基区表面势对栅控横向PNP晶体管中子位移损伤的影响

通过在常规横向PNP晶体管基区表面氧化层上淀积栅电极,制作了可以利用栅极偏置调制基区表面势的栅控横向PNP晶体管。对无栅极偏置电压和偏置电压分别为-10 V和10 V的栅控横向PNP晶体管,在西安脉冲反应堆上开展注量为21012, 41012, 61012, 81012,11013 cm-2的中子辐照实验,研究基区表面势的增加和降低对栅控横向PNP晶体管中子位移损伤退化特性的影响。研究结果表明,基区表面势的增加引起栅控横向PNP晶体管共射极电流增益倒数的变化量随辐照中子注量的退化速率增加,基区表面势的降低对位移损伤退化速率无明显影响。     

不同顺序中子/γ辐照对双极器件电流增益的影响

利用CFBR-Ⅱ快中子反应堆（中国第二座快中子脉冲堆）和⁶⁰Co装置开展不同顺序的中子/γ辐照双极晶体管的实验。在集电极-发射极电压恒定条件下,测量了双极晶体管电流增益随集电极电流的变化曲线,研究不同顺序中子/γ辐照对双极晶体管电流增益的影响。分析实验结果发现,集电极-发射极电压一定时,集电极电流极低情况下电流增益退化比较大,随集电极电流增加电流增益逐渐减小;就实验选中的两类晶体管而言,先中子后γ辐照造成双极晶体管电流增益的退化程度大于先γ后中子辐照,而且PNP型晶体管比NPN型晶体管差异更明显。本文进行了双极晶体管电离/位移协同辐照效应相关机理的初步探讨。     

PNP输入双极运算放大器在不同辐射环境下的辐射效应和退火特性

研究了PNP输入双极运算放大器LM837在1 MeV电子和⁶⁰Coγ源两种不同辐射环境中的响应特性和变化规律. 分析了不同偏置状态下其电离辐照敏感参数在辐照后三种温度 (室温, 100 ℃, 125 ℃)下随时间变化的关系, 讨论了引起电参数失效的机理. 结果表明: 1 MeV 电子辐照LM837引起的损伤主要是电离损伤, 并且在正偏情况下比⁶⁰Coγ源辐照造成的损伤大; 辐照过程中, 不同辐照源正偏条件下的偏置电流变化都比零偏时微大; 在不同的辐照源下, LM837辐照后的退火行为都与温度有较大的依赖关系, 而这种关系与辐照感生的界面态密度增长直接相关. 关键词： PNP 输入双极运算放大器 60Coγ源')" href="#">电子和⁶⁰Coγ源 偏置条件 退火     

带有n+深阱的三阱CMOS工艺中寄生NPN双极效应及其对电荷共享的影响

基于三维TCAD器件模拟, 研究了带有 n⁺深阱的90 nm三阱CMOS器件在重离子辐照下产生的电荷共享效应. 研究结果表明在重离子辐照时, n⁺深阱会导致寄生的NPN双极型晶体管触发, 显著增强NMOS间的电荷共享, 其放大因子达到双阱工艺中寄生PNP晶体管放大因子的2---4倍. 进而分别研究了n阱接触和p 阱接触对寄生NPN双极放大的影响, 结果表明增大p阱接触的面积和减小 n 阱接触的距离将抑制NPN晶体管的放大作用, 而增大n 阱接触的面积将增强NPN的放大作用.     

栅控横向PNP双极晶体管基极电流峰值展宽效应及电荷分离研究

为了对双极器件在电离辐射环境下的损伤机理及加固技术进行深入的研究,对设计制作的不同工艺类型的栅控横向PNP双极晶体管进行了60Co-γ低剂量率辐照试验.结果表明:1)栅控双极晶体管的辐射特性具有很强的工艺相关性,钝化层的存在对于双极晶体管的辐射响应具有很大影响,有钝化层的器件在电离辐射环境中会产生更多的界面态,其抗辐射能力大大减弱;2)针对国产栅控横向PNP晶体管在低剂量率辐照时会发生峰值电流展宽效应,文中对展宽效应潜在机理进行了分析,并针对展宽效应提出了新的分离方法.这不但对设计抗辐射加固器件提供了依据,而且为进一步深入研究双极器件的低剂量率辐射损伤增强效应提供了强有力工具.     

电子辐射环境中NPN输入双极运算放大器的辐射效应和退火特性

本文对不同偏置下的NPN输入双极运算放大器LM108分别在1.8 MeV和1 MeV两种电子能量下、不同束流电子辐照环境中的损伤特性及变化规律进行了研究, 分析了不同偏置状态下其辐照敏感参数在辐照后三种温度 (室温, 100 ℃, 125 ℃) 下随时间变化的关系, 讨论了引起电参数失效的机理, 并且分析了器件在室温和高温的退火效应以讨论引起器件电参数失效的机理. 结果表明, 1.8 MeV和1 MeV 电子对运算放大器LM108主要产生电离损伤, 相同束流下1.8 MeV电子造成的损伤比1 MeV 电子更大, 相同能量下0.32 Gy(Si)/s束流电子产生的损伤大于1.53 Gy(Si)/s束流电子. 对于相同能量和束流的电子辐照, 器件零偏时的损伤大于正偏时的损伤. 器件辐照后的退火行为都与温度有较大的依赖关系, 而这种关系与辐照感生的界面态密度增长直接相关.     

