High temperature phosphorylated or nonphosphorylated laminating resins based on maleimido-substituted aromatic s-triazines

Several new phosphorylated or nonphosphorylated maleimide or nadimide systems containing s-triazine rings were synthesized. Their synthesis was accomplished by simple methods utilizing readily available and relatively inexpensive starting materials. All polymer precursors were characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. They were thermally polymerized to heat-resistant laminating resins. Thermal characterization of monomers and their cured resins was achieved using differential thermal analysis (DTA), dynamic thermogravimetric analysis (TGA) and isothermal gravimetric analysis (IGA). The cured resins were stable up to 304–330°C both in nitrogen and air atmospheres and formed anaerobic char yield 49–59% at 800°C. The phosphorylated polymers showed a lower temperature of initial weight loss but afforded higher anaerobic char yield than did the corresponding nonphosphorylated polymers. The thermal properties of the polymers were correlated with their chemical structure.     

Bismaleimides chain-extended by imidized benzophenone tetracarboxylic dianhydride and their polymerization to high temperature matrix resins

Heat-resistant polymers were obtained by thermal polymerization of several bismaleimides or their substituted derivatives. The chain of the polymer precursors was extended by incorporation of imidized benzophenone tetracarboxylic dianhydride between the maleimide rings in order to impart a degree of flexibility in the polymers. The bismaleimides and their corresponding tetraamic acids were characterized by infrared (IR) and proton nuclear magnetic resonance (¹H-NMR) spectroscopy. The differential thermal analysis (DTA) thermograms of the monomers showed exotherms at 200–340°C attributed to the thermally induced polymerization reactions. The influence of different substituents in the maleic double bond on the curing temperature was investigated. The thermal stability of the cured resins was evaluated by thermogravimetric analysis (TGA) and isothermal gravimetric analysis (IGA). They were stable up to 367–433°C both in nitrogen and air atmosphere and afforded 57–68% char yield at 800°C under anaerobic conditions. The structure of the aromatic and aliphatic diamines utilized for imidization was correlated with the thermal stability of the cured resins. The bismaleimide derived from p-phenylenediamine gave the most heat-resistant resin because of its higher rigidity.     

Synthesis of novel bismaleimide monomers based on fluorene cardo moiety and ester bond: Characterization and thermal properties

Two novel bismaleimide monomers based on fluorene cardo moiety and ester bonds, namely 9, 9-bis[4-(4-maleimidobenzoate) phenyl]fluorene (PEFBMI) and 9,9-bis[4-(4-maleimidobenzoate)-3-methylphenyl]fluorene (MEFBMI) were designed and synthesized. Their structures were confirmed by FTIR, ¹H-NMR, ¹³C-NMR spectroscopy and Elemental analysis. Both monomers obtained have excellent solubility in some organic solvents with low boiling point, including acetone, chloroform and dichloromethane. The curing process of the monomers were investigated by DSC, displaying that the melting point of the monomers were 157.1°C and 193.6°C respectively, and all processing windows exceed 30°C. DMA results showed the glass transition temperature of the cured PEFBMI/glass cloth composite was higher than 390°C while that of the cured PEFBMI composite was 349.2°C. TGA results indicated that the cured BMI resins have good thermal stability and their 5% weight loss temperatures were both higher than 410°C.     

Studies of fluorine-containing bismaleimide resins. Part I: Synthesis and characteristics of model compounds

A series of fluorine-containing bismaleimide (FBMI) monomers are synthesized by a 2-step reaction for using as the applications of low-k materials. The synthesized FBMI monomers are characterized by the ¹H, ¹³C, ¹⁹F nuclear magnetic resonance (NMR) spectroscopy and element analysis. These FBMI monomers react with free radical initiator or self-cure to prepare FBMI-polymers. All the self-curing FBMI resins have the glass transition temperatures T _g in the range of 130–141°C and show the 5% weight loss temperatures T _5% of 280–322°C in nitrogen atmosphere. The higher heat resistance of self-curing FBMI resin relative to FBMI-homopolymer is due to its higher cross-linking density. The FBMI resins exhibit improved dielectric properties as compared with commercial bismaleimide (BMI) resins with the dielectric constants ? lower than 2.44 which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymers. Besides, the flame retardancy of all these FBMI resins could be enhanced via the introduction of Br-atom.     

