AlN插入层对AlxGa1-xN/GaN界面电子散射的影响

本文研究AlN作为Al_xGa_1-xN/GaN插入层引起的电子输运性质的变化, 考虑了Al_xGa_1-xN和AlN势垒层的自发极化、压电极化对Al_xGa_1-xN/AlN/GaN双异质结高电子迁移率晶体管(HEMT)中极化电荷面密度、二维电子气(2DEG) 浓度的影响, 分析了AlN厚度与界面粗糙度散射和合金无序散射的关系; 结果表明, 2DEG 浓度、界面粗糙度散射和合金无序散射依赖于AlN层厚度, 插入一层1–3 nm薄的AlN层, 可以明显提高电子迁移率.     

Quantum oscillations and nontrivial transport in(Bi_(0.92)In_(0.08))_2Se_3

Quantum phase transition in topological insulators has drawn heightened attention in condensed matter physics and future device applications.Here we report the magnetotransport properties of single crystalline(Bi_(0.92)In_(0.08))_2Se_3.The average mobility of～1000 cm~2·V~(-1)·s~(-1)is obtained from the Lorentz law at the low field(3 T)up to 50 K.The quantum oscillations rise at a field of～5 T,revealing a high mobility of～1.4×10~4cm~2·V~(-1)·s~(-1)at 2 K.The Dirac surface state is evident by the nontrivial Berry phase in the Landau–Fan diagram.The properties make the(Bi_(0.92)In_(0.08))_2Se_3a promising platform for the investigation of quantum phase transition in topological insulators.     

超薄EuF3电极修饰层对有机场效应晶体管性能的提升

采用EuF₃薄层修饰低功函数金属Ag源、漏电极,制备了CuPc有机场效应晶体管,研究了不同厚度EuF₃对器件性能的影响。结果表明,EuF₃的厚度由0 nm增至0.6 nm时,接触电阻由23.65×10⁵ Ω·cm减 至3.86×10⁵ Ω·cm,使得器件载流子迁移率由1.5×10^-3 cm²·V^-1·s^-1提高到4.65×10^-3 cm²·V^-1·s^-1。 UPS测试结果表明,薄层EuF₃在Ag与有机半导体间形成了界面偶极势垒,使源漏电极表面功函数增大,空穴注入势垒降低,Ag电极与有机半导体层界面的接触电阻减小,进而提升了空穴的注入效率。     

利用In0.82Ga0.18As与InP衬底之间的应力制作结构材料的缓冲层

采用低压金属有机化学气相淀积(LP-MOCVD)技术,在InP(100)衬底上生长In0.82Ga0.18As,研究生长温度对In0.82Ga0.18As材料表面形貌、结晶质量和电学性能的影响.利用InP(100)衬底与In0.82Ga0.18As材料晶格失配所产生的应变,在不同的生长温度下应变释放程度不同,进而在In...     

AlN隔离层生长时间对AlGaN/AlN/GaN HEMT材料电学性能的影响

利用金属有机化学气相沉积（MOCVD）设备,在蓝宝石（0001）面上外延不同生长时间AlN隔离层的Al_xGa_1-xN/AlN/GaN结构的高电子迁移率的晶体管（HEMT）,研究了AlN隔离层厚度对HEMT材料电学性能的影响。研究发现采用脉冲法外延（PALE）技术生长AlN隔离层的时间为12 s（1 nm左右）时,HEMT材料的方块电阻最小,电子迁移率为1 500 cm²·V^-1·s^-1,二维电子气（2DEG）浓度为1.16×10¹³ cm^-2。AFM测试结果表明,一定厚度范围内的AlN隔离层并不会对材料的表面形貌产生重大的影响。HRXRD测试结果表明,AlGaN/AlN/GaN具有好的异质结界面。     

沟道层厚度对室温制备的In2O3薄膜晶体管器件性能的影响

在室温下采用直流磁控溅射以SiO₂/Si为衬底制备了不同沟道层厚度的底栅式In₂O₃薄膜晶体管,讨论了沟道层厚度对底栅In₂O₃薄膜晶体管的电学性能的影响。实验结果表明:器件的特性与沟道层厚度有关,最优沟道层厚度的In₂O₃薄膜晶体管为增强型,其阈值电压为2.5 V,开关电流比约为10⁶,场效应迁移率为6.2 cm²·V^-1·s^-1。     

Non-destructive characterisation of (Ga,In,Al,As,P)-based ternary multilayer structures using spectroscopic ellipsometry

Spectroscopic ellipsometry has been used to measure compositions and layer thicknesses of two-, three- and four-layer structures consisting of Al_0.2Ga_0.8As/GaAs and In_0.53Ga_0.47As/Al_0.48In_0.52As/InP materials. A simple procedure has been developed to obtain Al_0.48In_0.52As dielectric functions by scaling InP values. Very good agreement has been obtained with destructive techniques.     

