Electrical characteristics of p-Si/TiO2/Al and p-Si/TiO2-Zr/Al Schottky devices

Electrical devices involve different types of diode in prospective electronics is of great importance. In this study, p-type Si surface was covered with thin film of TiO₂ dispersion in H₂O to construct p-Si/TiO₂/Al Schottky barrier diode (D1) and the other one with TiO₂ dispersion doped with zirconium to construct p-Si/TiO₂-Zr/Al diode (D2) by drop-casting method in the same conditions. Electrical properties of as-prepared diodes and effect of zirconium as a dopant were investigated. Current–voltage (I–V) characteristics of these devices were measured at ambient conditions. Some parameters including ideality factor (n), barrier height (Φ_B0), series resistance (Rs) and interface state density (Nss) were calculated from I–V behaviours of diodes. Structural comparisons were based on SEM and EDX measurements. Experimental results indicated that electrical parameters of p-Si/TiO₂/Al Schottky device were influenced by the zirconium dopant in TiO₂.     

Atomic layer deposition of TiO2 and Al‐doped TiO2 films on Ir substrates for ultralow leakage currents

TiO₂ and Al‐doped TiO₂ (ATO) films were grown on Ir substrates by atomic layer deposition using O₃ as the oxygen source. With increasing O₃ feeding time, the crystalline structure of the TiO₂ films was transformed from anatase to rutile. Above an O₃ feeding time of 35 s, the films crystallized as only rutile due to the formation of IrO₂ layer at the interface. The TiO₂ and ATO films showed higher dielectric constants of 78 and 51, respectively. The films on Ir showed superior leakage properties compared to the films on Ru due to the high work‐function of Ir. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Nature of chemical states of sulfur embedded in atomic‐layer‐deposited HfO2 film on Ge substrate for interface passivation

Sulfur was embedded in atomic‐layer‐deposited (ALD) HfO₂ films grown on Ge substrate by annealing under H₂S gas before and after HfO₂ ALD. The chemical states of sulfur in the film were examined by S K‐edge X‐ray absorption spectroscopy. It was revealed that the valences of S‐ions were mostly –2 at Ge/HfO₂ interface (GeS_x or HfO_2–yS_y to passivate the interface), while they were mostly +6 in HfO₂ layers (sulfates; HfO_2–z(SO₄)_z). The leakage current density in post‐deposi‐tion‐treated film was lower than that in pre‐deposition‐treated one. This suggests that the passivation of defects in oxide layer by sulfate ions is more effective to lower the leakage current rather than the interface defect passivation by S^2– ions. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Al2O3绝缘层的AlGaN/GaN MOSHEMT器件研究

在研制AlGaN/GaN HEMT器件的基础上,采用ALD法制备了Al₂O₃ AlGaN/GaN MOSHEMT器件.通过X射线光电子能谱测试表明在AlGaN/GaN异质结材料上成功淀积了Al₂O₃薄膜.根据对HEMT和MOSHEMT器件肖特基电容、器件输出以及转移特性的测试进行分析发现：所制备的Al₂O₃薄膜与AlGaN外延层间界面态密度较小,因而MOSHEMT器件呈现出较 关键词： 2O₃')" href="#">Al₂O₃ ALD GaN MOSHEMT     

The leakage current mechanisms in the Schottky diode with a thin Al layer insertion between Al0.245Ga0.755N/GaN heterostructure and Ni/Au Schottky contact

This paper investigates the behaviour of the reverse-bias leakage current of the Schottky diode with a thin Al inserting layer inserted between Al0.245Ga0.755 N/GaN heterostructure and Ni/Au Schottky contact in the temperature range of 25-350°C. It compares with the Schottky diode without Aluminium inserting layer. The experimental results show that in the Schottky diode with Al layer the minimum point of I-V curve drifts to the minus voltage, and with the increase of temperature increasing, the minimum point of I-V curve returns the 0 point. The temperature dependence of gate-leakage currents in the novelty diode and the traditional diode are studied. The results show that the Al inserting layer introduces interface states between metal and Al0.245Ga0.755N. Aluminium reacted with oxygen formed Al2O3 insulator layer which suppresses the trap tunnelling current and the trend of thermionic field emission current. The reliability of the diode at the high temperature is improved by inserting a thin Al layer.     