Synthesis and thermal characteristics of bisimides. I

Ten structurally different bisimide resins were prepared by reacting maleic anhydride/citraconic anhydride and benzophenone tetracarboxylic dianhydride with aromatic diamines and fused aromatic structures or heterocyclic groups. The amines included were 1,5-diaminonaphthalene, 2,5-bis(p-aminophenyl)1,3,4-oxadiazole, 3,3-bis(p-aminophenyl)phthalide, 9,9-bis(p-aminophenyl)fluorene. and 10,10-bis(p-aminophenyl)anthrone. These monomers were characterized by infrared (IR). ¹H-NMR, mass spectroscopy, and elemental analysis. Thermal polymerization of these monomers was investigated by differential scanning calorimetry. Broad exothermic peaks were observed for a temperature range of 225–380°C. Temperature of exothermic peak position was influenced by the presence of substituents at the olefinic bond, and in biscitraconimides it was 40–50°C lower than in the corresponding bismaleimides. Anaerobic char yields of cured bisimide resins ranged from 44 to 64%. Oxadiazole-containing bisimides had low thermal stability. Increase in formula weight between the imide groups did not influence the char yields in a systematic manner. Graphite cloth laminates with two of these bisimide resins were fabricated and tested for a number of physical properties. Their limiting oxygen index was 70–72%.     

Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin

A kind of aromatic diamine, 4′, 4″-(2, 2-diphenylethene-1, 1-diyl)dibiphenyl-4-amine (TPEDA), was successfully synthesized via Suzuki coupling reaction. The TPEDA containing nonplanar rigid moieties can be used as epoxy resins curing agent to improve the complex properties of cured composites. The curing kinetics during thermal processing of E51/TPEDA system was investigated by nonisothermal differential scanning calorimeter. The average activation energy (E _α), pre-exponential factor (lnA), and reaction order (n) calculated from the Kissinger, the Ozawa, the Friedman and the Flynn–Wall–Ozawa methods were 55.8 kJ mol^?1, 9.4 s^?1 and 1.1, respectively. By the aid of estimated kinetic parameters, the predicted heat generation vs temperature curves fit well with the experimental data, which supported the validity of the estimated parameters and the applicability of the analysis method used in this work. By the introduction of nonplanar rigid moieties, the cured epoxy resins with TPEDA exhibited a higher glass transition temperature (T _g = 258 °C), good thermal stability (≈395 °C at 10 % mass-loss), and high char yield (36.6 % at 700 °C under nitrogen) compared with conventional curing agents.     

Synthesis,Characterization and Thermal Properties of Imide-Containing Phthalonitrile Polymers

A series of novel imide-containing phthalonitrile polymers with flexible aryl ether units have been synthesized and characterized. Bisphenol monomers were synthesized by a multi-step synthesis involving a condensation reaction between aromatic aldehydes and 2,6-dimethyl phenol, respectively. The bisphenols obtained were reacted with 4-nitrophthalonitrile to form aryl ether linkage containing bisphthalonitriles. These products were hydrolyzed to tetra carboxylic acid, which were subsequently converted into corresponding dianhydrides. The obtained dianhydrides were reacted with synthesized 4-(4′-aminophenoxy) phthalonitrile by thermal imidization leading to the formation of imide-containing phthalonitrile monomers. The synthesized monomers were cured with 3.5 wt% of aromatic diamine, 4,4′-diaminodiphenylsulphone(DDS). The structure and properties of all compounds synthesized were confirmed by using elemental analysis, FT-IR, ¹H-NMR, ¹³C-NMR, DSC, TGA and rheometric studies. The cure temperatures are found to be in the range of 283–302°C, the temperature of 5% and 10% weight loss from TGA are in the range of 433–492°C in N₂ and 424–478°C in air, char yield at 800°C is 40–51%.     

