Liquid fragility of the unsaturated polyester resin

Curing behaviors of the unsaturated polyester resin (UPR) containing 1–1.8 wt% methyl ethyl ketone peroxide (MEKP) initiator are investigated. The viscosity, gelation and vitrification transition of the UPR-MEKP systems are examined using the rotating viscometer and differential scanning calorimetry (DSC). A liquid fragility parameter, M _c, defined as the viscosity variation rate of the liquids towards the curing temperature is presented. It is found that M _c has a good negative relation with the glass transition temperature (T _g) in the systems. M _c can be used for predicting the stability of the cured amorphous systems. The relationship between the liquid and cured thermoset polymer systems is studied from both the thermodynamic and kinetic point of view.     

Multi-walled carbon nanotubes functionalized with triethylenetetramine as fillers to enhance epoxy dimensional thermal stability

Multi-walled carbon nanotubes (MWCNT) have been used as fillers to improve thermal properties such as glass transition temperature (T _g) of epoxy materials. In this work, nanocomposites based on diglycidyl ether of bisphenol A resin and triethylenetetramine (TETA) were prepared by a three-roll mill process with TETA-functionalized (MWCNT–COTETA) and neat MWCNT. Thermogravimetric analysis of the nanofillers showed that in the case of MWCNT–COTETA, there is a 15 % mass loss that can be attributed to –COTETA and residual oxygen-containing functional groups. The influence of chemical modification on the behavior of the glass T _g was evaluated by dynamic scanning calorimetry. The MWCNT–COTETA allowed a ~20 °C reproducible increase of T _g in concentrations in the range of 0.5–1.0 mass%. Furthermore, images obtained by scanning electron microscopy were used to investigate the morphology of the polymer matrix and its interfaces. The quality of the dispersion and interaction of the nanotubes in the epoxy matrix was assessed from the images. Both the neat epoxy and the nanocomposite with MWCNT showed low thermal shrinkage upon curing.     

Cationic copolymerization of cycloaliphatic epoxy resin with a spirobislactone with lanthanum triflate as initiator: I. Characterization and shrinkage

3,4‐Epoxycyclohexylmethyl 3,4‐epoxycyclohexane carboxylate (ECH) was cured with different proportions of 1,6‐dioxaspiro [4,4]nonane‐2,7‐dione (s(γ‐BL)) using lanthanum triflate as a catalyst. The shrinkage undergone during curing was monitored by means of thermomechanical analysis (TMA) in isothermal experiments. Fourier transform infrared spectroscopy in attenuated‐total‐reflection mode (FTIR/ATR) was used to study the evolution of lactone, epoxide, and intermediate spiroorthoester (SOE) groups to identify the different reactions that take place during the curing process. DSC was used to study the thermal characteristics of the curing process and to assess the glass‐transition temperature (T_g) of the cured material. The dynamic mechanical properties of the cured material were determined based on the data obtained by DMTA. An increase in the proportion of s(γ‐BL) led to a decrease in the gelation time and the shrinkage after gelation. By combining the data obtained by TMA and FTIR/ATR, it was also possible to identify the reactive processes responsible for the shrinkage. It was observed that an increase in the proportion of s(γ‐BL) also increases the speed of the curing process and modifies the structure of the material, thus giving rise to more flexible materials. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 43: 3421–3432, 2005     

New epoxy thermosets modified with hyperbranched poly(ester-amide) of different molecular weight

The influence of hydroxy-functionalized hyperbranched poly(ester-amide) (HBP) of different molecular weight on the curing process of diglycidylether of bisphenol A (DGEBA) was studied using methyltetrahydrophthalic anhydride (MTHPA) as curing agent. By Differential Scanning Calorimetry (DSC) and Fourier Transform Infrared Spectroscopy (FTIR) the curing reaction was monitored and the covalent incorporation of the modifier in the matrix was proved. By thermomechanical analysis (TMA) the reduction of the contraction after gelation on changing the HBP proportion was observed. The incorporation of HBP increased the glass transition temperature (T_g) and reduced the overall shrinkage. The modified materials showed a higher thermal degradability than neat DGEBA thermosets allowing reworkability. Thermal expansion coefficient, Young’s modulus, impact strength and microhardness were improved. The water uptake behavior was also evaluated.     

