Ni/Au与N掺杂p型ZnO的欧姆接触

研究了Au,In,Ni/Au三种不同金属膜与N掺杂p型ZnO的接触特性,发现Ni/Au双层膜更适合作为其欧姆电极材料,并比较了不同气氛和不同温度退火对Ni/Au电极的影响.发现在O₂中退火电极性能发生蜕变,而在N₂中退火性能得到改善.指出即使在N₂中退火,退火温度的选择也是至关重要的,本实验在400℃,氮气气氛下退火150s,得到了较好的欧姆接触特性.     

N 掺杂ZnO薄膜的接触特性

氧化锌(ZnO)是一种直接带隙半导体材料,室温下带隙为3.37eV,激子束缚能为60meV。ZnO因其优越的光电特性在高亮度蓝紫光发光器件、紫外探测器件和短波长激子型激光器等方面具有广阔的应用前景。而要实现大功率的光电器件,稳定可靠的欧姆接触是必需的。研究了氮气氛条件下,不同温度快速退火对氮掺杂ZnO样品的电学性质以及Ni/Au与其接触特性的影响。原生样品表现为弱的肖特基接触,适当温度退火后,由肖特基转成了欧姆接触,650℃退火后得到最小比接触电阻率8×10-4Ω·cm2。霍尔测量表明550℃快速退火后,样品的导电类型由p型转变成了n型。采用AES和GXRD分别研究了不同退火温度下Au、Ni、Zn、O的深度分布变化及退火后所生成的合金相。实验结果表明,退火所导致的薄膜电学性质的变化以及界面态和表面态的增加是接触特性变化的原因。     

低接触电阻率Ni/Ag/Ti/Au反射镜电极的研究

研究了Ag的厚度、退火时间、沉积温度对于Ni/Ag/Ti/Au电极的反射率及与p-GaN欧姆接触性能的影响. 利用分光光度计测量反射率, 采用圆形传输线模型计算比接触电阻率. 结果表明: 随着Ag厚度的增加, Ni/Ag/Ti/Au电极的反射率逐渐增大; 在氧气氛围中, 随着退火时间从1 min增至10 min, 300 ℃退火时, 比接触电阻率持续下降, 而对于400-600 ℃退火, 比接触电阻率先减小后增大; 在300和400 ℃氧气中进行1-10 min 的退火后, Ni/Ag/Ti/Au的反射率变化较小, 退火温度高于400 ℃时, 随着退火时间的增加, 反射率急剧下降; 在400 ℃氧气中3 min退火后, 比接触电阻率可以达到3.6×10^-3 Ω·cm². 此外, 适当提高沉积温度可以增加Ni/Ag/Ti/Au的反射率并降低比接触电阻率, 沉积温度为120 ℃条件下的Ni/Ag/Ti/Au电极在450 nm处反射率达到90.1%, 比接触电阻率为6.4×10^-3 Ω·cm². 综合考虑电学和光学性能, 在沉积温度为120 ℃下蒸镀Ni/Ag/Ti/Au (1/200/100/100 nm)并在400 ℃氧气中进行3 min退火可以得到较优化的电极. 利用此电极制作的垂直结构发光二极管在350 mA电流下的工作电压为2.95 V, 输出光功率为387.1 mW, 电光转换效率达到37.5%.     

退火温度和退火气氛对Ni/Au与p-GaN之间欧姆接触性能的影响

研究了不同退火温度和气氛对Ni/Au与p-GaN之间欧姆接触性能的影响. 采用圆形传输线模型方法得到不同退火温度和不同退火气氛下的比接触电阻率. 结果表明, 较适宜的退火温度为500 ℃左右, 退火温度太高或太低都会导致比接触电阻率的增大; 较适宜的退火气氛为适量含氧的氮气气氛, 且氧气含量对比接触电阻率大小的影响并不显著. 经过对退火条件的优化, 得到的比接触电阻率可达7.65×10^-4 Ω·cm². 关键词： p-GaN 欧姆接触 圆形传输线模型 快速热退火     