Liquid crystalline epoxies bearing biphenyl ether and aromatic ester mesogenic units: Synthesis and thermal properties

Two liquid crystalline epoxies containing biphenyl ether and aromatic ester mesogenic units, oxybis(4,1-phenylene)bis(4-(oxiran-2-ylmethoxy)benzoate)(LCE1) and oxybis(4,1-phenylene) bis(4-(4-(oxiran-2-yl)butoxy)benzoate)(LCE2), were synthesized and characterized. Subsequently, the epoxy monomers were cured with diaminodiphenylsulfone (DDS). From DSC, XRD and POM results, monomers did not show liquid crystalline phase while the cured samples exhibited nematic phase. The cured samples showed good mechanical properties with strength of 99.1MPa and excellent thermal stabilities with high glass transition temperature up to 168.0?°C, 5% weight loss temperature at 343?°C and high char yield of 24.5% at 800?°C. The relationship between thermal conductivity and network structure was discussed in this work. Due to the introduction of mesogenic units into epoxy networks, the cured resins showed high thermal conductivity as high as 0.292?W/(m*K), more than 1.5times higher than conventional epoxy resins. By introducing alumina (Al₂O₃) into LCE1/DDS cured system, composites of LCE1/DDS/Al₂O₃ with the highest thermal conductivity of 1.61?W/(m*K) was obtained with the content of 80?wt% while that of diglycidyl ether of bisphenol A (DGEBA, E51) epoxy resin/DDS/Al₂O₃ was 1.10?W/(m*K). The as-prepared epoxy resins showed high glass transition temperature and excellent thermal stabilities, indicating the potential of application in microelectronics.     

Laminating resins obtained from 2,2′-(1,4-phenylenedivinylene)bispyridine bismaleimides and maleimide-terminated styrylpyridine prepolymers

A new bismaleimide (2a) , biscitraconimide (2b) , and bisnadimide (4) were synthesized by reacting 2-amino-6-methylpyridine with an equimolar amount of maleic, citraconic, or nadic anhydride, respectively, and then with a half molar amount of 1,4-benzenedicarbaldehyde in the presence of acetic anhydride. They, as well as the intermediate amic acids ( 1a, 1b, and 3 ) were characterized by IR and ¹H-NMR spectroscopy. The DTA thermograms showed that crosslinking of polymer precursors started at 180–212°C. The crosslinked resins obtained from 2a and 2b were stable up to 300–313°C and afforded anaerobic char yield of 53–60% at 800°C. The cured resin of 4 was less thermostable. In addition, end-capping of styrylpyridine prepolymers was accomplished by reacting 2,6-dimethylpyridine (n mol) with 1,4-benzenedicarbaldehyde (n + 1 mol) in acetic anhydride to yield a formyl-terminated styrylopyridine prepolymer. The latter reacted with the maleamic acid 1a (2 mol) to afford a series of maleimide-terminated styrylpyridine prepolymers MTSOs. They showed lower curing temperatures than did the ordinary poly(styrylpyridine). Their cured resins did not lose weight up to 310–344°C both in N₂ or air and afforded anaerobic char yield of 66-72% at 800°C.     

