紫外有机发光器件的激子形成区域优化与掺杂调控

采用空穴传输兼发光层CBP和电子传输兼发光层TAZ构建了紫外有机电致发光器件(UVOLED),通过调控功能层厚度可以优化激子形成区域,进而改善器件性能。实验结果表明:CBP厚度的变化对器件性能影响甚微,而TAZ厚度变化则有显著影响。当CBP和TAZ厚度分别为50 nm和30 nm时,获得了最大辐照度为4.4 m W/cm2@270 m A/cm2、外量子效率(EQE)为0.94%@12.5 m A/cm2,发光来自于CBP主发光峰~410nm以及TAZ肩峰~380 nm的UVOLED器件。在此基础上,通过在CBP/TAZ界面引入超薄[CBP∶TAZ]掺杂层可以加速激子复合,降低器件驱动电压,同时还有利于改善载流子平衡性,提高发光效率(最大EQE达到了0.97%@20 m A/cm2)而不影响光谱特性。     

ITO界面调制层对GZO电极LED器件性能的影响

采用磁控溅射制备GZO和具有ITO界面调控层的GZO(ITO/GZO)透明导电薄膜作为大功率LED的电流扩散层,对比研究界面调控层对LED器件性能的影响。研究结果表明,ITO/GZO薄膜的透过率在可见光区达80%以上,退火后的ITO/GZO薄膜有较低的电阻率(1.15×10^-3 Ω·cm)。ITO调控层的介入能够调制GZO表面粗糙度,有利于改善LED外量子效率,降低GZO/p-GaN界面的接触势垒,提高LED器件的光电性 能。通过ITO界面调控后,LED器件20 mA驱动电流下的工作电压从9.5 V降低为6.8 V,发光强度从245 mcd 升到297 mcd,提高了20%;驱动电流为35 mA时,其发光强度从340.5 mcd 升到511 mcd,提高了50%。     

电极结构优化对大功率GaN基发光二极管性能的影响

在台面结构的GaN基发光二极管(LED)里，电流要侧向传输，当尺寸与电流密度加大之后，由于n型GaN层和下限制层的横向电阻不能忽略，造成了横向电流分布不均匀.通过优化电极结构，以减小电流横向传输距离，制作出两种不同电极结构的大功率GaN基倒装LED.通过比较这两种不同电极结构的GaN基倒装大功率LED的电、光性能，发现在350mA正向电流下，插指电极结构的倒装大功率GaN基LED的正向电压为3.35V，比环形插指电极结构的倒装大功率GaN基LED高0.15V.尽管环形插指电极结构GaN基LED的发光面积略小于插指电极结构GaN基LED，但在大电流下，环形插指电极结构倒装GaN基LED的光输出功率比插指电极结构的倒装大功率LED的光输出功率大.并且在大电流下，环形插指电极结构的倒装大功率LED光输出功率饱和速度慢，而插指电极结构的倒装大功率LED光输出功率饱和明显.这说明优化电极结构能提高电流扩展均匀性，减小焦耳热的产生，改善GaN基LED的性能.     

GaN基LED低温空穴注入层的MOCVD生长研究

针对GaN基LED空穴注入效率低的问题,在量子阱与电子阻挡层之间插入低温空穴注入层（LT-HIL）,实验研究了MOCVD生长LT-HIL时二茂镁（Cp₂Mg）流量和生长温度的影响。结果表明：随着Cp₂Mg流量的增加,外延薄膜晶体质量下降,外延片表面平整度和均匀性降低;而受Mg掺杂时补偿效应的影响,主波长先红移后蓝移,芯片的输出光功率先升高后降低,正向电压先降低后升高。相比于无LT-HIL的样品,在20 mA工作电流下,Cp₂Mg流量为1.94 μmol/min时制备的芯片的输出光功率提升20.3%,而正向电压降低0.1 V。在Cp₂Mg流量较大时,LT-HIL的渐变式生长温度对外延质量有所改善,但不是主要影响因素。     

Performance improvement of Ga N-based light-emitting diodes transferred from Si(111) substrate onto electroplating Cu submount with embedded wide p-electrodes

Crack-free Ga N/In Ga N multiple quantum wells(MQWs) light-emitting diodes(LEDs) are transferred from Si substrate onto electroplating Cu submount with embedded wide p-electrodes. The vertical-conducting n-side-up configuration of the LED is achieved by using the through-hole structure. The widened embedded p-electrode covers almost the whole transparent conductive layer(TCL), which could not be applied in the conventional p-side-up LEDs due to the electrodeshading effect. Therefore, the widened p-electrode improves the current spreading property and the uniformity of luminescence. The working voltage and series resistance are thereby reduced. The light output of embedded wide p-electrode LEDs on Cu is enhanced by 147% at a driving current of 350 m A, in comparison to conventional LEDs on Si.     