Synthesis and properties of phosphorus-containing bio-based epoxy resin from itaconic acid

A phosphorus-containing bio-based epoxy resin (EADI) was synthesized from itaconic acid (IA) and 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO). As a matrix, its cured epoxy network with methyl hexahydrophthalic anhydride (MHHPA) as the curing agent showed comparable glass-transition temperature and mechanical properties to diglycidyl ether in a bisphenol A (DGEBA) system as well as good flame retardancy with UL94 V-0 grade during a vertical burning test. As a reactive flame retardant, its flame-resistant effect on DGEBA/MHHPA system as well as its influence on the curing behavior and the thermal and mechanical properties of the modified epoxy resin were investigated. Results showed that after the introduction of EADI, not only were the flame retardancy determined by vertical burning test, LOI measurement, and thermogravimetric analysis significantly improved, but also the curing reactivity, glass transition temperature (T _g), initial degradation temperature for 5% weight loss (T _d(5%)), and flexural modulus of the cured system improved as well. EADI has great potential to be used as a green flame retardant in epoxy resin systems.     

Thermal characterization of carbonate rocks,Kozani area,North-western Macedonia,Greece

The curing of a thermoreactive alkyd-melamine-formaldehyde resin system was investigated by rheologycal, TG and TMA-analysis, in order to construct the time-temperature-transformation diagram. The points of the gelation curve were determined by measuring the increase in viscosity during isothermal curing at different temperatures. A power-function could be fitted to the gelation curve, which is suitable to estimate gelation at any curing conditions, as well as to establish storage conditions. The reaction in the resin matrix was followed by monitoring the loss of mass during isothermal curing at different temperatures. The final section of the resulted iso-curing temperature (iso-T _cure) diagrams could be fitted with logarithmic functions, which may be used for estimating the conditions needed to a given, desirable mass loss, i.e. conversion. The steepness of the curves increases with temperature suggesting the forthcoming of degradation during cure with increasing temperature. From these data the iso-mass loss curves of the TTT-diagram were constructed. For determining the iso-Tg curves of the TTT-diagram isothermal curing was carried out in a drying oven at different temperatures, followed by TMA measurements. The iso-Tcure diagrams served to determine T _{g ￥}, and to construct the iso-T _g curves of the TTT diagram. Vitrification curve is far beyond conditions of storage, curing and degradation, meaning that the resin matrix is in rubbery physical state before, during and after the cure. Curing conditions resulting degradation can also be estimated from the TTT-diagram. This revised version was published online in August 2006 with corrections to the Cover Date.     

Comparative curing kinetics of 1,4-bis (4-diaminobenzene-1-oxygen) n-butane and 4,4′-bis-(diaminodiphenyl) methane with tetraglycidyl methylene dianiline systems

Aromatic amine curing agent with flexible unit in backbone, 1,4-bis (4-diaminobenzene-1-oxygen) n-butane (DDBE), was synthesized, and the structure was confirmed by FT-IR and ¹H NMR. The curing kinetics of tetraglycidyl methylene dianiline (TGDDM, or AG80) using DDBE and 4,4′-bis-(diaminodiphenyl) methane (DDM) as curing agents, respectively, were comparatively studied by non-isothermal DSC with a model-fitting Málek approach and a model-free advanced isoconversional method of Vyazovkin. The dynamic mechanical properties and thermal stabilities of the cured materials were investigated by DMTA and TG, respectively. The results showed that the activation energy of AG80/DDBE system was slightly higher than that of AG80/DDM system. ?esták-Berggren model can generally simulate well the reaction rates of these two systems. DMTA measurements showed that the storage modulus of cured AG80/DDBE is similar to that of cured AG80/DDM at the temperature below glass transition temperature (T _g) and lower than that of cured AG80/DDM at the temperature above glass transition temperature, while T _g of cured AG80/DDBE is lower than that of cured AG80/DDM. TG showed that the thermal stabilities of these two cured systems are similar.     

