磷在硅表面氧化层中的扩散

用示踪原子方法,研究了磷(Na₂HP³²O₄)在p型硅表面氧化层中的扩散。硅单晶的电阻率为5—6欧姆·厘米。氧化层是在高温下水汽中生长的,其厚度为0.5—0.6微米,是用灵敏度为10^-5克/刻度的微量天平测定的。发现在1245℃时氧化层的生长规律服从X^1.85=1.4×10^-2t,其中X为氧化层的厚度,单位为微米;t为氧化层的生长时间,单位为分钟。其红外吸收的测量结果与文献中的数据基本一致。扩散是在充满空气的封闭石英管中进行的,扩散温度为700—1250℃,扩散时间从4分钟到5小时。实验结果表明,磷在SiO₂层中的浓度分布不能直接用菲克第二定律描述,它可以看成是一个均匀分布和一个遵守菲克第二定律的分布的迭加。按后一种分布得到在700—1200℃范围内的扩散系数的温度依赖关系:D=1.9×10^-9exp(-1.1/kT)厘米²/秒。均匀分布部分的浓度为(1—8)×10¹⁹原子/厘米³。大中对所用方法和所得结果作了简单讨论.     

测定半导体扩散层表面浓度、p-n结深度及扩散系数的霍耳效应法

本文叙述测定半导体扩散层表面浓度、P-n结深度及扩散系数的霍耳效应法。导出了求算半导体扩散层表面浓度、P-n结深度及扩散系数的一组积分公式。对砷由气相扩散入锗这一情况进行了详细研究:对上述公式进行数值积分并给出一系列图线,利用这些图线从实验值求得表面浓度等上述参数。实验表明:此法所测得的结深度和表面浓度分别与光干涉法直接测得的结深度和平均电导法测得的表面浓度,在误差范围内很好符合;而且此法所测得的扩散系数与B?senberg用电容法测得的也极为接近。扩散系数与温度的关系为D=2.3exp(-2.36/(kT)),当N₀=10¹⁴厘米^-3;D=1.7exp(-2.36/(kT)),当N₀=10¹⁶厘米^-3。     

磷在SiO2-Si系统中的扩散

用中子激活方法,对气态P₂O₅在SiO₂-Si系统中的扩散分布进行了直接测量。样品为p型Si单晶,电阻率为3—5欧姆·厘米,氧化层是在1250℃下水汽中生长的,其厚度为0.45—0.47微米。实验结果表明:对于完全掩蔽的样品,磷在SiO₂层中的浓度分布有个陡峭的边界;对于掩蔽失效情形,在靠近SiO₂-Si交界面约0.1微米的SiO₂层内,磷的浓度显著地降低,出现一个明显的交界层,在交界层以外的SiO₂层中磷的浓度是均匀的和恒定的,而交界层中磷的浓度及磷在Si中的表面浓度都随时间的延长而显著地升高,文中对所得的结果作了简单讨论。     

外类杂质在氧化亚铜中的扩散

在640—960℃温度范围内研究了放射性铊和钽在结晶粒结构的氧化亚铜晶体中的扩散。结果指出,它们分别满足下列关系式:D_Tl=2.29×10^-2e^-37000/(RT)+7.73×10^-9e^-6100/(RT)厘米²/秒;D_Ta=8.95e^-49500/(RT)+1.85×10^-8e^-7200/(RT)厘米²/秒。logD～1/T图线在760±10℃有一转折点,在这个温度以上和以下由曲线斜率求出的激活能是不同的。根据实验结果可以认为,在760℃以下,杂质原子主要是沿着晶粒间界发生扩散的,而在760℃以上是沿着单晶体的空位式扩散机构。并且认为空位式的扩散机构是舆空格点本身的位移相伴随着。放射性钽在氧化过程中的浓度分布指出:在760℃以下,在氧化过程中,氧和铜的相对扩散佔同等重要地位;而在760℃以上,随着温度的升高,铜的扩散逐渐佔优势,在继续氧化过程中,由於氧的扩散生成的氧化层逐渐减少。     

