Study of a Crack at a Fastener Hole by Digital Image Correlation

In this work the efficacy of using digital image correlation to determine stress intensity factors for a crack emanating from a fastener hole has been investigated. To this end a fatigue crack was grown in pure mode I from a 50 mm diameter hole in an Al 7010 alloy plate test-piece. This crack was then loaded elastically under several combinations of mixed mode (I + II) displacements. In each case, images of the sample surface before and after the deformation were recorded using a high resolution digital camera. The surface preparation consisted only of scratching the surface lightly with silicon carbide abrasive paper. The crack location and resulting displacements were then calculated using digital image correlation. The analytical displacement fields for a traction free crack under arbitrary loading conditions based on the Muskhelishvili’s complex function approach were fitted to the experimentally measured displacement fields and the mixed mode stress intensity factor was determined in each case. Good agreement with the nominal applied values was obtained. The uncertainty of the crack tip position has a major influence on the accuracy of the stress intensity factors and so the Sobel edge finding filter was successfully applied to experimental displacement fields to establish precisely the crack tip location. This paper was presented at the 2007 SEM Congress held in Springfield, Massachusetts, USA     

Mode I Fracture at Spot Welds in Dual-Phase Steel: An Application of Reverse Digital Image Correlation

Strain fields in 600 grade dual-phase steel V-notch tensile specimens, both with and without a spot weld, were measured after mode I fracture initiation. Starting with the final image of a fully developed crack, a novel reverse digital image correlation (DIC) analysis was used to determine the path that the crack followed at the onset of fracture as well as the crack tip deformation field. This gave the pixel coordinates of grid points on both sides (i.e. fracture surfaces) of the crack path in the undeformed image. Strain fields that develop in the base material regions surrounding the two fracture surfaces were subsequently measured with forward DIC analysis. Steady state values of the crack tip opening displacement (CTOD) and crack tip opening angle (CTOA), which are important fracture parameters, were measured for the base DP600 metal. Notch tip opening displacement (NTOD) and notch tip opening angle were also measured. It was found that steady state values of the CTOD and CTOA are reached within 2 mm or so of crack growth following completion of the flat-to-slant transition of the fracture surface and stabilization of the crack tunneling effect.     

基于数字散斑相关方法测定Ⅰ型裂纹应力强度因子

提出了一种通过数字散斑相关方法测定金属材料Ⅰ型裂纹尖端位置和应力强度因子的实验方法.实验采用疲劳试验机对含Ⅰ型缺口的Cr12MoV钢试件预制裂纹,通过数字散斑相关方法测试试件在三点弯曲加载条件下裂纹的扩展过程及裂尖区域的位移场.将位移场数据代入裂尖位移场方程组,采用牛顿-拉普森方法求解含未知参量的裂尖非线性位移场方程组,计算裂尖位置和应力强度因子.实验结果表明,采用该方法可以准确地测定金属材料Ⅰ型裂纹应力强度因子、裂尖位置及裂纹扩展长度,解决了以往研究中因不能准确测定裂纹尖端位置,而无法准确计算Ⅰ型裂纹裂尖断裂参数的难题,揭示了金属材料裂纹扩展过程中应力强度因子演化特征.     

基于DIC的爆炸加载下脆性材料裂纹扩展规律的试验研究

通过数字图像相关法（DIC）,应用PMMA对爆炸加载条件下脆性材料的裂纹扩展规律进行了试验研究。基于对称性试验模型,实现了裂纹尖端位置和应变场信息的同步记录。以此为基础,通过对比分析获知,主应变场应变值最大点不能作为裂纹尖端的判断依据。并以动态裂纹扩展速度为参量,应用断裂动力学和最小二乘牛顿迭代法,计算出了考虑惯性效应的Ⅰ-Ⅱ混合型裂纹的应力强度因子:K_Ⅰ和K_Ⅱ值会随着裂纹扩展方向改变而发生突变;K_Ⅰ最大值为2.63 MPa·m1/2,最小值为0.89 MPa·m1/2;其整体变化趋势表明,爆炸加载条件下脆性材料裂纹扩展随能量积聚和释放呈循环阶梯式递减发展。     

