高气压下微晶硅薄膜的生长及微结构研究

通过射频等离子体增强化学气相沉积,在高气压条件下制备了微晶硅薄膜,并用拉曼光谱仪(Ram an)、扫描电镜(SEM)研究了微晶硅薄膜的微观结构。发现沉积速率在5Torr左右出现极大值,薄膜的晶化率随着沉积气压的升高而降低,薄膜表面的晶粒或团簇随着沉积气压的下降而增大,薄膜的粗糙度随着沉积气压的升高而降低。     

射频功率对Si薄膜微观结构及电学性能的影响

采用等离子体增强化学气相沉积(PECVD)法制备了不同射频功率的Si薄膜,并对其进行真空退火处理.研究了射频功率和退火处理对薄膜微观结构和电学性能的影响,并总结了不同电场环境对薄膜原子排列有序度的影响规律.结果表明:随射频功率的增加,Si薄膜的非晶结构无实质改变,但其少子寿命明显增强;经800℃真空退火处理后,Si薄膜的微观结构均由非晶态转变为晶态,晶化程度达60;以上,且少子寿命达到20 μs以上.     

沉积温度对电沉积PbS薄膜结构和性能的影响

采用电沉积法在ITO导电玻璃表面沉积了PbS薄膜,并用X射线衍射仪(XRD)、原子力显微镜(AFM)以及傅立叶变换红外光谱仪(FT-IR)对薄膜的结构和光学性能进行了表征,研究了沉积温度对薄膜的相组成、显微形貌以及光学性质的影响.结果表明:在U=3 V,pH=2.5,T=60 ℃,沉积时间为20 min,加入EDTA作络合剂的情况下,可制备出沿(111)和(200)晶面取向生长的立方相PbS薄膜.薄膜显微结构均匀而致密,随着反应温度从20 ℃增加到60 ℃,薄膜内的压应力逐渐减小,禁带宽度也随着变小.所制备的微晶PbS薄膜的禁带宽度约为0.39 eV.     

采用两步压强法制备优质微晶硅薄膜

针对氢化微晶硅薄膜吸收系数较低、制备需要较高厚度,从而需要较高沉积速度的问题,考虑到压强对沉积速度及晶化比的重要影响,在分析了单一压强法制备薄膜优缺点的基础上,提出了采用两步法来制备高质量微晶硅薄膜的方法.即先采用高压制备薄膜2min,减小非晶转微晶的孵化层厚度,然后再采用低压制备薄膜18min,提高薄膜的致密度及减小氧含量,最后制备出了光敏性较高,晶化比较大并且光照稳定性也较好的优质氢化微晶硅薄膜.     

氨气流量对富硅SiNx薄膜结构及其光学特性的影响

采用等离子体增强化学气相沉积技术,以NH3、SiH4和N2为反应气体制备富硅-氮化硅薄膜.在优化了其它沉积参数条件下,研究氨气流量对富硅-氮化硅薄膜的结构和光学性质的影响.利用傅立叶变换红外光谱、紫外可见光谱和X射线衍射谱分析了薄膜的键合情况、带隙结构.结果表明,随着NH3流量的增大,薄膜中的Si-N键和N-H键增强,Si-H键减小并向高波数方向移动,薄膜逐渐由非晶SiNx相向小晶粒Si3 N4相转变.同时随着NH3流量的增大,薄膜的光学带隙逐渐展宽,微观结构的有序度降低.XRD图谱分析表明薄膜内的平均晶粒尺寸也随着氨气流量的增加而在逐渐增大.结合以上结果分析,适当增加NH3流量有助于薄膜由非晶SiNx向包含小晶粒的Si3 N4转变.     

pH值对电沉积PbS薄膜结构和性能的影响

采用阴极恒电压法在ITO导电玻璃表面沉积了PbS薄膜,并用X射线衍射仪(XRD)、原子力显微镜(AFM)以及傅立叶变换红外光谱仪(FT-IR)对薄膜的结构和光学性能进行了表征,研究了沉积液pH值对薄膜的相组成、显微形貌以及光学性质的影响.结果表明:在U=3 V,pH=2.4,沉积时间为20 min,加入EDTA作络合剂的情况下,可制备出沿(111)和(200)晶面取向生长的立方相PbS薄膜.薄膜均匀而致密,随pH值增加,薄膜的压应力及禁带宽度呈现先减小后增大的变化趋势.所制备的微晶PbS薄膜的禁带宽度约为0.38～0.39 eV.     