Sucrose-based epoxy monomers and their reactions with diethylenetriamine

Two sets of sucrose-based epoxy monomers, namely, epoxy allyl sucroses (EAS), and epoxy crotyl sucroses (ECS), were prepared by epoxidation of octa-O-allyl and octa-O-crotyl sucroses (OAS and OCS, respectively). Synthetic and structural characterization studies showed that the new epoxy monomers were mixtures of structural isomers and diastereoisomers that contained varying numbers of epoxy groups per sucrose. EAS and ECS can be tailored to contain an average of one to eight epoxy groups per sucrose. Quantitative ¹³C-NMR spectrometry and titrimetry were used independently to confirm the average number of epoxy groups per sucrose. Sucrose-based epoxy monomers were cured with diethylenetriamine (DETA) in a differential scanning calorimeter (DSC), and their curing characteristics were compared with those of diglycidyl ether of bisphenol A (DGEBA) and diepoxycrotyl ether of bisphenol A (DECEBA). EAS and DGEBA cured at 100 to 125°C and exhibited a heat of cure of about 108.8 kJ per mol epoxy. ECS and DECEBA cured at 150 and 171°C, respectively, and exhibited a heat of cure of about 83.7 kJ per mol epoxy. Depending upon the degree of epoxidation (average number of epoxy groups per sucrose) and the concentration of DETA, glass transition temperatures (T_gs) of cured EAS varied from −17 to 72°C. DETA-cured ECS containing an average of 7.3 epoxy groups per sucrose (ECS-7.3) showed no DSC glass transition between −140 and 220°C when the ratio of amine (NH) to epoxy group was 1:1 and 1.5:1. Maximum T_gs obtained for DETA-cured DGEBA and DECEBA polymers were 134 and 106°C, respectively. DETA-cured bisphenol A-based epoxy polymers degraded at about 340°C, as observed by thermogravimetric analysis (TGA). DETA-cured sucrose-based epoxy polymers degraded at about 320°C. Sucrose-based epoxies cured with DETA were found to bind aluminum, glass, and steel. Comparative lap shear tests (ASTM D1002–94) showed that DETA-cured epoxy allyl sucroses with an average of 3.2 epoxy groups per sucrose (EAS-3.2) generated a flexible adhesive comparable in bond strength to DGEBA. However, DETA-cured ECS-7.3 outperformed the bonding characteristics of both DGEBA and EAS-3.2. All sucrose-based epoxy polymers were crosslinked and insoluble in water, N,N-dimethylformamide, tetrahydrofuran, acetone, and dichloromethane. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2397–2413, 1998     

Synthesis and crosslinking reaction of polyacetylenes substituted with benzoxazine rings: Thermally highly stable benzoxazine resins

Novel polyacetylenes, poly( 1 ) and poly( 2 ) substituted with benzoxazine rings were synthesized by the polymerization of the corresponding acetylene monomers 1 and 2 using Rh catalysts, [(nbd)RhCl]₂, and (nbd)Rh⁺B^–Ph₄ (nbd = 2,5‐norbornadiene). The polymers were heated at 250 °C under N₂ to obtain the corresponding polybenzoxazine resins, poly( 1 )′ and poly( 2 )′ possessing polyacetylene main chains via the ring‐opening polymerization of the benzoxazine moieties. The polyacetylene backbones were maintained after crosslinking reaction at 250 °C, which were confirmed by Raman spectroscopy. The benzoxazine resins were thermally highly stable as evidenced by differential scanning calorimetry and thermogravimetric analysis. The surface of poly( 1 )′ film became hydrophilic compared to that of poly( 1 ), while the surfaces of poly( 2 ) and poly( 2 )′ films showed almost the same hydrophilicity judging from the water contact angle measurement. Poly( 1 )′ and poly( 2 )′ exhibited refractive indices smaller than those of poly( 1 ) and poly( 2 ). © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018 , 56, 1884–1893     

Synthesis and properties of a cyanate ester containing dicyclopentadiene(II)

A 2,6‐dimethyl phenol‐dicyclopentadiene novolac (DCPDNO) was synthesized from dicyclopentadiene and 2,6‐dimethyl phenol, and the resultant DCPDNO was reacted with cyanogen bromide into 2,6‐dimethyl phenol‐dicyclopentadiene cyanate ester (DCPDCY). The structures of the novolac and cyanate ester were confirmed with Fourier transform infrared spectroscopy, elemental analysis, mass spectrometry (MS), and nuclear magnetic resonance. For the purpose of increasing the mobility of residual DCPDCY during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of a monofunctional cyanate ester, 4‐tert‐butylphenol cyanate ester (4TPCY), was added to DCPDCY to form the cyanate ester copolymer. The synthesized DCPDCY was then cured with 4TPCY at various molar ratios. The thermal properties of the cured cyanate ester resins were studied with dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those of the commercial bisphenol A cyanate ester system. Compared with the bisphenol A cyanate ester system, the cured DCPDCY resins exhibited lower dielectric constants (2.52–2.67 at 1 GHz), dissipation factors (0.0054–0.0087 at 1 GHz), glass‐transition temperatures (261–273 °C), thermal stability (5% degradation temperature at 406–450 °C), thermal expansion coefficients (4.8–5.78 × 10^?5/°C before the glass‐transition temperature), and moisture absorption (0.8–1.1%). © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 671–681, 2005     

