High-efficiency S-band harmonic tuning GaN amplifier

In this paper, we present a high-efficiency S-band gallium nitride （GaN） power amplifier （PA）. This amplifier is fabri- cated based on a self-developed GaN high-electron-mobility transistor （HEMT） with 10 mm gate width on SiC substrate. Harmonic manipulation circuits are presented in the amplifier. The matching networks consist of microstrip lines and discrete components. Open-circuited stub lines in both input and output are used to tune the 2rid harmonic wave and match the GaN HEMT to the highest efficiency condition. The developed amplifier delivers an output power of 48.5 dBm （70 W） with a power-added efficiency （PAE） of 72.2% at 2 GHz in pulse condition. When operating at 1.8-2.2 GHz （20% relative bandwidth）, the amplifier provides an output power higher than 48 dBm （,-~ 65 W）, with a PAE over 70% and a power gain above 15 dB. When operating in continuous-wave （CW） operating conditions, the amplifier gives an output power over 46 dBm （40 W） with PAE beyond 60% over the whole operation frequency range.     

Damage effect and mechanism of the GaAs high electron mobility transistor induced by high power microwave

In this paper, we present the damage effect and mechanism of high power microwave(HPM) on Al GaAs/GaAs pseudomorphic high-electron-mobility transistor(p HEMT) of low-noise amplifier(LNA). A detailed investigation is carried out by simulation and experiment study. A two-dimensional electro-thermal model of the typical GaAs p HEMT induced by HPM is established in this paper. The simulation result reveals that avalanche breakdown, intrinsic excitation, and thermal breakdown all contribute to damage process. Heat accumulation occurs during the positive half cycle and the cylinder under the gate near the source side is most susceptible to burn-out. Experiment is carried out by injecting high power microwave into GaAs p HEMT LNA samples. It is found that the damage to LNA is because of the burn-out at first stage p HEMT. The interiors of the damaged samples are observed by scanning electron microscopy(SEM) and energy dispersive spectrometer(EDS). Experimental results accord well with the simulation of our model.     

Analysis of the modulation mechanisms of the electric field and breakdown performance in AlGaN/GaN HEMT with a T-shaped field-plate

A novel Al Ga N/Ga N high electron mobility transistor(HEMT) with a source-connected T-shaped field-plate(ST-FP HEMT) is proposed for the first time in this paper. The source-connected T-shaped field-plate(ST-FP) is composed of a source-connected field-plate(S-FP) and a trench metal. The physical intrinsic mechanisms of the ST-FP to improve the breakdown voltage and the FP efficiency and to modulate the distributions of channel electric field and potential are studied in detail by means of two-dimensional numerical simulations with Silvaco-ATLAS. A comparison to the HEMT and the HEMT with an S-FP(S-FP HEMT) shows that the ST-FP HEMT could achieve a broader and more uniform channel electric field distribution with the help of a trench metal, which could increase the breakdown voltage and the FP efficiency remarkably. In addition, the relationship between the structure of the ST-FP, the channel electric field, the breakdown voltage as well as the FP efficiency in ST-FP HEMT is analyzed. These results could open up a new effective method to fabricate high voltage power devices for the power electronic applications.     

C band microwave damage characteristics of pseudomorphic high electron mobility transistor

The damage effect characteristics of Ga As pseudomorphic high electron mobility transistor(p HEMT) under the irradiation of C band high-power microwave(HPM) is investigated in this paper. Based on the theoretical analysis, the thermoelectric coupling model is established, and the key damage parameters of the device under typical pulse conditions are predicted, including the damage location, damage power, etc. By the injection effect test and device microanatomy analysis through using scanning electron microscope(SEM) and energy dispersive spectrometer(EDS), it is concluded that the gate metal in the first stage of the device is the vulnerable to HPM damage, especially the side below the gate near the source. The damage power in the injection test is about 40 d Bm and in good agreement with the simulation result. This work has a certain reference value for microwave damage assessment of p HEMT.     

Investigation of high sensitivity radio-frequency readout circuit based on AlGaN/GaN high electron mobility transistor

An Al Ga N/Ga N high electron mobility transistor(HEMT) device is prepared by using a semiconductor nanofabrication process. A reflective radio-frequency(RF) readout circuit is designed and the HEMT device is assembled in an RF circuit through a coplanar waveguide transmission line. A gate capacitor of the HEMT and a surface-mounted inductor on the transmission line are formed to generate LC resonance. By tuning the gate voltage V g, the variations of gate capacitance and conductance of the HEMT are reflected sensitively from the resonance frequency and the magnitude of the RF reflection signal. The aim of the designed RF readout setup is to develop a highly sensitive HEMT-based detector.     

