5-Gb/s 0.18-μm CMOS集成时钟提取功能的2:1复接器设计

摘要：采用SMIC 0.18um CMOS工艺设计并实现了一个5-Gb/s在片集成时钟提取功能的2:1复接器,且该时钟提取子电路具有自动相位对准功能.芯片面积为670um*780um.在1.8V电压下,总功耗为112 mW, 输入灵敏度在50 mV以下, 输出单端摆幅大于300 mV. 测试结果表明,该复接器能够在不需要任何外接元件、参考时钟或外部相位调整下可靠地工作在1.8 Gb/s至2.6 Gb/s之间的任何输入数据速率. 该芯片可被用在并行光互连系统中.     

5Gb/s0.18μm CMOS半速率时钟与数据恢复电路设计

基于具体的系统需求,采用标准0.18μm CMOS工艺,设计了一种半速率bang-bang型时钟与数据恢复(CDR)电路。该CDR电路主要由改进型半速率鉴相器、带粗控端的环形压控振荡器(VCO)以及信道选择器等模块构成。其中,改进型半速率鉴相器通过增加四个锁存器,不但能获得较好的鉴相性能,还能使分接输出的两路数据自动实现相位对齐。带粗控端的环形VCO能够解决高振荡频率范围需求与低调谐增益需求之间的矛盾。信道选择器则能解决信道交叉出错问题。仿真结果表明,电路工作正常,在1.8V电压下,电路功耗为140mW,恢复出的时钟和数据抖动峰峰值分别为3.7ps和5ps。     

宽范围连续速率时钟数据恢复电路的设计

采用0.18 μm CMOS工艺,设计了一种连续速率时钟与数据恢复(CDR)电路。该CDR电路主要由全速率鉴频鉴相器、多频带环形压控振荡器、电荷泵等模块组成。其中,全速率鉴频鉴相器不但具有很好的鉴频鉴相功能,而且结构简单,减小了功耗和面积。多频带环形压控振荡器不但调谐范围很宽,而且引入到环路中的调谐增益较低,解决了高振荡频率和低增益之间的矛盾问题。采用自举基准和运放的电荷泵减小了各种非理想因素的影响。仿真结果表明,该CDR电路版图尺寸为265 μm×786 μm,功能正常,且能恢复622~3 125 Mb/s之间的伪随机数据;在1.8 V电源电压下,输入伪随机速率为3 125 Mb/s时,功耗为100.8 mW,恢复出的数据和时钟的抖动峰峰值分别为5.38 ps和4.81 ps。     

10Gb/s0.18μm CMOS工艺复接器设计

介绍一种超高速4∶1复接器集成电路。电路采用0.18μm CMOS工艺实现,供电电源1.8 V。电路采用源极耦合场效应管逻辑(SCFL),与静态CMOS逻辑相比具有更高的速度。为了避免高速时序电路中常见的时钟偏差,在时钟树中放置了缓冲器。在设计中采用有源电感的并联峰化技术有效地提高了电路的工作速度。仿真结果表明电路工作速度可达10 Gb/s,复接器芯片面积约为970×880μm2。     

10Gb/s CMOS时钟和数据恢复电路的设计

介绍了利用0.18μmCMOS工艺实现了应用于光纤传输系统SDHSTM-64级别的时钟和数据恢复电路。采用了电荷泵锁相环(CPPLL)结构,CPPLL中的鉴相器能够鉴测相位产生超前滞后逻辑,采样数据具有1∶2分接的功能。振荡器采用全集成LC压控振荡器,鉴相器采用半速率的结构。对应于10Gb/s的PRBS数据(231-1),恢复出的5GHz时钟的相位噪声为-112dBc/Hz@1MHz,同时10Gb/s的PRBS数据分接出两路5Gb/s数据。芯片面积仅为1.00mm×0.8mm,电源电压1.8V时功耗为158mW。     

一种用于Bluetooth发接器的倍频式VCO

介绍了一种适用于 Bluetooth发接器的 ,可以单片集成的倍频式压控振荡器 ( VCO)。这种 VCO由两部分组成 ,主 VCO的振荡频率是所需本振频率的一半 ,然后采用“注入锁频”原理对主 VCO的振荡频率进行倍频以产生本振信号。主 VCO和倍频电路都使用了片上集成螺旋电感 ,调谐用的变容元件使用 PMOS晶体管实现。经过版图设计和后仿真 ,在 TSMC0 .35 μm数字 COMS工艺 ,3.3V电源电压下 ,该 VCO在 2 .4GHz中心频率附近可以达到的相位噪声指标为 -1 2 5 d Bc/Hz( 60 0 k Hz) ,在输出摆幅为 60 0 m Vp- p时 ,功耗为 2 2 m W。     

