Synthesis and characterization of novel phenolic resins containing aryl‐boron backbone and their utilization in polymeric composites with improved thermal and mechanical properties

In the present study, a novel aryl‐boron‐containing phenolic resin named as PBPR has been synthesized from phenol and formaldehyde in the presence of phenylboronic acid. The chemical structure of the PBPR was confirmed by Fourier transform infrared, nuclear magnetic resonance and X‐ray photoelectron spectroscopy. The molecular weight, viscosity and curing behavior were examined to demonstrate that PBPRs have better processability than common boric acid‐modified phenolic resin. The thermal stability and fracture toughness of the cured PBPRs were greatly enhanced, where the char yield at 1000°C (nitrogen atmosphere) and the glass transition temperature reached 70.0% and 218°C, respectively. The excellent mechanical and ablative properties of the PBPR composites may have benefited from the good interfacial adhesion between the resin matrix and the reinforced fiber. The flexural strength and the linear ablative rate are 436.8 ± 5.2 MPa and 0.010 mm/sec, respectively. This study opens a new window for the preparation of high‐performance ablative composites by designing a resin matrix containing an aryl‐boron backbone. Copyright © 2013 John Wiley & Sons, Ltd.     

Synthesis and curing of amino‐containing benzoxazine as a novel hardener for diglycidyl ether of bisphenol‐A

Benzoxazines containing various additional functional groups have been extensively reported to improve the properties of polybenzoxazines. In this work, a novel amino‐containing benzoxazine (PDETDA‐NH₂) was conveniently synthesized from diethyltoluenediamine (DETDA), 2‐hydroxybenzaldehyde, and paraformaldehyde and was used as a hardener for diglycidyl ether of bisphenol‐A (DGEBA). The curing behaviors of PDETDA‐NH₂ and PDETDA‐NH₂/DGEBA systems were studied by DSC, FT‐IR, and ¹H NMR. When curing, PDETDA‐NH₂ was firstly polymerized to N,O‐acetal‐type polymer and then rearranged to Mannich‐type polymer at elevated temperature, while the addition reaction between amino and benzoxazine was discouraged because of the steric hindrance of alkyl substituents. During PDETDA‐NH₂/DGEBA curing, it was found that the reactions happened in the order of addition polymerization of amino and epoxide, ring‐opening polymerization of benzoxazine, etherification between phenolic hydroxyl of the polymerized benzoxazine, and epoxide. Compared with DETDA cured DGEBA, PDETDA‐NH₂ cured DGEBA showed higher modulus, higher char yield, and much lower water uptake.     

Preparation and characterization of phosphorus‐containing Mannich‐type bases as curing agents for epoxy resin

Two novel phosphorus‐containing Mannich‐type bases, [(2‐{[(diethoxy‐phosphoryl)‐phenyl‐methyl]‐amino}‐ ethylamino)‐phenyl‐methyl]‐phosphonic acid diethyl ester (PEDA) and ({2‐[2‐(2‐{[(diethoxy‐phosphoryl)‐phenyl‐methyl]– amino}‐ethylamino)‐ethylamino]‐ethylamino}‐phenyl‐methyl)‐phosphonic acid diethyl ester (PTTA) were prepared and employed as curing agents in an attempt to prepare flame retardant epoxy systems. Through a curing reaction, phosphorus was incorporated in the backbone of the epoxy polymer. The processing characteristic of these systems was studied in terms of gel time at different temperatures. Thermal and flame retardancy properties of the cured epoxy thermosets were characterized by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and flammability test. The degradation activation energy was calculated by Kissinger's model. The results showed that the gel time of the phosphorus‐containing epoxy systems was prolonged; the glass transition temperature (T_g) was increased due to the introduction of phosphorus and the initial degradation activation energy of phosphorus‐containing epoxy systems was lower than phosphorus‐free epoxy systems. High char yield (23–27 wt%) and limiting oxygen index (LOI) values of 28–30 were observed for the phosphorus‐containing epoxy thermosets, indicating their improvement in flame retardancy. Copyright © 2008 John Wiley & Sons, Ltd.     