Thermal stability and viscoelastic properties of MF/PVAc hybrid resins on the adhesion for engineered flooring in under heating system; ONDOL

The thermal properties of blends of melamine-formaldehyde (MF) resin and poly(vinyl acetate) (PVAc) for engineered flooring used on the Korean traditional ONDOL house floor heating system were investigated by thermogravimetric analysis (TGA), differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The viscoelastic properties of the blends were also studied. Because MF resin is a thermosetting adhesive, the effect of MF rein was shown across all thermal behaviors. The addition of PVAc reduced the curing temperature. The TGA results showed that the DTG_max temperature and thermal stability of the blends increased with increasing PVAc content. The blends were examined in non-isothermal DSC experiments at a heating rate of 10 °C/min. There was an exothermic peak in all the heating scanning curves, with each blend displaying a single curing peak temperature (T_p), intermediate between those of the two pure components and varying with the blend composition. The DMTA thermogram of MF resin showed that the storage modulus (E′) increased as the temperature was further increased as a result of the cross-linking induced by the curing reaction of the resin. E′ of MF resin increased both as a function of increasing temperature and with increasing heating rate.     

Synthesis of Heat-resistant Polymers by Thiol–Ene Reaction of N-Allylmaleimide Copolymers Using Glycoluril Crosslinkers with Rigid Molecular Structures

We carried out the thermal curing of the copolymers of N-allylmaleimide (AMI) and 2-ethylhexyl acrylate (2EHA) using 1,3,4,6-tetra(2-mercaproethyl)glycoluril ( G1 ), 1,3,4,6-tetra(3-mercaptopropyl)glycoluril ( G2 ), 1,3,4,6-tetraallylglycoluril ( G3 ), triallylisocyanurate (TAIC), and pentaerythritol tetrakis(3-mercaptobutyrate) (PEMB) as the crosslinkers. Based on the results for the analysis of thiol–ene reactions monitored by IR spectroscopy, it was confirmed that the curing rate significantly depended on the combination of the used crosslinkers. The insoluble fraction after curing was more than 90% for the systems using the glycoluril crosslinkers, while the conversion of the allyl groups was suppressed due to the rigid structure of these crosslinkers. The heat resistance and the mechanical properties of the crosslinked polymers were investigated by thermogravimetric analysis, differential scanning calorimetry, dynamic mechanical analysis, and mechanical tensile tests. For the products cured using the glycoluril crosslinkers, the glass transition temperature (T_g) and the maximum temperature of thermal decomposition (T_max) were 54–59 °C and 395–409 °C, respectively, being higher than those for the cured product prepared with PEMB and TAIC as the conventional crosslinkers. The elasticity (75–139 MPa), the maximum strength (3.0–4.1 MPa), and the adhesion strength (6.7–10.7 MPa) for the polymers cured with the glycoluril crosslinkers, determined by the mechanical tensile and single lap-shear adhesion tests, were higher than those for cured materials produced with PEMB. Thus, the thermal and mechanical properties of the maleimide copolymers were efficiently enhanced by crosslinking using the rigid glycoluril compounds. © 2020 Wiley Periodicals, Inc. J. Polym. Sci. 2020 , 58, 923–931     

