Effect of antimony doping on the low‐temperature performance of solution‐processed indium oxide thin film transistors

The effects of antimony (Sb) doping on solution‐processed indium oxide (InO_x) thin film transistors (TFTs) were examined. The Sb‐doped InSbO TFT exhibited a high mobility, low gate swing, threshold voltage, and high I_ON/OFF ratio of 4.6 cm²/V s, 0.29 V/decade, 1.9 V, and 3 × 10⁷, respectively. The gate bias and photobias stability of the InSbO TFTs were also improved by Sb doping compared to those of InO_x TFTs. This improvement was attributed to the reduction of oxygen‐related defects and/or the existence of the lone‐pair s‐electron of Sb³⁺ in amorphous InSbO films. (© 2014 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

High performance IGZO/TiO2 thin film transistors using Y2O3 buffer layers on polycarbonate substrate

In this work, we fabricate IGZO TFT devices on flexible substrate at room temperature. The IGZO/TiO₂ TFT has small subthreshold swing of 0.16 V/dec, but suffers large gate leakage and negative threshold voltage. However, the TiO₂ TFT with Y₂O₃ buffer layers shows improved characteristics including a low threshold voltage of 0.55 V, a small sub-threshold swing of 0.175 V/decade and high field-effect mobility of 43 cm²/Vs. Such good performance can be attributed to the enhanced capacitance density and lowered gate leakage owing to the integration of large band gap Y₂O₃ and low-temperature higher-κ TiO₂.     

High-performance Zinc-Tin-Oxide thin film transistors based on environment friendly solution process

Zinc-Tin-Oxide (ZTO) thin films were fabricated using a simple and eco-friendly sol-gel method and their application in thin film transistors (TFTs) was investigated. Annealing temperature has a crucial influence on the structure and electrical properties of sol-gel ZTO thin films. The ZTO thin films annealed at 300–600?°C revealed smooth and uniform surfaces with amorphous state, in addition, a high optical transparency over 90% of the ZTO films in the visible range was obtained. The electrical performance of ZTO TFTs showed obvious dependence on annealing temperature. The ZTO TFTs annealed at 500?°C showed a high carrier mobility of 5.9?cm²/V, high on/off current ratio (I_on/off) of 10⁶-10⁷, and threshold voltage (V_th) of 1.03?V. To demonstrate the application of sol-gel ZTO films in low-power display fields, we also fabricated ZTO TFTs with a solution-processed high-permittivity (high-k) ZrTiO_x dielectric layer. The ZTO/ZrTiO_x TFTs showed high mobility of 17.9?cm²/V and I_on/off of 10⁵-10⁶?at a low operation voltage of 3?V, indicating that Indium-free ZTO thin films would be potential candidates for low cost, high performance oxide TFT devices.     

High‐performance In–Zn–O thin‐film transistors with a soluble processed ZrO2 gate insulator

Spin‐coated zirconium oxide films were used as a gate dielectric for low‐voltage, high performance indium zinc oxide (IZO) thin‐film transistors (TFTs). The ZrO₂ films annealed at 400 °C showed a low gate leakage current density of 2 × 10^–8 A/cm² at an electric field of 2 MV/cm. This was attributed to the low impurity content and high crystalline quality. Therefore, the IZO TFTs with a soluble ZrO₂ gate insulator exhibited a high field effect mobility of 23.4 cm²/V s, excellent subthreshold gate swing of 70 mV/decade and a reasonable I_on/off ratio of ～10⁶. These TFTs operated at low voltages (～3.0 V) and showed high drain current drive capability, enabling oxide TFTs with a soluble processed high‐k dielectric for use in backplane electronics for low‐power mobile display applications. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

An organic electrophosphorescent device driven by all-organic thin-film transistor using photoacryl as a gate insulator

Organic electrophosphorescent devices have been intensively investigated for using in full-color flat-panel display. Since the quantum efficiency of electrophosphorescent device decreases rapidly as the luminance increases, it is desirable to operate the electrophosphorescent display with active matrix rather than passive matrix. Here we report the study of driving electrophosphorescent diode with all-organic TFT. We obtained the maximum power luminance that was obtained about 90 cd/m². Turn-on voltage is approximately 10 V. Field effect mobility, threshold voltage, and on–off current ratio in 0.5-μm thick gate dielectric layer were 0.13 cm²/V s, −7 V, and 10⁶ A/A. The structure of electrophosphorescent diode is ITO/TPD/BCP:Ir(ppy)₃/BCP/Alq₃/Li:Al/Al. In organic TFT, photoacryl is used as an insulator and pentacene as an active layer.     

