Behavior of implanted hydrogen in thermally stimulated blistering in silicon

The processes of accumulation of ion implanted hydrogen in blisters in silicon and its release during the thermal treatment from 350 to 1020?°C have been studied by optical techniques. It was established that accumulation of gaseous hydrogen inside blisters takes place at temperatures lower than ～450–500?°C and is accompanied by the growth of blister thickness and deformation of their caps. At higher temperatures the gaseous hydrogen goes out of the cavities dissolving in silicon. Due to the internal pressure dropping the elastically deformed top layer partially relaxes and the blister thickness decreases. Etching of the surface layer reveals the agglomerations of small voids (<0.3?mm) located in the place of blisters approximately at their depth. Proceeding from the fact that the processes in blistering are similar to those in ion cut, the following conclusions with respect to the latter were drawn. The exfoliation processes themselves occur at temperatures lower than ～500?°C. The exfoliation efficiency particularly at the higher temperatures is essentially dependent on the heating rate.     

Channeling study of boron implanted silicon: Liquid nitrogen temperature implantation

Silicon samples have been boron implanted at 150 keV at liquid nitrogen temperature to a dose of 3.6 × 10¹⁵/cm². This dose rendered the implanted layer amorphous as viewed by helium ion backscattering. Four kinds of room temperature measurements were made on the same set of samples as a function of the isochronal annealing temperature. The measurements made were the determination of the substitutional boron content by the channeling technique using the B¹¹(p, α) nuclear reaction, observation of the disorder by helium ion backscattering, determination of the carrier concentration by van der Pauw Hall measurements, and the sheet resistivity by four point probe measurements. These measurements are compared with results from samples implanted at room temperature. The carrier concentration correlates well with the substitutional boron content for both room temperature and liquid nitrogen temperature implantations. Following annealing temperatures in the 600 to 800°C range, a much larger percentage of the boron lies on substitutional lattice sites, and therefore the carrier concentration is larger, if the implantation is done at liquid nitrogen temperature rather than at room temperature. Following liquid nitrogen temperature implantation, reverse annealing is observed from 600 to 800°C in the substitutional boron content, carrier concentration and sheet resistivity. The boron is more than 90 per cent substitutional after annealing to 1100°C for both the room temperature and liquid nitrogen temperature implantations. The low temperature implantation produced a buried amorphous layer, and this layer was observed to regrow from both the surface and substrate sides at approximately equal rates.     

Electrical characterization of rare-earth implanted GaN

Deep-level transient spectroscopy (DLTS) measurements were used to characterize the electrical properties of MOCVD grown, europium- (Eu) and xenon- (Xe) implanted GaN films on sapphire substrates. Implantation energy was 80 keV with a fluence of 1×10¹⁴ cm⁻² along a channeled crystallographic direction. Defect levels were observed at E_C−0.19 eV for both Eu- and Xe-implantation which were predicted to be a rare-earth related donor level by theoretical calculations. Other defect levels are observed with energy levels located at 0.22, 0.68, 0.49, 0.60, 0.77 eV and 0.48, 0.64, 0.45, 0.72 eV below the conduction band for Eu and Xe implantation, respectively. Some of these levels have similar defect signatures and can be related to other implantation related defects introduced in erbium, praseodymium and helium implantations.     

Investigation of helium implantation induced blistering in InP

 Four-inch InP wafers were implanted with 100 keV helium ions with a dose of 5×10¹⁶ cm⁻² and subsequently annealed in air in the temperature range of 225-400°C in order to determine the blistering kinetics of these wafers. An Arrhenius plot of the blistering time as a function of reciprocal temperature revealed two different activation energies for the formation of surface blisters in InP. The activation energy was found to be 0.30 eV in the higher temperature regime of 300-400 °C and 0.74 eV in the lower temperature regime of 225-300 °C. The implantation induced damage was analyzed by cross-sectional transmission electron microscopy, which revealed a band of defects extending from 400-700 nm from the surface of InP. The damage band was found to be decorated with a large number of nanovoids having diameters between 2 and 5 nm. These nanovoids served as precursors for the formation of microcracks inside InP upon annealing, which led to the formation of surface blisters.     

Properties investigation of GaN films implanted by Sm ions under different implantation and annealing conditions

GaN films grown by MOCVD were implanted by Sm ions under different implantation and annealing conditions, in order to optimize the implantation parameters. The structural and magnetic measurements indicated a reduction of defect concentration and an increase of saturation magnetization when samples were implanted at 400°C, most probably due to the increased substitutional fraction of Sm ions. While the subsequent annealing process further decreased the damage in GaN lattice, but reduced the saturation magnetization on the contrary, caused by the decomposition of the surface layer and the formation of Sm-defect complexes during high-temperature annealing.     