砂岩方梁断裂过程区范围的实验确定方法

裂纹前端的断裂过程区是引起岩石非线性断裂及尺寸效应的主要原因。利用数字图像相关技术对砂岩开展了三点弯曲梁实验,获得观测区域高精度的全场位移和应变数据,根据断裂韧带区域水平位移和水平应变的分布特征,结合裂尖岩石颗粒变化的微观分析,提出采用裂纹尖端水平位移波动性和水平应变突变性所得到的波动系数和水平应变突变值,确定断裂过程区形状和临界尺寸的方法。结果表明:砂岩断裂过程区的形状为不规则的狭长带状区域,断裂过程区的临界长度为11~13mm,临界宽度为1.58~2.36mm。断裂过程区区域内形变在趋向裂尖时呈指数增加,但其单位区域内的形变增量呈波动状态。该方法能够更加准确判断岩石断裂过程区的范围,有助于分析岩石的非线性断裂特性。     

RESEARCH PROGRESS OF FRACTURE TOUGHNESS TEST METHOD FOR LOW CONSTRAINT SPECIMENS 1)

低约束试件断裂韧性测试对油气管道安全运营具有重要意义。本文回顾了低约束试件断裂韧性测试方法及发展过程,介绍了裂纹尖端张开位 移(crack tip opening displacement, CTOD)和J积分等常用断裂韧性表征参数,并对断裂韧性测试中应力强度因子、J积分塑性因子、J积分与CTOD转换因子、裂纹尺寸测量方法、数 字图像相关方法等关键问题进行对比分析,总结需要深入研究的问题,为低约束试件断裂韧性测试发展提供一定依据。     

复合材料断裂力学参量的实验测定

本文采用三维云纹干涉仪同步测量含裂纹复合材料弯曲板的面内位移场及离面位移场，并对离面位移场云纹图进行计算机自动采集和处理，编制了云纹数字图像处理软件。文中推导了正交异性复合材料弯曲问题的离面位移场表达式，得到了弯曲板裂纹尖端位移w与应力场强度因子K1的关系式。通过实测位移，结合裂尖位移场推导出应力强度因子K1值。     

The interaction between crack and electric dipole of piezoelectricity

Discrete dipoles located near the crack tip play an important role in nonlinear electric field induced fracture of piezoelectric ceramics. A physico-mathematical model of dipole is constructed of two generalized concentrated piezoelectric forces with equal density and opposite sign. The interaction between crack and electric dipole in piezoelectricity is analyzed. The closed form solutions, including those for stress and electric displacement, crack opening displacement and electric potential, are obtained. The function of piezoelectric anisotropic direction,p _a (θ)=cosθ+p _a sinθ, can be used to express the influence of a dipole's direction. In the case that a dipole locates near crack tip, the piezoelectric stress intensity factor is a power function with −3/2 index of the distance between dipole and crack tip. Supported by National Natural Science Foundation of China(No. 10072033)     

Effect of intrinsic stress gradient on the effective mode-I fracture toughness of amorphous diamond-like carbon films for MEMS

The influence of intrinsic stress gradient on the mode-I fracture of thin films with various thicknesses fabricated for Microelectromechanical Systems (MEMS) was investigated. The material system employed in this study was hydrogen-free tetrahedral amorphous diamond-like carbon (ta-C). Uniform gauge microscale specimens with thicknesses 0.5, 1, 2.2, and 3 μm, containing mathematically sharp edge pre-cracks were tested under mode-I loading in fixed grip configuration. The effective opening mode fracture toughness, as calculated from boundary force measurements, was 4.25±0.7 MPa√m for 0.5-μm thick specimens, 4.4±0.4 MPa√m for 1-μm specimens, 3.74±0.3 MPa√m for 2.2-μm specimens, and 3.06±0.17 MPa√m for 3-μm specimens. Thus, the apparent fracture toughness decreased with increasing film thickness. Local elastic property measurements showed no substantial change as a function of film thickness, which provided evidence for the stability of the sp²/sp³ carbon binding stoichiometry in films of different thicknesses. Detailed experiments and finite element analysis pointed out that the dependence of the effective fracture toughness on specimen thickness was due to the intrinsic stress gradient developed during fabrication and post-process annealing. This stress gradient is usually unaccounted for in mode-I fracture experiments with thin films. Thicker films, fabricated from multiple thin layers, underwent annealing for extended times, which resulted in a stress gradient across their thickness. This stress gradient caused an out-of-plane curvature upon film release from its substrate and, thus, combined bending and tensile mode-I loading at the crack tip under in-plane forces. Since the bending component cannot be isolated from the applied boundary force measurements, its contribution, becoming important for thick films, remains unaccounted for in the calculation of the critical stress intensity factor, thus resulting in reduced apparent fracture toughness that varies with film thickness and curvature. It was concluded that in the presence of a stress gradient, accounting only for the average intrinsic stresses could lead in an overestimate of the fracture resistance of a brittle film. Under these considerations the material fracture toughness of ta-C, as determined from specimens with negligible curvature, is K_IC=4.4±0.4 MPa√m.     