Effect of iron doping on the hydrophobicity of titanium dioxide film: experiment and simulation

In this study, we carried out experiments and molecular dynamics simulations to identify the effect of Fe doping on the hydrophobicity of a titanium dioxide film. TiO₂ and Fe-doped TiO₂ films were fabricated in situ by atomic layer deposition without annealing. X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) were used to characterise the crystal structure and elemental composition. Iron doping resulted in the TiO₂ becoming more hydrophobic at a macroscopic level, as estimated by atomic force microscopy observations and static contact angle measurements. Furthermore, the effect of iron doping on the structure and kinetics of water molecules on the exterior of TiO₂ were studied by molecular dynamics simulations. On the basis of the XPS results, the Fe-TiO₂ surface matrix has a Ti:Fe ratio of 36:5. In addition, the density distribution of oxygen and hydrogen atoms indicate that interfacial water molecules enter the Fe-TiO₂ film more easily and hydrogen atoms in the water molecules are oriented upward at the interface. The self-diffusion coefficients indicate that iron doping makes the TiO₂ more hydrophobic, which is consistent with the macroscopic test results.     

Mechanisms of asymmetric leakage current in Pt/Ba0.6Sr0.4TiO3/Nb-SrTiO3 capacitor

Mechanisms of leakage current have been investigated in the capacitor consisting of a Ba_0.6Sr_0.4TiO₃ thin film, a Pt top electrode, and a Nb-doped SrTiO₃ (STON) bottom electrode. The leakage current shows asymmetric behavior for different bias voltage. For the Pt electrode negatively biased, the leakage current can be explained by modified Schottky emission mechanism, and the barrier height is obtained as 0.44 eV. For the Pt electrode positively biased, the leakage current shows a space-charge-limited current behavior. The trap in dielectric film is regarded as deep traps, and the density of trapped carrier is estimated as about 3.2×10²³/m³. PACS 77     

Controlling the electrical characteristics of Al/p-Si structures through Bi4Ti3O12 interfacial layer

In this study, the effects of high permittivity interfacial Bi₄Ti₃O₁₂ (BTO) layer deposition on the main electrical parameters; such as barrier height, series resistance, rectifying ratio, interface states and shunt resistance, of Al/p-Si structures are investigated using the current–voltage (I–V) and admittance measurements (capacitance–voltage, C–V and conductance–voltage, G/ω–V) at 1 MHz and room temperature. I–V characteristics revealed that, due to BTO layer deposition, series resistance values that were calculated by both Ohm's law and Cheung's method decreased whereas shunt resistance values increased. Therefore, leakage current value decreased significantly by almost 35 times as a result of high permittivity interfacial BTO layer. Moreover, rectifying ratio was improved through BTO interfacial layer deposition. I–V data indicated that high permittivity interfacial BTO layer also led to an increase in barrier height. Same result was also obtained through C–V data. Obtained results showed that the performance of the device is considerably dependent on high permittivity BTO interfacial layer.     

Analysis of electrical characteristics of Er/p-InP Schottky diode at high temperature range

We report on the temperature-dependent electrical characteristics of Er/p-InP Schottky barrier diodes. The current–voltage (I–V) and capacitance–voltage (C–V) measurements have been carried out in the temperature range of 300–400 K. Using thermionic emission (TE) theory, the zero-bias barrier height (Φ_bo) and ideality factor (n) are estimated from I–V characteristics. It is observed that there is a decrease in n and an increase in the Φ_bo with an increase in temperature. The barrier height inhomogenity at the metal/semiconductor (MS) interface resulted in Gaussian distribution of Φ_bo and n. The laterally homogeneous Schottky barrier height value of approximately 1.008 eV for the Er/p-InP Schottky barrier diodes is extracted from the linear relationship between the experimental zero-bias barrier heights and ideality factors. The series resistance (R_s) is calculated by Chenug's method and it is found that it increases with the decrease in temperature. The reverse-bias leakage current mechanism of Er/p-InP Schottky diode is investigated. Both Poole–Frenkel and Schottky emissions are described and discussed. Furthermore, capacitance–voltage (C–V) measurements of the Er/p-InP Schottky contacts are also carried out at room temperature in dark at different frequencies of 10, 100 and 1000 kHz. Using Terman's method, the interface state density is calculated for Er/p-InP Schottky diode at different temperatures.     