双极集成电路低剂量率辐射损伤增强效应的高温辐照加速实验

选择了四种典型双极集成电路,在两种不同剂量率下,开展了不同温度的高温辐照加速实验,测量了典型双极集成电路的辐射敏感参数在不同高温辐照下的变化规律。实验结果表明:高温辐照能够给出空间低剂量率辐射损伤增强效应的保守估计,且存在最佳辐照温度,最佳辐照温度随总剂量的增加向低温区漂移,随剂量率的增大向高温区漂移,在相同剂量率和总剂量下,输入级为NPN晶体管的双极集成电路比输入级为PNP晶体管的最佳辐照温度低。     

双极集成电路低剂量率辐射损伤增强效应的高温辐照加速实验

选择了四种典型双极集成电路,在两种不同剂量率下,开展了不同温度的高温辐照加速实验,测量了典型双极集成电路的辐射敏感参数在不同高温辐照下的变化规律。实验结果表明：高温辐照能够给出空间低剂量率辐射损伤增强效应的保守估计,且存在最佳辐照温度,最佳辐照温度随总剂量的增加向低温区漂移,随剂量率的增大向高温区漂移,在相同剂量率和总剂量下,输入级为NPN晶体管的双极集成电路比输入级为PNP晶体管的最佳辐照温度低。     

不同剂量率下锗硅异质结双极晶体管电离损伤效应研究

对于相同制作工艺的NPN锗硅异质结双极晶体管(SiGe HBT), 在不同辐照剂量率下进行⁶⁰Co γ射线的辐照效应与退火特性的研究. 测量结果表明, 两种辐照剂量率下, 随着辐照总剂量增加, 晶体管基极电流增大, 共发射极电流放大倍数降低, 且器件的辐照损伤、性能退化与辐照剂量率相关, 低剂量率下辐照损伤较高剂量率严重. 在经过与低剂量率辐照等时的退火后, 高剂量率下的辐照损伤仍较低剂量率下的损伤低, 即待测SiGeHBT具有明显的低剂量率损伤增强效应(ELDRS). 本文对相关的物理机理进行了探讨分析. 关键词： 锗硅异质结双极晶体管 低剂量率辐照损伤增强 辐照效应     

栅控横向PNP双极晶体管辐照感生电荷的定量分离

设计并制作了一种栅控横向PNP双极晶体管测试结构,在常规横向PNP双极晶体管基区表面氧化层上制作了一栅电极,利用栅扫描法,通过扫描栅极所加电压,获得了基极电流随栅极电压的变化特性.理论推导和数学计算获得了氧化物陷阱电荷和界面陷阱电荷的定量变化,分离出栅控横向PNP双极晶体管在辐照及其室温退火过程中感生的缺陷.对设计的晶体管测试结构和采用的测试方法做了具体介绍.     

Radiation effects of 50-MeV protons on PNP bipolar junction transistors

The effects of radiation on 3CG110 PNP bipolar junction transistors (BJTs) are characterized using 50-MeV protons, 40-MeV Si ions, and 1-MeV electrons. In this paper, electrical characteristics and deep level transient spectroscopy (DLTS) are utilized to analyze radiation defects induced by ionization and displacement damage. The experimental results show a degradation of the current gain and an increase in the types of radiation defect with increasing fluences of 50-MeV protons. Moreover, by comparing the types of damage caused by different radiation sources, the characteristics of the radiation defects induced by irradiation show that 50-MeV proton irradiation can produce both ionization and displacement defects in the 3CG110 PNP BJTs, in contrast to 40-MeV Si ions, which mainly generate displacement defects, and 1-MeV electrons, which mainly produce ionization defects. This work provides direct evidence of a synergistic effect between the ionization and displacement defects caused in PNP BJTs by 50-MeV protons.     

Degradation mechanisms of current gain in NPN transistors

An investigation of ionization and displacement damage in silicon NPN bipolar junction transistors (BJTs) is presented. The transistors were irradiated separately with 90-keV electrons, 3-MeV protons and 40-MeV Br ions. Key parameters were measured {\em in-situ} and the change in current gain of the NPN BJTS was obtained at a fixed collector current (I_{\rm c}=1~mA). To characterise the radiation damage of NPN BJTs, the ionizing dose D_{\i} and displacement dose D_{\d} as functions of chip depth in the NPN BJTs were calculated using the SRIM and Geant4 code for protons, electrons and Br ions, respectively. Based on the discussion of the radiation damage equation for current gain, it is clear that the current gain degradation of the NPN BJTs is sensitive to both ionization and displacement damage. The degradation mechanism of the current gain is related to the ratio of D_{\rm d}/(D_{\rm d}+D_{\rm i}) in the sensitive region given by charged particles. The irradiation particles leading to lower D_{\rm d}/(D_{\rm d}+D_{\rm i}) within the same chip depth at a given total dose would mainly produce ionization damage to the NPN BJTs. On the other hand, the charged particles causing larger D_{\rm d}/(D_{\rm d}+D_{\rm i}) at a given total dose would tend to generate displacement damage to the NPN BJTs. The Messenger--Spratt equation could be used to describe the experimental data for the latter case.     

