Investigation of GaN layer grown on different low misoriented sapphire by MOCVD

GaN layer on c-plane misoriented sapphire, grown by metal organic chemical vapor deposition, has been studied. It was observed that the random and non-uniform distribution of the step was caused by the step reconstruction for GaN grown on 0° sapphire by atomic force microscopy. The image quality parameter analysis of electron back-scatter diffraction indicated that the strains were reduced for GaN grown on 0.2° and 0.3° sapphire, and optical and electrical properties were improved. The electroluminescence intensity of LED grown on 0.2° and 0.3° sapphire was 2 times as that of 0° sapphire.     

AlGaN/GaN heterostructure grown on 1 -tilt sapphire substrate by MOCVD

AlGaN/GaN epitaxial layers were grown on 0^°-tilt and 1^°-tilt sapphire substrates by metalorganic chemical vapor deposition (MOCVD). With exactly the same growth conditions, it was found that dislocation density was smaller and crystal quality was better for the AlGaN/GaN epitaxial layers prepared on 1^°-tilt sapphire substrate. We also found that AlGaN/GaN epitaxial layers on 1^°-tilt sapphire substrate were grown with step growth mode while those on 0^°-tilt substrate were grown with two-dimensional island growth. From the temperature-dependent mobility, it was found that crystal quality of the AlGaN/GaN epitaxial layer prepared on 1^°-tilt sapphire substrate is better.     

Improved breakdown voltage of AlGaN/GaN HEMTs grown on Si substrates using partially Mg-doped GaN buffer layer by MOCVD

AlGaN/GaN high electron mobility transistors(HEMTs) were grown on Si substrates by MOCVD.In the HEMT structure,a 1 μm GaN buffer layer was partially doped with Mg in an attempt to increase the resistivity and minimize the buffer leakage.The AlGaN/GaN HEMTs grown on undoped and partially Mg-doped GaN buffer layers were processed and the DC characteristics of the devices were characterized for comparing the effect of Mg doping.For the device with the partially Mg-doped GaN buffer layer,a lower drain leakage current density of 55.8 nA/mm,a lower gate leakage current density of 2.73 μA/mm,and a higher off-state breakdown voltage of 104 V were achieved with device dimensions Lg/Wg/Lgs/Lgd=1/10/1/1 μm,better than the device with the undoped GaN buffer layer,which has a higher drain leakage current density of 9.2 μA/mm,a higher gate leakage current density of 91.8 μA/mm,and a lower off-state breakdown voltage of 87 V with the same device dimensions.     

The defect structure of AlGaN/GaN superlattices grown on sapphire by the MOCVD method

High-resolution x-ray diffractometry and electron microscopy are used to study the defect structure and relaxation mechanism of elastic stresses in AlGaN/GaN superlattices grown by the MOCVD method on sapphire covered with a preliminarily deposited GaN and AlGaN buffer layer. Based on an analysis of the half-widths of three-crystal scan modes of x-ray reflections measured in different diffraction geometries, the density of different dislocation families is determined. For all the dislocation families, the density is shown to increase with the Al concentration in the solid-solution layers and depend only weakly on the superlattice period. From the electron-microscopic patterns of planar and cross sections, the types of dislocations and their distribution in depth are determined. It is shown that, in addition to high-density vertical edge and screw dislocations, which nucleate in the buffer layer and propagate through the superlattice layers, there are sloped intergrowing dislocations with a large horizontal projection and bent mixed dislocations with a Burgers vector $\left\langle {11\overline 2 3} \right\rangle $ at the interface between individual superlattice layers. The former dislocations form at the interface between the buffer layer and the superlattice and remove misfit stresses between the buffer and the superlattice as a whole, and the latter dislocations favor partial relaxation of stresses between individual superlattice layers. In samples with a high Al concentration (greater than 0.4) in AlGaN layers, there are cracks surrounded by high-density chaotic horizontal dislocations.     

Microstructure of bulk GaN layer grown on sapphire substrates with amorphous buffer

The structure of bulk GaN layers grown on (0001) sapphire substrates by vapor-phase epitaxy has been studied by x-ray diffraction and transmission electron microscopy (TEM). It is found that these layers contain grown-in and screw dislocations. The dislocation density decreases away from the interface. The effect of an amorphous buffer layer on the formation of the initial GaN layer and, thus, on the degree of perfection of gallium nitride layers is elucidated. A model of generating grown-in dislocations and the relaxation mechanism of misfit stresses are proposed.     