A 24-GHz Patch Array with a Power Amplifier/Low-Noise Amplifier MMIC

This paper presents an active patch array designed at 24 GHz. It can be used as a front-end component for a phased array. A series resonant array structure is chosen which is compact and easy excite. With 5 elements, the array proved a 12-dB antenna gain. A power amplifier and a low noise amplifier are designed on a single GaAs chip (PALNA). Bias switch is used in the PALNA, which greatly reduces the switch loss in a transceiver and increases the efficiency. 20-dB small signal gain is achieved in both power amplifier and low noise amplifier. The active patch array is built by the combination of the patch array and PALNA. The measured active gain of this antenna is 35-dB for the PA mode and 31-dB for the LNA mode. This active patch array can obtain an EIRP of 34 dBm with a total radiated power of 22dBm and a maximum PAE of 32%. To check the noise performance, we applied sources at both normal temperature and 77K (liquid nitrogen) and extracted the noise figure (3.5 dB) of the active antenna by the Y factor method. The results proved that the active antenna is working efficiently as both a transmitting and receiving antenna.     

射频等离子体光源高效固态功率源的设计

针对射频等离子体光源(LEP)开发了一种较高抗负载失配能力的高效驱动功率源.采用三次谐波开路和偶次谐波短路,并利用集总参数和分布参数相结合的拓扑结构,实现了谐波控制的高效F类功率放大器;利用单片机控制固态源的工作频率,使其与光源谐振频率的变化一致,减小功放输出的驻波比,提高长期可靠性.对高效固态功率源进行连续波满功率测...     

X~Ku波段宽带驱动放大器设计

基于SiC衬底的0.25 μm GaN HEMT工艺,设计了一款X~Ku波段宽带1 W驱动放大器单片微波集成电路。设计使用了一种有源器件的大信号输出阻抗的等效RC模型验证了GaN HEMT工艺模型的准确性,并获得了不同尺寸的GaN HEMT的大信号输出阻抗。第一级管芯采用负反馈结构,降低匹配网络的Q值,通过带通匹配网络拓扑,实现了宽带匹配。测试结果表明,在28 V的工作电压下,8~18 GHz的频率内驱动放大器实现了输出功率大于30 dBm,功率附加效率大于21%,功率增益大于15 dB。芯片尺寸为:2.20 mm×1.45 mm。该芯片电路具有频带宽、效率高、尺寸小的特点,主要用于毫米波收发组件、无线通讯等领域,具有广泛的应用前景。     

长脉冲X波段多注相对论速调管放大器的初步实验研究

设计了工作在长脉冲的X波段同轴强流多注相对论速调管放大器, 对长脉冲强流多注电子束在多注器件结构中的传输、电子束经过输入腔和中间腔后的束流调制以及经过输出腔的微波提取等过程进行了实验研究, 采用了相应的设计措施以减轻实验中出现的脉冲缩短现象, 得到了初步的长脉冲实验结果. 在输入微波功率60 kW、频率9.378 GHz、电子束电压700 kV、束流4.2 kA、轴向引导磁感应强度1 T的条件下, 重频5Hz输出微波功率为670 MW, 脉宽89 ns, 效率为23%, 增益为40 dB, 输出微波频率与输入微波一致. 从实验上验证了几十千瓦级输入微波驱动X波段同轴多注RKA输出几百兆瓦长脉冲高功率微波的可行性, 为后续更高功率研究打下了基础.     

Investigation of trap states in Al_2O_3 InAlN/GaN metal–oxide–semiconductor high-electron-mobility transistors

In this paper the trapping effects in Al2O3/In0.17Al0.83N/Ga N MOS-HEMT(here, HEMT stands for high electron mobility transistor) are investigated by frequency-dependent capacitance and conductance analysis. The trap states are found at both the Al2O3/In Al N and In Al N/Ga N interface. Trap states in In Al N/Ga N heterostructure are determined to have mixed de-trapping mechanisms, emission, and tunneling. Part of the electrons captured in the trap states are likely to tunnel into the two-dimensional electron gas(2DEG) channel under serious band bending and stronger electric field peak caused by high Al content in the In Al N barrier, which explains the opposite voltage dependence of time constant and relation between the time constant and energy of the trap states.     