用于HIT太阳能电池的非晶硅薄膜制备与性能研究

采用射频等离子体增强化学气相沉积技术(RF-PECVD),在不同硅烷浓度下制备本征非晶硅薄膜,研究薄膜材料的微结构和光电性能.研究表明,在硅烷浓度为5;时,制备的薄膜材料处于非晶/微晶相过渡区域,具有宽光学带隙、低吸收系数、较高电导率和较好的致密性.作为钝化层应用到HIT太阳电池中,具有良好的钝化效果,在n型单晶硅衬底上制备出了效率为13.92;的太阳电池.     

沉积时间对电沉积ZnS薄膜的影响

采用阴极恒电位法在氧化锡铟导电玻璃(ITO)基板上电沉积了ZnS薄膜,用X射线衍射仪(XRD)、原子力显微镜(AFM)和紫外/可见/近红外吸收光谱仪(UV-VIS-NIR)对薄膜的物相结构,微观形貌和光学性能进行了表征,研究了沉积时间对薄膜的结构以及光学性能的影响。研究结果表明:当沉积时间为6min时,可以得到表面均匀而致密的ZnS薄膜,在500～1000nm波长范围内的薄膜透过率约为40%～60%。随着沉积时间的增加,ZnS薄膜的结晶程度、微观形貌均有所改善,但当沉积时间达到或超过8min时,薄膜的结构和性能又有所下降。     

硫化时间对CuInS2薄膜微结构的影响

采用磁控溅射技术在镀Mo玻璃基片上沉积Cu-In金属预制膜后在N2气氛下硫化制备CuInS2薄膜。研究热处理硫化时间对CuInS2薄膜的表面形貌和晶相结构性能的影响。利用场发射扫描电镜(FE-SEM)、X射线衍射(XRD)和Raman光谱等测试手段对薄膜的表面形貌和晶相结构进行表征。实验结果表明,采用磁控溅射金属预制膜经适当的时间硫化所制备的CuInS2薄膜为黄铜矿结构,随着硫化时间的增加,CuInS2薄膜的晶粒的形貌由球形结构向片状结构转化,并且硫化时间越长,所得薄膜的结晶性能越好,但过长的硫化时间会生成Cu-Au相而导致薄膜质量的劣化。     

VHF-PECVD制备微晶硅薄膜及其微结构表征研究

采用VHF-PECVD技术制备了系列不同衬底温度的硅薄膜.运用微区拉曼散射(Micro-Raman)和X射线衍射(XRD)对薄膜进行了结构方面的测试分析.Micro-Raman测试结果表明:随衬底温度的升高,薄膜逐渐由非晶向微晶过渡,晶化率(Xc)逐渐增大.XRD的结果显示样品的择优取向随衬底温度的升高而变化,(220)方向计算得出样品的晶粒尺寸逐渐变大.     

利用快速热退火法制备多晶硅薄膜

为了制备优质的多晶硅薄膜,该论文研究了非晶硅薄膜的快速热退火(RTA)技术.先利用PECVD设备沉积非晶硅薄膜,然后把其放入快速热退火炉中进行退火.退火前后的薄膜利用X射线衍射(XRD)仪、Raman光谱仪及扫描电子显微镜(SEM)测试其晶体结构及表面形貌,利用电导率测试设备测试其暗电导率.研究表明退火温度、退火时间以及沉积时的衬底温度对非晶硅薄膜的晶化都有很大的影响.     

Synthesis of polycrystalline silicon thin films with ‘icosahedral’ symmetry by ceramics hot wire chemical vapor deposition

We report on synthesis and materials physics of polycrystalline silicon thin films deposited on glass with rarely observed ‘five-fold’ symmetry or ‘icosahedral’ symmetry. We invented these ‘novel form’ of polycrystalline silicon thin films by ceramics hot wire chemical vapor deposition (hot-wire CVD). A new physical effect in hot-wire CVD technology has been proposed that controls the nucleation and growth of silicon thin films on glass substrate.     

Low temperature plasma deposition of silicon thin films: From amorphous to crystalline

We report on the epitaxial growth of crystalline silicon films on (100) oriented crystalline silicon substrates by standard plasma enhanced chemical vapor deposition at 175 °C. Such unexpected epitaxial growth is discussed in the context of deposition processes of silicon thin films, based on silicon radicals and nanocrystals. Our results are supported by previous studies on plasma synthesis of silicon nanocrystals and point toward silicon nanocrystals being the most plausible building blocks for such epitaxial growth. The results lay the basis of a new approach for the obtaining of crystalline silicon thin films and open the path for transferring those epitaxial layers from c-Si wafers to low cost foreign substrates.     