扩展数字图像相关方法中裂尖位移函数的表征研究

探寻适用于扩展数字图像相关方法(X-DIC)的裂纹尖端位移函数,对于提高该方法在裂尖测试精度方面具有重要意义。本文基于断裂力学裂纹尖端位移场函数,进行主导项影响分析,并探究裂尖位移函数中各项及其组合项对位移场表征的贡献程度及对测试精度的影响。通过对I型、II型及混合型裂纹进行测试,发现各项及其组合项在不同裂纹类型测试中的影响有着较大区别,从而得出在X-DIC测试计算中影响裂尖位移场表征的主导项。最后,应用上述研究成果对某航空超硬铝合金的单边裂纹进行拉伸测试。     

Dynamic stress intensity factor K III and dynamic crack propagation characteristics of anisotropic materials

Based on the mechanics of anisotropic materials, the dynamic propagation problem of a mode Ⅲ crack in an infinite anisotropic body is investigated. Stress, strain and displacement around the crack tip are expressed as an analytical complex function, which can be represented in power series. Constant coefficients of series are determined by boundary conditions. Expressions of dynamic stress intensity factors for a mode Ⅲ crack are obtained. Components of dynamic stress, dynamic strain and dynamic displacement around the crack tip are derived. Crack propagation characteristics are represented by the mechanical properties of the anisotropic materials, i.e., crack propagation velocity M and the parameter ~. The faster the crack velocity is, the greater the maximums of stress components and dynamic displacement components around the crack tip are. In particular, the parameter α affects stress and dynamic displacement around the crack tip.     

Experimental Investigation of Strain Rate Dependence of Nanocrystalline Pt Films

A new microscale uniaxial tension experimental method was developed to investigate the strain rate dependent mechanical behavior of freestanding metallic thin films for MEMS. The method allows for highly repeatable mechanical testing of thin films for over eight orders of magnitude of strain rate. Its repeatability stems from the direct and full-field displacement measurements obtained from optical images with at least 25 nm displacement resolution. The method is demonstrated with micron-scale, 400-nm thick, freestanding nanocrystalline Pt specimens, with 25 nm grain size. The experiments were conducted in situ under an optical microscope, equipped with a digital high-speed camera, in the nominal strain rate range 10⁻⁶–10¹ s⁻¹. Full field displacements were computed by digital image correlation using a random speckle pattern generated onto the freestanding specimens. The elastic modulus of Pt, E = 182 ± 8 GPa, derived from uniaxial stress vs. strain curves, was independent of strain rate, while its Poisson’s ratio was v = 0.41 ± 0.01. Although the nanocrystalline Pt films had the elastic properties of bulk Pt, their inelastic property values were much higher than bulk and were rate-sensitive over the range of loading rates. For example, the elastic limit increased by more than 110% with increasing strain rate, and was 2–5 times higher than bulk Pt reaching 1.37 GPa at 10¹ s⁻¹.     

