基于1/f噪声的NPN晶体管辐照感生电荷的定量分离

本文针对NPN双极性晶体管, 在研究辐照感生的氧化层电荷及界面态对晶体管基极电流和1/f噪声的影响的基础上, 建立辐照感生氧化层电荷及界面态与基极电流和1/f噪声的定量物理模型. 根据所建立的模型, 提出一种新的分离方法, 利用1/f噪声和表面电流求出氧化层电荷密度, 利用所求得氧化层电荷密度和表面电流求出界面态密度. 利用本方法初步实现了辐照感生氧化层电荷及界面态的定量计算.     

Total ionizing dose effects of domestic Si Ge HBTs under different dose rates

The total ionizing radiation(TID) response of commercial NPN silicon germanium hetero-junction bipolar transistors(Si Ge HBTs) produced domestically are investigated under dose rates of 800 m Gy(Si)/s and 1.3 m Gy(Si)/s with a Co-60 gamma irradiation source. The changes of transistor parameters such as Gummel characteristics, and excess base current before and after irradiation, are examined. The results of the experiments show that for the KT1151, the radiation damage is slightly different under the different dose rates after prolonged annealing, and shows a time dependent effect(TDE). For the KT9041, however, the degradations of low dose rate irradiation is higher than for the high dose rate, demonstrating that there is a potential enhanced low dose rate sensitivity(ELDRS) effect for the KT9041. The possible underlying physical mechanisms of the different dose rates responses induced by the gamma rays are discussed.     

电子辐射环境中NPN输入双极运算放大器的辐射效应和退火特性

本文对不同偏置下的NPN输入双极运算放大器LM108分别在1.8 MeV和1 MeV两种电子能量下、不同束流电子辐照环境中的损伤特性及变化规律进行了研究, 分析了不同偏置状态下其辐照敏感参数在辐照后三种温度 (室温, 100 ℃, 125 ℃) 下随时间变化的关系, 讨论了引起电参数失效的机理, 并且分析了器件在室温和高温的退火效应以讨论引起器件电参数失效的机理. 结果表明, 1.8 MeV和1 MeV 电子对运算放大器LM108主要产生电离损伤, 相同束流下1.8 MeV电子造成的损伤比1 MeV 电子更大, 相同能量下0.32 Gy(Si)/s束流电子产生的损伤大于1.53 Gy(Si)/s束流电子. 对于相同能量和束流的电子辐照, 器件零偏时的损伤大于正偏时的损伤. 器件辐照后的退火行为都与温度有较大的依赖关系, 而这种关系与辐照感生的界面态密度增长直接相关.     

氮化镓基蓝光发光二极管伽马辐照的1/f噪声表征

通过电离辐照对氮化镓基蓝光发光二极管器件有源区光/暗电流产生机制的研究, 建立了电离辐照减小发光二极管有效输出功率电学模型.通过电离辐照对氮化镓基蓝光发光 二极管器件有源区1/f噪声影响机制的研究, 建立了电离辐照增大发光二极管1/f噪声的相关性模型.在I < 1 μA 的小注入区,空间电荷区的复合电流随辐照剂量的增加而增加. 同时, 随着电离辐照产生缺陷的增加, 1/f噪声幅度增大. 在 I> 1 mA 的大注入条件下, 由于串联电阻的影响占主导地位,表面复合速率和电流随辐照剂量的增加而增加.同时, 随着电离辐照产生缺陷的增加, 1/f噪声幅度增大.根据辐照前后电流电压试验结果噪声测试结论, 证实了实验结论与理论推导结果的一致性. 在1 μA < I < 5×10^-5 A 的中值电流情况下, 由于高能载流子散射相关的迁移率涨落与辐照新增缺陷引起的载流子数涨落竞争机制, 随着辐照剂量增大, 1/f噪声在频域变化没有明显规律. 但是, 通过1/f噪声时域多尺度熵复杂度分析方法, 得出随着辐照剂量增大, 1/f噪声时域多尺度熵复杂度的结果. 最终证实1/f噪声幅度可以敏感地反映小注入和大注入情况下氮化镓基蓝光发光二极管电离辐照的可靠性. 噪声幅值越大, 则说明辐照感应N_it越高, 暗电流相关的复合电流越大, 光电流相关的扩散电流比例减少, 使得器件发光效率、光输出功率等性能参数下降, 继而影响器件可靠性, 造成失效率显著增大. 1/f噪声时域多尺度熵复杂度可以敏感地反映中值电流情况下氮 化镓基蓝光发光二极管的电离辐照可靠性.多尺度熵复杂度越大, 则说明辐照感应越多, 复合电流越大,器件可靠性越差.本文结论提供了一种基于 1/f噪声的氮化镓基蓝光发光二极管电离辐照可靠性表征方法. 关键词： f噪声')" href="#">1/f噪声 电离辐照 氮化镓基蓝光发光二极管     