Study of radiation damage induced by 12 keV X‐rays in MOS structures built on high‐resistivity n‐type silicon

Imaging experiments at the European X‐ray Free Electron Laser (XFEL) require silicon pixel sensors with extraordinary performance specifications: doses of up to 1 GGy of 12 keV photons, up to 10⁵ 12 keV photons per 200 µm × 200 µm pixel arriving within less than 100 fs, and a time interval between XFEL pulses of 220 ns. To address these challenges, in particular the question of radiation damage, the properties of the SiO₂ layer and of the Si–SiO₂ interface, using MOS (metal‐oxide‐semiconductor) capacitors manufactured on high‐resistivity n‐type silicon irradiated to X‐ray doses between 10 kGy and 1 GGy, have been studied. Measurements of capacitance/conductance–voltage (C/G–V) at different frequencies, as well as of thermal dielectric relaxation current (TDRC), have been performed. The data can be described by a dose‐dependent oxide charge density and three dominant radiation‐induced interface states with Gaussian‐like energy distributions in the silicon band gap. It is found that the densities of the fixed oxide charges and of the three interface states increase up to dose values of approximately 10 MGy and then saturate or even decrease. The shapes and the frequency dependences of the C/G–V measurements can be quantitatively described by a simple model using the parameters extracted from the TDRC measurements.     

Self‐assembly of poly(3‐hexylthiophene) nanowire networks by a mixed‐solvent approach for organic field‐effect transistors

Organic field‐effect transistors (OFETs) based on interconnected nanowire networks of P3HT have been successfully fabricated by using a mixed‐solvent method. The nanowire network density can be tuned by controlling the anisole/chlorobenzene ratio of mixed solvents. The obtained field‐effect mobility, threshold voltage and the ratio of on‐state current and off‐state current (I_on/I_off) was 0.0435 cm²/V s, –10 V and 1.75 × 10⁴, respectively. The three‐dimensional and interconnected nanowire structure of the networks can enhance the charge transport in P3HT.

     

Fabrication of 6,13‐bis(triisopropyl‐silylethynyl)–pentacene thin‐film transistors with the silver ink transfer method using a polymer stamp

We fabricated 6,13‐bis(triisopropylsilylethynyl)–pentacene (TIPS–pentacene) thin film transistors using a direct metal transfer method. Using different metals, such as Au and Ag ink, electrode patterns are formed from the relief region of the polymer mold. TIPS–pentacene TFTs using the Ag ink transfer method show a similar performance to those using the Au metal transfer method. This method has advantages over the Au metal transfer method because it does not require vacuum equipment and a dry etching process. The self‐assembled monolayer (SAM) treated device exhibits a carrier mobility of 9.5 × 10^–2 cm²/V · s, and an on/off ratio of 4.6 × 10⁴. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

SUT‐NANOTEC‐SLRI beamline for X‐ray absorption spectroscopy

The SUT‐NANOTEC‐SLRI beamline was constructed in 2012 as the flagship of the SUT‐NANOTEC‐SLRI Joint Research Facility for Synchrotron Utilization, co‐established by Suranaree University of Technology (SUT), National Nanotechnology Center (NANOTEC) and Synchrotron Light Research Institute (SLRI). It is an intermediate‐energy X‐ray absorption spectroscopy (XAS) beamline at SLRI. The beamline delivers an unfocused monochromatic X‐ray beam of tunable photon energy (1.25–10 keV). The maximum normal incident beam size is 13 mm (width) × 1 mm (height) with a photon flux of 3 × 10⁸ to 2 × 10¹⁰ photons s^?1 (100 mA)^?1 varying across photon energies. Details of the beamline and XAS instrumentation are described. To demonstrate the beamline performance, K‐edge XANES spectra of MgO, Al₂O₃, S₈, FeS, FeSO₄, Cu, Cu₂O and CuO, and EXAFS spectra of Cu and CuO are presented.     

The effect of annealing in forming gas on the a-IGZO thin film transistor performance and valence band cut-off of IGZO on SiNx

In this investigation, the carrier concentration gradient between channel and contact region is achieved to improve the Thin film Transistors (TFT) performance by employing annealing at 350 °C in forming gas (N₂ + 5% H₂). The contact region is covered with Mo metal and the channel region is only exposed to forming gas to facilitate the diffusion controlled reaction. The TFT using a-IGZO active layer is fabricated in ambient of Ar:O₂ in ratio 60:40 and the conductivity of the order of 10⁻³ S/cm is measured for as-deposited sample. The electrical conductivity of an annealed sample is of the order of 10² S/cm. The device performance is determined by measuring merit factors of TFT. The saturation mobility of magnitude 18.5 cm²V⁻¹ s⁻¹ has been determined for W/L (20/10) device at 15 V drain bias. The extrapolated field effect mobility for a device with channel width (W) 10 μm is 19.3 cm²V⁻¹ s⁻¹. The on/off current ratio is 10⁹ and threshold voltage is in the range between 2 and 3 V. The role of annealing on the electronic property of a-IGZO is carried out using X-ray photoelectron spectroscopy (XPS). The valance band cut-off has been approximately shifted to higher binding energy by 1 eV relative to as-deposited sample.     