高灵敏度Sb基量子阱2DEG的霍尔器件

用分子束外延技术将高灵敏度的InAs/AlSb量子阱结构的Hall器件赝配生长在GaAs衬底上。设计了由双δ掺杂构成的Hall器件的新结构,有效地提高了器件的面电子浓度。与传统的没有掺杂的InAs/AlSb量子阱结构的Hall器件相比,室温下器件电子迁移率从15 000 cm²·V^-1·s^-1 提高到16 000 cm²·V^-1·s^-1。AFM测试表明材料有好的表面形态和结晶质量。从77 K 到300 K对Hall器件进行霍尔测试,结果显示器件不同温度范围有不同散射机构。双δ掺杂结构形成高灵敏度、高二维电子气（2DEG）浓度的InAs/AlSb异质结Hall器件具有广阔的应用前景。     

铟锡氧化物薄膜表面等离子体损耗降低的研究

本文采用直流磁控溅射方法在普通浮法玻璃基底上制备了立方多晶铁锰矿结构的铟锡氧化物(indium tin oxide, ITO)薄膜,并对其进行了结晶性、表面粗糙度、紫外-可见吸收光谱、折射率、介电常数及霍尔效应的测试.研究了溅射时基底温度的改变对于ITO薄膜的光电、表面等离子体性质的影响.随着基底温度由100?C升高至500?C,其光学带隙(3.64—3.97eV)展宽,减少了电子带间跃迁的概率,有效降低了ITO薄膜的光学损耗.与此同时,对应ITO薄膜的载流子浓度(4.1×10~(20)-—2.48×10~(21)cm~(-3))与迁移率(24.6—32.2 cm~2·V~(-1)·s~(-1))得到提高,电学损耗明显降低.     

基于聚(4-乙烯基苯酚)衬底修饰层喷墨打印的小分子有机半导体薄膜制备和表征

采用旋涂法预先在SiO₂衬底表面形成一层聚（4-乙烯基苯酚）（PVP）作为表面修饰层,以喷墨打印的6,13-双（三异丙基甲硅烷基乙炔基）并五苯（TIPS并五苯）作为有源层制作有机薄膜晶体管,有效改善了有机半导体薄膜的形貌。采用真空热蒸镀工艺制备源漏电极,形成底栅顶接触结构的有机薄膜晶体管（OTFT）器件。作为对比,在未经过表面修饰的SiO₂衬底上采用相同条件打印TIPS并五苯薄膜晶体管,发现在经过PVP修饰的SiO₂衬底上打印的单点厚度更均匀,咖啡环效应被抑制或被消除;而通过多点交叠打印形成的矩形薄膜的晶粒尺寸更大,相应的OTFT器件具有更高的场效应迁移率。在有PVP修饰层的衬底上制作的OTFT,器件在饱和区的平均场效应迁移率达到了0.065 cm²·V^-1·s^-1;而直接在SiO₂衬底上制作的器件,相应的平均场效应迁移率仅为0.02 cm²·V^-1·s^-1。     

Interband Stark effects in InxGa1−xAs/InyAl1−yAs coupled step quantum wells

The effects of an electric field on the interband transitions in In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum wells have been investigated both experimentally and theoretically. A In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum well sample consisted of the two sets of a 50 Å In_0.53Ga_0.47As shallow quantum well and a 50 Å In_0.65Ga_0.35As deep step quantum well bounded by two thick In_0.52Al_0.48As barriers separated by a 30 Å In_0.52Al_0.48As embedded potential barrier. The Stark shift of the interband transition energy in the In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum well is larger than that of the single quantum well, and the oscillator strength in the In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum well is larger than that in a coupled rectangular quantum well. These results indicate that In_xGa_1−xAs/In_yAl_1−yAs coupled step quantum wells hold promise for potential applications in optoelectron devices, such as tunable lasers.     

