-Si structure are shown to be ohmic. Au/C₆₀/p-Si sandwiches irradiated with swift (300 MeV) heavy ions, (⁸⁴Kr¹⁴⁺) to a total fluence 10¹⁰ ion/cm² yield structures which are sensitive to ambient air pressure, specifically in the case of a transverse contact configuration, and if one of the contacts is located on the irradiated part of the fullerite film. The sandwich-structure sensitivity to pressure is 5×10⁻⁶ Pa⁻¹. This exceeds the sensitivity of conventional silicon pressure transducers by almost three orders of magnitude.     

Near-interface oxide traps in 4H–SiC MOS structures fabricated with and without annealing in NO

Near-interface oxide traps(NIOTs)in 4H–Si C metal–oxide–semiconductor(MOS)structures fabricated with and without annealing in NO are systematically investigated in this paper.The properties of NIOTs in Si C MOS structures prepared with and without annealing in NO are studied and compared in detail.Two main categories of the NIOTs,the"slow"and"fast"NIOTs,are revealed and extracted.The densities of the"fast"NIOTs are determined to be 0.76×10~(11)cm~(-2)and0.47×10~(11)cm~(-2)for the N_2 post oxidation annealing(POA)sample and NO POA sample,respectively.The densities of"slow"NIOTs are 0.79×10~(11)cm~(-2)and 9.44×10~(11)cm~(-2)for the NO POA sample and N_2POA sample,respectively.It is found that the NO POA process only can significantly reduce"slow"NIOTs.However,it has a little effect on"fast"NIOTs.The negative and positive constant voltage stresses(CVS)reveal that electrons captured by those"slow"NIOTs and bulk oxide traps(BOTs)are hardly emitted by the constant voltage stress.     

电离辐射对部分耗尽绝缘体上硅器件低频噪声特性的影响

本文针对辐射前后部分耗尽结构绝缘体上硅(SOI)器件的电学特性与低频噪声特性开展试验研究. 受辐射诱生埋氧化层固定电荷与界面态的影响, 当辐射总剂量达到1 M rad(Si) (1 rad = 10^-2 Gy)条件下, SOI器件背栅阈值电压从44.72 V 减小至12.88 V、表面电子有效迁移率从473.7 cm²/V·s降低至419.8 cm²/V· s、亚阈斜率从2.47 V/dec增加至3.93 V/dec; 基于辐射前后亚阈斜率及阈值电压的变化, 可提取得到辐射诱生界面态与氧化层固定电荷密度分别为5.33×10¹¹ cm^{- 2}与2.36×10¹² cm^-2. 受辐射在埋氧化层-硅界面处诱生边界陷阱、氧化层固定电荷与界面态的影响, 辐射后埋氧化层-硅界面处电子被陷阱俘获/释放的行为加剧, 造成SOI 器件背栅平带电压噪声功率谱密度由7×10^{- 10} V²·Hz^-1增加至1.8×10^-9 V² ·Hz^-1; 基于载流子数随机涨落模型可提取得到辐射前后SOI器件埋氧化层界面附近缺陷态密度之和约为1.42×10¹⁷ cm^-3·eV^-1和3.66×10¹⁷ cm^-3·eV^-1. 考虑隧穿削弱因子、隧穿距离与时间常数之间关系, 本文计算得到辐射前后埋氧化层内陷阱电荷密度随空间分布的变化.     

退火对AlGaInP/GaInP多量子阱 LED外延片性能的影响

采用LP-MOCVD技术在n-GaAs衬底上生长了AlGaInP/GaInP多量子阱红光LED外延片.研究表明退火对外延片性能有重要影响.与未退火样品相比,460℃退火15min,外延片p型GaP层的空穴浓度由5.6×10¹⁸cm^-3增大到6.5×10¹⁸cm^-3,p型AlGaInP层的空穴浓度由6.0×10¹⁷cm^-3增大到1.1×10¹⁸cm^-3.但退火温度为780℃时,p型GaP层和p型AlGaInP层的空穴浓度分别下降至8×10¹⁷cm^-3和1.7×10¹⁷cm^-3,且Mg原子在AlGaInP系材料中的扩散加剧,导致未掺杂AlGaInP/GaInP多量子阱呈现p型电导.在460～700℃退火范围内,并没有使AlGaInP/GaInP多量子阱的发光性能发生明显变化.但退火温度为780℃时,AlGaInP/GaInP多量子阱的发光强度是退火前的2倍.     