Flexible InGaZnO thin film transistors using stacked Y2O3/TiO2/Y2O3 gate dielectrics grown at room temperature

In this Letter, we report a low operation voltage and high mobility flexible InGaZnO thin‐film transistor (TFT) using room‐temperature processed Y₂O₃/TiO₂/Y₂O₃ gate dielectric. The flexible IGZO TFT showed a low threshold voltage of 0.75 V, a small sub‐threshold swing of 137 mV/decade, a good field effect mobility of 32.7 cm²/V s, and a large I_on/I_off ratio of 1.7 × 10⁶. The low operation voltage, small sub‐threshold swing and high mobility could be ascribed to the combination of high‐κ TiO₂ and large band gap Y₂O₃, which provide the potential to meet the requirements of low‐temperature and low‐power portable electronics.

     

Room-temperature flexible thin film transistor with high mobility

We report a room-temperature and high-mobility InGaZnO thin-film transistor on flexible substrate. To gain both high gate capacitance and low leakage current, we adopt stacked dielectric of Y₂O₃/TiO₂/Y₂O₃. This flexible IGZO TFT shows a low threshold voltage of 0.45 V, a small sub-threshold swing of 0.16 V/decade and very high field-effect mobility of 40 cm²/V. Such good performance is mainly contributed by improved gate stack structure and thickness modulation of IGZO channel that reduce the interface trap density without apparent mobility degradation.     

Ultra‐high long‐term stability of oxide‐TTFTs under current stress

In this letter the stability of transparent thin‐film transistors (TTFTs) based on the ZnO–SnO₂ (ZTO) material system is investigated. Bottom‐gate devices have been subject to electrical stress via a gate–source bias of 10 V and a drain‐source bias of 10 V leading to a drain–source current of 188 µA. In optimized TTFTs with a composition of [Zn]:[Sn] = 36:64 the relative change of the saturated field effect mobility was less than 1% and the threshold voltage shift was about 320 mV after 1000 hours of operation. This extraordinary stability of ZTO TTFTs underlines their suitability as drivers in active matrix OLED displays. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

High vertical breakdown strength in with low specific on‐resistance AlGaN/AlN/GaN HEMTs on silicon

Off‐state and vertical breakdown characteristics of AlGaN/AlN/GaN high‐electron‐mobility transistors (HEMTs) on high‐resistivity (HR)‐Si substrate were investigated and analysed. Three‐terminal off‐state breakdown (BV_gd) was measured as a function of gate–drain spacing (L_gd). The saturation of BV_gd with L_gd is because of increased gate leakage current. HEMTs with L_gd = 6 µm exhibited a specific on‐resistance R_DS[ON] of 0.45 mΩ cm². The figure of merit (FOM = BV_gd²/R_DS[ON]) is as high as 2.0 × 10⁸ V² Ω^–1 cm^–2, the highest among the reported values for GaN HEMTs on Si substrate. A vertical breakdown of ～1000 V was observed on 1.2 µm thick buffer GaN/AlN grown on Si substrate. The occurrence of high breakdown voltage is due to the high quality of GaN/AlN buffer layers on Si substrate with reduced threading dislocations which has been confirmed by transmission electron microscopy (TEM). This indicates that the AlGaN/AlN/GaN HEMT with 1.2 µm thick GaN/AlN buffer on Si substrate is promising candidate for high‐power and high‐speed switching device applications. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Amorphous IZO TTFTs with saturation mobilities exceeding 100 cm2/Vs

In this paper we demonstrate the use of amorphous binary In₂O₃–ZnO oxides simultaneously as active channel layer and as source/drain regions in transparent thin film transistor (TTFT), processed at room temperature by rf sputtering. The TTFTs operate in the enhancement mode and their performances are thickness dependent. The best TTFTs exhibit saturation mobilities higher than 10² cm²/Vs, threshold voltages lower than 6 V, gate voltage swing of 0.8 V/dec and an on/off current ratio of 10⁷. This mobility is at least two orders of magnitude higher than that of conventional amorphous silicon TFTs and comparable to or even better than other polycrystalline semiconductors. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Drop‐cast and dye‐sensitized ZnO nanorod‐based visible‐light photodetectors