Characterization of the N-polar GaN film grown on C-plane sapphire and misoriented C-plane sapphire substrates by MOCVD

Gallium nitride (GaN) thin film of the nitrogen polarity (N-polar) was grown on C-plane sapphire and misoriented C-plane sapphire substrates respectively by metal-organic chemical vapor deposition (MOCVD). The misorientation angle is off-axis from C-plane toward M-plane of the substrates, and the angle is 2° and 4° respectively. The nitrogen polarity was confirmed by examining the images of the scanning electron microscope before and after the wet etching in potassium hydroxide (KOH) solution. The morphology was studied by the optical microscope and atomic force microscope. The crystalline quality was characterized by the x-ray diffraction. The lateral coherence length, the tilt angle, the vertical coherence length, and the vertical lattice-strain were acquired using the pseudo-Voigt function to fit the x-ray diffraction curves and then calculating with four empirical formulae. The lateral coherence length increases with the misorientation angle, because higher step density and shorter distance between adjacent steps can lead to larger lateral coherence length. The tilt angle increases with the misorientation angle, which means that the misoriented substrate can degrade the identity of crystal orientation of the N-polar GaN film. The vertical lattice-strain decreases with the misorientation angle. The vertical coherence length does not change a lot as the misorientation angle increases and this value of all samples is close to the nominal thickness of the N-polar GaN layer. This study helps to understand the influence of the misorientation angle of misoriented C-plane sapphire on the morphology, the crystalline quality, and the microstructure of N-polar GaN films.     

Characterization and comparison between Ig(Vgs) structures HEMT AlInN/GaN and AlGaN/GaN

In this paper, we have studied the Schottky contact of two structures AlInN/GaN and AlGaN/GaN in transistors HEMTs. The current–voltage Igs(Vgs) of AlInN/GaN and AlGaN/GaN structures were investigated at room temperature. The electrical parameters such as ideality factor (2.3 and 1.96), barrier height (0.72 and 0.71 eV) and series resistance (33 and 153 $\Omega $ ) were evaluated from I–V data. The comparison of the performance of the two structures AlInN/GaN and AlGaN/GaN in transistors HEMTs have been analyzed and discussed.     

Structure and properties of ZnO films grown on Si substrates with low temperature buffer layers

Zinc oxide (ZnO) thin films were grown on Si (1 0 0) substrates by pulsed laser deposition (PLD) using two-step epitaxial growth method. Low temperature buffer layer (LTBL) was initially deposited in order to obtain high quality ZnO thin film; the as-deposited films were then annealed in air at 700 °C. The effects of LTBL and annealing treatment on the structural and luminescent properties of ZnO thin film were investigated. It was found that tensile strain was remarkably relaxed by employing LTBL and the band-gap redshifted, correspondingly. The shift value was larger than that calculated from band-gap theories. After annealing treatment, it was found that the annealing temperature with 700 °C has little influence on strains of ZnO films with LTBLs other than directly deposited film in our experiments. Interestingly, the different behaviors in terms of the shift of ultraviolet (UV) emission after annealing between films with and without buffer were observed, and a tentative explanation was given in this paper.     

GaP layers grown on GaN with and without buffer layers

The growth of GaP layer on GaN with and without buffer layers by metal-organic chemical vapour deposition (MOCVD) has been studied. Results indicate that the GaP low temperature buffer layer can provide a high density of nucleation sites for high temperature (HT) GaP growth. These sites can promote the two-dimensional (2D) growth of HT GaP and reduce the surface roughness. A GaP single crystal layer grown at 680°C is obtained using a 40-nm thick GaP buffer layer. The full-width at half-maximum (FWHM) of the (111) plane of GaP layer, measured by DCXRD, is 560 arcsec. The GaP layer grown on GaN without low temperature GaP buffer layer shows a rougher surface. However, the FWHM of the (111) plane is 408 arcsec, which is the indication of better crystal quality for the GaP layer grown on GaN without a low temperature buffer layer. Because it provides less nucleation sites grown at high growth temperature, the three-dimensional (3D) growth is prolonged. The crystalline quality of GaP is lightly improved when the surface of GaN substrate is pretreated by PH3 , while it turned to be polycrystalline when the substrate is pretreated by TEGa.     