Effect of hydrogen defects on nanocrystallite layers of Si solar cells by hydrogen implantation

The Si solar cells were irradiated with high energy hydrogen ions of 10, 30, 60 and 120?keV at the dose rate of 10¹⁷ H⁺ ions (proton)/cm². The structural, optical and electrical properties of the implanted samples and fabricated cells were studied. The implantation induced defects bringing structural changes before and after annealing was evidenced by the transmission electron microscopy. The Raman spectrum showed a change of crystalline to amorphous state at 480?cm^?1 when the sample was implanted by hydrogen ion of 30?keV energy. Formation of nanocrystallite layers were observed after annealing. The electroluminescence images showed that hydrogen-related defect centers were involved in the emission mechanism. The photoluminescence emission from the implanted cells was attributed to nanocrystallite layers. From current–voltage measurements, the conversion efficiencies of implanted Si solar cells were found lower than the un-implanted reference cell. The ion implantation did not passivate the defects rather acted as recombination centers.     

Effect of hydrogen introduced by channelling implantation on the microstructures in silicon wafers

High-resolution transmission electron microscopy has been employed to study the platelet defects before annealing and the extended defects generated by annealing in the channelling-implanted silicon wafers. It has been found that there apparently appear platelet defects of quite great size and spacing at the maximum projected range of ions (R _max). Additionally, the cracks induced by annealing at 550 °C are generated around R _max instead of the average projected range of ions (R _p) as it is in the non-channelling-implanted samples. Moreover, after annealing at 1000 °C, cracks without branches and cavities arranging in a single array, different from the forked cracks and cavities arranged in several arrays in the non-channelling-implanted samples, are observed in the channelling-implanted silicon wafers. It is suggested that those special microstructure characteristics are ascribed to the channelling effect of implanted hydrogen ions.     

Effect of high temperature annealing on strain and band gap of GaN nanoparticles

Black-coloured GaN nanoparticles with an average grain size of 50 nm have been obtained by annealing GaN nanoparticles under flowing nitrogen at 1200 oC for 30 min. XRD measurement result indicates an increase in the lattice parameter of the GaN nanoparticles annealed at 1200 oC, and HRTEM image shows that the increase cannot be ascribed to other ions in the interstitial positions. If the as-synthesised GaN nanoparticles at 950 oC are regarded as standard, the thermal expansion changes nonlinearly with temperature and is anisotropic; the expansion below 1000oC is smaller than that above 1000 oC. This study provides an experimental demonstration for selecting the proper annealing temperature of GaN. In addition, a large blueshift in optical bandgap of the annealed GaN nanoparticles at 1200 oC is observed, which can be ascribed to the dominant transitions from the C(Γ₇) with the peak energy at 3.532 eV.     

Effect of high temperature band gap of GaN annealing on strain and nanoparticles

<正>Black-coloured GaN nanoparticles with an average grain size of 50 nm have been obtained by annealing GaN nanoparticles under flowing nitrogen at 1200℃for 30 min.XRD measurement result indicates an increase in the lattice parameter of the GaN nanoparticles annealed at 1200℃,and HRTEM image shows that the increase cannot be ascribed to other ions in the interstitial positions.If the as-synthesised GaN nanoparticles at 950℃are regarded as standard,the thermal expansion changes nonlinearly with temperature and is anisotropic;the expansion below 1000℃is smaller than that above 1000℃.This study provides an experimental demonstration for selecting the proper annealing temperature of GaN.In addition,a large blueshift in optical bandgap of the annealed GaN nanoparticles at 1200℃is observed,which can be ascribed to the dominant transitions from the C（Γ₇） with the peak energy at 3.532 eV.     

Structural modifications of GaN after cerium implantation

Among the family of rare earth (RE) dopants, the doping of first member Ce into GaN is the least studied system. This article reports structure properties of Ce‐doped GaN realized by technique of ion implantation. Ce ions were implanted into metal organic chemical vapor deposition grown n‐ and p‐GaN/sapphire thin films at doses 3 × 10¹⁴ and 2 × 10¹⁵ cm⁻². X‐ray diffraction scans and Raman scattering measurements exhibited expansion of lattice in the implanted portion of the samples. First order Raman scattering spectra show appearance of several disorder‐activated Raman scattering modes in addition to typical GaN features. A dose‐dependent decrease in intensity of E₂ mode was observed in Raman the spectra of the implanted samples. Ultraviolet Raman spectra of implanted samples show complete quenching of photoluminescence emission and appearance of multiple A₁(LO) phonon scattering modes up to fifth order. Moreover, a decrease in intensity and an increase in line width of LO modes as a function of wavenumber were observed for implanted samples. Copyright © 2012 John Wiley & Sons, Ltd.     