We report the facile fabrication of metal–semiconductor–metal (MSM) photodetectors with dye‐sensitized ZnO nanorods (NRs) operating at wavelengths of ～405–638 nm by a simple drop casting method. The ZnO NRs were synthesized by the hydrothermal synthesis method at 75 °C. The droplet of ethanol solution containing ZnO NRs was dropped between two metal electrodes and dried at 65 °C, which allows the ZnO NRs to be adhered and contacted to both metal electrodes. When a violet light of 405 nm was illuminated into the MSM ZnO NRs‐based photodetector, the photocurrent gain was obtained as ～3.9 × 10³ at the applied bias voltage of 5 V. By increasing the bias voltage from 10 V to 15 V, the device exhibited good recovery performance with a largely reduced reset time from 85.68 s to 2.47 s and an increased on–off ratio from 17.9 to 77.4. To extend the photodetection range towards the long visible spectral region, the ZnO NRs were sensitized by the N719 dye and then drop‐cast. The dye‐sensitized ZnO NRs‐based photodetector also exhibited good photocurrent switching under 638 nm of light illumination. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

P‐type tin‐oxide thin film transistors for blue‐light detection application

We reported the characteristics of p‐type tin‐oxide (SnO) thin film transistors (TFTs) upon illumination with visible light. Our p‐type TFT device using the SnO film as the active channel layer exhibits high sensitivity toward the blue‐light with a high light/dark read current ratio (I_light/I_dark) of 8.2 × 10³ at a very low driven voltage of <3 V. Since sensing of blue‐light radiation is very critical to our eyes, the proposed p‐type SnO TFTs with high sensitivity toward the blue‐light show great potential for future blue‐light detection applications.

     

In–Ga–Zn–O MESFET with transparent amorphous Ru–Si–O Schottky barrier

Rectifying transparent amorphous Ru–Si–O Schottky contacts to In–Ga–Zn–O have been fabricated by means of reactive sputtering without any annealing processes nor semiconductor surface treatments. The ideality factor, effective Schottky barrier height and rectification ratio are equal to 1.6, 0.9 eV and 10⁵ A/A, respectively. Ru–Si–O/In–Ga–Zn–O Schottky barriers were employed as gate electrodes for In–Ga–Zn–O metal–semiconductor field‐effect transistors (MESFETs). MESFET devices exhibiting on‐to‐off current ratio at the level of 10³ A/A in a voltage range of 2 V, with subthreshold swing equal to 420 mV/dec were demonstrated. A channel mobility of 7.36 cm²/V s was achieved. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Structural and electrical analysis of In–Sb–Te‐based PCM cells

Two In–Sb–Te compounds with low Te content (12 at.% and 17 at.%), deposited by metalorganic chemical vapour deposition, were implemented into prototype phase‐change memory devices of size 50 × 50 nm² and 93 × 93 nm². These chalcogenides yielded devices with higher threshold voltage than those based on Ge–Sb–Te alloys. The endurance and programming window were markedly improved (from 10³ to 10⁶ cycles and from 1 to 2 orders of magnitude, respectively) when employing the Te‐richer alloy. Moreover, in situ structural and electrical analysis on TiN/In–Sb–Te/dielectric stacks provided additional insight on the thermal stability of the two ternary phases In₃SbTe₂ and InSb_0.8Te_0.2, which were found to coexist in these compounds. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Flexible Ti‐Doped FeOOH Quantum Dots/Graphene/Bacterial Cellulose Anode for High‐Energy Asymmetric Supercapacitors

Ti‐doped FeOOH quantum dots (QD) decorated on graphene (GN) sheets are designed and fabricated by a facile and scalable synthesis route. Importantly, the Ti‐doped FeOOH QD/GN are successfully dispersed within bacterial cellulose (BC) substrate as bending anode with large loading mass for flexible supercapacitor. By virtue of its favorable architecture, this composite electrode exhibits a remarkable areal capacitance of 3322 mF cm^?2 at 2 mA cm^?2, outstanding cycle performance (94.7% capacitance retention after 6000 cycles), and excellent mechanical strength (68.7 MPa). To push the energy density of flexible supercapacitors, the optimized asymmetric supercapacitor using Mn₃O₄/GN/BC as positive electrode and Ti‐doped FeOOH QD/GN/BC as negative electrode can be cycled reversibly in the operating voltage range of 0–1.8 V and displays ultrahigh areal energy density of 0.541 mWh cm^?2, ultrahigh volumetric energy density of 9.02 mWh cm^?3, reasonable cycling performance (9.4% decay in specific capacitance after 5000 cycles), and good capacitive retention at bending state.