金镍复合膜上碳纳米管的定向生长及生长过程中金的作用

以金镍复合膜作催化剂，在96%的高氢气浓度下实现了碳纳米管的定向生长，并对其生长过 程进行了深入探讨.结果表明，高氢气浓度下碳纳米管生长的实现与本实验所选用的催化剂 ——金镍复合膜有密切关系.催化剂中金的参与，促进了碳在催化剂中的扩散，提高了碳在 催化剂中的活度.与催化剂中没有金的情况相比较，金的参与有利于镍吸收气氛中的碳，从 而使镍更容易达到碳饱和，有利于在高的氢气浓度下实现碳纳米管的定向生长. 关键词： 金镍复合膜 高氢气浓度 原子氢 碳活度     

不同退火方式对Ni/SiC接触界面性质的影响

采用快速热退火(rapid thermal annealing, RTA)法和脉冲激光辐照退火(laser spark annealing, LSA)法, 在n型4H-SiC的Si面制备出Ni电极欧姆接触. 经传输线法测得RTA样品与LSA样品的比接触电阻分别为5.2×10^-4 Ω·cm², 1.8× 10^-4 Ω·cm². 使用扫描电子显微镜、原子力显微镜、透射电子显微镜、拉曼光谱等表征手段, 比较了两种退火方式对电极表面形貌、电极/衬底截面形貌和元素成分分布、SiC衬底近表层碳团簇微结构的影响. 结果表明, 相比于RTA, LSA法制备出的欧姆接触在电极表面形貌、界面形貌、电极层组分均匀性等方面都具有明显优势, 有望使LSA成为一种非常有潜力的制备欧姆接触的退火处理方法.     

Thermal annealing behaviour of Al/Ni/Au multilayer on n-GaN Schottky contacts

Recently GaN-based high electron mobility transistors (HEMTs) have revealed the superior properties of a high breakdown field and high electron saturation velocity. Reduction of the gate leakage current is one of the key issues to be solved for their further improvement. This paper reports that an Al layer as thin as 3 nm was inserted between the conventional Ni/Au Schottky contact and n-GaN epilayers, and the Schottky behaviour of Al/Ni/Au contact was investigated under various annealing conditions by current--voltage (I--V) measurements. A non-linear fitting method was used to extract the contact parameters from the I--V characteristic curves. Experimental results indicate that reduction of the gate leakage current by as much as four orders of magnitude was successfully recorded by thermal annealing. And high quality Schottky contact with a barrier height of 0.875 eV and the lowest reverse-bias leakage current, respectively, can be obtained under 12 min annealing at 450°C in N₂ ambience.     

石墨烯与金属的欧姆接触理论研究

石墨烯材料应用于多种电子器件时不可避免地要与金属电极接触,它们之间的接触电阻直接影响了器件的性能.为了揭示影响金属电极与石墨烯间接触电阻的因素,提出有效地抑制这些影响的措施,本文建立了一种求解接触电阻的物理模型,将载流子的输运分为金属与正下方石墨烯之间、正下方石墨烯与邻近石墨烯之间的两个过程,分别研究各个过程的输运概率;结合金属电极与石墨烯接触对载流子分布的影响分析接触电阻,据此分别探讨了金属电极材料、栅极电压、掺杂浓度、金属与石墨烯原子距离等对接触电阻的影响.为验证理论分析结果的正确性,制作了金与石墨烯接触的实验样品,实验测得的接触电阻与理论分析结果符合.理论分析结果表明,可通过选择与石墨烯功函数接近的金属材料,降低二氧化硅层厚度,增加载流子平均自由程,改进金属材料的表面形态使其更光滑,减小金属与石墨烯耦合长度等方法降低石墨烯与金属电极的接触电阻.     