Si_3N_4钝化层对横向PNP双极晶体管电离辐射损伤的影响机理

航天器中电子器件在轨服役期间,会遭受到空间带电粒子及各种射线的辐射环境的显著影响,易于造成电离辐射损伤.本文采用60Coγ射线辐照源,针对有/无Si_3N_4钝化层结构的横向PNP型(LPNP)双极晶体管,开展了电离辐射损伤效应及机理研究.利用KEITHLEY 4200-SCS半导体参数测试仪测试了LPNP晶体管电性能参数(包括Gummel特性曲线和电流增益等).采用深能级瞬态谱分析仪(DLTS),对辐照前后有/无Si_3N_4钝化层结构的LPNP晶体管的电离缺陷进行测试.研究结果表明,在相同吸收剂量条件下,与无Si_3N_4钝化层的晶体管相比,具有Si_3N_4钝化层的LPNP晶体管基极电流退化程度大,并且随吸收剂量的增加,电流增益退化更为显著.通过DLTS分析表明,与无Si_3N_4钝化层的晶体管相比,有Si_3N_4钝化层的晶体管辐射诱导的界面态能级位置更接近于禁带中心.这是由于制备Si_3N_4钝化层时引入了大量的氢所导致,而氢的存在会促使辐射诱导的界面态能级位置更接近于禁带中心,复合率增大,从而加剧了晶体管性能的退化.     

Incident particle range dependence of radiation damage in a power bipolar junction transistor

The characteristic degradations in silicon NPN bipolar junction transistors(BJTs) of type 3DD155 are examined under the irradiations of 25-MeV carbon(C),40-MeV silicon(Si),and 40-MeV chlorine(Cl) ions respectively.Different electrical parameters are measured in-situ during the exposure of heavy ions.The experimental data shows that the changes in the reciprocal of the gain variation((1/β)) of 3DD155 transistors irradiated respectively by 25-MeV C,40-MeV Si,and 40-MeV Cl ions each present a nonlinear behaviour at a low fluence and a linear response at a high fluence.The(1/β) of 3DD155 BJT irradiated by 25-MeV C ions is greatest at a given fluence,a little smaller when the device is irradiated by 40-MeV Si ions,and smallest in the case of the 40-MeV Cl ions irradiation.The measured and calculated results clearly show that the range of heavy ions in the base region of BJT affects the level of radiation damage.     

Analysis of displacement damage effects on bipolar transistors irradiated by spallation neutrons

Displacement damage induced by neutron irradiation in China Spallation Neutron Source(CSNS) is studied on bipolar transistors with lateral PNP, substrate PNP, and vertical NPN configurations, respectively. Comparison of the effects on different type transistors is conducted based on displacement damage factor, and the differences are analyzed through minority carrier lifetime calculation and structure analysis. The influence of CSNS neutrons irradiation on the lateral PNP transistors is analyzed by the gate-controlled method, including the oxide charge accumulation, surface recombine velocity,and minority carrier lifetime. The results indicate that the total ionizing dose in CSNS neutron radiation environment is negligible in this study. The displacement damage factors based on 1-MeV equivalent neutron flux of different transistors are consistent between Xi'an pulse reactor(XAPR) and CSNS.     

Effects of orientation of substrate on the enhanced low-dose-rate sensitivity （ELDRS） in NPN transistors

The radiation effects and annealing characteristics of two types of domestic NPN bipolar junction transistors, fabricated with different orientations, were investigated under different dose-rate irradiation. The experimental results show that both types of the NPN transistors exhibit remarkable Enhanced Low-Dose-Rate Sensitivity (ELDRS). After irradiation at high or low dose rate, the excess base current of NPN transistors obviously increased, and the current gain would degrade rapidly. Moreover, the decrease of collector current was also observed. The NPN transistor with <111> orientation was more sensitive to ionizing radiation than that with <100> orientation. The underlying mechanisms of various experimental phenomena are discussed in detail in this paper.     

Effects of orientation of substrate on the enhanced low-dose-rate sensitivity (ELDRS) in NPN transistors

The radiation effects and annealing characteristics of two types of domestic NPN bipolar junction transistors, fabricated with different orientations, were investigated under different dose-rate irradiation. The experimental results show that both types of the NPN transistors exhibit remarkable Enhanced Low-Dose-Rate Sensitivity (ELDRS). After irradiation at high or low dose rate, the excess base current of NPN transistors obviously increased, and the current gain would degrade rapidly. Moreover, the decrease of collector current was also observed. The NPN transistor with (111) orientation was more sensitive to ionizing radiation than that with (100) orientation. The underlying mechanisms of various experimental phenomena are discussed in detail in this paper.