Simulation study of InAlN/GaN high-electron mobility transistor with AlInN back barrier

In this work, we use a 3-nm-thick Al_(0.64)In_(0.36)N back-barrier layer in In_(0.17)Al_(0.83) N/Ga N high-electron mobility transistor(HEMT) to enhance electron confinement. Based on two-dimensional device simulations, the influences of Al_(0.64)In_(0.36) N back-barrier on the direct-current(DC) and radio-frequency(RF) characteristics of In AlN/GaN HEMT are investigated, theoretically. It is shown that an effective conduction band discontinuity of approximately 0.5 eV is created by the 3-nm-thick Al_(0.64)In_(0.36) N back-barrier and no parasitic electron channel is formed. Comparing with the conventional In AlN/GaN HEMT, the electron confinement of the back-barrier HEMT is significantly improved, which allows a good immunity to short-channel effect(SCE) for gate length decreasing down to 60 nm(9-nm top barrier). For a 70-nm gate length, the peak current gain cut-off frequency( f_T) and power gain cut-off frequency( f_(max)) of the back-barrier HEMT are172 GHz and 217 GHz, respectively, which are higher than those of the conventional HEMT with the same gate length.     

Characterization of different-Al-content AlGaN/GaN heterostructures on sapphire

Al x Ga 1-x N/GaN high-electron-mobility transistor (HEMT) structures with Al composition ranging from x = 0.13 to 0.36 are grown on sapphire substrates by low-pressure metalorganic chemical vapor deposition (LP-MOCVD). The effects of Al content on crystal quality, surface morphology, optical and electrical characteristics of the AlGaN/GaN heterostructures have been analyzed. Although high Al-content (36%) heterostructure exhibits a distinguished photoluminescence peak related to recombination between the two-dimensional electron gas and photoexcited holes (2DEG-h), its crystal quality and rough surface morphology are poor. 2DEG mobility increases with the Al content up to 26% and then it apparently decreases for high Al-content (36%) AlGaN/GaN heterostructure. The increase of sheet carrier density with the increase of Al content has been observed. A high mobility at room temperature of 2105 cm 2 /V s with a sheet carrier density of n s = 1.10 × 10 13 cm -2 , for a 26% Al-content AlGaN/GaN heterostructure has been obtained, which is approaching state-of-the-art for HEMT grown on SiC. Sheet resistance as low as 274 Ω/□ has also been achieved.     

High linearity AlGaN/GaN HEMT with double-Vth coupling for millimeter-wave applications

We demonstrated an AlGaN/GaN high electron mobility transistor(HEMT)namely double-Vthcoupling HEMT(DVC-HEMT)fabricated by connecting different threshold voltage(Vth)values including the slant recess element and planar element in parallel along the gate width with N;O plasma treatment on the gate region.The comparative studies of DVC-HEMT and Fin-like HEMT fabricated on the same wafer show significantly improved linearity of transconductance(Gm)and radio frequency(RF)output signal characteristics in DVC-HEMT.The fabricated device shows the transconductance plateau larger than 7 V,which yields a flattened fT/fmax-gate bias dependence.At the operating frequency of 30 GHz,the peak power-added efficiency(PAE)of 41%accompanied by the power density(Pout)of 5.3 W/mm.Furthermore,the proposed architecture also features an exceptional linearity performance with 1-d B compression point(P1 d B)of 28 d Bm,whereas that of the Fin-like HEMT is 25.2 d Bm.The device demonstrated in this article has great potential to be a new paradigm for millimeter-wave application where high linearity is essential.     

锁频锁相的高功率微波器件技术研究

综述了中国工程物理研究院应用电子学研究所锁频锁相的高功率微波器件最新研究成果,主要包括稳频稳相的相对论速调管放大器和注入锁相的相对论返波管振荡器.针对高功率长脉冲相对论速调管研究中遇到的问题,介绍了该放大器的束波互作用特点、杂频振荡抑制、脉冲缩短、高频段高功率运行、高增益等物理、设计与实验中的关键技术研究概况,使其功率、相位稳定性、增益等性能有了显著提高,S波段环形单注相对论速调管实现了高功率稳相输出,重频25 Hz运行时输出功率大于1 GW,脉宽大于150 ns、相位波动18°,高增益运行时在注入微波功率数kW条件下也实现类似功率和相位水平;采用同轴多注器件结构,突破了速调管高频段运行条件下高效率电子束引入和高功率束波转换技术等难题,使X波段相对论速调管在注入功率30 kW条件下实现了功率大于1 GW的放大输出,效率为34%,相位波动为15°.在掌握相对论返波管技术的基础上,利用返波管的高效率和结构紧凑的优点,开展了注入调制电子束锁相的相对论返波管研究,采用百kW级的种子微波实现了对GW量级输出微波的相位锁定.该研究结果对功率合成、粒子加速和多功能雷达等技术具有重要的推动作用.     