Microstructure and current transport in Ti/Al/Ni/Au ohmic contacts to n-type AlGaN epilayers grown on Si(111)

The microstructure and the current transport in Ti/Al/Ni/Au ohmic contacts on AlGaN were investigated in this paper.Significant structural changes of the metal stack occurred upon annealing and ohmic contacts were obtained after thermal treatments above 700 C, with specific contact resistance values , which depend on the thickness of the Ti layer.Although the formation of a TiN interfacial layer is independent of the Ti thickness, different contact structures, i.e. the phases and grain location, were found as a function of the Ti layer, which were crucial for the nanoscale current transport through the contact stack. In particular, conductive atomic force microscopy combined with the resistivity measurement of the main phases formed upon annealing (AlNi, AlAu₄, Al₂Au) indicated that the low resistivity Al₂Au phase provides preferential conductive paths for the nanoscopic current flow through the contact.     

Magnetic properties of Ni/Au core/shell studied by Monte Carlo simulations

The magnetic properties of ferromagnetic Ni/Au core/shell have been studied using Monte Carlo simulations within the Ising model framework. The considered Hamiltonian includes the exchange interactions between Ni–Ni, Au–Au and Ni–Au and the external magnetic field. The thermal total magnetizations and total magnetic susceptibilities of core/shell Ni/Au are computed. The critical temperature is deduced. The exchange interaction between Ni and Au atoms is obtained. In addition, the total magnetizations versus the external magnetic field and crystal filed for different temperature are also established.     

Low contact resistivity between Ni/Au and p-GaN through thin heavily Mg-doped p-GaN and p-InGaN compound contact layer

Thin heavily Mg-doped In Ga N and Ga N compound contact layer is used to form Ni/Au Ohmic contact to p-Ga N.The growth conditions of the compound contact layer and its effect on the performance of Ni/Au Ohmic contact to p-Ga N are investigated. It is confirmed that the specific contact resistivity can be lowered nearly two orders by optimizing the growth conditions of compound contact layer. When the flow rate ratio between Mg and Ga gas sources of p++-In Ga N layer is 10.6% and the thickness of p++-In Ga N layer is 3 nm, the lowest specific contact resistivity of 3.98×10-5?·cm2is achieved. In addition, the experimental results indicate that the specific contact resistivity can be further lowered to1.07×10-7?·cm2by optimizing the alloying annealing temperature to 520℃ .     

热退火处理对AuGeNi/n-AlGaInP欧姆接触性能的影响

本文在n-(Al0.27Ga0.73)0.5In0.5P表面通过电子束蒸发Ni/Au/Ge/Ni/Au叠层金属并优化退火工艺成功制备了具有较低接触电阻的欧姆接触,其比接触电阻率在445℃退火600 s时达到1.4×10–4 W·cm2.二次离子质谱仪测试表明,叠层金属Ni/Au/Ge/Ni/Au与n-AlGaInP界面发生固相反应,Ga,In原子由于热分解发生外扩散并在晶格中留下Ⅲ族空位.本文把欧姆接触形成的原因归结为Ge原子内扩散占据Ga空位和In空位作为施主提高N型掺杂浓度.优化退火工艺对低掺杂浓度n-(Al0.27Ga0.73)0.5In0.5P的欧姆接触性能有显著改善效果,但随着n-(Al0.27Ga0.73)0.5In0.5P掺杂浓度提高,比接触电阻率与退火工艺没有明显关系.本文为n面出光的AlGaInP薄膜发光二极管芯片的n电极制备提供了一种新的方法,有望大幅简化制备工艺,降低制造成本.     

