From coherent to incoherent mismatched interfaces: A generalized continuum formulation of surface stresses

The equilibrium of coherent and incoherent mismatched interfaces is reformulated in the context of continuum mechanics based on the Gibbs dividing surface concept. Two surface stresses are introduced: a coherent surface stress and an incoherent surface stress, as well as a transverse excess strain. The coherent surface stress and the transverse excess strain represent the thermodynamic driving forces of stretching the interface while the incoherent surface stress represents the driving force of stretching one crystal while holding the other fixed and thereby altering the structure of the interface. These three quantities fully characterize the elastic behavior of coherent and incoherent interfaces as a function of the in-plane strain, the transverse stress and the mismatch strain. The isotropic case is developed in detail and particular attention is paid to the case of interfacial thermo-elasticity. This exercise provides an insight on the physical significance of the interfacial elastic constants introduced in the formulation and illustrates the obvious coupling between the interface structure and its associated thermodynamics quantities. Finally, an example based on atomistic simulations of Cu/Cu₂O interfaces is given to demonstrate the relevance of the generalized interfacial formulation and to emphasize the dependence of the interfacial thermodynamic quantities on the incoherency strain with an actual material system.     

A continuum description of partially coherent interfaces

A continuum model of a two-phase crystal-crystal system is constructed in which the structure of the interface between the phases is determined by energy minimization, rather than by being specified a priori. The interfacial structure is parameterized by a variable? corresponding to the jump in the surface deformation gradient (or strain) at the interface, so that coherence is defined locally by the condition? = 0. The energy of the system is taken to be the sum of the bulk and interfacial energies, where the interfacial energy densityf ^xs depends on?. In order to explore how the equilibrium interfacial structure depends on the functionf ^xs (?), a model system consisting of an elastic film on a rigid substrate is studied, and the interfacial energy density is taken to be nonconvex with a sharp minimum associated with coherence. In this case, it can be shown that the energy of the system is driven to its infimum by separating the interface into coherent and incoherent regions, which may be viewed as a continuum analog to a partially coherent interface. Further, this solution only appears above a certain critical thickness of the film, in agreement with misfit dislocation models of partially coherent interfaces.     

Multi-Scale Experiments and Interfacial Mechanical Modeling of Carbon Nanotube Fiber

The multi-scale deformation and interfacial mechanical behavior of carbon nanotube fibers with multi-level structures are investigated by experimental and theoretical methods. Multi-scale experiments including uniaxial tensile testing, in situ Raman spectroscopy, and scanning electron microscopy are conducted to measure the mechanical response of multi-level structures within the fiber under tension. A two-level interfacial mechanical model is then presented to analyze the interfacial bonding strength of mesoscopic bundles and microscopic nanotubes. The evolution characteristics of multi-scale deformation of the fiber are described based on experimental characterization and interfacial strength analysis. The strengthening mechanism of the fiber is further studied. Comprehensive analysis shows that the property of multi-level interfaces is a critical factor for the fiber strength and toughness. Finally, the method of improving the mechanical properties of fiber-based materials is discussed. The result can be used to guide multi-level interface engineering of carbon nanotube fibers and fiber-based composites to produce high performance materials.     

Transmission of a screw dislocation across a coherent, non-slipping interface

Current research on nanocrystalline metals and nanoscale multilayer thin films suggests extraordinary plastic strength is due to confinement of slip to individual grains or layers. To assess the magnitude of confinement, a Peierls model of slip transmission of a screw dislocation across a coherent, non-slipping interface is presented. The results reflect that large interfacial barriers to transmission are generated by rapid fluctuations in dislocation line energy near the interface due to elastic modulus mismatch, stacking fault energy mismatch, and antiphase boundary energy for transmission into an ordered phase. Coherency stress is predicted to dramatically alter the dislocation core configuration and impart additional strength regardless of the sign. Contributions to strength are not additive due to nonlinear coupling via the dislocation core configuration. The predicted barrier strength for a coherent (0 0 1) Cu/Ni interface is comparable to atomistic (EAM) results but larger than estimates from hardness data.     

功能梯度双材料弱/微间断界面的冲击断裂分析

提出强间断、弱间断、微间断和全连续界面的概念与分类,建立功能梯度弹性双材料弱间断 界面冲击断裂问题的力学模型,采用积分变换法推导问题的Cauchy奇异积分方程,并用配 点法求得数值解. 分析表明,弱/微间断性对于FGMs界面裂纹应力强度因子有着重要影响, 而且微间断性是优于弱间断性的一种界面力学性能连接关系. 以FGMs界面某一侧 的力学性能函数在界面处的Taylor展开式的低阶项作为界面另一侧的力学性能函数,便可 以使FGMs界面成为``微间断'界面. 界面的一阶微间断对应力强度因子的减小作用较为明 显,而高阶(二阶及以上)微间断对应力强度因子的影响较小. 减小界面的弱间断程度或使 FGMs界面具备``微间断性',都将利于提高功能梯度双材料界面抗冲击断裂能力,在一定 程度上达到界面增韧的目的.     