Epoxy resin curing reaction studied by proton multiple‐quantum NMR

This study demonstrates that the curing reaction of thermosetting polymers, in particular, epoxy resins cured with aliphatic amines, can be characterized by different multiple‐quantum (MQ) NMR experiments performed in low‐field spectrometers. Measurements of the curing reaction at 40 °C, 70 °C, and 100 °C are carried out to obtain the kinetic parameters like induction time, vitrification time, polymerization rate, and activation energy being consistent with data obtained by other traditional and complementary techniques. Besides, it is demonstrated that ¹H MQ‐NMR spectroscopy is a successful approach to overcome the experimental challenge arising from the characterization of high dipolar‐coupled polymers to study the network structure and segmental dynamics of thermosetting polymer networks. © 2015 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2015 , 53, 1324–1332     

The effect of the curing agent content on the curing and liquid‐crystalline phase of liquid‐crystalline epoxy resin

The effect of the curing agent content on the curing behavior and liquid‐crystalline (LC) phase of the liquid‐crystalline epoxy (LCE) resin 4,4′‐di(2,3‐epoxypropyloxy)phenyl benzoate was studied. Diaminodiphenylester (DDE) was used as a curing agent. The curing behavior was observed via differential scanning calorimetry, and the LC phase was investigated with a polarized optical microscopy. The LC phase in the LCE/DDE mixture with a high DDE content was developed during curing. The onset time was inversely proportional to the DDE content. The mesophase stability of LCE/DDE was enhanced by the addition of large amounts of DDE. © 2000 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 374–379, 2001     

Synthesis of a novel DPPA‐containing benzoxazine to flame‐retard epoxy resin with maintained thermal properties

The flame‐retarded epoxy resin with improved thermal properties based on environmentally friendly flame retardants is vital for industrial application. Hereby, a novel reactive‐type halogen‐free flame retardant, 10‐(3‐(4‐hydroxy phenyl)‐3,4‐dihydro‐2H‐benzo[e] [1,3] oxazin‐4‐yl)‐5H‐phenophosphazinine 10‐oxide (DHA‐B) was synthesized via a two‐step reaction route. Its structure was characterized using ¹H, ¹³C, and ³¹P NMR and HRMS spectra. For 4,4′‐diaminodipheny ethane (DDM) and diglycidyl ether of bisphenol A (DGEBA)‐cured systems, the epoxy resin with only 2 wt% loading of DHA‐B passed V‐0 rating of UL‐94 test. Significantly, its glass transition temperature (T_g) and initial decomposition temperature (T_5%) were as high as 169.6°C and 359.6°C, respectively, which were even higher than those of the corresponding original epoxy resin. Besides, DHA‐B decreased the combustion intensity during combustion. The analysis of residues after combustion suggested that DHA‐B played an important role in the condensed phase.     

Effect of new nonionic curing agent on curing kinetics and mechanical properties of epoxy resin

The current research work presents a novel nonionic curing agent (AEDA) synthesized by utilizing ethylene glycol diglycidyl ether (EGDE), 3,4-dimethoxyaniline (DI), and triethylenetetramine (TETA). Infrared spectroscopy and nuclear magnetic resonance spectroscopy were used to characterize the structure of AEDA curing agent. Non-isothermal scanning calorimetry was used to determine the activation energy and curing conditions of epoxy resin in the curing process. An impact testing machine, a tensile testing machine and a scanning electron microscope (SEM) were used to analyze the impact strength, tensile strength, bending strength, and micromorphology of the AEDA/E-51 system with different mass ratios. The results show that AEDA is an effective high-temperature curing agent. For the AEDA/E-51 system with the optimal mass ratio of 10:100, the best curing temperature is 92.15°C, and the post-curing temperature is 135.65°C. Furthermore, the apparent activation energy (E_a) of 1670 J/mol, the pre-exponential factor (A) of 3.7 × 10^?4, and the reaction series (n) value of 0.76 are obtained for the AEDA/E-51 system. The impact strength of AEDA/E-51 epoxy resin polymer is 7.82 kJ/m², tensile strength is 14.2 MPa, and bending strength is 18.92 MPa. The micromorphological results of the AEDA/E-51 system are consistent with the results of DSC test and mechanical properties test. Hence, this study provides theoretical support for the practical applications of AEDA as curing agent.     