Synthesis of GaN phase by ion implantation

GaN phase is synthesized using systemic implantation of nitrogen ions of multiple energies (290, 130 and 50 keV) into Zn-doped GaAs (1 0 0) at room temperature and subsequent annealing at 850 °C for 30 min in Ar + H₂ atmosphere. The implanted doses of nitrogen ions are 5 × 10¹⁶ and 1 × 10¹⁷ ions-cm⁻². Glancing angle X-ray diffraction studies show that hexagonal phase of GaN were formed. The photoluminescence studies show the emission from the band edge as well as from point defects.     

Effects of different ions implantation on yellow luminescence from GaN

The influence of C, N, O, Mg, Si and co-implants (Mg+Si) ions implantation with fluences in the wide range 10¹³-10¹⁷ cm⁻² on the yellow luminescence (YL) properties of wurtzite GaN has been studied by photoluminescence (PL) spectroscopy. Two types of n-type GaN samples grown by metal-organic chemical vapor deposition method (MOCVD) and labeled as No-1 and No-2 were studied. In their as-grown states, No-1 samples had strong YL, while No-2 samples had weak YL. Results of the frontside and backside PL measurements in one of the as-grown GaN epifilms are also presented. Comparing the intensity of YL between frontside and backside PL spectra, the backside PL spectrum shows the more intense YL intensity. This implies that most of the intrinsic defects giving rise to YL exist mainly near the interface between the epilayer and buffer layer. Our experimental results show that the intensity ratio of YL to near-band-edge UV emission (I_YL/I_UV) decreases gradually by increasing the C implantation fluence from 10¹³ to 10¹⁶ cm⁻² for No-1 samples after annealing at 900 °C. When the fluence is 10¹⁷ cm⁻², a distinct change of the I_YL/I_UV is observed, which is strongly increased after annealing. For No-2 samples, after annealing the I_YL/I_UV decreases gradually with increase in the C implantation fluence from 10¹³ to 10¹⁵ cm⁻². The I_YL/I_UV is gradually increased with increasing C fluence from 10¹⁶ to 10¹⁷ cm⁻² after annealing, while I_YL/I_UV for other ions-implanted GaN samples decreases monotonically with increase in the ions implantation fluences from 10¹³ to 10¹⁷ cm⁻² for both No-1 samples and No-2 samples. It is noted that for annealed C-implanted No-2 samples I_YL/I_UV is much higher than that of the as-grown one and other ion-implanted ones. In addition, I_YL/I_UV for the Mg, Si, and co-implants (Mg+Si) implanted No-2 samples with a fluence of 10¹³ cm⁻² after being annealed at 900 °C is higher than that of the as-grown one. Based on our experimental data and literature results reported previously, the origins of the YL band have been discussed.     

Effect of reaction temperature on morphology and electrochemical behavior

LiCoO₂ and LiMn₂O₄ compounds were synthesized using two different methods, viz., low-temperature-aided hydrothermal and high-temperature-assisted co-precipitation method. Keeping the reaction parameters such as type of precursors chosen and the medium of reaction as same for both the hydrothermal and co-precipitation methods, the effect of temperature in producing LiCoO₂ and LiMn₂O₄ with varying physical as well as electrochemical properties has been studied. As expected, the effect of low-temperature-involved hydrothermal method rendered finer particles of nanocrystalline nature with minimum strain, and the high-temperature synthesis of co-precipitation method produced slightly enhanced particle size with an increased strain value. The effect of size-grown particles resulting from co-precipitation method exhibited inferior electrochemical properties such as increasing resistance of the cell upon cycling and a significant decline in capacity behavior, irrespective of LiCoO₂ or LiMn₂O₄ cathodes. On the other hand, hydrothermal synthesis of LiCoO₂ and LiMn₂O₄ has exhibited acceptable specific capacity with an admissible capacity fade behavior and negligible internal resistance of the cell, thus qualifying the same as better-performing cathodes. Hence, the effect of low temperature in producing LiCoO₂ and LiMn₂O₄ cathodes with facile intercalation and de-intercalation of lithium is demonstrated.     

Effect of anode area on the sensing mechanism of vertical GaN Schottky barrier diode temperature sensor

Effect of anode area on temperature sensing ability is investigated for a vertical GaN Schottky-barrier-diode sensor. The current-voltage-temperature characteristics are comparable to each other for Schottky barrier diodes with different anode areas, excepting the series resistance. In the sub-threshold region, the contribution of series resistance on the sensitivity can be ignored due to the relatively small current. The sensitivity is dominated by the current density. A large anode area is helpful for enhancing the sensitivity at the same current level. In the fully turn-on region, the contribution of series resistance dominates the sensitivity. Unfortunately, a large series resistance degrades the temperature error and linearity, implying that a larger anode area will help to decrease the series resistance and to improve the sensing ability.     