AlGaN/GaN-based HEMT on SiC substrate for microwave characteristics using different passivation layers

In this paper, a new gate-recessed AlGaN/GaN-based high electron mobility transistor (HEMT) on SiC substrate is proposed and its DC as well as microwave characteristics are discussed for Si₃N₄ and SiO₂ passivation layers using technology computer aided design (TCAD). The two-dimensional electron gas (2DEG) transport properties are discussed by solving Schr?dinger and Poisson equations self-consistently resulting in various subbands having electron eigenvalues. From DC characteristics, the saturation drain currents are measured to be 600?mA/mm and 550?mA/mm for Si₃N₄ and SiO₂ passivation layers respectively. Apart from DC, small-signal AC analysis has been done using two-port network for various microwave parameters. The extrinsic transconductance parameters are measured to be 131.7?mS/mm at a gate voltage of V _gs?= ?0.35?V and 114.6?mS/mm at a gate voltage of V _gs?= ?0.4?V for Si₃N₄ and SiO₂ passivation layers respectively. The current gain cut-off frequencies (f _t) are measured to be 27.1?GHz and 23.97?GHz in unit-gain-point method at a gate voltage of ?0.4?V for Si₃N₄ and SiO₂ passivation layers respectively. Similarly, the power gain cut-off frequencies (f _max) are measured to be 41?GHz and 38.5?GHz in unit-gain-point method at a gate voltage of ?0.1?V for Si₃N₄ and SiO₂ passivation layers respectively. Furthermore, the maximum frequency of oscillation or unit power gain (MUG = 1) cut-off frequencies for Si₃N₄ and SiO₂ passivation layers are measured to be 32?GHz and 28?GHz respectively from MUG curves and the unit current gain, ?O?h ₂₁??O?=?1 cut-off frequencies are measured to be 140?GHz and 75?GHz for Si₃N₄ and SiO₂ passivation layers respectively from the abs ?O?h ₂₁??O curves. HEMT with Si₃N₄ passivation layer gives better results than HEMT with SiO₂ passivation layer.     

Effects of sapphire substrate annealing on ZnO epitaxial films grown by MOCVD

The annealing effects of sapphire substrate on the quality of epitaxial ZnO films grown by metalorganic chemical vapor deposition (MOCVD) were studied. The atomic steps formed on (0 0 0 1) sapphire (α-Al₂O₃) substrate surface by annealing at high temperature was analyzed by atomic force microscopy (AFM). The annealing effects of sapphire substrate on the ZnO films were examined by X-ray diffraction (XRD), AFM and photoluminescence (PL) measurements. Experimental results indicate that the film quality is strongly affected by annealing treatment of the sapphire substrate surface. The optimum annealing temperature of sapphire substrates is given.     

Investigation of hillocks formation on (1 0 0) HgCdTe layers grown by MOCVD on GaAs epi-ready substrates

In this paper we present the recent progress in the growth of (1 0 0) HgCdTe epilayers using metal organic chemical vapour deposition on GaAs epi-ready substrates. Particular progress has been achieved in the reduction of macro-defects known as “hillocks”, revealed on the surface of HgCdTe epilayers with (1 0 0) crystallographic orientation. The large-scale defects can arise from such sources as poor substrate processing, dust and remnants from previous deposition, and non optimal parameters of nucleation and growth process. In our experiment, hillocks density was decreased to <10² cm⁻² by proper choice of the growth parameters.Obtained epilayers are suitable for device fabrication. So far, significant improvements has been obtained in photoconductors operated at near-room temperatures. Devices fabricated from (1 0 0) HgCdTe have about one order of magnitude higher voltage responsivity than their (1 1 1) B counterparts.     