Au层退火温度对ZnO/Au/ZnO多层膜的结构、光学及电学性质的影响

采用金属有机化学气相沉积(MOCVD)技术在蓝宝石衬底上制备出晶体质量较好的透明导电的ZnO/Au/ZnO(ZAZ)多层膜,其中,Au夹层是通过射频磁控溅射的方法获得。通过对Au夹层进行不同温度的退火处理,研究了Au层退火温度对ZAZ多层膜的结构特性、电学性能和光学特性的影响。利用原子力显微镜(AFM)、扫描电子显微镜(SEM)、X射线衍射(XRD)仪、霍尔效应测试和透射谱分析等测试手段对ZAZ多层膜的性质进行了分析。测试结果表明,在200 ℃下对Au夹层进行快速退火处理,多层膜的结构、电学和光学性质达到最优,表面等离子体效应也更明显。其中,XRD(002)衍射峰的半高宽为0.14°,电阻率为2.7×10^-3 Ω·cm,载流子浓度为1.07×10²⁰ cm^-3,可见光区平均透过率为75.3%。     

Effect of annealing on the electronic parameters of Au/poly(ethylmethacrylate)/n-InP Schottky diode with organic interlayer

A thin poly(ethylmethacrylate) (PEMA) layer is deposited on n-InP as an interlayer for electronic modification of Au/n-InP Schottky structure. The electrical properties of Au/PEMA/n-InP Schottky diode have been investigated by current–voltage (I–V) and capacitance–voltage (C–V) measurements at different annealing temperatures. Experimental results show that Au/PEMA/n-InP structure exhibit a good rectifying behavior. An effective barrier height as high as 0.83 eV (I–V) and 1.09 eV (C–V) is achieved for the Au/PEMA/n-InP Schottky structure after annealing at 150 °C compared to the as-deposited and annealed at 100 and 200 °C. Modified Norde's functions and Cheung method are also employed to calculate the barrier height, series resistance and ideality factors. Results show that the barrier height increases upon annealing at 150 °C and then slightly decreases after annealing at 200 °C. The PEMA layer increases the effective barrier height of the structure as this layer creates a physical barrier between the Au metal and the n-InP. Terman's method is used to determine the interface state density and it is found to be 5.141 × 10¹² and 4.660 × 10¹² cm^?2 eV^?1 for the as-deposited and 200 °C annealed Au/PEMA/n-InP Schottky diodes. Finally, it is observed that the Schottky diode parameters change with increasing annealing temperature.     

电迁移对Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P倒装焊点界面反应的影响

本文研究了150 ℃, 1.0× 10⁴ A/cm²条件下电迁移对Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P倒装焊点界面反应的影响. 回流后在solder/Ni和solder/Ni-P的界面上均形成(Cu,Ni)₆Sn₅类型金属间化合物. 时效过程中两端界面化合物都随时间延长而增厚, 且化合物类型都由(Cu,Ni)₆Sn₅转变为(Ni,Cu)₃Sn₄. 电迁移过程中电子的流动方向对Ni-P层的消耗起着决定性作用. 当电子从基板端流向芯片端时, 电迁移促进了Ni-P层的消耗, 600 h后阴极端Ni-P层全部转变为Ni₂SnP层. 阴极界面处由于Ni₂SnP层的存在, 使界面Cu-Sn-Ni三元金属间化合物发生电迁移脱落溶解, 而且由于Ni₂SnP层与Cu焊盘的结合力较差, 在Ni₂SnP/Cu界面处会形成裂纹. 当电子从芯片端流向基板端时, 阳极端Ni-P层并没有发生明显的消耗. 电流拥挤效应导致了阴极芯片端Ni层和Cu焊盘均发生了局部快速溶解, 溶解到钎料中的Cu和Ni原子沿电子运动的方向往阳极运动并在钎料中形成了大量的化合物颗粒. 电迁移过程中(Au,Pd,Ni)Sn₄的聚集具有方向性, 即(Au,Pd,Ni)Sn₄因电流作用而在阳极界面处聚集.     

Ni/Au层对碳纳米管薄膜强流脉冲发射稳定性的影响

采用酞菁铁高温裂解法在镀有镍金缓冲层的硅基底上生长了碳纳米管薄膜(Ni/Au-CNT),并采用二极结构在相同的主Marx电压下研究了其强流脉冲发射稳定性.结果表明:在脉冲电压峰值为1.60～1.74 MV(对应的脉冲电场峰值为11.43～12.43 V/μm)时,Ni/Au-CNT薄膜首次发射的电流峰值可达331.2A;Ni/Au层不仅能提高CNT薄膜的强流脉冲发射电流峰值,还能提高其发射稳定性;当冷阴极重复脉冲发射7次时,Ni/Au-CNT的脉冲电流峰值衰减到初值的72％,而Ni-CNT和Si-CNT脉冲电流峰值分别衰减到初值的62％和32％.     

