A 20-Gb/s 1:2 demultiplexer in 0.18-μm CMOS

A 1:2 demultiplexer (DEMUX) has been designed and fabricated in SMIC's standard 0.18-μm CMOS technology, based on standard CML logic and current-density-centric design philosophy. For the integrity of the DEMUX and the reliability of the internal operations, a data input buffer and a static latch were adopted. At the same time, the static latch enables the IC to work in a broader data rate range than the dynamic latch. Measurement results show that under a 1.8-V supply voltage, the DEMUX can operate reliably at any data rate in the range of 5-20 Gb/s. The chip size is 875 × 640 μm2 and the power consumption is 144 mW, in which the core circuit has a share of less than 28%.     

A 2.5-Gb/s fully-integrated,low-power clock and recovery circuit in 0.18-μm CMOS

Based on the devised system-level design methodology,a 2.5-Gb/s monolithic bang-bang phase-locked clock and data recovery(CDR) circuit has been designed and fabricated in SMIC's 0.18-μm CMOS technology.The Pottb(a|¨)cker phase frequency detector and a differential 4-stage inductorless ring VCO are adopted,where an additional current source is added to the VCO cell to improve the linearity of the VCO characteristic.The CDR has an active area of 340×440μm~2,and consumes a power of only about 60 mW from a 1...     

80 Gb/s 2 ： 1 multiplexer in 0.13-μm SiGe BiCMOS technology

This work presents an ultra-high speed 2 ： 1 multiplexer （MUX） in a SiGe BiCMOS technology with fT = 103 GHz. To boost the operating speed, the system scheme is optimized including a 2 ： 1 selector circuit directly driving an external 50 Ω load, and two wide-band data buffers and one clock buffer in the input stage. The chip exhibited an open eye at 80 Gb/s with a 160 mV single-ended voltage swing.     

20Gb/s 1∶2 Demultiplexer in 0.18μm CMOS

使用标准0.18μm CMOS工艺设计并实现了1:2分接器.核心电路单元采用一种新的高速、低电压锁存器结构实现.与传统的源极耦合场效应管逻辑结构的锁存器相比,其电源电压更低且速度更快.此外,为了拓展带宽,在缓冲放大电路中采用了负反馈.测试结果表明芯片可以工作于20Gb/s数据速率下.电源电压为1.8V时,包括缓冲电路在内整个芯片的工作电流为72mA.     

A 6.25 Gb/s equalizer in 0.18μm CMOS technology for high-speed SerDes

This paper presents a 0.18μm CMOS 6.25 Gb/s equalizer for high speed backplane communication. The proposed equalizer is a combined one consisting of a one-tap feed-forward equalizer （FFE） and a two-tap half-rate decision feedback equalizer （DFE） in order to cancel both pre-cursor and post-cursor ISI. By employing an active-inductive peaking circuit for the delay line, the bandwidth of the FFE is increased and the area cost is minimized. CML-based circuits such as DFFs, summers and multiplexes all help to improve the speed of DFEs. Measurement results illustrate that the equalizer operates well when equalizing 6.25 Gb/s data is passed over a 30-inch channel with a loss of 22 dB and consumes 55.8 mW with the supply voltage of 1.8 V. The overall chip area including pads is 0.3 × 0.5 mm^2.     

0.18μm CMOS 20Gb/s 1:2分接器设计

使用标准0.18μm CMOS工艺设计并实现了1:2分接器.核心电路单元采用一种新的高速、低电压锁存器结构实现.与传统的源极耦合场效应管逻辑结构的锁存器相比,其电源电压更低且速度更快.此外,为了拓展带宽,在缓冲放大电路中采用了负反馈.测试结果表明芯片可以工作于20Gb/s数据速率下.电源电压为1.8V时,包括缓冲电路在内整个芯片的工作电流为72mA.     

A 5-GHz programmable frequency divider in 0.18-μm CMOS technology

正A 5-GHz CMOS programmable frequency divider whose modulus can be varied from 2403 to 2480 for 2.4-GHz ZigBee applications is presented.The divider based on a dual-modulus prescaler(DMP) and pulse-swallow counter is designed to reduce power consumption and chip area.Implemented in the 0.18-μm mixed-signal CMOS process,the divider operates over a wide range of 1-7.4 GHz with an input signal of 7.5 dBm;the programmable divider output phase noise is -125.3 dBc/Hz at an offset of 100 kHz.The core circuit without test buffer consumes 4.3 mA current from a 1.8 V power supply and occupies a chip area of approximately 0.015 mm~2.The experimental results indicate that the programmable divider works well for its application in frequency synthesizers.     