磷在SiO_2-Si系统中的扩散

用中子激活方法,对气态P_2O_5在SiO_2-Si系统中的扩散分布进行了直接测量。样品为p型Si单晶,电阻率为3—5欧姆·厘米,氧化层是在1250℃下水汽中生长的,其厚度为0.45—0.47微米。实验结果表明:对于完全掩蔽的样品,磷在SiO_2层中的浓度分布有个陡峭的边界;对于掩蔽失效情形,在靠近SiO_2-Si交界面约0.1微米的SiO_2层内,磷的浓度显著地降低,出现一个明显的交界层,在交界层以外的SiO_2层中磷的浓度是均匀的和恒定的,而交界层中磷的浓度及磷在Si中的表面浓度都随时间的延长而显著地升高,文中对所得的结果作了简单讨论。     

用四探针及阳极氧化方法测量硅中扩散层杂质分布

本文讨论了:(1)用阳极氧化法在硅片表面去层的技术;(2)用四探针测量扩散层面电导的方法;(3)用阳极氧化去层及四探针测量面电导方法求得扩散层精细杂质分布。文中着重讨论了实验技术中的实际问题,如如何在阳极氧化过程中取得精细而均匀的去层(300—1500?);如何控制及测量去层厚度;测量面电导及杂质分布时的误差来源及减小误差的措施。以典型的磷在硅中扩散的杂质分布测量为例:扩散深度为4.9μm,测量间距为400—1600?,面电导测量误差估计小于3％,杂质分布误差估计小于20％。简单地提出了一些测量中尚待进一步解决的问题。     

耗散反应产物的电荷扩散与能量相干

在输运理论的框架内研究了¹⁹F+⁵¹V耗散反应中能量相干宽度随出射产物中质比N/Z变化的关系,得到了反应系统已经达到电荷平衡的结论,提取了相应的电荷扩散系数. 分析表明电荷扩散过程造成了的分布宽度随反应时间线性增大的现象. 还探讨了各个同位素出射道的相关对激发函数振荡结构涨落幅度的作用.     

掺磷的硅中电子自旋共振

本文叙述了在室温、液N₂和液H₂及其降压温度下,利用3厘米波段双重调制波谱仪对掺磷原子浓度为～10¹⁵—～10¹⁸/厘米³的硅样品进行的电子自旋共振研究,文中还简述了低温控制系统。实验观察到传导电子、表面缺陷中心和电子-核超精细结构谱线,以及有效电子-施子核对的互作用谱线,并获得相应的g因子。在14°K下,得到施主核上电子波函数幅度的平方|Ψ(0)|²和电子-核超精细互作用常数α_D,与G.Feher在1.25°K下利用电子-核双共振方法得到的结果相近。     

双次曝光积分效应实现杂质浓度分布均匀化

 激光诱导扩散中,当入射激光光强为高斯分布甚至均匀分布时，微小扩散区的温度分布不均匀。由于扩散系数是温度的函数，必将导致扩散后杂质浓度分布的均匀性较差，无法制作出高性能的p-n结。提出采用多次激光诱导扩散的积分效应来实现杂质浓度分布的均匀化整形。对于InP衬底的CO_{2激光诱导Zn扩散,利用温度闭环测控系统测得的基片表面热斑温度场分布，分析计算了两次激光诱导扩散重叠区域的浓度分布积分效应。在此基础上模拟计算出，用双次曝光积分效应做杂质浓度分布的均匀化整形时，基片上两次激光照射位置的最佳间隔为20 μm。这为改进激光诱导扩散工艺，用多次曝光实现面均匀的杂质浓度分布奠定了理论基础。}     

使用时间切片离子速度成像技术研究CF2Cl2光解动力学

本文使用时间切片离子速度成像技术结合共振增强多光子电离技术研究了CF₂Cl₂分子在235 nm附近的光解动力学. 通过测量CF₂Cl₂分子在235 nm附近单光子解离产生的氯原子影像,直接得到了解离产物的速度分布和角分布. 激发态氯原子的速度分布包含高动能组分和低动能组分,分别对应³Q₀电子态的直接解离和由于内转换引起的基态预解离. 基态氯原子的速度分布也包含高动能组分和低动能组分,分别对应³Q₀与¹Q₁电子态的预解离和由于内转换引起的基态预解离. 自由基解离通道被确认,二次解离通道和三体解离通道被排除.     