Control of symmetric properties of metamorphic In_(0.27)Ga_(0.73)As layers by substrate misorientation

Asymmetry in dislocation density and strain relaxation has a significant impact on device performance since it leads to anisotropic electron transport in metamorphic materials. So it is preferred to obtain metamorphic materials with symmetric properties. In this paper, we grew metamorphic In_(0.27)Ga_(0.73) As epilayers with symmetric low threading dislocation density and symmetric strain relaxation in two (110) directions using In Al Ga As buffer layers on 7°misoriented Ga As(001)substrates. To understand the control mechanism of symmetric properties of In_(0.27)Ga_(0.73) As layers by the substrate miscut angles, In_(0.27)Ga_(0.73) As grown on 2°and 15°misoriented substrates were also characterized as reference by atomic force microscopy, transmission electron microscopy, and high resolution triple axis x-ray diffraction. The phase separation and interaction of 60°misfit dislocations were found to be the reasons for asymmetry properties of In_(0.27)Ga_90.73 As grown on 2and 15°substrates, respectively. Photoluminescence results proved that the In_(0.27)Ga_(0.73) As with symmetric properties has better optical properties than the In_(0.27)Ga_(0.73) As with asymmetric properties at room temperature. These results imply that high quality metamorphic In_(0.27)Ga_(0.73) As can be achieved with controllable isotropic electron transport property.     

退火温度对溶胶-凝胶法制备锌锡氧化物薄膜晶体管的影响

采用溶胶-凝胶法制备了非晶锌锡氧化物(ZTO)薄膜晶体管(TFT),通过热重-差热分析(TG-DTA)对ZTO胶体中的化学反应进行了分析,研究了不同退火温度对ZTO TFTs性能的影响。结果表明:当退火温度在300~500℃范围内时,薄膜为非晶态结构,薄膜表面致密、平整。当退火温度达到400℃时,薄膜在可见光范围内具有高透过率(>85%)。随着退火温度的升高,器件阈值电压明显降低,由15.85 V降至3.76 V,载流子迁移率由0.004 cm²·V^-1·s^-1提高到5.16 cm²·V^-1·s^-1,开关电流比达到10⁵。退火温度的升高明显改善了ZTO TFT的电学性能。     

Electronic transport properties of silicon junctionless nanowire transistors fabricated by femtosecond laser direct writing

Silicon junctionless nanowire transistor(JNT) is fabricated by femtosecond laser direct writing on a heavily n-doped SOI substrate.The performances of the transistor,i.e.,current drive,threshold voltage,subthreshold swing(SS),and electron mobility are evaluated.The device shows good gate control ability and low-temperature instability in a temperature range from 10 K to 300 K.The drain currents increasing by steps with the gate voltage are clearly observed from 10 K to50 K,which is attributed to the electron transport through one-dimensional(1D) subbands formed in the nanowire.Besides,the device exhibits a better low-field electron mobility of 290 cm~2·V~(-1)·s~(-1),implying that the silicon nanowires fabricated by femtosecond laser have good electrical properties.This approach provides a potential application for nanoscale device patterning.     

空间用倒装三结太阳能电池及其抗辐射性能研究

使用金属有机化学气相沉积技术,在4英寸GaAs衬底上获得了空间用GaInP/GaAs/In_(0.3)Ga_(0.7)As倒装三结太阳能电池.高分辨X射线衍射和阴极射线发光测试结果表明AlInGaAs应力渐变缓冲层的晶格弛豫度约100%,其整面平均穿透位错密度约5.4×10~6/cm~2.与GaInP/InGaAs/Ge常规三结太阳能电池相比,在AM0光谱、25℃测试条件下,面积24 cm~2的倒装三结太阳能电池转换效率达到32%,输出功率提高了5%.采用1 MeV高能电子对倒装三结电池进行粒子辐照测试,电池各项性能参数随不同辐照剂量发生改变,在1×10~(15)/cm~2辐照总剂量下电池转换效率衰降比例达到15%.     