An optimized preparation of bismaleimide–diamine co‐polymer matrices

The main aim of this study was to develop an improved method for the preparation of a bismaleimide–diamine (BMI/DDM) polymer matrix, achieving shorter curing time, longer processing time (pot life), and good thermal mechanical properties. A matrix of BMI/DDM thermoset was prepared at optimal conditions and formulation, containing BMI and DDM in a 2:1 mol ratio with 0.1 wt% of dicumyl peroxide (DCP) as the curing accelerator. An optimal temperature of 150°C was selected for both melt‐mixing and curing processes. The mechanism of matrix preparation was also investigated using differential scanning calorimetry and quantitative Fourier transformed infrared analysis. DCP at the optimal concentration was found to accelerate cross‐linking reactions between BMI and DDM without inhibiting the chain‐extension reaction of BMI. The specified formulation exhibited longer gel time (208 s/g) and shorter post‐curing time (2 h) compared to other formulations. In addition, thermomechanical behavior and thermal stability were analyzed by dynamic mechanical analysis and thermomechanical analysis, and thermogravimetric analysis, respectively. The storage modulus (E′), glass transition temperature (T_g), and decomposition temperature (T_d) of the BMI/DDM thermosets increased with the BMI content of the formulations, while the coefficient of thermal expansion and damping behavior (tan δ) decreased in a similar manner, primarily because of an increase in the degree of cross‐linking. Copyright © 2014 John Wiley & Sons, Ltd.     

Time-temperature transformation (TTT) cure diagram of an unsaturated polyester resin

The curing of an unsaturated polyester resin was studied by differential scanning calorimetry (DSC), thermal mechanical analysis (TMA), and Fourier-transform infrared spectroscopy (FTIR). The results are presented in the form of a time-temperature-transformation (TTT) diagram. The kinetic analysis was performed by means of the dynamic Ozawa method. This analysis was used to determine the curing times (t) at various conversions (α) and temperatures (T) (isoconversional lines ln t = A + E/RT). The equivalence of the Ozawa method and the isothermal isoconversional adjustment ln t = A + E/RT were demonstrated. The relationship between the glassy transition temperature (T_g) and the conversion α was determined by DSC. It was established that this relationship is one-to-one and independent of mass, initiation system, and curing temperature (T_c). The T_g-α relationship was adjusted using the DiBenedetto equations and heat capacity data. Using the T_g-α relationship and the isoconversional lines, the vitrification curve was determined and it was observed that the vitrification times obtained are consistent with those obtained experimentally when T_c = T_g. Gelation was determined by TMA, the material being considered gelled when it reached sufficient mechanical stability for the TMA measuring probe to become embedded in it. At that moment the conversion reached was determined by DSC. It was seen that the material always gels at constant conversion, regardless of the curing temperature. The gelation line (gel times) were traced from the corresponding isoconversional line. © 1997 John Wiley & Sons, Inc.     

Influence of fluorine on thermal properties of lead oxyfluoride glass

Oxyfluoride glasses are the basic materials for obtaining transparent glass–ceramic (TGC) which can be used in a wide range of optoelectronics devices such as: amplifiers, up-conversion, telescopes, laser sources. Oxyfluoride TGC is obtained by the control heat treatment of the parent glass due to low phonon nanocrystalline phases. The oxyfluoride glasses from the sodium–lead–silica system were the object of investigation. The influence of fluoride content on the thermal properties of glasses was analyzed. Thermal characteristics of glasses like the transition temperature T _g, the temperature for the crystallization onset T _x, and the maximum crystallization temperature T _c, thermal stability parameter were determined by DTA/DSC method. The linear expansion coefficients of oxyfluoride glasses as a function of temperature were measured using a thermo-mechanical analyzer (TMA 7 Perkin-Elmer). The effect of crystallization on the thermal expansion coefficient and softening temperature T _s was found.     

Revealing defects hampering the formation of epoxy networks with extremely high thermal properties: Theory and experiments

We present a combined experimental and theoretical investigation of thermal properties of cycloaliphatic epoxy networks. The networks are prepared from 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate ERL-4221 as a monomer and 4-methylhexahydrophthalic anhydride as a curing agent and their glass transition temperature T_g is evaluated by dynamic mechanical and thermal mechanical analyses as well as by differential scanning calorimetry. It is found that the cured epoxy networks have high T_g values reaching 233–238 °C. The method of anharmonic oscillators is first proposed to simulate the effect of network structure on the thermal properties. It suggests that further increase of T_g values is not attained because of the formation of intramolecular cyclic structures. Studies of model reaction by mass-spectrometry confirm the formation of such structures at curing.     