硅的低温电学性质

本文在20°—300°K研究了室温载流子浓度2×10¹²—1×10²⁰cm^-3含硼或磷(砷)Si的电学性质。对一些p-Si样品用弱场横向磁阻法及杂质激活能法进行了补偿度的测定,并进行了比较。从霍尔系数与温度关系的分析指出,对于较纯样品,硼受主能级的电离能为0.045eV,磷施主能级为0.045eV,在载流子浓度为10¹⁸—10¹⁹cm^-3时发现了费米简并,对载流子浓度为2×10¹⁷—1×10¹⁸cm^-3的p-Si及5×10¹⁷—4×10¹⁸cm^-3的n-Si观察到了杂质电导行为。从霍尔系数与电导率计算了非本征的霍尔迁移率。在100°—300°K间,晶格散射迁移率μ满足关系式AT^-a,其中A=2.1×10⁹,α=2.7(对空穴);或A=1.2×10⁸,α=2.0(对电子)。另外,根据我们的材料(载流子浓度在5×10¹¹—5×10²⁰cm^-3间),分别建立了一条电阻率与载流子浓度及电阻率与迁移率的关系曲线,以提供制备材料时参考之用。     

Nanostructuring Si surface and Si/SiO2 interface using porous-alumina-on-Si template technology. Electrical characterization of Si/SiO2 interface

In this work, anodic porous alumina thin films with pores in the nanometer range are grown on silicon by electrochemistry and are used as masking material for the nanopatterning of the silicon substrate. The pore diameter and density are controlled by the electrochemical process. Through the pores of the alumina film chemical oxidation of the silicon substrate is performed, leading to the formation of regular arrays of well-separated stoichiometric silicon dioxide nanodots on silicon, with a density following the alumina pores density and a diameter adjustable by adjusting the chemical oxidation time. The alumina film is dissolved chemically after the SiO₂ nanodots growth, revealing the arrays of silicon dioxide dots on silicon. In a next step, the nanodots are also removed, leaving a nanopatterned bare silicon surface with regular arrays of nanopits at the footprint of each nanodot. This silicon surface structuring finds interesting applications in nanoelectronics. One such application is in silicon nanocrystals memories, where the structuring of the oxidized silicon surface leads to the growth of discrete silicon nanocrystals of uniform size. In this work, we examine the electrical quality of the Si/SiO₂ interface of a nanostructured oxidized silicon surface fabricated as above and we find that it is appropriate for electronic applications (an interface trap density below 1–3×10¹⁰ eV⁻¹ cm⁻² is obtained, indicative of the high quality of the thermal silicon oxide).     

Magnetoplasticity and diffusion in silicon single crystals

The effect of static magnetic fields on the dynamics of surface dislocation segments, as well as the diffusion mobility of a dopant in silicon single crystals, has been analyzed. It has been experimentally found that the preliminary treatment of p-type silicon plates (the dopant is boron with a concentration of 10¹⁶ cm⁻³) in the static magnetic field (B = 1 T, a treatment time of 30 min) leads to an increase in the mobility of surface dislocation segments. The characteristic times of observed changes (about 80 h) and the threshold dopant concentration (10₁₅ cm⁻³) below which the magneto-optical effect in silicon is not fixed have been determined. It has been found that diffusion processes in dislocation-free silicon are magnetically sensitive: the phosphorus diffusion depth in p-type silicon that is preliminarily aged in the static magnetic field increases (by approximately 20%) compared to the reference samples.     

多晶硅薄膜低温生长中的表面反应控制

报道用SiF₄和H₂的间接微波等离子体化学气相沉积方法低温生长多晶硅(poly-Si)薄膜.实验发现,等离子体中的离子、荷电集团对薄膜生长表面的轰击是影响薄膜结晶质量的重要因素之一.通过外加偏压抑制这些荷电粒子的动能是控制表面生长反应、制备高质量ploy-Si薄膜的有效方法.在合适的外加偏压下制备的poly-Si薄膜,氢含量仅约为0.9at%,中心位于520cm^-1的Raman特征峰半高宽约为4.4cm^-1. 关键词： 多晶硅薄膜 低温生长 表面生长反应 外加偏压     

Phosphorus distribution profiles in 100-silicon using a spin-on source at low temperatures