半速率时钟10Gb/s光纤传输用2∶1复接器设计

介绍了使用 0 2 μmGaAsHEMT工艺设计的一个 1 0Gb/s以上的光纤传输用2∶1复接器。该复接器使用了半速率时钟的结构。为了减小功耗 ,设计时使用了 3 3V的电源 ,并对每个单元进行了优化。整个芯片的功耗约为 460mW。测试结果显示 ,该电路可以工作在 1 0Gb/s以上的数据速率。     

2.5Gb/s 0.18μm CMOS时钟数据恢复电路

采用TSMC公司标准的0．18μm CMOS工艺，设计并实现了一个全集成的2．5Gb／s时钟数据恢复电路．时钟恢复由一个锁相环实现．通过使用一个动态的鉴频鉴相器，优化了相位噪声性能．恢复出2．5GHz时钟信号的均方抖动为2．4ps，单边带相位噪声在10kHz频偏处为-111dBc／Hz．恢复出2．5Gb／s数据的均方抖动为3．3ps．芯片的功耗仅为120mW．     

2.5Gb/s 0.18μm CMOS时钟数据恢复电路

采用TSMC公司标准的0.18μm CMOS工艺,设计并实现了一个全集成的2.5Gb/s时钟数据恢复电路.时钟恢复由一个锁相环实现.通过使用一个动态的鉴频鉴相器,优化了相位噪声性能.恢复出2.5GHz时钟信号的均方抖动为2.4ps,单边带相位噪声在10kHz频偏处为-111dBc/Hz.恢复出2.5Gb/s数据的均方抖动为3.3ps.芯片的功耗仅为120mW.     

半速率时钟10Gb／s光纤传输用2：1复接器设计

介绍了使用0．2μm GaAsHEMT工艺设计的一个10Gb／s以上的光纤传输用2：1复接器。该复接器使用了半速率时钟的结构。为了减小功耗，设计时使用了3．3V的电源，并对每个单元进行了优化。整个芯片的功耗约为460mW。测试结果显示，该电路可以工作在10Gb／s以上的数据速率。     

A 10-Gb/s CMOS clock and data recovery circuit with a half-rate binary phase/frequency detector

A 10-Gb/s phase-locked clock and data recovery circuit incorporates a multiphase LC oscillator and a half-rate phase/frequency detector with automatic data retiming. Fabricated in 0.18-/spl mu/m CMOS technology in an area of 1.75/spl times/1.55 mm/sup 2/, the circuit exhibits a capture range of 1.43 GHz, an rms jitter of 0.8 ps, a peak-to-peak jitter of 9.9 ps, and a bit error rate of 10/sup -9/ with a pseudorandom bit sequence of 2/sup 23/-1. The power dissipation excluding the output buffers is 91 mW from a 1.8-V supply.     

A 40-43-Gb/s clock and data recovery IC with integrated SFI-5 1:16 demultiplexer in SiGe technology

A fully integrated OC-768 clock and data recovery IC with SFI-5 1:16 demultiplexer is designed in a 120-GHz/100-GHz (f/sub T//f/sub MAX/) SiGe technology. The 16 2.5-Gb/s outputs and additional deskew channel are compliant with the Serdes Framer Implementation Agreement Level 5 specification. The measured bit-error rate is <10/sup -15/. The measured jitter tolerance exceeds the mask specified in G.8251. The IC operates with 1.8-V and -5.2-V supplies and dissipates 7.5 W.     

A 33-mW 8-Gb/s CMOS clock multiplier and CDR for highly integrated I/Os

A 0.622-8-Gb/s clock and data recovery (CDR) circuit using injection locking for jitter suppression and phase interpolation in high-bandwidth system-on-chip solutions is described. A slave injection locked oscillator (SILO) is locked to a tracking aperture-multiplying DLL (TA-MDLL) via a coarse phase selection multiplexer (MUX). For the fine timing vernier, an interpolator DAC controls the injection strength of the MUX output into the SILO. This 1.2-V 0.13-/spl mu/m CMOS CDR consumes 33 mW at 8Gb/s. Die area including voltage regulator is 0.08 mm/sup 2/. Recovered clock jitter is 49 ps pk-pk at a 200-ppm bit-rate offset.     

