基于微陷阱结构的金属二次电子发射系数抑制研究

近年来,金属二次电子发射系数的抑制研究在加速器、大功率微波器件等领域得到了广泛关注.为评估表面形貌对抑制效果的影响,利用唯象概率模型计算方法对三角形沟槽、矩形沟槽、方孔及圆孔4种不同形状微陷阱结构的二次电子发射系数进行了研究,分析了微陷阱结构的形状、尺寸对二次电子发射系数抑制特性的影响规律.理论研究结果表明:陷阱结构的深宽比、孔隙率越大,则其二次电子发射系数抑制特性越明显;方孔形和圆孔形微陷阱结构的二次电子发射系数抑制效果优于三角形沟槽和矩形沟槽;具有大孔隙率的微陷阱结构表面的二次电子发射系数对入射角度的依赖显著弱于平滑表面.制备了具有不同表面形貌的金属样片并进行二次电子发射系数测试,所得实验规律与理论模拟规律符合较好.     

微孔阵列铜表面二次电子发射系数抑制研究

针对微孔阵列对铜表面二次电子发射系数(SEY)的抑制效应进行实验研究以提高电真空器件性能。首先利用Casino软件模拟了入射能量分别为0.5 keV和3 keV的电子束垂直入射到方形微孔阵列表面的SEY,分析了方孔阵列的深宽比和孔隙率对本征二次电子发射系数(ISEY)、背散射二次电子发射系数(BSEY)及总二次电子发射系数(TSEY)的影响。然后采用半导体光刻工艺在铜箔表面制备具有不同形貌参数的圆孔阵列,采用激光扫描显微镜进行形貌分析和几何结构参数提取,采用二次电子测试平台进行TSEY测试。仿真结果表明:微孔阵列的深宽比、孔隙率越大,其SEY抑制特性越明显;随着微孔阵列深宽比逐渐增大,SEY逐渐趋于饱和;入射电子束能量较低时,微孔阵列对SEY抑制效应比入射能量较高时更为明显。实验结果表明:微孔阵列能有效抑制铜表面SEY,实测结果与仿真结果规律一致,为微孔阵列结构用于铜表面SEY抑制提供了依据。     

氧等离子体处理对GaAs表面单层自组装SiO2纳米球薄膜的影响

二维纳米阵列结构因其重要的光学性能被广泛应用于各类光电子器件。本文对自组装单层SiO2纳米球掩模刻蚀法制备GaAs纳米柱二维阵列结构的关键工艺技术进行了研究。采用旋涂法在GaAs表面制备自组装单层SiO2纳米球,重点研究了GaAs表面氧等离子体亲水处理工艺对纳米球排列特性的影响,获得最佳工艺条件为功率配比100 W+80 W、腔室压力4 Pa、氧气流量20 mL/min、处理时间1200 s,并最终得到排列紧密的大面积单层纳米球薄膜。以单层纳米球为掩模,采用感应耦合等离子体刻蚀技术在GaAs表面制备了纳米柱阵列并测试了其表面光反射谱。测试结果表明,GaAs纳米柱阵列在特定波段的反射率降低至5%,远低于表面无纳米结构的薄膜材料表面高达40%的光反射。分析表明纳米柱可以激发米氏散射共振效应,从而有效降低反射率并提升光吸收。     

凹折射微透镜阵列的离子束刻蚀制作

利用光刻热熔成形工艺及离子束刻蚀制作 12 8× 12 8元凹微透镜阵列。所制硅及石英凹微透镜的典型基本图形分别为凹球冠形、凹柱形和矩顶凹面形。分析了在光致抗蚀剂柱凹微透镜图形制作过程中的膜系匹配特性 ,与制作该种微透镜有关的光掩模版的主要结构参数 ,以及光致抗蚀剂掩模工艺参数的控制依据等。探讨了在凹微透镜器件制作基础上利用成膜工艺开展平面折射微透镜器件制作的问题。采用扫描电子显微镜 (SEM)和表面轮廓仪测试了所制石英凹微透镜阵列的表面微结构形貌。给出了所制石英凹微透镜阵列远场光学特性的测试结果。     