0.18μm CMOS 20Gb/s 1∶2分接器设计(英文)

使用标准0.18μm CMOS工艺设计并实现了1∶2分接器.核心电路单元采用一种新的高速、低电压锁存器结构实现.与传统的源极耦合场效应管逻辑结构的锁存器相比,其电源电压更低且速度更快.此外,为了拓展带宽, 在缓冲放大电路中采用了负反馈.测试结果表明芯片可以工作于20Gb/s数据速率下.电源电压为1.8V时,包括缓冲电路在内整个芯片的工作电流为72mA.     

5-Gb/s 0.18-μm CMOS 2 : 1 multiplexer with integrated clock extraction

8 and 2.6 Gb/s with no need for external components, reference clock, or phase alignment between data and clock. It can be used in a parallel optic-fiber data interconnecting system.     

A 3.125-Gb/s inductorless transimpedance amplifier for optical communication in 0.35μm CMOS

A 3.125-Gb/s transimpedance amplifier(TIA) for an optical communication system is realized in 0.35μm CMOS technology.The proposed TIA employs a regulated cascode configuration as the input stage, and adopts DC-cancellation techniques to stabilize the DC operating point.In addition,noise optimization is processed. The on-wafer measurement results show the transimpedance gain of 54.2 dBΩand -3 dB bandwidth of 2.31 GHz.The measured average input referred noise current spectral density is about 18.8 pA/(?).The measured eye diagram is clear and symmetrical for 2.5-Gb/s and 3.125-Gb/s PRBS.Under a single 3.3-V supply voltage,the TIA consumes only 58.08 mW,including 20 mW from the output buffer.The whole die area is 465×435μm~2.     

A 2.5-Gb/s fully-integrated, low-power clock and recovery circuit in 0.18-μm CMOS

Based on the devised system-level design methodology, a 2.5-Gb/s monolithic bang-bang phase-locked clock and data recovery (CDR) circuit has been designed and fabricated in SMIC's 0.18-μm CMOS technology. The Pottbacker phase frequency detector and a differential 4-stage inductorless ring VCO are adopted, where an additional current source is added to the VCO cell to improve the linearity of the VCO characteristic. The CDR has an active area of 340 × 440μm2, and consumes a power of only about 60 mW from a 1.8 V supply voltage, with an input sensitivity of less than 25 mV, and an output single-ended swing of more than 300 mV. It has a pull-in range of 800 MHz, and a phase noise of-111.54 dBc/Hz at 10 kHz offset. The CDR works reliably at any input data rate between 1.8 Gb/s and 2.6 Gb/s without any need for reference clock, off-chip tuning, or external components.     

0.18μm CMOS 10Gb/s 4:1复接器集成电路设计

本文主要介绍采用0．18μm CMOS工艺设计用于光纤传输系统的4：1复接器。该复接器采用树型结构源级耦合逻辑(SCFL)电路实现；仿真结果显示：速度达到12．5Gb／s，功耗小于400mw；版图设计使用Cadence软件完成，其面积为2．4平方毫米；最后在TSMC流片。     

0.35μm CMOS 2.5Gb/s宽动态范围前置放大器设计

采用Chartered 0.35μm CMOS工艺设计了一种适用于光纤传输系统STM-16(2.5Gb/s)速率级的低功耗、宽动态范围的前置放大器.该前置放大器采用RGC(Regulated Cascode)结构作为输入级,同时引入消直流电路来提高光电流的过载能力.仿真结果表明,前置放大器的跨阻增益为57.0dBΩ,-3dB带宽为2.003GHz;当误码率BER为10~(-12)时,输入灵敏度为-23.0dBm,过载光电流达到800 μ A.3.3V单电源供电时,功耗仅为59.43mW.芯片面积为465 μm × 435 μm.     

4位5GS/s 0.18μm CMOS并行A/D转换器

基于0.18 μm CMOS工艺,设计了一种最大采样速率为5 GS/s的4位全并行模数转换器.设计中,为了提高模数转换器的采样速度,采用三种技术相结合:1)比较电路与解码电路都采用流水线的工作方式;2)在比较器中使用电感技术,提高比较器的转换速度;3)使模拟电路和数字电路都工作在低摆幅的工作状态,在提高速度的同时,降低了电路的功耗.为了提高电路的信噪比,采用全差分输入输出方式和低摆幅时钟控制,并在解码器中先将温度计码转换成格林码,再将格林码转换成二进制码,有效地抑制了由比较电路产生的亚稳定性.仿真结果表明,在输入信号为102.539 MHz、5 GS/s采样率下,设计的电路有效比特数达3.74位,积分非线性和微分非线性分别小于0.255 LSB和0.171 LSB,功耗小于65 mW.     