宽范围偏置电流下的GaAlAs红外发光二极管1/f噪声特性

在宽范围偏置条件下,测量了GaAlAs红外发光二极管(IRLED)的低频噪声,发现1/f噪声幅值与偏置电流的γ次方成正比,在小电流区,γ≈1,在大电流区γ≈2.基于载流子数涨落和迁移率涨落机制建立了一个GaAlAs IRLED 1/f噪声模型,该模型的分析表明,低电流区GaAlAs IRLED的1/f噪声源于体陷阱对载流子俘获和发射导致的扩散电流涨落,高电流区的1/f噪声源于结空间电荷区附近氧化层陷阱对该处表面势的调制而引起载流子表面复合速率的涨落.该研究结果为1/f噪声表征GaAlAs IRLED的可靠性提供了实验基础与理论依据.     

Effect of anisotropic pressure on the parameters of silicon diodes

We analyze experimental data on the effect of external pressure on the following parameters of silicon alloyed diodes: charge capacitance of the p-n junction, lifetime of the minority charge carriers in the diode base, the rate of surface recombination on the base surface, and the reverse current.     

氢气浸泡辐照加速方法在3DG111器件上的应用及辐射损伤机理分析

本文以~(60)Co为辐照源,针对3DG111型晶体管,利用半导体参数分析仪和深能级缺陷瞬态谱仪,研究高/低剂量率和有/无氢气浸泡条件下,电性能和深能级缺陷的演化规律.试验结果表明,与高剂量率辐照相比,低剂量率辐照条件下,3DG111型晶体管的电流增益退化更加严重,这说明该器件出现了明显的低剂量率增强效应;无论是高剂量率还是低剂量率辐照条件下,3DG111晶体管的辐射损伤缺陷均是氧化物正电荷和界面态陷阱,并且低剂量率条件下,缺陷能级较深;氢气浸泡后在高剂量率辐照条件下,与未进行氢气处理的器件相比,辐射损伤程度明显加剧,且与低剂量率辐照条件下器件的损伤程度相同,缺陷数量、种类及能级也相同.因此,氢气浸泡处理可以作为低剂量率辐射损伤增强效应加速评估方法的有效手段.     

Current transport in ZnO/Si heterostructure grown by laser molecular beam epitaxy

The n-ZnO/p-Si heterojunction was fabricated by depositing high quality single crystalline aluminium-doped n-type ZnO film on p-type Si using the laser molecular beam epitaxy technique. The heterojunction exhibited a good rectifying behavior. The electrical properties of the heterojunction were investigated by means of temperature dependence current density-voltage measurements. The mechanism of the current transport was proposed based on the band structure of the heterojunction. When the applied bias V is lower than 0.15 V, the current follows the Ohmic behavior. When 0.15V 0.6 V), the space charge limited effect becomes the main transport mechanism. The current-voltage characteristic under illumination was also investigated. The photovoltage and the short circuit current density of the heterojunction aproached 270 mV and 2.10 mA/cm 2 , respectively.     

Analysis of the planar transistor at medium and high injection levels

The processes occurring in the base of a planar transistor of the p-n-p type at medium and high injection levels were investigated by an approximate method, taking into account explicity the space charge, the electric field, and scattering at moving carriers. For nonstationary injection the current densities are described by the used combination of hyperbolic functions.Notation pa, n0 equilibrium concentration of holes and elections - Tp, rn lifetime of holes and electrons taking into account surface recombination - jp, jn current density of holes and electrons - Dp, Dn, p, jjn diffusion coefficients and mobilities for holes and electrons respectively - NA, NQ concentration of acceptor and donor impurities - E electric field intensity - q charge per hole - s dielectric constant of semiconductor - b = Mn/Mp! x coordinate measured from emitter towards collector - Wn width of base - Wp width of emitter region - d(Vc) width of p-n junction with reverse bias Vc at junction - k Boltzman's constant - T absolute temperatme - h Planck's constant - mo mass of free electron     