Synthesis and characterization of novel low‐dielectric cyanate esters

For the purpose of increasing the mobility of residual bisphenol A dicyanate ester (BADCY) during the final stage of curing and achieving a complete reaction of cyanate groups, a small quantity of monofunctional phenol was added to BADCY to form an imidocarbonate, or a small quantity of monofunctional cyanate esters was added to form cyanate ester copolymers. The proposed structures were confirmed with Fourier transform infrared, elemental analysis, mass spectrometry, and NMR spectroscopy. The thermal properties of the cured cyanate esters were measured with dynamic mechanical analysis, thermogravimetric analysis, and dielectric analysis. These data were compared with those for the cured BADCY resin. The cured modified cyanate esters exhibited a lower dielectric constant, a lower dissipation factor, and lower moisture absorption than the cured BADCY system. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2589–2600, 2004     

Preparation of phosphorus‐containing phenolic resin and its application in epoxy resin as a curing agent and flame retardant

For the sake of improving the flame retardancy of epoxy resin (EP), a novel phosphorus‐containing phenolic resin (PPR) synthesized in our group instead of conventional phenolic resin (PR) was used to cure EP in the present research. The curing processes and the corresponding crosslinking structure and mechanical performance were investigated by differential scanning calorimeter and dynamic mechanical thermal analysis. Because of the introduction of flame‐retarding elements including P and Si, PPR exhibited higher charring capacity in the condensed phase, which is helpful to construct a char layer of higher quality. Correspondingly, PPR‐cured EP displayed remarkably improved flame retardance as compared to conventional PR‐cured EP through the related evaluations including limiting oxygen index, vertical burning test, and microscale combustion colorimeter. As a multifunction agent, it is believable that PPR possesses potential commercial value to prepare flame‐retardant EP with high performance.     

Synthesis and characterization of self‐catalyzed imide‐containing pthalonitrile resins

Some new amino‐ and imide‐containing phthalonitrile compounds with 1:1 molar ratio of amino group to pthalonitrile unit were successfully synthesized. The molecular structures were characterized by spectroscopic techniques. They were thermally polymerized under nitrogen/air, even in the absence of curing additives. The thermal properties of the cured products were characterized by thermogravimetric analysis and differential scanning calorimetry. The 5% weight loss temperatures ranged from 525 to 528 °C and 513 to 520 °C under nitrogen and air, respectively. Char yields (900 °C) were in the range of 62–70%. Rheometric measurements showed that the rate of the cure reaction differs for all the three monomers. The glass transition temperature advances with increasing extent of cure and disappears on postcure at 375 °C. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Synthesis and characterization of a novel liquid‐crystalline epoxy resin combining biphenyl and aromatic ester‐type mesogenic units

A novel liquid‐crystalline epoxy resin combining biphenyl and aromatic ester‐type mesogenic units, diglycidyl ether of 4,4′‐bis(4‐hydroxybenzoyloxy)‐3,3′,5,5′‐tetramethyl biphenyl, was synthesized. Its spectroscopic structure, thermal properties, and phase structures were investigated with NMR, differential scanning calorimetry (DSC), and polarized light microscopy (PLM), respectively. The curing agent, diaminodiphenylsulfone, was chosen to investigate the curing behavior by means of DSC and PLM during isothermal and nonisothermal processes. Only one exothermal peak appeared in the isothermal DSC curves. Birefringence was also observed during the curing processes and preserved after postcuring. Compared with short rigid‐rod and flexible epoxies, the cured liquid‐crystalline epoxy resin that was obtained displayed special thermal stability according to thermogravimetric analysis because of its long rigid‐rod mesogenic unit and bulky methyl groups. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 727–735, 2007     

Curing kinetics,thermal, mechanical,and dielectric properties based on o‐cresol formaldehyde epoxy resin with polyhedral oligomeric (N‐aminoethyl‐γ‐amino propyl)silsesquioxane