铝阳极氧化的多孔结构抑制二次电子发射的研究

针对空间大功率微波部件中的二次电子倍增效应影响微波部件性能的问题,基于铝阳极氧化产生大深宽比、高孔隙率均匀纳米级多孔结构的特性,结合蒸发镀银技术,提出一种有效降低表面二次电子发射系数的方法.结果表明,相比于未阳极氧化的铝样片,在不清洗样片的情况下(实际的样片表面都会存在吸附或沾污),测试得到二次电子发射系数曲线的第一能量交叉点E1从45 eV增加到77 eV,最大二次电子发射系数SEY_(max)从2.68减小到1.52;在清洗样片的情况下(清洗是为了去除吸附或沾污,获得理想的表面),测试得到第一能量交叉点E_1从40 eV增加到211 eV,最大二次电子发射系数SEY_(max)从2.55减小到1.36.为了验证本文所提方法对抑制空间大功率微波部件二次电子倍增效应的有效性,分别将获得的未阳极氧化和阳极氧化后的二次电子发射系数数据用于一个X频段阻抗变换器设计中,结果显示,使用本文所提方法后,阻抗变换器的微放电阈值从7000 W提高到125000 W.本文研究的方法不仅对解决空间大功率微波部件的微放电问题有指导意义,而且对真空电子器件、加速器等领域的研究也具有重要参考价值.     

Rapid fabrication of microhole array structured optical fibers

A microhole array in a common single-mode fiber is fabricated by selective chemical etching of femtosecond-laser-induced fiber Bragg grating (FBG), which has a laser-modified region extending from the fiber core to the cladding-air boundary due to laser self-focusing. The shape and size of the orderly microhole on the fiber surface are controlled via changing conditions of FBG fabrication and chemical etching. A simultaneous sensing for surrounding refractive index and temperature is demonstrated by this microhole array FBG through measurement of the transmission power change and Bragg resonant wavelength shift.     

微米量级表面结构形貌特性对二次电子发射抑制的优化

抑制二次电子倍增效应是提高空间大功率微波器件和粒子加速器等设备性能的重要课题,而使用表面处理降低材料的二次电子发射系数是抑制二次电子倍增的有效手段.为优化寻找抑制效果最好的表面形貌,本文采用蒙特卡罗方法模拟了各种微米量级不同表面形貌的二次电子发射特性,研究占空比、深宽比、结构形状及排列方式等的影响.模拟结果表明,正方形、圆形、三角形凸起和凹陷结构的二次电子发射系数随占空比和深宽比的增大而减小,但存在饱和值;凸起结构的排列方式对二次电子发射系数的影响不大,但是凸起结构形状却对二次电子发射系数的影响较大,其中三角形的抑制效果最佳.对凹陷结构而言,不同形状的抑制效果差别不大;同时,占空比和深宽比相同时,凸起结构较凹陷结构抑制效果更佳.究其原因,核心在于垂直侧壁的“遮挡效应”,凹陷结构遮挡效应的大小与“陷阱”垂直高度有关,而凸起结构遮挡效应的大小和凸起部分的斜方向投影大小有关.     

Influence of surface topography on the secondary electron yield of clean copper samples

Secondary electron yield (SEY) due to electron impact depends strongly on surface topography. The SEY of copper samples after Ar-ion bombardment is measured in situ in a multifunctional ultrahigh vacuum system. Increasing the ion energy or duration of ion bombardment can even enlarge the SEY, though it is relatively low under moderate bombardment intensity. The results obtained with scanning electron microscopy and atomic force microscopy images demonstrate that many valley structures of original sample surfaces can be smoothed due to ion bombardment, but more hill structures are generated with stronger bombardment intensity. With increasing the surface roughness in the observed range, the maximum SEY decreases from 1.2 to 1.07 at a surface characterized by valleys, while it again increases to 1.33 at a surface spread with hills. This phenomenon indicates that hill and valley structures are respectively effective in increasing and decreasing the SEY. These obtained results thus provide a comprehensive insight into the surface topography influence on the secondary electron emission characteristics in scanning electron microscopy.     