GaN-based light-emitting diode with ZnO nanotexture layer prepared using hydrogen gas

ZnO films were deposited on indium tin oxide (ITO), which formed the transparent conductive layer (TCL) of a GaN-based light-emitting diode (LED), by ultrasonic spraying pyrolysis to increase the light output power. The ZnO nanotexture was formed by treating the as-deposited ZnO films with hydrogen. The root mean square (RMS) roughness increased from 4.47 to 7.89 nm before hydrogen treatment to 10.82-15.81 nm after hydrogen treatment for 20 min. Typical current-voltage (I-V) characteristics of the GaN-based LEDs with a ZnO nanotexture layer have a forward-bias voltage of 3.25 V at an injection current of 20 mA. The light output power of a GaN-based LED with a ZnO nanotexture layer improved to as much as about 27.5% at a forward current of 20 mA.     

[1ChCl∶2EG]/CrCl3·6H2O离子液体中Cr(Ⅲ)配合物的研究

利用电喷雾质谱(ESI-MS)和紫外-可见吸收光谱(UV-Vis)分析,研究了CrCl₃·6H₂O 浓度为0.1～0.6 mol·L-1的水溶液和[1ChCl∶2EG]/CrCl₃·6H₂O ILs中,Cr(Ⅲ)配合物的存在形式。研究结果表明,在含有CrCl₃·6H₂O的溶液中,Cr(Ⅲ)与Cl-和H₂O形成[Cr(H₂O)_nCl_6-n]n-3配合物,其配合物的优势物种受CrCl₃·6H₂O浓度的影响。水溶液中Cr(Ⅲ) 的优势配合物为[Cr(H₂O)₆]3+与[Cr(H₂O)₅Cl]2+,并随CrCl₃·6H₂O浓度增加,水溶液的UV-Vis吸收光谱峰红移,[Cr(H₂O)₅Cl]2+的相对含量增加。而[1ChCl∶2EG]/CrCl₃·6H₂O ILs中的优势配合物为[Cr(H₂O)₂Cl₄]-和[Cr(H₂O)₃Cl₃],且随CrCl₃·6H₂O 浓度增加,溶液的颜色从浅橙红色逐渐变为深绿色,溶液的UV-Vis吸收光谱峰蓝移,[Cr(H₂O)₃Cl₃]的相对量增加。说明CrCl₃·6H₂O的浓度变化,将影响配体Cl-和H₂O与Cr(Ⅲ)配位结合的配位数,从而影响配合物优势物种的相对量。     

AgO_x界面插入层对GZO电极LED器件性能的影响

采用磁控溅射的方法在p-GaN上制备了GZO透明导电薄膜,通过在p-GaN和GZO界面之间插入AgOx薄层来改善LED器件的接触性能。研究结果表明:氮气退火后,采用界面插入层的AgOx/GZO薄膜电阻率为5.8×10-4Ω.cm,在可见光的透过率超过80%。AgOx界面插入层有效地降低了GZO与p-GaN之间的接触势垒,表现出良好的欧姆接触特性,同时使LED器件的光电性能获得了显著的提高。在50 mA的注入电流下,相比于常规的GZO电极LED器件,AgOx/GZO电极LED器件的正向电压由9.68 V降至6.92 V,而发光强度提高了13.5%。     

注入电流对绿光高压LED光电特性的影响

设计并制备了12 V 的GaN基绿光高压发光二极管（LED）,并对其进行了变电流测试。研究了绿光高压LED的正向电压、峰值波长、光功率以及光效等重要参数随注入电流的变化关系,电流变化范围为3~50 mA,测试温度为25 ℃。实验结果表明：电流对绿光高压LED的光电特性有很大影响。在驱动电流为20 mA时,对应电压为14 V。随着注入电流的增大,峰值波长蓝移了2 nm。随着电流的增大,光功率近似于线性增加。在注入电流从3 mA增大到20 mA的过程中,光效降低了约61%;在注入电流从20 mA增大到50 mA的过程中,光效降低了约39%。这说明高压LED在大电流驱动时,光效降低的幅度比较缓慢。上述结果对 GaN基绿光高压 LED 的改进优化具有一定的参考价值。     

Enhanced thermal stability of Ag ohmic reflector for InGaN/GaN light-emitting diode using a Ru capping layer