QFP结构中引脚焊缝界面端的奇异性热应力问题研究

由于引脚、印制电路板和焊接剂的热-机材料属性不同,在受到热载荷或机械载荷时,引脚焊接界面端会产生奇异性应力,有可能产生界面开裂.为了基于界面端奇异场来评价QFP结构引脚界面端力学行为,本文拟采用数值方法求解引脚焊缝任意角度尖劈界面端的应力强度系数.具体步骤为:首先,基于高次内插有限元特征分析法确定两相任意角度尖劈界面端的奇异性指数和应力角分布函数,并引入常数热应力项,获得热-机耦合奇异性应力场表达式;采用有限元分析技术和最小二乘拟合法来获得应力强度系数的数值解.文中考察了热-机材料属性对热载荷下焊接剂/印制电路板界面端应力强度系数的影响,并给出改善界面端热应力状态的建议.     

Modeling core-spreading of interface dislocation and its elastic response in anisotropic bimaterial

Interfacial dislocation may have a spreading core corresponding to a weak shear resistance of interfaces. In this paper, a conic model is proposed to mimic the spreading core of interfacial dislocation in anisotropic bimaterials. By the Stroh formalism and Green's function, the analytical expressions of the elastic fields are deduced for such a dislocation. Taking Cu/Nb bimaterial as an example, it is demonstrated that the accuracy and efficiency of the method are well validated by the interface conditions, a spreading core can greatly reduce the stress intensity near the interfacial dislocation compared with the compact core, and the elastic fields near the spreading core region are significantly different from the condensed core, while they are less sensitive to a field point that is 1.5times the core width away from the center of the spreading core.     

Interfacial excess energy, excess stress and excess strain in elastic solids: Planar interfaces

In this paper, interfacial excess energy and interfacial excess stress for coherent interfaces in an elastic solid are reformulated within the framework of continuum mechanics. It is shown that the well-known Shuttleworth relationship between the interfacial excess energy and interfacial excess stress is valid only when the interface is free of transverse stresses. To account for the transverse stress, a new relationship is derived between the interfacial excess energy and interfacial excess stress. Dually, the concept of transverse interfacial excess strain is also introduced, and the complementary Shuttleworth equation is derived that relates the interfacial excess energy to the newly introduced transverse interfacial excess strain. This new formulation of interfacial excess stress and excess strain naturally leads to the definition of an in-plane interfacial stiffness tensor, a transverse interfacial compliance tensor and a coupling tensor that accounts for the Poisson's effect of the interface. These tensors fully describe the elastic behavior of a coherent interface upon deformation.     

Analysis of an interfacial crack in a piezoelectric bi-material via the extended Green’s functions and displacement discontinuity method

Based on the extended Stroh formalism, we first derive the extended Green’s functions for an extended dislocation and displacement discontinuity located at the interface of a piezoelectric bi-material. These include Green’s functions of the extended dislocation, displacement discontinuities within a finite interval and the concentrated displacement discontinuities, all on the interface. The Green’s functions are then applied to obtain the integro-differential equation governing the interfacial crack. To eliminate the oscillating singularities associated with the delta function in the Green’s functions, we represent the delta function in terms of the Gaussian distribution function. In so doing, the integro-differential equation is reduced to a standard integral equation for the interfacial crack problem in piezoelectric bi-material with the extended displacement discontinuities being the unknowns. A simple numerical approach is also proposed to solve the integral equation for the displacement discontinuities, along with the asymptotic expressions of the extended intensity factors and J-integral in terms of the discontinuities near the crack tip. In numerical examples, the effect of the Gaussian parameter on the numerical results is discussed, and the influence of different extended loadings on the interfacial crack behaviors is further investigated.     

Improved tri-layered interfacial stress model with the effect of different temperatures in the layers

The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials and electronic packages. An understanding of the nature of the interfacial stresses under different temperature conditions is necessary in order to minimize or eliminate the risk of mechanical failure. An accurate estimate of thermal stresses in the interfaces plays an important role in the design and reliability studies of micro-electronic devices. In the microelectronic industry, from a practical point of view, there is a need for simple and powerful analytical models to determine interfacial stresses in layered structures quickly and accurately. In the present paper, a model is proposed for the shearing and peeling stresses occurring at the interface of three bonded thin plates of dissimilar materials to account for different uniform temperatures in the layers by incorporating two temperature ratios. The model is then further upgraded to accommodate the effect of thickness wise linear temperature gradients in the layers by incorporating three linear temperature gradients at the interfaces. This upgraded model can be viewed as a more generalized form to take care of different temperature conditions which may occur in a tri-layered structure. The improved uniform temperature model of tri-material assembly provided by Sujan (Int Microelectron Packag Soc JMEP 5(1):37–42, 2008) is utilized to develop the proposed tri-layered model. The selected shearing stress results are presented for the case of die, die attach and substrate as commonly found in electronic packaging.     