Thermally stable polymers based on addition-type imidobenzoxazoles; synthesis and characterization of polybismaleimidobenzoxazoles and polybiscitraconimidobenzoxazoles

Four structurally different bisimidobenzoxazole monomers were synthesized, based on the reaction of two isomeric diaminobenzoxazoles, viz., 5-amino-2-(p-aminophenyl) benzoxazole and 5-amino-2-(m-aminophenyl) benzoxazole with maleic and citraconic anhydrides. The diamines were synthesized by a new route. The imides and the amic intermediates were characterized by elemental analysis, IR, NMR, and mass spectra. The imides could be thermally polymerized to crosslinked brittle polybisimidobenzoxazoles. The citraconimides polymerized at a lower temperature than the maleimide. Thermal stability of the cured resins was evaluated by TGA and was correlated to the structure of the polyimide. The polybismaleimidobenzoxazoles were stable up to about 500°C in N₂, leaving 50–60% anaerobic char yield at 800°C, whereas polybiscitraconimidobenzoxazoles were stable up to 420°C. Comparison of the thermal behavior of similar polyimides based on oxydianiline revealed that incorporation of benzoxazole structure enhances the decomposition temperature, lowers the rate of decomposition, and enhances the anaerobic char yield at high temperature. Addition of diamines as chain-extending agents decreased the thermal stability of the resins without any change in the anaerobic char yield.     

Synthesis and thermal properties of thermosetting bis-benzocyclobutene–terminated arylene ether monomers

A series of new bis-benzocyclobutene-endcapped arylene ether monomers was prepared and characterized. Whereas 2,6-bis(4-benzocyclobutenyloxy)benzonitrile (BCB-EBN) could be prepared in good yield using the standard procedure (K₂CO₃/NMP/toluene/Dean–Stark trap/120°C), other bis(benzocyclobutene) (BCB)-terminated monomers containing ether-benzophenone (BCB-EK), ether-phenylsulfone (BCB-ES), and ether-6F-benzoxazole (BCB-EBO) moieties were invariably contaminated by mono-endcapped products under similar reaction conditions. This can be attributed to a much greater activating effect of the nitrile group on the ortho-fluorides in the aromatic nucleophilic displacement reaction than the carbonyl, sulfonyl, and benzoxazolyl groups. However, the latter monomers could be synthesized (70–80%) from 4-trimethylsiloxybenzocyclobutene and respective aromatic fluorides in the presence of CsF at 140°C. Similar curing behaviors under N₂ (DSC: extrapolated onset and peak temperatures at 227–230° and 260–262°C, respectively) characterized all four monomers. BCB-EK, BCB-ES, and BCB-EBN showed melting transitions at 108, 119, and 146°C, in that order. As BCB-EBO contained more rigid benzoxazole segments, it only exhibited a glass transition (T_g) at 85°C prior to curing exotherm, after it had been previously heated to 125°C. The following T_gs were observed for the cured materials: BCB-EK (201°C), BCB-EBN (224°C), BCB-ES (264°C), and BCB-EBO (282°C). The relative thermal stability according to TGA (He) results is: BCB-ES < BCB-EBN < BCB-EK < BCB-EBO. Finally, the results from thermal analysis, infrared spectroscopic, and variable temperature microscopic studies indicated that the nitrile group plays an important role in the cure chemistry, thermal, and microstructural properties of BCB-EBN. © 1998 John Wiley & Sons, Inc. J. Polym. Sci. A Polym. Chem. 36: 2637–2651, 1998     

Synthesis and characterization of siloxane resins derived from silphenylene‐siloxane copolymers bearing benzocyclobutene pendant groups