 Incorporation of phosphorus into silicon from a spin-on dopant layer (SOD) at 400 ^°C is described. Annealing experiments were carried out with SOD films deposited on (100) silicon substrates by using the spin-on technique. Conventional heating on a hotplate in normal atmosphere and a temperature range up to 400 ^°C was used to study the dopant incorporation. After removing the SOD-films one part of the silicon substrates was annealed at higher temperatures. Investigations were carried out by SIMS, SAM, XPS, HTEM, stripping Hall and Van der Pauw measurements before and after the high temperature annealing. Chemical phosphorus concentration profiles obtained from low temperature annealed samples showed diffusion depths of 60–80 nm (extrapolated to a substrate doping level of 10¹⁶ cm^-3) and surface concentrations of 10¹⁹–10²⁰ cm^-3. Electron concentration profiles exhibiting maximum values around 2⋅10¹⁹ cm^-3 could be measured on high temperature annealed samples only. Received: 28 March 1996/Accepted: 19 August 1996     

Ionization mechanisms of aluminum acceptor impurity in silicon

Processes of ionization of shallow acceptor centers (ACs) in silicon are studied. In crystalline silicon samples with phosphorus (1.6×10¹³, 2.7×10¹³, and 2.3×10¹⁵cm^?3) and boron (1.3×10¹⁵cm^?3) impurities, _μAl impurity atoms were produced by implantation of negative muons. It is found that thermal ionization is the main mechanism for ionizing the Al acceptor impurity in both p-type and n-type silicon with an impurity concentration of ?10¹⁵cm^?3 at T>45 K. The thermal ionization rate of Al ACs in Si varies from ～10⁵ to ～10⁶s^?1 in the temperature range 45–55 K.     

Silicon diffusion through thin tungsten films on silicon,studied with Auger spectroscopy

Silicon out-diffusion through ? 3000 Å tungsten films deposited on silicon by r.f. sputtering was studied using Auger spectroscopy. Silicon first diffuses to the tungsten film surface by grain boundary diffusion and surface migration. The out-diffusion kinetics were most strongly dependent on the thickness of the silicon dioxide layer between tungsten and silicon, and this (native) oxide thickness varied with substrate doping. The out-diffusion rate was independent of tungsten film thickness at 540 Å and 2400 Å. For substrates from which the native oxide was removed by backsputtering just prior to tungsten deposition, no Si out-diffusion to the W film surface was observed until almost the entire film had converted to WSi².     

Improvement of transport properties for polycrystalline silicon prepared by plasma-enhanced chemical vapor deposition

The carrier transport property of polycrystalline silicon (poly-Si:H:F) thin films was studied in relation to film microstructure, impurity, in situ or post-annealing treatments to obtain better carrier transport properties. Poly-Si:H:F films were prepared from SiF₄ and H₂ gas mixtures at temperatures <300 °C. Dark conductivity of the films prepared at high SiF₄/H₂ gas flow ratio (e.g., 60/3 sccm) exhibits a high value for intrinsic silicon and its Fermi level is located near the conduction band edge. The carrier incorporation is suppressed well, either by in situ hydrogen plasma treatment or by post-annealing with high-pressure hot-H₂O vapor. It is confirmed that weak-bonded hydrogen atoms are removed by the hot-H₂O vapor annealing. In addition, evident correlation between impurity concentrations and dark conductivity is not found for these films. It is thought that the carrier incorporation in the films prepared at high SiF₄/H₂ gas flow ratios is related to grain-boundary defects such as weak-bonded hydrogen. By applying hot-H₂O vapor annealing at 310 °C to a 1-μm-thick p-doped (400)-oriented poly-Si:H:F film, Hall mobility was improved from 10 cm²/Vs to 17 cm²/Vs. Received: 7 August 2000 / Accepted: 2 March 2001 / Published online: 20 June 2001     

Hole-phonon scattering in zinc doped GaSb

The phonon thermal conductivity values in Zn-doped GaSb are explained for hole concentrations ranging from 2 × 10¹⁷ to 4 × 10¹⁹ cm^-3. The concentration dependence of thermal conductivity above 3 × 10¹⁸ cm^-3 is similar to other doped materials and is explained by considering the scattering of phonons by free electrons (holes) given by Ziman and Kosarev and applying the screening effects suggested by Crossby and Grenier. The density-of-states effective mass is kept constant and the dilatation deformation potential is found to increase with hole concentration. For impurity concentrations less than 3 × 10¹⁸ cm^-3, the thermal conductivity is found to increase with hole concentration. Since this concentration region is below the metal-insulator transition, the theory of scattering of phonons by holes bound to the impurity atoms explains the conductivity results. The values of acceptor hole radius and deformation potential constants are in agreement with the experimental values.