纯化器对VHF-PECVD制备的不同结构硅薄膜特性的影响

本文采用VHF-PECVD技术制备了不同结构的硅薄膜,分析研究了有、无纯化器对制备薄膜特性的影响.电学特性和结构特性测试结果表明:在10W的功率条件下,使用纯化器时制备的薄膜是光敏性满足非晶硅电池要求的材料,而在不使用纯化器时制备的材料是适用于太阳能电池有源层的纳米硅材料;在30W时,不使用纯化器制备薄膜的晶化明显增大,光敏性也相应的降低,50W的条件表现出相类似的结果,初步分析是氧引起的差别;激活能的测试结果也表明,使用纯化器会降低材料中的氧含量,即表现激活能相对大;另外,沉积速率的测试结果也给出:耗尽区所在位置与是否使用纯化器有很大关系.     

Effect of oxygen content on barrier properties of silicon oxide thin film deposited by dual ion-beam sputtering

A silicon oxide thin film barrier was prepared with various oxygen contents and its chemical composition, surface morphology and optical and barrier properties were related to the deposition conditions used. Our study showed that under Ar and O₂ assisted process conditions, a stoichiometric silicon oxide thin film formed at a critical oxygen content during deposition of 40-50%. The thin films deposited at the critical condition showed the lowest surface roughness giving similar or higher optical transmittance than that of the bare polycarbonate (PC) substrate. The boiling and tensile strength test performed on the thin film deposited with assisted ions before the deposition process showed improvement in the adhesion between the oxide layer and the polymer substrate. In addition, interface modification to improve for improving the barrier layer properties of the silicon oxide thin film was achieved through the introduction of dual ion beam sputtering without pre-treatment.     

PECVD法制备不同衬底微晶硅薄膜的研究

采用等离子体增强化学气相沉积(PECVD)法分别在玻璃衬底和p型薄膜硅衬底上制备了微晶硅薄膜。使用拉曼谱仪、紫外-可见分光光度计、傅里叶红外光谱仪等对微晶硅薄膜进行检测,重点研究了硅烷浓度、衬底温度对薄膜沉积速率和晶化率的影响。实验结果表明:两种衬底上薄膜的沉积速率均随硅烷浓度的增大、衬底温度的升高而变大。硅烷浓度对两种衬底的薄膜晶化率影响规律相同,即均随其升高而降低;但两种衬底的衬底温度影响规律存在差别:对玻璃衬底而言,温度升高,样品晶化率减小;而p型薄膜硅衬底则在温度升高时,样品晶化率先增大后减小。此外还发现,晶化率与薄膜光学性能及含氧量存在较密切关联。     

高压13.56MHz PECVD法沉积器件质量级本征微晶硅材料

本文国内首次报道了采用高压RF-PECVD技术沉积本征微晶硅材料的结果.实验表明,增大等离子体激发功率和减小硅烷浓度都能够使薄膜材料由非晶硅逐渐向微晶硅转变,而结构上的改变使得电学特性也随之改变.通过工艺参数的优化和纯化器的使用,有效地控制了氧的掺杂,在较高的生长速度下得到了器件质量级的本征微晶硅材料.将实验得到的微晶硅作为太阳电池光吸收层,在没有ZnO背电极和没有优化窗口层材料以及p/i界面时,电池的效率达到5.22;,这进一步表明本征微晶硅材料的良好性能.     

The effects of annealing temperature on photoluminescence of silicon nanoparticles embedded in SiNx matrix

The effects of the annealing temperature on photoluminescence (PL) of non-stoichiometric silicon nitride (SiN_x) thin films deposited by plasma enhanced chemical vapor deposition (PECVD) using ammonia and silane mixtures at 200 °C were investigated. The optical property and the chemical composition of the films annealed at different temperatures were investigated by PL spectroscopy and Fourier transform infrared absorption spectroscopy (FTIR), respectively. Based on the PL results and the analyses of the bonding configurations of the films, the light emission is attributed to the quantum confinement effect of the carriers inside silicon nanoparticles and radiative defect-related states. These results provide a better understanding of optical properties of silicon nanoparticles embedded in silicon nitride films and are useful for the application of nanosize silicon semiconductor material.     

Characterization of HF-PECVD a-Si:H thin film solar cells by using OES studies

Hydrogenated amorphous silicon (a-Si:H) films show considerable potential for the fabrication of thin film solar cells. In this study, the a-Si:H thin films have been deposited in a parallel-plate radio frequency (RF) plasma reactor fed with pure SiH₄. The plasma diagnostics were performed simultaneously during the a-Si:H solar cell deposition process using an optical emission spectrometer (OES) in order to study their correlations with growth rate and microstructure of the films. During the deposition, the emitting species (SiH*, Si*, H*) was analyzed. The effect of RF power on the emission intensities of excited SiH, Si and H on the film growth rate has been investigated. The OES analysis revealed a chemisorption-based deposition model of the growth mechanism. Finally, the a-Si:H thin film solar cell with an efficiency of 7.6% has been obtained.