Synthesis, cure kinetics, and thermal properties of a novel boron–silicon hybrid polymer

A novel boron–silicon hybrid polymer (PASB) was synthesized from polycondensation between phenylboron dichloride and dichloromethylsilane with Grignard reagent. The structure of PASB was characterized using fourier transform infrared spectra, ¹H-NMR, ¹³C-NMR, and gel permeation chromatography. The curing behavior of PASB was investigated by means of non-isothermal differential scanning calorimetry and the kinetic parameters were determined by the Kissinger’s and Ozawa’s methods, respectively. The results showed that both the methods for calculating the activation energy value gave fairly close results of 104.4 and 107.7 kJ mol^?1, respectively. A reasonable curing cycle for the resin system was also established, which suggested that it was reasonable to choose a curing temperature between T _i0 (452.0 K) and T _f0 (554.0 K). These results can provide theoretical guidance reference for determining the curing of the resin system. The thermal stability of cured PASB resin was studied by means of thermogravimetric analysis under nitrogen atmosphere and the temperature of 5 % mass loss (Td₅) was 610.1 °C, the residue at 1,000 °C was 87.8 %, which showed that the cured PASB resin exhibited excellent thermal properties and made it potentially useful as high performance matrix resin and precursor for ceramics.     

Synthesis of aromatic amine curing agent containing non-coplanar rigid moieties and its curing kinetics with epoxy resin

A kind of aromatic diamine, 4′, 4″-(2, 2-diphenylethene-1, 1-diyl)dibiphenyl-4-amine (TPEDA), was successfully synthesized via Suzuki coupling reaction. The TPEDA containing nonplanar rigid moieties can be used as epoxy resins curing agent to improve the complex properties of cured composites. The curing kinetics during thermal processing of E51/TPEDA system was investigated by nonisothermal differential scanning calorimeter. The average activation energy (E _α), pre-exponential factor (lnA), and reaction order (n) calculated from the Kissinger, the Ozawa, the Friedman and the Flynn–Wall–Ozawa methods were 55.8 kJ mol^?1, 9.4 s^?1 and 1.1, respectively. By the aid of estimated kinetic parameters, the predicted heat generation vs temperature curves fit well with the experimental data, which supported the validity of the estimated parameters and the applicability of the analysis method used in this work. By the introduction of nonplanar rigid moieties, the cured epoxy resins with TPEDA exhibited a higher glass transition temperature (T _g = 258 °C), good thermal stability (≈395 °C at 10 % mass-loss), and high char yield (36.6 % at 700 °C under nitrogen) compared with conventional curing agents.     

Cationic concentration effects on electron beam cured of carbon-epoxy composites

Electron beam (e-beam) curing is a technology that offers advantages over the thermal curing process, that usually requires high temperature and are time-consuming. E-beam curing is faster and occurs at low temperatures that help reduce residual mechanical stresses in a thermoset composite. The aim of the present study is to analyze the effects of cationic initiator (diaryliodonium hexafluoroantimonate) ranged from 1 to 3 wt% in DGEBA (diglycidyl ether of bisphenol A) epoxy resin when cured by a 1.5 MeV electron beam. The specimens were cured to a total dose of 200.4 kGy for 40 min. Analyses by dynamic mechanical thermal analysis (DMTA) and differential scanning calorimetry (DSC) show that the e-beam irradiated samples with 2 wt% cationic initiator were 96% cured obtained a glass transition temperature (tan δ) of 167 °C. The same epoxy resin, thermally cured for 16 h with an anhydride hardener, reached a T_g (tan δ) of 136 °C. So, the irradiated sample had its T_g increased approximately 20% and the curing process was much less time consuming.     