The curing reaction and kinetics of o‐cresol formaldehyde epoxy resin (o‐CFER) with polyhedral oligomeric silsesquioxane of N‐aminoethyl‐γ‐amino propyl group (AEAP‐POSS) were investigated by differential scanning calorimetry (DSC). The thermal, mechanical, and dielectric properties of o‐CFER/AEAP‐POSS nanocomposites were investigated with thermogravimetric analysis (TGA), torsional braid analysis (TBA), tensile tester, impact tester, and electric analyzer, respectively. The results show that the activation energy (E) of curing reaction is 58.08 kJ/mol, and the curing reaction well followed the ?esták‐Berggren (S‐B) autocatalytic model. The glass transition temperature (T_g) increases with the increase in AEAP‐POSS content, and reaches the maximum, 107°C, when the molar ratio (N_s) of amino group to epoxy group is 0.5. The nanocomposites containing a higher percentage of AEAP‐POSS exhibited a higher thermostability. The AEAP‐POSS can effectively increase the mechanical properties of epoxy resin, and the tensile and impact strengths are 2.84 MPa and 143.25 kJ m^?2, respectively, when N_s is 0.5. The dielectric constant (ε), dielectric loss factor (tan δ), volume resistivity (ρ_v), and surface resistivity (ρ_s) are 4.98, 3.11 × 10^?4, 3.17 × 10¹² Ω cm³, and 1.41 × 10¹² Ω cm², respectively, similarly at N_s 0.5. Copyright © 2009 John Wiley & Sons, Ltd.     

Synthesis and characterisation of a novel Y-shaped liquid crystalline epoxy and its effect on isotropic epoxy resin

ABSTRACT

A novel Y-shaped liquid crystalline epoxy with a rigid core with three flexible liquid crystalline arms (ETTPM) was synthesised and its structure was characterised by Fourier transform infrared spectroscopy and nuclear magnetic resonance (NMR) spectroscopy. It was analysed and observed by differential scanning calorimetry, X-ray diffraction and polarised optical microscopy (POM) that the liquid crystal phase was stable on the temperature range of 107.8°C. In particular, an unusual transition phenomenon of liquid crystal phases was observed. Modified epoxy-resin-cured products were prepared using ETTPM, epoxy resin E51 and 4,4-diaminodiphenyl methane. The liquid crystalline domains in cured products were observed by researching their scattering effect on laser. Mechanical tests showed that ETTPM was effective for the mechanical properties improvement of epoxy-resin-cured products, as demonstrated in the improvement of impact strength, tensile strength and tensile elasticity modulus. The impact fracture cross-sections and surface morphologies were studied further by POM and scanning electron microscopy (SEM). Crack deformation, crack split and notable plastic deformations were found in modified epoxy-resin-cured products, and these factors played important roles in improving the impact strength.     

Investigation of irradiation dose rate on curing characteristics of carbon fiber/polymer composites by low‐energy electron beam

During in situ low‐energy electron beam (E‐Beam) curing for carbon fiber‐reinforced polymer composite, prepregs undergoes 3 sequenced curing processes, namely E‐Beam‐induced curing, postray curing after irradiation, and thermally induced curing. In this study, the irradiation dose rate (IDR) is demonstrated to be influential on the redistribution of the curing portions in the 3 curing stages and directly influences the interlaminar bonding quality of the stepwise cured laminates. Differential scanning calorimetry results showed that higher IDR resulted in higher temperature of irradiated prepregs, and hence, a higher degree of curing was induced by the E‐Beam within a dose range of 0 to 500 kGy as compared to lower IDRs, which decreased the interlaminar physical adhesive quality between layers. Analysis indicates that other than pure physical adhesion between uncured layers, postray curing can further enhance the interlaminar shear strength for cured laminates by introducing cross‐layer chemical bonding in the interlaminar zone.     