A 10-Gb/s 16:1 multiplexer and 10-GHz clock synthesizer in0.25-μm SiGe BiCMOS

A 10-Gb/s 16:1 multiplexer, 10-GHz clock generator phase-locked loop (PLL), and 6 × 16 b input data buffer are integrated in a 0.25-μm SiGe BiCMOS technology. The chip multiplexes 16 parallel input data streams each at 622 Mb/s into a 9.953-Gb/s serial output stream. The device also produces a 9.953-GHz output clock from a 622- or 155-MHz reference frequency. The on-board 10-GHz voltage-controlled oscillator (VCO) has a 10% tuning range allowing the chip to accommodate both the SONET/SDH data rate of 9.953 Gb/s and a forward error correction coding rate of 10.664 Gb/s. The 6 × 16 b input data buffer accommodates ±2.4 ns of parallel input data phase drift at 622 Mb/s. A delay-locked loop (DLL) in the input data buffer allows the support of multiple input clocking modes. Using a clock generator PLL bandwidth of 6 MHz, the 9.953-GHz output clock exhibits a generated jitter of less than 0.05 UI_P-P over a 50-kHz to 80-MHz bandwidth and jitter peaking of less than 0.05 dB     

A 5-Gb/s OEIC with voltage-up-converter

In this paper (based on our previous paper at ESSCIRC 2004, "A 2.4 GHz-Bandwidth OEIC with Voltage-Up-Converter," but new results for 4 Gb/s and 5 Gb/s have been added), an optoelectronic integrated circuit (OEIC) with an integrated voltage-up-converter (VUC) to enhance the frequency response of an integrated pin photodiode is presented. With the VUC a voltage of 11 V is generated on the chip without any additional external components. Thus, for a single-supply environment of 5 V the bandwidth of the OEIC is increased from 1.5 to 2.4 GHz. For data rates of 1, 3, 4, and 5 Gb/s at a bit error rate of 10/sup -9/, sensitivities of -29.3, -24.3, -22.9, and -20.5 dBm, respectively, were measured at a wavelength of 660 nm. For the implementation of the OEIC a modified 0.6-/spl mu/m silicon BiCMOS technology with f/sub T/=25 GHz is used.     

Simulation and design methodology for a 50-Gb/s multiplexer/demultiplexer package

A 50 Gb/s package for SiGe BiCMOS 4:1 multiplexer and 1:4 demultiplexer targeting SONET OC-768 serial communication systems is introduced in this work. The package was designed to facilitate bit-error-rate tests and constructed with high-speed coaxial connectors, transmission lines on ceramic substrate, ribbon bonds for chip-to-package interconnects, and a metal composite housing. Numerical simulations were conducted to guide the package design, and both small signal measurements and operational tests were performed thereafter to verify the design and modeling concepts. To keep the model structure under the existing computing capability, the simulation was segmented into three sections - coaxial connector to transmission line, transmission line alone, and transmission line to ribbon bond, and then the results were assembled to predict the performance of the entire package. The package was operated up to 50 Gb/s with low degradation to input digital waveforms and free of error.     

All-optical clock distribution with synchronous frequency division and multiplication

A master optical clock from a mode locked laser is distributed to two slave twin section lasers. One slave laser divides the optical modulation frequency by 2, the other slave laser multiples the frequency by 2. It is also possible to vary the multiplication-division ratio in a slave laser using only DC control of the absorber of the twin section laser.<>     

A 2.5-Gb/s 15-mW clock recovery circuit

This paper describes the design of a 2.5-Gb/s 15-mW clock recovery circuit based on the quadricorrelator architecture. Employing both phase and frequency detection, the circuit combines high-speed operations such as differentiation, full-wave rectification, and mixing in one stage to lower the power dissipation. In addition, a two-stage voltage-controlled oscillator is utilized that incorporates both phase shift elements to provide a wide tuning range and isolation techniques to suppress the feedthrough due to input data transitions. Fabricated in a 20-GHz 1-μm BiCMOS technology, the circuit exhibits an rms jitter of 9.5 ps and a capture range of 300 MHz     

A fully integrated 40-Gb/s clock and data recovery IC with 1:4DEMUX in SiGe technology

In this paper, a fully integrated 40-Gb/s clock and data recovery (CDR) IC with additional 1:4 demultiplexer (DEMUX) functionality is presented. The IC is implemented in a state-of-the-art production SiGe process. Its phase-locked-loop-based architecture with bang-bang-type phase detector (PD) provides maximum robustness. To the authors' best knowledge, it is the first 40-Gb/s CDR IC fabricated in a SiGe heterojunction bipolar technology (HBT). The measurement results demonstrate an input sensitivity of 42-mV single-ended data input swing at a bit-error rate (BER) of 10^-10. As demonstrated in optical transmission experiments with the IC embedded in a 40-Gb/s link, the CDR/DEMUX shows complete functionality as a single-chip-receiver IC. A BER of 10^-10 requires an optical signal-to-noise ratio of 23.3 dB