Preparation and thermal degradation kinetics of terpolymer poly(?-caprolactone-co-1,2-butylene carbonate)

Poly(?-caprolactone-co-1,2-butylene carbonate) (PBCCL) was successfully synthesized via terpolymerization of carbon dioxide, 1,2-butylene oxide(BO) and ?-caprolactone (CL). A polymer-supported bimetallic complex (PBM) was used as catalyst. The influences of various reaction conditions such as reaction content, reaction time and reaction temperature on properties of terpolymers were investigated. When CL content increased, the viscosity-average molecular weights (M_v), glass transition temperature (T_g) and decomposition temperature (T_d) of PBCCL improved relative to those of poly(1,2-butylene carbonate) (PBC). Prolonging the reaction time resulted in increase in M_v and T_g. As reaction temperature increased, the molar fractions of CL (fCL) increased obviously. When the reaction temperature went beyond 80 °C, the resulting copolymers tended to be crystalline. The thermal properties and degradation behaviors of PBCCL were investigated by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The apparent activation energy and thermal degradation model of PBCCL was estimated by means of Ozawa-Flynn-Wall method and Phadnis-Deshpande method, respectively. The results showed that T_g and T_d of the terpolymer PBCCL were much higher than those of PBC. The thermal degradation behavior of PBCCL was evidenced by one-step thermal degradation profile. The average apparent activation energy is 77.06 kJ/mol, the thermal degradation kinetics follows the power law thermal decomposition model.     

Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry

We characterized the glass transition temperature T_g of thin polyimide films by temperature-dependent spectroscopic ellipsometry and compared the results to DSC measurements of the bulk polymer. The effect of the curing temperature on T_g and the thermal expansion α(T) was analyzed. An improved ellipsometric data evaluation was used to get most precise and reliable T_g data. T_g increased with increasing curing temperature, while the bulk T_g was considerably lower than the thin film T_g. Both observations are attributed to the temperature sensitive release of the imidization by-product 2-hydroxyethyl methacrylate (HEMA) and crosslinker components as well as decomposition products from the material. Variation in the curing temperatures of 230–380 °C led to an increase in the T_g of 34 °C.     

Thermal runaway reaction evaluation of two by-products mixed with cumene hydroperoxide in the oxidation tower

Oxygen (O₂) or air is widely used to produce cumene hydroperoxide (CHP) in the cumene oxidation tower. The aim of this study was applied to analyze thermal hazard of two by-products including alpha-methylstyrene (AMS) and acetophenone (AP) in a CHP oxidation tower. Differential scanning calorimetry (DSC) and thermogravimetry (TG) were operated to evaluate thermal runaway reaction of CHP mixed with AMS and AP. Exothermic onset temperature (T ₀), maximum temperature (T _max), activation energy (E _a), etc., that were employed to prevent and protect thermal runaway reaction and explosion in the manufacturing process and storage area. In view of proactive loss prevention, the inherently safer handling procedure and storage situation should be maintained in the chemical industries. The T ₀ of 30 mass% CHP was determined to be 105 °C by DSC. Therefore, the T ₀ of 30 mass% CHP mixed with AMS was determined to be 60–70 °C by DSC. The exothermic reaction of CHP/AP and CHP/AMS by DSC under N₂ reaction gas is thermal decomposition of oxygen–oxygen bond (–O–O–) because of the anaerobic reaction.     

Effects of novel reactive toughening agent on thermal stability of epoxy resin

A reactive amino-ended toughener was blended with different commercial epoxy resins namely, diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl p-aminophenol and 1,5-naphthalenediamine as curing agent. The toughener was an aromatic amino-ended copolyethersulphone (coPES):poly(ether-sulphone)–poly(etherether-sulphone). The effect of the toughener on the thermal decomposition and char oxidation behaviour of the epoxy resins was studied by the simultaneous differential thermal analysis and thermogravimetric techniques. The glass transition temperature (T _g) as well as characteristic parameters of decomposition, initial decomposition temperature (T _i) and temperature at maximum degradation rate (T _m), in both inert and oxidative environments, were determined in order to verify the influence of toughener on the thermal degradation of the different epoxy systems. It was observed that the presence of coPES maintains the high level thermal stability of the resin and that the glass transition temperature increase with the toughener percentage.