128 W单频线偏振光纤放大器特性研究

高功率单频激光在激光雷达、光谱学、精密测量等领域具有广阔的应用前景.采用中心波长为1064 nm、光谱线宽为20 kHz、偏振消光比（PER）高于20 dB的单频线偏振分布式反馈光纤激光器做种子源（尾纤输出功率约为10 mW）,利用种子注入主振荡功率光纤放大技术,通过两级级联放大实现了128 W高功率单频、线偏振、近衍射极限单模连续激光输出.主放大器光-光效率达到83%,PER高于12 dB.采用分段温控技术有效地提高了光纤中的受激布里渊散射（SBS）阈值,实验中未观察到明显的放大自发辐射和SBS现象,进 关键词： 掺Yb光纤放大器 主振荡功率光纤放大 单频 线偏振     

高电子迁移率晶体管放大器高功率微波损伤机理

在TCAD半导体仿真环境中,建立了0.25 m栅长的AlGaAs/InGaAs高电子迁移率晶体管(HEMT)低噪声放大器与微波脉冲作用的仿真模型,基于器件内部的电场强度、电流密度和温度分布的变化,研究了1 GHz的微波从栅极和漏极注入的损伤机理。研究结果表明,从栅极注入约40.1 dBm的微波时,HEMT内部峰值温度随着时间的变化振荡上升,最终使得器件失效,栅下靠源侧电流通道和强电场的同时存在使得该位置最容易损伤;从漏极注入微波时,注入功率的高低会使器件内部出现不同的响应过程,注入功率存在一个临界值,高于该值,器件有可能在第一个周期内损伤,损伤位置均在漏极附近。在1 GHz的微波作用下,漏极注入比栅极注入更难损伤。     

离轴X波段五腔高增益速调管放大器

利用辛普森算法求解螺线管线圈内磁场分布,证明了离轴磁场能用于电子束的聚束。利用2维粒子模拟程序建立了X波段五腔高增益速调管放大器模型,整管模拟得到了频率9.45GHz、输出功率300MW、增益50.3dB和效率37.5%的微波输出。依此设计了X波段五腔高增益速调管放大器的三维模型,并将其分别放置在线圈中心轴和离轴54mm的位置进行模拟,模拟结果证明工作在离轴状态的器件同样可以进行微波放大。最后,对一个螺线管线圈内放置七个器件的状态进行了三维模拟,其合成功率输出可达2GW。     

具有部分本征GaN帽层新型AlGaN/GaN高电子迁移率晶体管特性分析

为了优化传统Al GaN/GaN高电子迁移率晶体管(high electron mobility transistors,HEMTs)器件的表面电场,提高击穿电压,本文提出了一种具有部分本征GaN帽层的新型Al GaN/GaN HEMTs器件结构.新型结构通过在Al GaN势垒层顶部、栅电极到漏电极的漂移区之间引入部分本征GaN帽层,由于本征GaN帽层和Al GaN势垒层界面处的极化效应,降低了沟道二维电子气(two dimensional electron gas,2DEG)的浓度,形成了栅边缘低浓度2DEG区域,使得沟道2DEG浓度分区,由均匀分布变为阶梯分布.通过调制沟道2DEG的浓度分布,从而调制了Al GaN/GaN HEMTs器件的表面电场.利用电场调制效应,产生了新的电场峰,且有效降低了栅边缘的高峰电场,Al GaN/GaN HEMTs器件的表面电场分布更加均匀.利用ISE-TCAD软件仿真分析得出:通过设计一定厚度和长度的本征GaN帽层,Al GaN/GaN HEMTs器件的击穿电压从传统结构的427 V提高到新型结构的960 V.由于沟道2DEG浓度减小,沟道电阻增加,使得新型Al GaN/GaN HEMTs器件的最大输出电流减小了9.2%,截止频率几乎保持不变,而最大振荡频率提高了12%.     

Low power fluorine plasma effects on electrical reliability of AlGaN/GaN high electron mobility transistor

The new electrical degradation phenomenon of the AlGaN/GaN high electron mobility transistor(HEMT) treated by low power fluorine plasma is discovered. The saturated current, on-resistance, threshold voltage, gate leakage and breakdown voltage show that each experiences a significant change in a short time stress, and then keeps unchangeable. The migration phenomenon of fluorine ions is further validated by the electron redistribution and breakdown voltage enhancement after off-state stress. These results suggest that the low power fluorine implant ion stays in an unstable state. It causes the electrical properties of AlGaN/GaN HEMT to present early degradation. A new migration and degradation mechanism of the low power fluorine implant ion under the off-stress electrical stress is proposed. The low power fluorine ions would drift at the beginning of the off-state stress, and then accumulate between gate and drain nearby the gate side. Due to the strong electronegativity of fluorine, the accumulation of the front fluorine ions would prevent the subsequent fluorine ions from drifting, thereby alleviating further the degradation of AlGaN/GaN HEMT electrical properties.