Rapid thermal annealing induced changes on the contact of Ni/Au to N-doped ZnO

N-doped p-type ZnO (p ∼ 10¹⁸cm^-3) was grown on sapphire(0 0 0 1) substrate by metal-organic chemical vapor deposition method. Ni/Au metal was evaporated on the ZnO film to form contacts. As-deposited contacts were rectifying while ohmic behavior was achieved after thermally annealing the contacts in nitrogen environment. Specific contact resistance was determined by circular transmission line method and a minimum specific contact resistance of 8 × 10⁻⁴ Ω cm² was obtained for the sample annealed at 650 °C for 30 s. However, Hall effect measurements indicate that, as the rapid thermal annealing temperature increased up to 550 °C or higher the samples’ conductive type have changed from p-type to n-type, which may be due to the instability nature of the present-day p-type N-doped ZnO or the dissociation of ZnO caused by annealing process in N₂ ambient. Evolution of the sample's electric characteristics and the increment of metal/semiconductor interface states induced by rapid thermal annealing process are supposed to be responsible for the improvement of electrical properties of Au/Ni/ZnO.     

Ni–Al ohmic contact to p-type 4H-SiC

Investigations on Ni/Al alloys to form ohmic contacts to p-type 4H-SiC are presented in this paper. Different ratios of Ni/Al were examined. Rapid thermal annealing was performed in argon atmosphere at 400 C for 1 min, followed by an annealing at 1000 C for 2 min. In order to extract the specific contact resistance, TLM test structures were fabricated. A specific contact resistance of 3×10⁻⁵ Ω cm² was obtained reproducibly on Al²⁺ implanted p-type layers, having a doping concentration of 1×10¹⁹ cm⁻³. The lowest specific contact resistance value measured amounts to 8×10⁻⁶ Ω cm².     

氧气氛中p-GaN/Ni/Au电极在相同温度不同合金时间下的欧姆接触形成机制和扩散行为

用卢瑟福背散射/沟道技术研究了p-GaN上的Ni/Au电极在氧气氛下相同合金温度(500℃)不同合金时间后的微结构演化,以揭示欧姆接触的形成机制.利用背散射随机谱和RUMP模拟程序研究了电极金属之间的互扩散,用沟道谱探测了电极金属中的氧分布.结合不同合金时间下比接触电阻ρ_c的变化,发现随着合金时间的延长比接触电阻持续降低,在合金时间60 s后降低的速度减慢, Au扩散到GaN的表面,在p-GaN上形成外延结构,O向电极内部扩散反应生成NiO对降低ρ_{关键词： GaN 卢瑟福背散射/沟道 欧姆接触}     

Effects of annealing temperature on the electrical property and microstructure of aluminum contact on n-type 3C–SiC

The 3C-SiC thin films used herein are grown on Si substrates by chemical vapor deposition. A1 contacts with differ- ent thickness values are deposited on the 3C-SiC/Si （100） structure by the magnetron sputtering method and are annealed at different temperatures. We focus on the effects of the annealing temperature on the ohmic contact properties and mi- crostructure of A1/3C-SiC structure. The electrical properties of A1 contacts to n-type 3C-SiC are characterized by the transmission line method. The crystal structures and chemical phases of A1 contacts are examined by X-ray diffraction, Raman spectra, and transmission electron microscopy, respectively. It is found that the A1 contacts exhibit ohmic contact behaviors when the annealing temperature is below 550 ℃, and they become Schottky contacts when the annealing tem- perature is above 650 ℃. A minimum specific contact resistance of 1.8 × 10-4 Ω cm2 is obtained when the A1 contact is annealed at 250 ℃.