A Ru capping layer is employed to improve the thermal stability of Ag ohmic reflectors for high-power GaN-based light-emitting diodes (LEDs). The 20-nm-thick Ru capping layer is shown to be fairly effective in suppressing agglomeration by forming RuO₂. The Ag/Ru contacts exhibit specific contact resistance of 8.1 × 10⁻⁵ Ω cm² and reflectance of ∼89% at a wavelength of 450 nm when annealed at 500 °C for 1 min, which are much better than that of Ag only contacts. Blue LEDs fabricated with the 500 °C-annealed Ag/Ru contacts give a forward voltage of 2.98 V at an injection current of 20 mA, which is lower than that (3.02 V) of LEDs with the 500 °C-annealed Ag only contacts. LEDs with the 500 °C-annealed Ag/Ru contacts show 25% higher output power (at 20 mA) than LEDs with the 500 °C-annealed Ag only contacts. X-ray photoemission spectroscopy examinations are performed to describe the improved electrical performance of the Ag/Ru contacts.     

940nm垂直腔面发射激光器的设计及制备

利用PICS3D计算得到InGaAs/GaAsP应变补偿量子阱的增益特性,得到量子阱的各项参数,再通过传输矩阵理论和TFCalc膜系设计软件分别仿真出上下分布式布拉格反射镜的白光反射谱.采用金属有机化合物气相沉积技术外延生长了垂直腔面发射激光器结构,之后通过干法刻蚀、湿法氧化以及金属电极等芯片技术制备得到8μm氧化孔径的VCSEL芯片.最终,测试得到其光电特性实现室温下阈值电流和斜效率分别为0.95 mA和0.96 W/A,在6 mA电流和2 V电压下输出功率达到4.75 mW,并测试了VCSEL的高温特性.     

High power and high reliability GaN/InGaN flip-chip light-emitting diodes

High-power and high-reliability GaN/InGaN flip-chip light-emitting diodes (FCLEDs) have been demonstrated by employing a flip-chip design, and its fabrication process is developed. FCLED is composed of a LED die and a submount which is integrated with circuits to protect the LED from electrostatic discharge (ESD) damage. The LED die is flip-chip soldered to the submount, and light is extracted through the transparent sapphire substrate instead of an absorbing Ni/Au contact layer as in conventional GaN/InGaN LED epitaxial designs. The optical and electrical characteristics of the FCLED are presented. According to ESD IEC61000-4-2 standard (human body model), the FCLEDs tolerated at least 10\,kV ESD shock have ten times more capacity than conventional GaN/InGaN LEDs. It is shown that the light output from the FCLEDs at forward current 350mA with a forward voltage of 3.3\,V is 144.68\,mW, and 236.59\,mW at 1.0\,A of forward current. With employing an optimized contact scheme the FCLEDs can easily operate up to 1.0\,A without significant power degradation or failure. The life test of FCLEDs is performed at forward current of 200\,mA at room temperature. The degradation of the light output power is no more than 9\% after 1010.75\,h of life test, indicating the excellent reliability. FCLEDs can be used in practice where high power and high reliability are necessary, and allow designs with a reduced number of LEDs.     

Mg0.57Zn0.43O合金薄膜生长及性能表征

本文利用金属有机气相沉积法(MOCVD)生长单一立方相Mg_0.57Zn_0.43O (记作立方MZO)合金薄膜, 以及该合金薄膜在后期热处理过程中质量和热稳定性的关系. 通过X射线衍射等测试发现, 后期热处理对于立方MZO合金薄膜质量具有较大的影响. 其中在500–850℃的条件下, 合金薄膜的结晶质量和表面形貌随温度的增加得到明显的改善, 吸收截止边逐渐蓝移,带隙展宽, 但仍保持单一立方结构. 当温度达到950℃时立方MZO合金薄膜出现混合相. 通过对立方MZO合金薄膜制备的MSM型单元器件进行光响应的测试表明, 在外加15 V的偏压下, 器件的响应峰值在260 nm附近,紫外/可见抑制比大约为4个数量级, 饱和响应度为3.8 mA/W, 暗电流值为5 pA左右. 关键词： MOCVD 0.57Zn_0.43O')" href="#">Mg_0.57Zn_0.43O 热处理 光响应     

倒置器件结构及局域等离子体效应对CdSe量子点LED发光性能的改进

研究了倒置器件结构以及CdSe量子点发光材料与金属纳米粒子之间的相互作用对量子点的电致发光性能的影响。利用TiO₂作为电子传输/注入层,成功地制备了倒置结构的量子点电致发光器件。通过对单载流子器件电压-电流特性的分析,证明了ITO作为阴极到TiO₂的电子注入特性与Al作为阴极时的效果几乎相同。观察到金属纳米粒子产生的局域等离子体效应提高了器件的效率,使得效率随电流增大而降低的速度明显减小。在电流密度为200 mA/cm²时,电致发光器件的效率大约提高了42%。     

Effects of precursors on nucleation in atomic layer deposition of HfO2

Atomic layer deposition of hafnium dioxide (HfO₂) on silicon substrates was studied. It was revealed that due to low adsorption probability of HfCl₄ on silicon substrates at higher temperatures (450–600 °C) the growth was non-uniform and markedly hindered in the initial stage of the HfCl₄–H₂O process. In the HfI₄–H₂O and HfI₄–O₂ processes, uniform growth with acceptable rate was obtained from the beginning of deposition. As a result, the HfI₄–H₂O and HfI₄–O₂ processes allowed deposition of smoother, more homogeneous and denser films than the HfCl₄–H₂O process did. The crystal structure developed, however, faster at the beginning of the HfCl₄–H₂O process.     