Design and simulation of AlN-based vertical Schottky barrier diodes

The key parameters of vertical AlN Schottky barrier diodes(SBDs) with variable drift layer thickness(DLT) and drift layer concentration(DLC) are investigated. The specific on-resistance(R_(on,sp)) decreased to 0.5 m? · cm~2 and the breakdown voltage(V_(BR)) decreased from 3.4 kV to 1.1 kV by changing the DLC from 10~(15) cm~(-3) to 3×10~(16) cm~(-3). The VBRincreases from 1.5 kV to 3.4 kV and the Ron,sp also increases to 12.64 m? · cm~2 by increasing DLT from 4-μm to 11-μm. The VBRenhancement results from the increase of depletion region extension. The Baliga's figure of merit(BFOM) of3.8 GW/cm~2 was obtained in the structure of 11-μm DLT and 10~(16) cm~(-3) DLC without FP. When DLT or DLC is variable,the consideration of the value of BFOM is essential. In this paper, we also present the vertical AlN SBD with a field plate(FP), which decreases the crowding of electric field in electrode edge. All the key parameters were optimized by simulating based on Silvaco-ATLAS.     

沟道层厚度对室温制备的In2O3薄膜晶体管器件性能的影响

在室温下采用直流磁控溅射以SiO₂/Si为衬底制备了不同沟道层厚度的底栅式In₂O₃薄膜晶体管,讨论了沟道层厚度对底栅In₂O₃薄膜晶体管的电学性能的影响。实验结果表明:器件的特性与沟道层厚度有关,最优沟道层厚度的In₂O₃薄膜晶体管为增强型,其阈值电压为2.5 V,开关电流比约为10⁶,场效应迁移率为6.2 cm²·V^-1·s^-1。     

Degradation of β-Ga_2O_3 Schottky barrier diode under swift heavy ion irradiation

The electrical characteristics and microstructures of β-Ga_2 O_3 Schottky barrier diode(SBD) devices irradiated with swift heavy ions(2096 Me V Ta ions) have been studied. It was found that β-Ga_2 O_3 SBD devices showed the reliability degradation after irradiation, including turn-on voltage Von, on-resistance Ron, ideality factor n, and the reverse leakage current density Jr. In addition, the carrier concentration of the drift layer was decreased significantly and the calculated carrier removal rates were 5 × 10~6–1.3 × 10~7 cm~(-1). Latent tracks induced by swift heavy ions were observed visually in the whole β-Ga_2 O_3 matrix. Furthermore, crystal structure of tracks was amorphized completely. The latent tracks induced by Ta ions bombardments were found to be the reason for the decrease in carrier mobility and carrier concentration. Eventually,these defects caused the degradation of electrical characteristics of the devices. In terms of the carrier removal rates, theβ-Ga_2 O_3 SBD devices were more sensitive to swift heavy ions irradiation than Si C and Ga N devices.     

A simulation study on p-doping level of polymer host material in P3HT:PCBM bulk heterojunction solar cells

In this study,we investigate the influence of doping on the charge transfer and device characteristics parameters in the bulk heterojunction solar cells based on poly(3-hexylthiophene)(P3HT) and a methanofuUerene derivative(PCBM).Organic semiconductors are also known to be not pure and they have defects and impurities,some of them are being charged and act as p-type or n-type dopants.Calculations of the solar cell characteristics parameters versus the p-doping level have been done at three different n-dopings(N_d) that consist of 5 × 10~(17) cm~(-3),10~(18) cm~(-3),and 5 × 10~(18) cm~(-3).We perform the analysis of the doping concentration through the drift-diffusion model,and calculate the current and voltage doping dependency.We find that at three different n-dopant levels,optimum p-type doping is about N_p = 6 × 10~(18) cm~(-3).Simulation results have shown that by increasing doping level,V_(oc) monotonically increases by doping.Cell efficiency reaches its maximum at somewhat higher doping as FF has its peak at N_p = 3 × 10~(18) cm~(-3).Moreover,this paper demonstrates that the optimum value for the p-doping is about N_p = 6 × 10~(18) cm~(-3) and optimum value for n-dopant is N_d = 10~(18) cm~(-3),respectively.The simulated results confirm that doping considerably affects the performance of organic solar cells.     

Eu掺杂Si纳米线的光致发光特性

利用Si(111)衬底, 以Au-Al为金属催化剂, 基于固-液-固生长机理, 在温度为1100℃, N₂气流量为1.5 L/min、生长时间为30–90 min等工艺条件下, 制备了直径约为100 nm、长度为数微米的高密度、均匀分布、大面积的Si纳米线(～10¹⁰ cm^-2). 对Si纳米线进行了Eu掺杂, 实验研究了不同长度的Si纳米线以及不同掺杂温度、掺杂时间等工艺参数对Eu离子红光发射的影响, 利用扫描电子显微镜和X射线衍射仪对Si纳米线表面形貌和Eu掺杂后Si纳米线的结晶取向进行了测量和表征; 室温下利用Hitachi F-4600型荧光分光光度计对样品的激发光谱和发射光谱进行了测试和分析. 结果表明: 在Si纳米线生长时间为30 min、掺杂温度为1000℃、 最佳激发波长为395 nm时, 样品最强荧光波长为619 nm (⁵D₀→⁷F₂); 同时, 还出现了576 nm (⁵D₀→⁷F₀), 596 nm (⁵D₀→⁷F₁), 658 nm (⁵D₀→⁷F₃)和708 nm (⁵D₀→⁷F₄)四条谱带.