Barrier lowering and leakage current reduction in Ni-AlGaN/GaN Schottky diodes with an oxygen-treated GaN cap layer

We report on the effect of oxygen annealing for GaN surface on the Schottky barrier configuration and leakage current in Ni-AlGaN/GaN Schottky barrier diodes. After oxygen annealing, their turn-on voltage and reverse-bias leakage current characteristics are significantly improved due to a reduction in the Schottky barrier height (SBH) and suppression in the surface states respectively. Interface state density extracted from the Terman method was reduced by 2 orders of magnitude. X-ray photoelectron spectroscopy measurements show that the oxygen annealing induces Ga₂O₃ on the GaN surface. The formation of Ga₂O₃ reduces the interface state density as well as lowers the SBH through the modification of hybridized metal induced gap states.     

Carrier transport mechanism of strained AlGaN/GaN Schottky contacts

Using polarization field effect-based thermionic field emission (PFE-TFE) model based on current–voltage–temperature data, possible carrier transport mechanisms for Pt/Au and Cr/Pd Schottky contacts to Al_0.25Ga_0.75N/GaN layers were investigated. Thermionic emission (TE) model was also investigated to compare to the PFE-TFE. It was shown that Schottky barrier heights (SBHs) are significantly affected by a polarization field-induced carrier density of the AlGaN layer. In addition, relatively little temperature dependence on the leakage current density of both contacts was found, which is in good agreement with the PFE-TFE model. The results indicate that the TFE is responsible for the current flow across the metal/AlGaN–GaN interface at T ≥ 293 K.     

Fluorination of Al2O3 blocking layer for improving the performance of metal‐oxide‐nitride‐oxide‐silicon flash memory

The characteristics of Al₂O₃ film grown by atomic‐layer deposition as blocking layer with and without fluorine plasma treatment were investigated based on a capacitor structure of Al/Al₂O₃/TaON/SiO₂/Si. The physical structure was studied by transmission electron microscopy, and the chemical composition of the blocking layer was analyzed by X‐ray photoelectron spectroscopy and secondary ion mass spectroscopy. Moreover, the surface roughness of the blocking layer was investigated by atomic force microscopy. Compared with a capacitor with Al₂O₃ blocking layer, the one with fluorinated Al₂O₃ displayed higher programming/erasing speeds, better endurance property and better charge retention characteristic because the fluorination could reduce excess oxygen and traps in the blocking layer, thus forming a larger barrier height at the interface between the charge‐trapping layer and the blocking layer. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Impact of amorphous titanium oxide film on the device stability of Al/TiO2/Al resistive memory

We have investigated the role of amorphous titanium oxide film in the reliable bipolar resistive switching of Al/TiO₂/Al resistive random access memory devices. As TiO₂ deposition temperature decreased, a more stable endurance characteristic was obtained. We proposed that the degradation of the bipolar resistive switching property of Al/TiO₂/Al devices is closely related to the imperfect migration of oxygen ions between the top insulating interface layer and the oxygen-deficient titanium oxide during the set and reset operations. In addition, the dependence of the TiO₂ film thickness on the switching property was also studied. As the thickness of the film increased, a reduction in the resistance of the high resistance state rapidly appeared. We attribute the improved endurance performance of thin and low-temperature grown TiO₂ devices to the amorphous state with a low film density.     

Fowler-nordheim tunnelling in Au−TiO<Subscript>2</Subscript>−Ag film structures

I-V-characteristics have been measured for Au−TiO₂−Ag structures with TiO₂ layers of 30 and 180 nm thickness. The TiO₂ films were grown by atomic layer deposition (ALD) technique. In the case of negative bias on the Au electrode, the conduction currents through TiO₂ layers follow the Fowler-Nordheim formula for field emission over several orders of magnitude. The bulk of the currents may be attributed to tunnelling, seemingly through a Schottky barrier at the Au−TiO₂ junction. In the case of reversed polarity the currents are also observed, but cannot be interpreted as tunnelling.     

Effect of modification of S-terminated Ge(1 0 0) surface on ALD HfO2 gate stack

When S-termination on a Ge(1 0 0) surface was desorbed at an elevated temperature and an atomic layer deposition (ALD) HfO₂ film was deposited, interfacial thickness was less than 1 nm. As a result, the equivalent oxide thickness (EOT) of the stack on the initially S-terminated surface was thinner than that deposited on the O₃-oxidized surface, while HfO₂ film thickness was almost identical on both surfaces. Nevertheless, the HfO₂ stack on the initially S-terminated surface exhibited improved leakage current characteristics due to an increase in barrier height. Its thinner but robust interface will contribute to the scaling down of gate oxide integrity.     