An Experimental Study of Mixed Mode Crack Initiation and Growth in Functionally Graded Materials

Quasi-static mixed mode crack initiation and growth in functionally graded materials (FGMs) was studied through fracture experiments on polymer-based FGMs manufactured by selective ultraviolet irradiation poly(ethylene carbon monoxide)—a photo-sensitive copolymer that becomes more brittle and stiffer under ultraviolet irradiation. The objective of the study was to determine whether crack kinking criteria for homogeneous materials, e.g., maximum hoop stress criterion, also hold for FGMs. Single edge notched tension specimens with different spatial variations of Young's modulus, failure stress and failure strain, were tested. Near tip mode mixity was introduced either by inclining the crack to the remote loading direction, as in the case of homogeneous materials, or to the direction of material gradient, or both. A full-field digital image correlation technique was used to measure in real-time the displacement field around the crack tip while it propagated through the graded material, and to extract the fracture parameters of stress intensity factor K _I and K _II , and the T-stress. It was found that the nonsingular T-stress term in the asymptotic expansion for stresses plays a very important role in accurately measuring fracture parameters. It was also found that the maximum tangential stress criterion can be applied to the case of FGMs to predict crack kinking provided that the effect of the T-stress is accounted for and the process zone size is small compared to the intrinsic material gradient length scale. However, for accurate crack path prediction at a length scale comparable to the material gradient, detailed material property information is required. In general, the crack will propagate towards a region that exhibits less fracture toughness, but, unlike the case of homogeneous materials, along a path where K _II is not necessarily equal to zero.     

Parameters controlling fracture resistance in functionally graded materials under mode I loading

In this investigation the fracture behavior of functionally graded materials (FGMs) was studied by means of experiments carried out on model polymer-based FGMs. Model graded materials were manufactured by selective ultraviolet irradiation of ECO [poly(ethylene carbon monoxide)], a photo-sensitive ductile copolymer that becomes more brittle and stiffer under exposure to ultraviolet light. The mechanical response of the graded material was characterized using uniaxial tensile tests. Single edge notched tension graded ECO specimens possessing different spatial variations of Young’s modulus, failure stress and failure strain were tested under remote opening loading. A full-field digital image correlation technique was used to measure in real-time the displacement field around the crack tip while it propagated through the graded material. The measured displacement field was then used to extract fracture parameters such as stress intensity factor and T-stress, and thus construct resistance curves for crack growth in the FGMs. For this loading configuration it was found that the nonsingular T-stress term in the asymptotic expansion for stresses needs to be accounted for in order to accurately measure the fracture resistance in FGMs. In addition, the influence of local failure properties (i.e., failure stress and failure strain) on crack growth resistance was investigated in detail. It was found that depending on the combined effects of the spatial variation of these two failure parameters, regardless of the spatial variation of the Young’s modulus, the FGM fracture resistance can either increase, decrease or remain constant with continued crack growth.     

Plane-strain crack tip field and a dual-parameter fracture-criterion for non-linear fracture mechanics

Hancock and Cowling measured the critical crack tip opening displacements, δ_f, at fracture initiation in HY-80 steel specimens of six different configurations. δ_f varied from 90 μm in a deeply double-edge-cracked tensile panel to 900 μm in a single-edge-cracked tensile panel.McMeeking and Parks, and Shih and German have shown by their finite element calculations that the characteristics of the plane strain crack tip fields in both large scale yielding and general yielding are strongly dependent on specimen geometry and load level.In this study, the plane strain crack tip fields in the specimens tested by Hancock and Cowling were calculated using the finite element method. The crack tip triaxial tensile stress field is strongly affected by specimen geometric constraint, and the state of the triaxial tensile stress in a crack tip region is monitored by the ratio between the local tensile stress and the effective stress, i.e., ( ), at a distance x=2δ from the crack tip. The values of ( ) vary from 3.1 for the double-edge-cracked tensile panel to 1.7 for the single-edge-cracked tensile panel. The δ_f measured by Hancock and Cowling correlates very well with the ratio ( ). δ_f is a measure of the fracture ductility of the material ahead of the crack tip, and the ductility decreases with an increase in the triaxial tensile stress, i.e., the ratio ( ).     