柱状与孔状图形衬底对MOVPE生长GaN体材料及LED器件的影响

在柱状图形蓝宝石衬底（PSS-p）和孔状图形蓝宝石衬底（PSS-h）上外延了GaN体材料和LED结构并进行了详细对比和分析.X射线衍射仪（XRD）和原子力显微镜（AFM）测试结果表明,PSS-h上体材料的晶体质量和表面形貌都优于PSS-p上体材料的特性,通过断面扫面电子显微镜（SEM）照片看出PSS-h上GaN的侧向生长是导致这种差异的原因.另外,基于PSS-p和PSS-h上外延的LED材料制作而成的器件结果表明,其20?mA下光功率水平相比普通蓝宝石衬底（CSS）分别提高了46%和33%.通过变温光荧光 关键词： 蓝宝石图形衬底 氮化镓 发光二极管 侧向生长     

Heteroepitaxy of erbium-doped silicon layers on sapphire substrates

The possibility of using sublimation molecular-beam epitaxy as an efficient method for growing erbium-doped silicon layers on sapphire substrates for optoelectronic applications is analyzed. The advantage of this method is that the erbium-doped silicon layers can be grown at relatively low temperatures. The use of sublimation molecular-beam epitaxy makes it possible to grow silicon layers of good crystal quality. It is demonstrated that the growth temperature affects not only the structure of silicon-on-sapphire layers but also the crystallographic orientation of these layers. The electrical and luminescence properties of the erbium-doped silicon layers are discussed. It is revealed that structures of this type exhibit intense erbium photoluminescence at a wavelength of 1.54 μm.     

DLTS study of n-type GaN grown by MOCVD on GaN substrates

Electron traps in n-type GaN layers grown homoepitaxially by MOCVD on free-standing GaN substrates have been characterized using DLTS for vertical Schottky diodes. Two free-standing HVPE GaN substrates (A and B), obtained from two different sources, are used. The Si-doped GaN layers with the thickness of 5 μm are grown on an area of 0.9×0.9 cm² of substrate A and on an area of 1×1 cm² of substrate B. Two traps labeled B1 and B2 are observed with trap B2 dominant in GaN on both substrates. There exist no dislocation-related traps which have been previously observed in MOCVD GaN on sapphire. This might be correlated to the reduction in dislocation density due to the homoepitaxial growth. However, it is found that there is a large variation, more than an order of magnitude, in trap B2 concentration and that the B2 spatial distributions are different between the two substrates used.     

Investigation of the vibrational modes of ZnO grown by MOCVD on different orientation planes

Wurtzite ZnO thin films were prepared on sapphire substrate by metal organic chemical vapor deposition (MOCVD). Raman scattering studies on different crystallographic textures were performed in the backscattering geometry, and polarization effect is investigated in different configurations and . ZnO Raman modes are investigated in each texture. In the case of ZnO thin film deposed on r‐() sapphire plane and using backscattering geometry, new Raman line was observed at 390 cm⁻¹ because this mode has not been noticed in this geometry. It is shown that the frequencies of the quasi‐phonon modes of the examined thin film are in good agreement with the theoretical values calculated within the framework of Loudon model. Copyright © 2014 John Wiley & Sons, Ltd.     

使用AlN/GaN超晶格势垒层生长高Al组分AlGaN/GaN HEMT结构

在蓝宝石衬底上生长了以AlN/GaN超晶格准AlGaN合金作为势垒的HEMT结构材料,并与传统AlGaN合金势垒样品进行了对比.在高Al组分(≥40%)情况下,超晶格势垒样品的表面形貌明显改进,电学性能特别是2DEG面电子浓度也有所改进.对超晶格势垒生长参数进行了初步优化,使得HEMT结构薄层电阻进一步降低,最后获得了251 Ω/□的薄层电阻. 关键词： AlGaN/GaN 结构 AlN/GaN超晶格 二维电子气 高电子迁移率晶体管     

Structural and optical characterisation of InN layers grown by MOCVD

In the following, we report investigations of the dependencies of the structural, optical and electrical characteristics of InN thin films grown by MOCVD on the growth temperature. The layer thicknesses range from 70 to 400 nm. Their carrier concentrations range from 7×10¹⁸ to 4×10¹⁹ cm⁻³. Hall mobility values from 150 to 1300 cm²/V/s were determined in these films. The variation of the growth temperature and V/III ratio brought about different growth modes and rates. Using TEM, in addition to measuring layer thickness, we also determined the growth mode along with the structural quality of the InN layers. The surface roughness was obtained from AFM measurements. The layer crystalline quality was also investigated by means of X-ray diffraction in the rocking mode. Photoluminescence measurements performed at room temperature and at 7 K gave emission at around 0.7 eV.