深振幅Al调制靶的化学腐蚀制备工艺研究

 介绍了用于惯性约束聚变分解实验的铝调制靶的制备。以半导体光刻工艺结合化学腐蚀工艺在铝箔表面引入周期为50 μm的条槽图形,研究腐蚀条件对腐蚀速率的影响;采用光学显微镜、扫描电镜和台阶仪对图形形貌和样品表面成分进行测量和分析,获得厚度在32 μm左右、腐蚀深度达到20 μm的铝调制靶。     

半导体微碟激光器设计原理与工艺制作

用经典量子电动力学理论初步研究了半导体碟型微腔激光器的设计原理，采用光刻、反应离子刻蚀和选择化学腐蚀等现代微加工技术制备出抽运阈值功率很低用品质因数很高的低温光抽运InGaAs/InGaAsP多量子阱微碟激光器。这种激光器制作工艺简单，对有效光子状态密度调制较大，是比较理想的半导体微腔激光器。     

Tunable characteristic of phase-locked quantum cascade laser arrays

A multimode interference(MMI) structure is designed to simplify the fabrication of quantum cascade laser(QCL)phase-locked arrays. The MMI geometry is optimized with a sufficient output channel distance to accommodate conventional photolithography and wet etching process by which power amplifier array is fabricated without using the complicated two-step etching-regrowth or dry etching technique. The far-field pattern with periodically modulated peaks reveals that the beams from the arrays are phase-locked. Furthermore, the frequency tuning performance of the MMI-based phase-locked arrays is studied using the Littrow-configuration external cavity structure. A wavelength tuning range of more than 60 cm~(-1) is demonstrated, which will eventually realize the high power, frequency tunable, large-scale phase-locked arrays, and their application in spectroscopy.     

飞秒激光和酸刻蚀方法制作凹面微透镜阵列

基于飞秒激光光刻技术和氢氟酸对光学玻璃的刻蚀,在K9光学玻璃表面制作了凹面微透镜阵列,并且可以以此为模板实现凸微透镜阵列的大量复制.用相位对比显微镜和扫描电子显微镜分析了微透镜阵列的表面轮廓,测试了微透镜阵列的光学衍射特征.该方法简单、透镜参量可控,制作的微透镜阵列能够用于分光、光束匀化、并行光刻等强激光领域.     

金属规则表面形貌影响二次电子产额的解析模型

表面形貌是影响二次电子发射特性的重要因素, 但目前仍缺乏刻画这一影响规律的解析模型. 本文通过分析发现表面结构的遮挡作用是影响二次电子发射特性的主要因素. 基于二次电子以余弦角分布出射的规律, 提出了建立表面形貌参数与二次电子产额之间定量关系的方法, 并以矩形槽和三角槽为例, 建立了电子正入射和斜入射时的一代二次电子产额的解析模型. 将推导的解析模型与Monte Carlo模拟结果和实验结果进行了比较, 结果表明本文建立的模型能够正确反映规则表面形貌的二次电子产额. 本文的模型对于反映常用规则结构影响二次电子出射的规律以及指导通过表面结构调控二次电子发射特性都具有参考价值.     

Micro-optical components based on silicon mold technology

Two micro-optical components fabricated by silicon molds are described. One component is micro-cavity in micro-scales and the other is sub-micron grating with a pitch of 200 nm. The feasibility of two methods for the micro-fabrication of the silicon molds is investigated: one method is for making hundreds of micrometer size silicon molds by using conventional photolithography and deep reactive ion etching (Deep-RIE) technique combined with wet etching; and the other is for fabricating sub-micron grating molds by using electron beam lithography and fast atom beam etching (FAB). Sub-wavelength structure is successfully transferred from silicon mold to poly-methyl methacrylate (PMMA) material. The yield and repeatability of the original master are quite good. This technique can also be used to fabricate other micro-scale structures.     