三维数值仿真研究锗硅异质结双极晶体管总剂量效应

为探索锗硅异质结双极晶体管(SiGe HBT)总剂量效应的损伤机理,采用半导体器件三维模拟工具(TCAD),建立电离辐照总剂量效应损伤模型,分析比较电离辐射在SiGe HBT不同氧化层结构的不同位置引入陷阱电荷缺陷后,器件正向Gummel特性和反向Gummel特性的退化特征,获得SiGe HBT总剂量效应损伤规律,并与⁶⁰Coγ辐照实验进行对比.结果表明:总剂量辐照在SiGe HBT器件中引入的氧化物陷阱正电荷主要在pn结附近的Si/SiO₂界面处产生影响,引起pn结耗尽区的变化,带来载流子复合增加,最终导致基极电流增大、增益下降;其中EB Spacer氧化层中产生的陷阱电荷主要影响正向Gummel特性,而LOCOS隔离氧化层中的陷阱电荷则是造成反向Gummel特性退化的主要因素.通过数值模拟分析获得的SiGe HBT总剂量效应损伤规律与不同偏置下⁶⁰Coγ辐照实验的结论符合得较好.     

170 keV Proton radiation effects on low-frequency noise of bipolar junction transistors

In this paper, the electrical properties and low-frequency noise for bipolar junction transistors irradiated by 170?keV proton are examined. The result indicates that for the sample under proton irradiation with fluence 1.25?×?10^14?p/cm², base current I_B in low bias range (V_BE < 0.7?V) increases due to superimposition of radiation-induced recombination current, while the gain decreases significantly. Meanwhile, the low-frequency noise increases in the proton-irradiated sample. By analysis of evolution of parameters extracted from low-frequency noise power spectra, it is demonstrated that radiation-induced noise is mainly originated from carrier fluctuation modulated by generation–recombination centers (G–R centers) located at the interface of Si/SiO₂, which are introduced by proton-radiation-induced defects. It is also confirmed that the electrical properties and noise behavior of irradiated sample are mostly affected by the carrier recombination process caused by G–R centers at the interface of Si/SiO₂ than by G–R centers in EB junctions.     

光电耦合器电离辐射损伤电流传输比1/f噪声表征

在研究光电耦合器电离辐射损伤机理基础上,分别建立光电耦合器电离辐射损伤电流传输比(CTR)表征模型和1/f噪声表征模型.结果表明CTR退化和噪声增加都归因于辐射后光敏三极管集电结和发射结处SiO₂/Si界面缺陷增多.根据CTR退化和噪声变化分别与辐射剂量的关系,建立起噪声变化与CTR退化之间的关系,辐照实验对表征模型正确性进行了验证.运用噪声变化与辐射剂量的关系,通过低剂量辐照实验可以预测高剂量辐射后光电耦合器退化程度,故可用于评价光电耦合器抗辐射能力. 关键词： f噪声')" href="#">1/f噪声 光电耦合器 缺陷 模型     

Numerical model of multilayer organic light-emitting devices

A numerical model of multilayer organic light-emitting devices is presented in this article. This model is based on the drift-diffusion equations which include charge injection, transport, space charge effects, trapping, heterojunction interface and recombination process. The device structure in the simulation is ITO/CuPc (20 nm)/NPD (40 nm)/Alq3 (60 nm)/LiF/Al. There are two heterojunctions which should be dealt with in the simulation. The I--V characteristics, carrier distribution and recombination rate of a device are calculated. The simulation results and measured data are in good agreement.     

Study on the dose rate upset effect of partially depleted silicon-on-insulator static random access memory

This paper implements the study on the Dose Rate Upset effect of PDSOI SRAM (Partially Depleted Silicon-On-Insulator Static Random Access Memory) with the Qiangguang-I accelerator in Northwest Institute of Nuclear Technology. The SRAM (Static Random Access Memory) chips are developed by the Institute of Microelectronics of Chinese Academy of Sciences. It uses the full address test mode to determine the upset mechanisms. Specified address test is taken in the same time. The test results indicate that the upset threshold of the PDSOI SRAM is about 1x10⁸Gy(Si)/s. However, there are few bits upset when the dose rate reaches up to 1.58x10⁹Gy(Si)/s. The SRAM circuit can still work after the high level γ ray pulse. Finally, the upset mechanism is determined to be the rail span collapse by comparing the critical charge with the collected charge after γ ray pulse. The physical locations of upset cells are plotted in the layout of the SRAM to investigate the layout defect. Then, some layout optimizations have been taken to improve the dose rate hardened performance of the PDSOI SRAM.     

Experimental analysis and modeling of the IV characteristics of photovoltaic solar cells under solar spectrum spot illumination

In this paper, some models that have been put forward to explain the characteristics of a photovoltaic solar cell device under solar spot-illumination are investigated. In the experimental procedure, small areas of the cell were selected and illuminated at different solar intensities. The solar cell open circuit voltage (V_oc) and short circuit current (I_sc) obtained at different illumination intensities was used to determine the solar cell ideality factor. By varying the illuminated area on the solar cell, changes in the ideality factor were studied. The ideality factor obtained increases with decreasing illumination surface ratio. The photo-generated current at the illuminated part of the cell is assumed to act as a dc source that injects charge carriers into the p-n junction of the whole solar cell while the dark region of the solar cell operates in a low space charge recombination regime with small diffusion currents. From this analysis, a different model of a spot illuminated cell that uses the variation of ideality factor with the illuminated area is proposed.     