Synthesis,characterization, and functionalization of zirconium tungstate (ZrW2O8) nano‐rods for advanced polymer nanocomposites

Nanomaterials based on zirconium tungstate (ZrW₂O₈) exhibit numerous outstanding properties that make them ideal candidates for the development of high‐performance composites. Low coefficient of thermal expansion for advanced materials is a promising direction in the field of insulating nanocomposites. However, the agglomeration of zirconium tungstate (ZrW₂O₈)‐based nanomaterials in the polymer matrix is a limiting factor in their successful applications, and studies on surface functionalization ZrW₂O₈ for advanced nanocomposites are very limited. In this work, ZrW₂O₈ nano‐rods were synthesized using a hydrothermal method and subsequently functionalized in a solvent‐free aqueous medium using dopamine. Both pristine and functionalized nano‐rods were thoroughly characterized using Fourier transform infrared spectroscopy, Raman spectroscopy, thermogravimetric analysis, X‐ray diffraction, Scanning Electron Microscopy (SEM), and transmission electron microscopy techniques, which confirmed the successful functionalization of the nanomaterials. Polymer nanocomposites were also prepared using epoxy resin as a model matrix. Polymer nanocomposites with functionalized ZrW₂O₈ nano‐rods exhibited low coefficient of thermal expansion and enhanced tensile properties. The improved properties of the nanocomposites render them suitable for electronic applications. Copyright © 2017 John Wiley & Sons, Ltd.     

Synthesis and characterization of novel low‐bandgap triphenylamine‐based conjugated polymers with main‐chain donors and pendent acceptors for organic photovoltaics

A series of novel low‐bandgap triphenylamine‐based conjugated polymers ( PCAZCN , PPTZCN , and PDTPCN ) consisting of different electron‐rich donor main chains (N‐alkyl‐2,7‐carbazole, phenothiazine, and cyclopentadithinopyrol, respectively) as well as cyano‐ and dicyano‐vinyl electron‐acceptor pendants were synthesized and developed for polymer solar cell applications. The polymers covered broad absorption spectra of 400–800 nm with narrow optical bandgaps ranging 1.66–1.72 eV. The highest occupied molecular orbital and lowest unoccupied molecular orbital levels of the polymers measured by cyclic voltammetry were found in the range of ?5.12 to ?5.32 V and ?3.45 to ?3.55 eV, respectively. Under 100 mW/cm² of AM 1.5 white‐light illumination, bulk heterojunction photovoltaic devices composing of an active layer of electron‐donor polymers ( PCAZCN , PPTZCN , and PDTPCN ) blended with electron‐acceptor [6,6]‐phenyl‐C₆₁‐butyric acid methyl ester or [6,6]‐phenyl‐C₇₁‐butyric acid methyl ester (PC₇₁BM) in different weight ratios were investigated. The photovoltaic device containing donor PCAZCN and acceptor PC₇₁BM in 1:2 weight ratio showed the highest power conversion efficiency of 1.28%, with V_oc = 0.81 V, J_sc = 4.93 mA/cm², and fill factor = 32.1%. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

Synthesis and properties of room temperature curable trimethoxysilane‐terminated polyurethane and their dispersions

The purpose of this research is to study the synthesis and characterization of stable aqueous dispersions of externally chain extended polyurethane/urea compositions terminated by hydrolyzable or hydrolyzed trialkoxysilane groups incorporated through secondary amino groups. These dispersions with excellent storage stability are substantially free from organic solvents which cure to water and solvent resistant, tough, scratch resistant, preferably light stable (non‐yellowing) silylated polyurethane (SPU) films. The films were characterized by FT‐IR, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), tensile strength and water contact angle measurements, nanoindentation, gel content, water and xylene swellability tests. The properties of the films were discussed and correlated in detail by changing length of soft segment, diisocyanates, NCO/OH ratio and chain extender, ethylenediamine (EDA). From the results, it was found that the particle size and viscosity are lower whereas the gel content and thermal stability are higher for SPUs. Modulus, hardness and tensile properties of SPU films are superior compared to EDA‐PU film. Higher water contact angle and residual weight percentage of SPU films confirm silylation of PU by [3‐(phenylamino)propyl]trimethoxysilane (PAPTMS). Increase in NCO/OH ratios consumes more quantity of PAPTMS which makes PU with superior mechanical properties. Higher PAPTMS content in SPU results in effective crosslinking of the functional silanol groups formed by hydrolysis reaction of trimethoxysilane groups. Overall, SPUs synthesized at 1.4 NCO/OH ratio using Poly‐(oxytetramethylene)glycol (PTMG)‐2000 and isophorone diisocyanate (or) toluene‐2,4‐diisocyanate have excellent properties compared to SPUs prepared using PTMG‐1000 and at 1.2 and 1.6 NCO/OH ratios. SPUs prepared at 1.6 NCO/OH ratio are brittle due to higher crosslinking density. In addition, the crosslinking density of the films can be modified through silane end‐group modification to produce SPUs with a wide range of physical properties. Copyright © 2007 John Wiley & Sons, Ltd.     