Two bis(dimethylamimo)silanes with benzocyclobutene (BCB) groups, bis(dimethylamino)methyl(4′‐benzocyclobutenyl)silane ( 2 ) and bis(dimethylamino)methyl [2′‐(4′‐benzocyclobutenyl)vinyl]silane ( 4 ), were synthesized from different synthetic routes, which were then employed to prepare two novel silphenylene‐siloxane copolymers (SiBu and SiViBu) bearing latent reactive BCB groups by polycondensation procedure with 1,4‐bis(hydroxydimethylsilyl)benzene. At elevated temperatures these copolymers were readily converted to highly crosslinked films and molding disks with network structures by polymer chain crosslinking, which followed the first‐order kinetic reaction model. The final resins of SiBu and SiViBu demonstrated excellent thermal stability with high glass transition temperatures (218 and 256 °C) and high temperatures at 5% weight loss (553 and 526 °C in N₂, 530 and 508 °C in air). After aging at 300 °C in air for 100 h, the cured resins showed weight loss lower than 4%. The films of cured SiBu and SiViBu also exhibited relatively low dielectric constants of 2.66 and 2.64, low dissipation factors of 2.23 and 2.12 × 10^?3, low water absorptions (≤0.28%), and high transparence in the visible region with cutoff wavelengths of 321 and 314 nm. Moreover, the aged films exhibited good dielectric properties and low water absorptions. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 7868–7881, 2008     

Novel Copolymers of Styrene. 9. Methyl and Methoxy Ring-Substituted 2-Cyano-3-phenyl 2-propenamides

Novel electrophilic trisubstituted ethylene monomers, methyl and methoxy ring- substituted 2-cyano-3-phenyl-2-propenamides, RPhCH=C(CN)CONH₂, where R is 2,3-dimethyl, 2,4-dimethyl, 2,5-dimethyl, 2-(3-methoxyphenoxy), 2-(4-methoxyphenoxy), 3-(4-methoxyphenoxy), 4-(4-methylphenoxy), 2,3-methylenedioxy were prepared and copolymerized with styrene. The monomers were synthesized by potassium hydroxide catalyzed Knoevenagel condensation of ring-substituted benzaldehydes and cyanoacetamide, and characterized by CHN elemental analysis, IR, ¹H- and ¹³C-NMR. Novel copolymers of the ethylenes and styrene were prepared at equimolar monomer feed composition by solution copolymerization in the presence of a radical initiator, ABCN at 70°C. The composition of the copolymers was calculated from nitrogen analysis, and the structures were analyzed by IR, ¹H- and ¹³C-NMR, GPC, DSC, and TGA. High T_g of the copolymers in comparison with that of polystyrene indicates a substantial decrease in chain mobility of the copolymer due to the high dipolar character of the trisubstituted ethylene monomer unit. Decomposition of the copolymers in nitrogen occurred in two steps, first in the 200–500°C range with residue (5.8–33.8 wt%), which then decomposed in the 500–800°C range.     

Synthesis and characterization of photosensitive benzocyclobutene‐functionalized siloxane thermosets

Two methylphenylsiloxane monomers with crosslinkable benzocyclobutene functionalities at the terminal positions, 1,1,5,5‐dimethyldiphenyl‐1,1,5,5‐di[2′‐(4′‐benzocyclobutenyl)vinyl]‐3,3‐diphenyltrisiloxane (BCB‐1) and 1,1,3,3‐dimethyl‐diphenyl‐1,1,3,3‐di[2′‐(4′‐benzocyclobutenyl)vinyl]disiloxane (BCB‐2) were prepared and characterized. By heating the solution of BCB‐1 and BCB‐2 in mesitylene, two partially polymerized resins of BCB‐1B and BCB‐2B with high molecular weight were also achieved. The monomers and their oligomers fully cured at temperatures above 250 °C. Cured BCB‐1 and BCB‐2 exhibited high T_g (257 and 383 °C) and good thermal stability (T_5% > 472 °C both in N₂ and in air). They also demonstrated low dielectric constants (2.69 and 2.66), low dissipation factors (2.36 and 2.23), and low water absorptions (0.20% and 0.17%). Moreover, a negative photosensitive formulation derived from BCB‐1B in combination with 2,6‐bis(4‐azidobenzylidene)‐4‐methylcyclohexanone (BAC‐M) as a photosensitive agent has been developed. The photosensitive composition, BCB‐1B containing 5 wt % BAC‐M, showed a sensitivity of 550 mJ/cm² and a contrast of 1.96 when it was exposed to a 365 nm light (i‐line) and developed with cyclohexanone at 25 °C. A fine negative image of 10 μm line‐and‐space pattern was also printed in a film which was exposed to 700 mJ/cm² of i‐line by contact‐printing mode. The negative image can be maintained without any pattern deformation in the curing process. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 6246–6258, 2009     