γ射线总剂量辐照对单轴应变Si纳米n型金属氧化物半导体场效应晶体管栅隧穿电流的影响

基于γ射线辐照条件下单轴应变Si纳米n型金属氧化物半导体场效应晶体管(NMOSFET)载流子的微观输运机制,揭示了单轴应变Si纳米NMOSFET器件电学特性随总剂量辐照的变化规律,同时基于量子机制建立了小尺寸单轴应变Si NMOSFET在γ射线辐照条件下的栅隧穿电流模型,应用Matlab对该模型进行了数值模拟仿真,探究了总剂量、器件几何结构参数、材料物理参数等对栅隧穿电流的影响.此外,通过实验进行对比,该模型仿真结果和总剂量辐照实验测试结果基本符合,从而验证了模型的可行性.本文所建模型为研究纳米级单轴应变Si NMOSFET应变集成器件可靠性及电路的应用提供了有价值的理论指导与实践基础.     

基于4晶体管像素结构的互补金属氧化物半导体图像传感器总剂量辐射效应研究

对基于4晶体管像素结构互补金属氧化物半导体图像传感器的电离总剂量效应进行了研究,着重分析了器件的满阱容量和暗电流随总剂量退化的物理机理.实验的总剂量为200 krad(Si),测试点分别为30 krad(Si),100 krad(Si),150 krad(Si)和200 krad(Si),剂量率为50 rad(Si)/s.实验结果发现随着辐照总剂量的增加,器件的满阱容量下降并且暗电流显著增加.其中辐照使得传输门沟道掺杂分布发生改变是满阱容量下降的主要原因,而暗电流退化则主要来自于浅槽隔离界面缺陷产生电流和传输门-光电二极管交叠区产生电流.实验还表明样品器件的转换增益在辐照前后未发生明显变化,并且与3晶体管像素结构不同,4晶体管像素结构的互补金属氧化物半导体图像传感器没有显著的总剂量辐照偏置效应.     

光电耦合器件1/f噪声和g-r噪声的机理研究

对光电耦合器件1/f噪声和g-r噪声(产生－复合噪声) 的偏置特性及其产生机理进行了实验和理论研究.结果表明：在低频段,光电耦合器件的g-r噪声通常表现为叠加1/f噪声,且两者均随输入电流的增加呈现先增大后减小的规律.通过测量前级噪声和后级噪声,发现光电耦合器件的g-r噪声源为后级光敏三极管.理论分析表明：光电耦合器件的1/f噪声主要为表面1/f噪声,g-r噪声则源于光敏三极管发射结空间电荷区的深能级对载流子的俘获和发射.     

总剂量效应致0.13μm部分耗尽绝缘体上硅N型金属氧化物半导体场效应晶体管热载流子增强效应

空间科学的进步对航天用电子器件提出了更高的性能需求, 绝缘体上硅(SOI)技术由此进入空间科学领域, 这使得器件的应用面临深空辐射环境与地面常规可靠性的双重挑战. 进行SOI N型金属氧化物半导体场效应晶体管电离辐射损伤对热载流子可靠性的影响研究, 有助于对SOI器件空间应用的综合可靠性进行评估. 通过预辐照和未辐照、不同沟道宽长比的器件热载流子试验结果对比, 发现总剂量损伤导致热载流子损伤增强效应, 机理分析表明该效应是STI辐射感生电场增强沟道电子空穴碰撞电离率所引起. 与未辐照器件相比, 预辐照器件在热载流子试验中的衬底电流明显增大, 器件的转移特性曲线、输出特性曲线、跨导特性曲线以及关键电学参数V_T, GM_max, ID_SAT退化较多. 本文还对宽沟道器件测试中衬底电流减小以及不连续这一特殊现象进行了讨论.     

ANALYTICAL MODELING OF THE RECOMBINATION CURRENT IN THE BASE-EMITTER SPACE CHARGE REGION OF HETEROJUNCTION BIPOLAR TRANSISTORS

An analytical modeling of the recombination current in the base-emitter space charge region of heterojunction bipolar transistors is derived. The recombination rates as functions of distance in the space charge region are calculated for different hase doping concentrations. The relations between the space charge recombination current and the applied voltage have been determined.