Experimental analysis of crack tip fields in rubber materials under large deformation

A three-nested-deformation model is proposed to describe crack-tip fields in rubber-like materials with large deformation.The model is inspired by the distribution of the measured in-plane and out-of-plane deformation.The inplane displacement of crack-tip fields under both Mode I and mixed-mode(Mode I-II) fracture conditions is measured by using the digital Moire’ method.The deformation characteristics and experimental sector division mode are investigated by comparing the measured displacement fields under different fracture modes.The out-of-plane displacement field near the crack tip is measured using the three-dimensional digital speckle correlation method.     

功能梯度压电材料反平面裂纹问题

基于三维弹性理论和压电理论，导出了材料系数在横观各向同性平面内梯度分布的压电体的状态方程，进而对材料系数指数函数规律分布的半无限大压电体中的反平面裂纹问题进行了求解，利用Fourier变换给出了半无限大压电体中位移，应力，电势及电位移的解析表达式，并求得了裂纹尖端的应力强度因子和电位移强度因子，分析了不同的非均匀材料系数及几何尺寸对它们的影响。     

Semi-weight function method on computation of stress intensity factors in dissimilar materials

Semi-weight function method is developed to solve the plane problem of two bonded dissimilar materials containing a crack along the bond. From equilibrium equation, stress and strain relationship, conditions of continuity across interface and free crack surface, the stress and displacement fields were obtained. The eigenvalue of these fields is lambda. Semi-weight functions were obtained as virtual displacement and stress fields with eigenvalue-lambda. Integral expression of fracture parameters, KⅠ and KⅡ, were obtained from reciprocal work theorem with semi-weight functions and approximate displacement and stress values on any integral path around crack tip. The calculation results of applications show that the semi-weight function method is a simple, convenient and high precision calculation method.     

Direct Extraction of Cohesive Fracture Properties from Digital Image Correlation: A Hybrid Inverse Technique

The accuracy of an adopted cohesive zone model (CZM) can affect the simulated fracture response significantly. The CZM has been usually obtained using global experimental response, e.g., load versus either crack opening displacement or load-line displacement. Apparently, deduction of a local material property from a global response does not provide full confidence of the adopted model. The difficulties are: (1) fundamentally, stress cannot be measured directly and the cohesive stress distribution is non-uniform; (2) accurate measurement of the full crack profile (crack opening displacement at every point) is experimentally difficult to obtain. An attractive feature of digital image correlation (DIC) is that it allows relatively accurate measurement of the whole displacement field on a flat surface. It has been utilized to measure the mode I traction-separation relation. A hybrid inverse method based on combined use of DIC and finite element method is used in this study to compute the cohesive properties of a ductile adhesive, Devcon Plastic Welder II, and a quasi-brittle plastic, G-10/FR4 Garolite. Fracture tests were conducted on single edge-notched beam specimens (SENB) under four-point bending. A full-field DIC algorithm was employed to compute the smooth and continuous displacement field, which is then used as input to a finite element model for inverse analysis through an optimization procedure. The unknown CZM is constructed using a flexible B-spline without any “a priori” assumption on the shape. The inversely computed CZMs for both materials yield consistent results. Finally, the computed CZMs are verified through fracture simulation, which shows good experimental agreement.     

Constant moving crack in a magnetoelectroelastic material under anti-plane shear loading

Analytical solutions for an anti-plane Griffith moving crack inside an infinite magnetoelectroelastic medium under the conditions of permeable crack faces are formulated using integral transform method. The far-field anti-plane mechanical shear and in-plane electrical and magnetic loadings are applied to the magnetoelectroelastic material. Expressions for stresses, electric displacements and magnetic inductions in the vicinity of the crack tip are derived. Field intensity factors for magnetoelectroelastic material are obtained. The stresses, electric displacements and magnetic inductions at the crack tip show inverse square root singularities. The moving speed of the crack have influence on the dynamic electric displacement intensity factor (DEDIF) and the dynamic magnetic induction intensity factor (DMIIF), while the dynamic stress intensity factor (DSIF) does not depend on the velocity of the moving crack. When the crack is moving at very lower or very higher speeds, the crack will propagate along its original plane; while in the range of M_c1 < M < M_c2, the propagation of the crack possibly brings about the branch phenomena in magnetoelectroelastic media.