2.5-Gb/s 0.18-μm CMOS全集成，低功耗时钟数据恢复电路

采用SMIC 0.18-μm CMOS 工艺设计并实现了一款基于锁相原理的单片Bang-Bang时钟恢复电路。从系统级及电路级详细论述了本电路的设计方法。本电路的有效面积为340×440 μm2。在1.8V电压下的功耗仅仅为60mW,输入灵敏度不到25mV,输出单端摆幅超过300mV。它具有800MHz的牵引带宽,相位噪声为 -111.54 dBc/Hz @10 kHz。本电路可以可靠地工作在1.8 Gb/s 到2.6 Gb/s之间的任意数据输入速率,而不需要任何参考时钟,外部调谐或外接元件。     

5-Gb/s 0.18-μm CMOS集成时钟提取功能的2:1复接器设计

摘要：采用SMIC 0.18um CMOS工艺设计并实现了一个5-Gb/s在片集成时钟提取功能的2:1复接器,且该时钟提取子电路具有自动相位对准功能.芯片面积为670um*780um.在1.8V电压下,总功耗为112 mW, 输入灵敏度在50 mV以下, 输出单端摆幅大于300 mV. 测试结果表明,该复接器能够在不需要任何外接元件、参考时钟或外部相位调整下可靠地工作在1.8 Gb/s至2.6 Gb/s之间的任何输入数据速率. 该芯片可被用在并行光互连系统中.     

A 20-Gb/s wideband AGC amplifier with 26-dB dynamic range in 0.18-μm SiGe BiCMOS

This paper presents a 20-Gb/s automatic gain control (AGC) amplifier in a 0.18-μm SiGe BiCMOS for high-speed applications. The proposed AGC amplifier compactly consists of a folded Gilbert variable-gain amplifier (VGA), a post amplifier (PA), a 50-Ω output buffer, and AGC loop including an open-loop peak detector (PD), a RC low-pass filter (LPF), and an error amplifier (EA). The AGC amplifier achieves the broadband characteristic by utilizing inductive peaking and capacitive degeneration as well as f_T-doubler techniques to overcome the large parasitic capacitances. The proposed AGC circuits together with a linear VGA exhibits a wide gain control range of 45 dB for the received signal strength indication (RSSI). The measured AGC amplifier achieves a maximum gain of 21 dB and a -3-dB bandwidth (BW) of 20.6 GHz, which can support up to 25.4-Gb/s data rate. For the pseudorandom bit sequence (PRBS) length 2³¹–1 with a bit-error rate (BER) of 10⁻¹² at 20 Gb/s, the measured input dynamic range is 26 dB (20–400mV_pp) and the peak-to-peak data jitter is less than 8 ps. The AGC amplifier consumes a power of 160 mW from a 3.3-V supply voltage and occupies an area of 850 μm × 850 μm.     

A monolithic 3.1-4.8 GHz MB-OFDM UWB transceiver in 0.18-μm CMOS

正A monolithic RF transceiver for an MB-OFDM UWB system in 3.1-4.8 GHz is presented.The transceiver adopts direct-conversion architecture and integrates all building blocks including a gain controllable wideband LNA,a I/Q merged quadrature mixer,a fifth-order Gm-C bi-quad Chebyshev LPF/VGA,a fast-settling frequency synthesizer with a poly-phase filter,a linear broadband up-conversion quadrature modulator,an active D2S converter and a variablegain power amplifier.The ESD protected transceiver is fabricated in Jazz Semiconductor's 0.18-μm RF CMOS with an area of 6.1 mm~2 and draws a total current of 221 mAfrom 1.8-V supply.The receiver achieves a maximum voltage gain of 68 dB with a control range of 42 dB in 6 dB/step,noise figures of 5.5-8.8 dB for three sub-bands,and an inband /out-band IIP_3 better than-4 dBm/+9 dBm.The transmitter achieves an output power ranging from-10.7 to-3 dBm with gain control,an output P_(1dB) better than-7.7 dBm,a sideband rejection about 32.4 dBc,and LO suppression of 31.1 dBc.The hopping time among sub-bands is less than 2.05 ns.     

12-Gb/s 0.25-μm CMOS 1:4分接器

介绍光纤传输系统的组成,分析1:4分接器的树型结构,并给出其主要特点.在此基础上,进一步探讨树型结构中所用的1:2分接器,并给出其中的锁存器电路结构.此外,讨论了起重要作用的匹配电路以及驱动电路.电路采用标准的0.25μm CMOS工艺设计并实现.实际测试结果显示该电路能够稳定地在STM-16至STM-64所要求的数据速率下工作,最高工作速率为12.92Gb/s.