Development of Oligomeric Phthalonitrile Resins for Advanced Composite Applications

Phthalonitrile endcapped oligomers containing aromatic ether and imide linkages have been synthesized and characterized. The phthalonitrile terminated oligomers were prepared in two step (one spot) method by the reaction of an excess amount of pyromellitc dianhydride (PMDA) with aromatic diamines, in a N,N-dimethylacetamide (DMAc)/toluene solvent mixture to form anhydride terminated oligomeric intermediate that was terminated by the reaction with 4-(aminophenoxy) phthaloitrile. The average molecular weights of the prepared oligomers were determined by GPC analysis. The oligomeric phthalonitrile monomers have been converted to network polymers using 4,4'-diaminodiphenyl sulfone (DDS) (5.0 wt %) curing additive at elevated temperatures. Differential scanning calorimetric (DSC) analysis was used to follow the polymerization as the oligomeric phthalonitrile/diamine mixtures and prepolymers. An isothermal rheometric analysis was conducted to determine the complex viscosity of the prepolymers during polymerization reaction. Viscosity increases as a function of time due to crosslinking, which depends upon the concentration and reactivity of the curing agent. The TGA analysis of cured resins showed superior thermal and thermo-oxidative stability. The temperature of 10% weight loss from TGA are in the range of 498-511 °C in N₂ and 448–461 °C in air atmosphere. Char yield at 800 °C is 41.7–50.2% in air and 70.6–83.1% in N_2.     

Cure mechanism of novel bismaleimide resins based on fluorene cardo moiety and their thermal properties

In this paper, two novel bismaleimide resins based on 9, 9-bis[4-(4-maleimidophenoxy) phenyl] fluorene (PFBMI), 9, 9-bis[4-(4-maleimidophenoxy)-3-methylphenyl]fluorene (MFBMI), and 2, 2’-diallyl bisphenol A (DABPA) were prepared. Their curing mechanism and curing kinetic were carefully investigated by Differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR). The thermal mechanical properties of the composites based on these BMI resins and the glass cloth were obtained by Dynamic mechanical analysis (DMA), displaying that the novel resins whose T_g were 296°C and 289°C had excellent thermal performance. In addition, Thermogravimetric analysis (TGA) results showed that both the cured PD and MD resins possessed good thermal stability, and their T_5% were all higher than 410°C.     

Synergism and multiple mechanical relaxations observed in ternary systems based on benzoxazine,epoxy, and phenolic resins

The synergism in the glass‐transition temperature (T_g) of ternary systems based on benzoxazine (B), epoxy (E), and phenolic (P) resins is reported. The systems show the maximum T_g up to about 180 °C in BEP541 (B/E/P = 5/4/1). Adding a small fraction of phenolic resin enhances the crosslink density and, therefore, the T_g in the copolymers of benzoxazine and epoxy resins. To obtain the ultimate T_g in the ternary systems, 6–10 wt % phenolic resin is needed. The molecular rigidity from benzoxazine and the improved crosslink density from epoxy contribute to the synergistic behavior. The mechanical relaxation spectra of the fully cured ternary systems in a temperature range of −140 to 350 °C show four types of relaxation transitions: γ transition at −80 to −60 °C, β transition at 60–80 °C, α₁ transition at 135–190 °C, and α₂ transition at 290–300 °C. The partially cured specimens show an additional loss peak that is frequency‐independent as a result of the further curing process of the materials. The ternary systems have a potential use as electronic packaging molding compounds as well as other highly filled systems. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 38: 1687–1698, 2000