Effect of ortho‐methylation on a bis(4‐cyanatocumyl)benezene low‐dielectric resin

A synthesis procedure for and characterization of a tetra‐ortho‐methyl substituted three‐ringed cyanate ester monomer, 4,4′‐[1,3‐phenylenebis(1‐methylethylidene)]bis[2,6‐dimethyl]phenylcyanato, and the corresponding cured resin are described with comparative characterization of the resin analogue without the ortho‐methyl substitutents. The othro‐methylation lowered the dielectric from 2.64 to 2.59 at 1 GHz and from 2.64 to 2.48 GHz at 15 GHz, whereas the tan δ was not significantly affected. Other physical properties also affected included a 40 °C decrease in the glass‐transition temperature, an increase in the thermal‐expansion coefficients, and a reduction in thermogravimetric stability. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 60–67, 2003     

Synthesis of poly(o‐phenylenediamine) nanofiber with novel structure and properties

The poly(o‐phenylenediamine) (PoPD) was synthesized from the monomer o‐phenylenediamine in various organic solvent medium viz. dimethyl sulfoxide (DMSO), N,N‐dimethyl formamide (DMF) and methanol using ammonium per sulfate as a radical initiator. The structure just like polyaniline derivative with free ?NH functional groups of the synthesized polymers confirmed by various standard characterizations was explained from the proposed polymerization mechanism. All the synthesized polymers were completely soluble in common organic solvent like DMSO and DMF because of the presence of polar free ?NH functional groups in its structure. The formation of polymer nanofiber by reverse salting‐out process was confirmed, and the synthesized polymer in DMSO medium was the best polymer in terms of nano‐morphology as well as conducting properties. Interestingly, the average DC conductivity of undoped polymer film was recorded as 2.21 × 10^?6 Scm^?1 because of induced doping through self charge separation. Moreover, the conductivity of the polymer film was further increased to 1.16 × 10^?3 Scm^?1 after doping by sulfuric acid. Copyright © 2016 John Wiley & Sons, Ltd.     

The effect of a novel phosphorus-nitrogen reactive flame retardant curing agent on the performance of epoxy resin

A phosphorus-nitrogen reactive flame retardant curing agent poly-(isophorondiamine spirocyclic pentaerythritol bisphosphonate) (PIPSPB) was synthesized. The chemical structure of the obtained compound was identified by FTIR, ¹HNMR, and mass spectroscopies. Different proportions of DDS and PIPSPB were compounded as the curing agents to prepare a series of flame retardant epoxy resins with different phosphorus contents. The curing behavior of E-44/PIPSPB?+?DDS system was studied by DSC. A series of tests were conducted to characterize E-44/PIPSPB?+?DDS thermosetting system’s performance. The result demonstrates that the residual carbon content of EP/PIPSPB?+?DDS system is obviously higher than that of EP/DDS system after 500?°C with the increase of phosphorus content in the system, and the heat release rate of the system during combustion is significantly reduced. The generated phosphorus-containing carbon layer is obviously foamed, which shows that the flame retardancy of the system is the result of the combined action of condensed phase and gas phase. When the phosphorus content is 1.77wt%, EP-3 successfully passed UL94 V-0 flammability rating, the LOI value was as high as 29%, the impact strength and tensile strength of it were 6.08KJ/m² and 49.10MPa respectively, the adhesive strength could reach 13.89?MPa, the system presents a good overall performance.