Effect of nitrogen gas flow and growth temperature on extension of GaN layer on Si

The effect of nitrogen flow and growth temperature on extension of GaN on Si substrate has been studied. By increasing the nitrogen flow whose outlet is located in the center of the MOCVD (metal-organic chemical vapor deposition) gas/particle screening flange and by increasing the growth temperature of HT-AlN and AlGaN buffer layers near the primary flat of the wafer, the GaN layer has extended more adequately on Si substrate. In the meantime, the surface morphology has been greatly improved. Both the AlN and GaN crystal quality uniformity has been improved. X-ray diffraction results showed that the GaN (0002) XRD FWHMs (full width at half maximum) decreased from 579 arcsec～ 1655 arcsec to around 420 arcsec.     

X-ray reflectivity study of hydrogen implanted silicon

The X-ray reflectivity (XRR) technique was used to study monocrystalline silicon samples implanted with H₂ ions at an energy of 31 keV and to the dose of 2 × 10¹⁶ hydrogen atoms/cm². All samples were subsequently isochronally annealed in vacuum at different temperatures in the range from 100 to 900 °C. Although the hydrogen depth distribution was expected to be smooth initially, fringes in the XRR spectra were observed already in the implanted but not annealed sample, revealing the presence of a well-defined film-like structure. Annealing enhances the film top to bottom interface correlation due to structural relaxation, resulting in the appearance of fringes in the larger angular range, already at low annealing temperatures. The thickness of the film decreases slowly up to 350 °C where substantial changes in the roughness are observed, probably due to the onset of larger clusters formation. Further annealing at higher temperatures restores the high correlation of the film interfaces, while the thickness decreases with the temperature more rapidly.     

Influence of ammoniating temperature on Co-catalyzed GaN nanowires

GaN nanowires (NWS) were synthesized at different temperatures by ammoniating Ga₂O₃/Co films deposited on Si (111) substrate. X-ray diffraction (XRD), scanning electron microscopy (SEM), high resolution transmission electron microscope (HRTEM), Fourier transformed infrared spectra (FTIR) and photoluminence (PL) spectra were used to characterize the influences of the ammoniating temperature on the morphology, crystallinity and optical properties of GaN NWS. Our results indicate that the samples are all of wurtzite structure and also show that the GaN NWS ammoniated at 950 °C have the best morphology and crystallinity with a single-crystalline structure, and at this temperature the PL spectrum with the strongest ultraviolet (UV) peak is observed. PACS 61.46.-w; 71.55.Eq; 81.15.Cd; 81.07.-b; 61.10.Nz     

The effects of hydrogen dose and thermal treatment on the formation of microsplits in hydrogen implanted GaAs

Transmission electron microscopy has been used to study the effect of thermal treatment on the formation of microsplits and damage rafts in hydrogen implanted (1 × 10¹⁶ and 5 × 10¹⁶ H⁺ cm^-2) and annealed (700 and 800°C) GaAs. The results show that microsplit and damage raft formation in implanted samples may be prevented if the samples are first given a pre-anneal heat treatment for 15 minute intervals at 300, 350, 400 and 450°C, during which the hydrogen concentration is reduced without allowing vacancy coalescence to take place.     

还原温度对氧化石墨烯结构及室温下H_2敏感性能的影响

以氧化石墨凝胶制备的氧化石墨烯(GO)溶胶为前驱体,在100—350℃温度下还原获得不同还原程度的还原氧化石墨烯(rGO)样品,并采用旋涂工艺制备还原氧化石墨烯气敏薄膜元件.采用X射线衍射、拉曼光谱、傅里叶变换红外光谱和气敏测试等手段研究还原温度对样品结构、官能团和气敏性能的影响.结果表明:经热还原处理的氧化石墨烯结构向较为有序的类石墨结构转变,还原温度为200℃时,样品处于GO向rGO转变的过渡阶段,还原温度达到250℃时,则表现出还原氧化石墨烯特性;无序程度随还原温度的升高先由0.85增大至1.59,随后减小至1.41,总体呈现增加趋势;氧化石墨烯表面含氧官能团随还原温度的升高逐渐热解失去,不同含氧官能团的失去温度范围不同;热还原氧化石墨烯具有优异的室温H_2敏感性能,随着还原温度的升高,元件灵敏度逐渐减小,响应-恢复时间逐渐增大,最佳灵敏度为88.56%,响应时间为30 s.