Superhydrophobic properties of a hierarchical structure using a silicon micro-tip array decorated with ZnO nanowires

In this study, wetting properties of a hierarchical structure using a silicon micro-tip array covered with ZnO nanowire are characterized, and compared with hierarchical structures composed of micro-pillars for micro-scale roughness. The superhydrophobicity of a surface can be efficiently enhanced by using a micro-tip array, compared with a micro-pillar structure, because a micro-tip structure with high aspect ratio and small apex radius can significantly reduce fractions of liquid droplet area in contact, maintaining the droplet in the regime of the Cassie state. The micro-tip array was simply fabricated by combining anisotropic and isotropic silicon etching processes with one-step photolithography and a single etch mask. The measured height and aspect ratio of the fabricated micro-tip was around 40 μm and 8, respectively, when the center-to-center distance between micro-tips was 30 μm. The maximum CA on the hierarchical surface using the micro-tip array was measured to be 165.0 ± 2.3° with a period of 30 μm, while the hierarchical surface using the micro-pillar array showed the maximum CA of 158.6 ± 1.1° with 20 μm-diameter and 70 μm-gap between micro-pillars. The smallest CAH on the hierarchical micro-tip array was measured to be 5.0 ± 0.3° for the center-to-center distance between micro-tips of 30 μm.     

微透镜制作中光刻胶与衬底匹配行为的研究

利用光刻/离子束刻蚀制作大面阵硅微透镜阵列,采用SEM和表面探针测试等手段分析所制样品的形貌特点,定性讨论制备工艺的不同对所制器件的影响.所用工艺为大面阵微尖阵列和微合阵列的离子束刻蚀制作奠定了基础.     

Design of novel three port optical gates scheme for the integration of large optical cavity electroabsorption modulators and evanescently-coupled photodiodes

This paper presents a novel scheme to monolithically integrate an evanescently-coupled uni-travelling carrier photodiode with a planar short multimode waveguide structure and a large optical cavity electroabsorption modulator based on a multimode waveguide structure. By simulation, both electroabsorption modulator and photodiode show excellent optical performances. The device can be fabricated with conventional photolithography, reactive ion etching, and chemical wet etching.     

High power-added-efficiency AlGaN/GaN HEMTs fabricated by atomic level controlled etching

An atomic-level controlled etching(ACE)technology is invstigated for the fabrication of recessed gate AlGaN/GaN high-electron-mobility transistors(HEMTs)with high power added efficiency.We compare the recessed gate HEMTs with conventional etching(CE)based chlorine,Cl₂-only ACE and BCl³/Cl₂ACE,respectively.The mixed radicals of BCl₃/Cl₂were used as the active reactants in the step of chemical modification.For ensuring precise and controllable etching depth and low etching damage,the kinetic energy of argon ions was accurately controlled.These argon ions were used precisely to remove the chemical modified surface atomic layer.Compared to the HEMTs with CE,the characteristics of devices fabricated by ACE are significantly improved,which benefits from significant reduction of etching damage.For BCl₃/Cl₂ACE recessed HEMTs,the load pull test at 17 GHz shows a high power added efficiency(PAE)of 59.8%with an output power density of 1.6 W/mm at Vd=10 V,and a peak PAE of 44.8%with an output power density of 3.2 W/mm at Vd=20 V in a continuous-wave mode.     

Secondary electron emission yield from vertical graphene nanosheets by helicon plasma deposition

The secondary electron emission yields of materials depend on the geometries of their surface structures.In this paper,a method of depositing vertical graphene nanosheet(VGN)on the surface of the material is proposed,and the secondary electron emission(SEE)characteristics for the VGN structure are studied.The COMSOL simulation and the scanning electron microscope(SEM)image analysis are carried out to study the secondary electron yield(SEY).The effect of aspect ratio and packing density of VGN on SEY under normal incident condition are studied.The results show that the VGN structure has a good effect on suppressing SEE.