Schottky barrier height lowering induced by CoSi2 nanostructure

CoSi₂ nanostructures were formed through thermal agglomeration by annealing ultrathin Co film on Si substrate at high temperatures. The characteristics of the Schottky diodes with CoSi₂ nanostructures capped by a Pt layer were measured and fitted using thermionic emission theory. All the diodes have a ideality factor less than 1.1. The results show that the Schottky barrier height of these diodes significantly decreases as the annealing temperature for CoSi₂ agglomeration increases. The barrier height lowering is correlated with the agglomeration of CoSi₂ film and the formation of CoSi₂ nano-islands. The thermal field emission may be the major reason to cause barrier lowering. Although the Schottky contact interface consists of both CoSi₂ nano-islands and Pt film whose individual contact barrier height to Si is very different, the current-voltage-temperature measurements reveal that the interface homogeneity is not degraded as expected. The study demonstrates that the CoSi₂ nanostructures can both lower the Schottky barrier height and form an ideal Schottky contact with a Pt capping layer.     

Controlled growth of rutile TiO2 by atomic layer deposition on oxidized ruthenium

Crystalline rutile TiO₂ films were grown by atomic layer deposition on oxidized Ru electrodes using a titanium methoxide as the metal precursor and O₃ as the oxidant. A protective layer of ～0.3 nm TiO₂ grown with H₂O as the oxidant was first deposited in order to avoid etching of the Ru bottom electrode by the O₃ used for the growth of the TiO₂ (bulk) layer. Electrical evaluation of the capacitor stacks with TiO₂ as dielectric, RuO₂/Ru and Pt as the bottom and top electrodes respectively, resulted in superior characteristics of the rutile phase as compared to the anatase. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

CoSi2 formation in contact systems based on Ti-Co alloy with low cobalt content

The process of integrated-circuit contact formation based on Ti–Co alloy with low content of cobalt has been investigated. By AES and XRD it is shown that nitrogen doping of the alloy film during magnetron deposition and its subsequent annealing at 800–850°C allow simultaneously to obtain a CoSi₂ contact layer and a diffusion barrier layer on the basis of TiN. Electrical characteristics of Schottky barrier and ohmic contacts have been studied.     

Embedded-Ge source and drain in InGaAs/GaAs dual channel MESFET

We report the first demonstration of n-type III–V metal-semiconductor field-effect transistors (nMESFETs) with IV group material hetero-junction source and drain (S/D) technology. A selective epitaxial growth of germanium (Ge) in the recessed gallium arsenide (GaAs) S/D regions is successfully developed using ultra-high vacuum chemical vapor deposition (UHVCVD) system. The dual channel structure includes an additional 10-nm higher mobility n-In_0.2Ga_0.8As layer on n-GaAs channel and is introduced to further improve the device performance. The n-MESFET, combining embedded-Ge S/D with In_0.2Ga_0.8As/GaAs channel, exhibits good transfer properties with a drain current on/off ratio of approximately 10³. Due to the small barrier height of Ti/In_0.2Ga_0.8As Schottky contact, a lattice-matched wide bandgap In_0.49Ga_0.51P dielectric layer is also integrated into the device architecture to build a higher electron Schottky barrier height (SBH) for gate leakage current reduction. The Ti/In_0.49Ga_0.51P/n-In_0.2Ga_0.8As Schottky diode shows a comparable leakage level to Ti/n-GaAs with 2 × 10^?2 A/cm² at a gate voltage of ?2.0 V.     

Improving Ni/GaN Schottky diode performance through interfacial passivation layer formed via ultraviolet/ozone treatment

Electrical passivation has a significant effect on metal-semiconductor (MS) device operations including performance and reliability. In this study, the improvement in performance of Ni/GaN Schottky diodes (SDs) through an ultraviolet/ozone (UV/O₃) interface treatment is investigated and the mechanism of carrier conduction at the MS junction interfaces is analyzed. The formation of surface oxide layer at the MS interface through the UV/O₃ treatment is confirmed by the measurements using X-ray photoelectron spectroscopy, contact angle, and atomic force microscopy. The atomic intensity and surface energy increased and surface roughness improved through the implementation of oxide layer. Electrical measurements reveal reduced leakage and improved breakdown voltage and are used to determine the Schottky barrier height and Richardson constant of the Ni/GaN MS SDs. The enhancement in the entire performance of the MS SDs is attributed to the passivation of defect centers at the dislocation-related pits through the formation of oxide layer with the UV/O₃ treatment, which thereby improves the carrier transfer properties of Ni/GaN SDs.