Li修饰的C$lt;sub$gt;6$lt;/sub$gt;分子对H$lt;sub$gt;2$lt;/sub$gt;O的吸附研究

采用密度泛函理论中的广义梯度近似研究C₆Li吸附H₂O分子并将之进行分解的催化过程. 几何优化发现：Li原子最稳定的吸附位置是位于C 原子顶位上方. 研究表明,第一个H₂O 分子吸附在C₆Li上需要克服1.77 eV的能量势垒,然后分解为H和OH且与Li原子成键. 当吸附第二个H₂O分子时,第二个H₂O分子需要克服1.2 eV的能量势垒分解为H和OH,其中H与Li原子上的H原子结合成H₂,OH则替代Li 原子上的H结合在Li原子上. 因此C₆Li 可以作为催化剂将H₂O分子进行分解得到H₂. 分析可知：C₆Li主要是通过Li原子与H₂O之间形成的偶极矩作用来吸附H₂O 分子,与C₆₀Li₁₂ 的储氢机制类似. 研究结果可为储氢材料的制备提供一个新的思路. 关键词： 6')" href="#">C₆ Li 2O')" href="#">H₂O 密度泛函理论     

The interaction of water with solid surfaces: Fundamental aspects

The purpose of this review is to compare and discuss recent experimental and theoretical results in the field of H₂O-solid interactions. We emphasize studies of low (submonolayer) coverages of water on well-characterized, single-crystal surfaces of metals, semiconductors and oxides. We discuss the factors which influence dissociative versus associative adsorption pathways. When H₂O adsorbs molecularly, it tends to form three-dimensional hydrogen-bonded clusters, even at fractional monolayer coverages, because the strength of the attractive interaction between two molecules is comparable to that of the substrate-H₂O bond. The template effect of the substrate is important in determining both the local orientation and long-range order of H₂O molecules in these clusters. The influence of surface additive atoms (e.g., O, Br, Na, K) and also surface imperfections (e.g. steps and defects) on the surface structure and chemistry of H₂O is examined in detail. Some results on single-crystal substrates are compared with earlier measurements of H₂O adsorption on high-area materials.     

InGaN蓝光与CdTe纳米晶基白光LED

报道了倒装焊InGaN蓝光LED与黄光CdTe纳米晶的复合结构。利用蓝光作为CdTe纳米晶的激发源,通过光的下转换机制,将部分蓝光转化为黄光,复合发射出白光。室温下正向驱动电流为10mA时,发光色品坐标为x=0.29,y=0.30。实验表明,该复合结构白光LED的一大优点在于,复合光的色品坐标几乎不随正向驱动电流大小变化,颜色稳定。     

Heat-treatment studies of molybdenum oxide-monohydrate

The dehydration of molybdic acid, MoO₃---H₂O, was studied by thermal analysis, X-ray diffractometry and FTIR spectroscopy. The results show that an intermediate phase, MoO₃-2/3H₂O is formed at 216 °C and the monoclinic form of MoO₃ is grown above 350 °C. The mechanism of dehydration and structural rearrangement were confirmed by the features of the infrared spectra showing formation of corner-shared MoO₆ octahedra.     

Electrical conductivity and defect structure of Mg-doped Cr2O3

The electrical conductivity of Cr₂O₃ nominally doped with 2 mol% MgO has been studied by the four point a.c. technique as a function of the oxygen activity (O₂ + Ar, CO + CO₂ and H₂ + H₂O) in the temperature range 400–1200 °C. It is concluded that Cr₂O₃ doped with MgO is an extrinsic conductor and that the dissolved Mg-dopant is compensated by the formation of electron holes at near atmospheric oxygen pressures and by oxygen vacancies (or possibly interstitial chromium ions) at highly reduced oxygen activities (in CO + CO₂ and H₂ + H₂O gas mixtures). In H₂ + H₂O mixtures Mg-doped chromia also dissolves hydrogen as protons and significantly affects the defect structure and electrical conductivity. The defect structure of the oxide under various conditions is discussed.