PVA栅绝缘层浓度对P3HT有机场效应晶体管性能的影响

采用溶液制备法制备了用PVA作为绝缘层、P3HT作为有源层的有机场效应晶体管,,研究了不同浓度PVA栅绝缘层对器件性能的影响。实验结果显示,以质量分数为8%的PVA溶液制备的栅绝缘层具有最好的性能,器件的场效应迁移率为0.31 cm²·V^-1·s^-1,阈值电压为-6 V。进一步分析了PVA栅绝缘层浓度对器件性能提高的原因,结果表明,对于制备溶液化的有机场效应晶体管,选取合适的PVA栅绝缘层浓度非常重要。     

空间用GaInP/GaAs/In0.3Ga0.7 As(1 eV)倒装三结太阳电池研制

采用阶变缓冲层技术 (step-graded) 外延生长了具有更优带隙组合的倒装GaInP/GaAs/In_0.3Ga_0.7As(1.0 eV) 三结太阳电池材料, TEM和HRXRD测试表明晶格失配度为2%的In_0.3Ga_0.7As 底电池具有较低的穿透位错密度和较高的晶体质量, 达到太阳电池的制备要求. 通过键合、剥离等工艺制备了太阳电池芯片. 面积为 10.922 cm² 的太阳电池芯片在空间光谱条件下转换效率达到32.64% (AM0, 25 ℃), 比传统晶格匹配的 GaInP/GaAs/Ge(0.67 eV) 三结太阳电池的转换效率提高3个百分点. 关键词： 太阳电池 三结 倒装结构     

Improved thermal property of strained InGaAlAs/AlGaAs quantum wells for 808-nm vertical cavity surface emitting lasers

The 808-nm vertical cavity surface emitting laser (VCSEL) with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is designed and fabricated. Compared with the VCSELs with Al_0.05Ga_0.95As/Al_0.3Ga_0.7As quantum wells, the VCSEL with strained In_0.13Ga_0.75Al_0.12As/Al_0.3Ga_0.7As quantum wells is demonstrated to possess higher power conversion efficiency (PCE) and better temperature stability. The maximum PCE of 43.8% for 10-μm VCSEL is achieved at an ambient temperature of 30 ℃. The size-dependent thermal characteristics are also analyzed by characterizing the spectral power and output power. It demonstrates that small oxide-aperture VCSELs are advantageous for temperature-stable performance.     

缓冲层InxGa1-xAs组分对In0.82Ga0.18As结晶质量和表面形貌的影响

采用低压金属有机化学气相沉积(LP-MOCVD)技术,两步生长法在InP衬底上制备In_0.82Ga_0.18As材料.研究缓冲层In_xGa_1-xAs的In组分对In_0.82Ga_0.18As结晶质量和表面形貌的影响.X射线衍射(XRD)用于表征材料的组分和结晶质量.用扫描电子显微镜(SEM)观察样品的表面形貌.实验结果表明,低温生长的缓冲层In_xGa_1-xAs的In组分影响高温生长的外延层In_0.82Ga_0.18As的结晶质量和表面形貌.测量得到四个样品的外延层In_0.82Ga_0.18As的X射线衍射谱峰半峰全宽(FWHM)为0.596°,0.68°,0.362°和0.391°,分别对应缓冲层In组分x=0.28,0.53,0.82,0.88,当缓冲层In组分是0.82时,FWHM最窄,表明样品的结晶质量最好.SEM观察四个样品的表面形貌,当缓冲层In组分是0.82时,样品的表面平整,没有出现交叉平行线或蚀坑等缺陷,表面形貌最佳.     

Fabrication and characterization of the normally-off N-channel lateral 4H–SiC metal–oxide–semiconductor field-effect transistors

In this paper, the normally-off N-channel lateral 4H–Si C metal–oxide–semiconductor field-effect transistors(MOSFFETs) have been fabricated and characterized. A sandwich-(nitridation–oxidation–nitridation) type process was used to grow the gate dielectric film to obtain high channel mobility. The interface properties of 4H–Si C/SiO_2 were examined by the measurement of HF I–V, G–V, and C–V over a range of frequencies. The ideal C–V curve with little hysteresis and the frequency dispersion were observed. As a result, the interface state density near the conduction band edge of 4H–Si C was reduced to 2 × 10~(11) e V~(-1)·cm~(-2), the breakdown field of the grown oxides was about 9.8 MV/cm, the median peak fieldeffect mobility is about 32.5 cm~2·V~(-1)·s~(-1), and the maximum peak field-effect mobility of 38 cm~2·V~(-1)·s~(-1) was achieved in fabricated lateral 4H–Si C MOSFFETs.