Interaction of a screw dislocation with a semi-infinite interfacial crack in a magneto-electro-elastic bi-material

The interaction between a screw dislocation and a semi-infinite interfacial crack in a transversely isotropic magneto-electro-elastic bi-material is investigated. The dislocation line is perpendicular to the isotropic basal plane of the bi-material. The elastic and electromagnetic fields induced by the dislocation are obtained through the use of the complex variable method together with the superposition scheme. The stress, electric displacement and magnetic intensity factors as well as the image exerted on the dislocation are given explicitly. We find that the intensity factors are expressed in terms of the so-called effective materials and the radial component of the image force is only dependent on the elastic modulus of the material with the dislocation. As an illustrative example, the bi-material that consists of piezoelectric and piezomagnetic phases is analyzed.     

Discrete dislocation dynamics simulation of cutting of γ′ precipitate and interfacial dislocation network in Ni-based superalloys

We proposed a back force model for simulating dislocations cutting into a γ′ precipitate, from the physical viewpoint of work for making or recovering an antiphase boundary (APB). The first dislocation, or a leading partial of a superdislocation, is acted upon by a back force whose magnitude is equal to the APB energy. The second dislocation, or a trailing partial of a superdislocation, is attracted by the APB with a force of the same magnitude. The model is encoded in a 3D discrete dislocation dynamics (DDD) code and demonstrates that a superdislocation nucleates after two dislocations pile up at the interface and that the width of dislocations is naturally balanced by the APB energy and repulsion of dislocations. The APB energy adopted here is calculated by ab initio analysis on the basis of the density functional theory (DFT). Then we applied our DDD simulations to more complicated cases, namely, dislocations near the edges of a cuboidal precipitate and those at the γ/γ′ interface covered by an interfacial dislocation network. The former simulation shows that dislocations penetrate into a γ′ precipitate as a superdislocation from the edge of the cube, when running around the cube to form Orowan loops. The latter reveals that dislocations become wavy at the interface due to the stress field of the dislocation network, then cut into the γ′ precipitate through the interspace of the network. Our model proposed here can be applied to study the dependence of the cutting resistance on the spacing of dislocations in the interfacial dislocation network.     

一种预测颗粒增强复合材料界面力学性能的新方法

界面在颗粒增强复合材料中起到传递载荷的关键作用,界面性能对复合材料整体力学行为产生重要影响.然而由于复合材料内部结构较为复杂,颗粒与基体间的界面强度和界面断裂韧性难以确定,尤其是法向与切向界面强度的分别预测缺乏有效方法.本文以氧化锆颗粒增强聚二甲基硅氧烷(PDMS)复合材料为研究对象,提出一种预测颗粒增强复合材料界面力...     

Using geometric complexity to enhance the interfacial strength of heterogeneous structures fabricated in a multi-stage,multi-piece molding process

Interfaces in heterogeneous structures are typically engineered for optimal strength through the control of surface roughness and the choice of adhesives. Advances in manufacturing technologies are now making it possible to also tailor the geometries of interfaces from the nanoscale to the macroscale to create geometrically complex interfaces that exhibit enhanced performance characteristics. However, the impact of geometric complexity on the mechanical behavior of interfaces has not yet been ascertained. In this investigation, the first step is taken towards understanding the effects of geometric complexity on interfacial strength. A new multi-stage, multi-piece molding process is used to create heterogeneous polymer structures with geometrically complex interfaces consisting of rectangular and circular interlocking features. The structural integrity of these heterogeneous structures is characterized through interfacial tension testing. The full-field deformation measurement technique known as digital image correlation is also used during the testing to visualize the deformation fields around the geometrically complex features. Through this characterization, it is determined that the complex geometries increase the interfacial strength by approximately 20–25%, while reducing the statistical variation by 50%. These effects are attributed to a transition in the failure mechanism from interfacial fracture to homogeneous ligament failure. Results also indicate that geometrically complexity can be used on completely debonded interfaces to increase the strength to at least 25–35% of the bonded interface. Based on these results, some simple design rules have been proposed that enable geometrically complex interfaces to be engineered with enhanced strengths approaching the weaker of the two base materials. These design rules can also be used in the engineering of interfaces to facilitate the development of heterogeneous structures using new design paradigms, such as design for recyclability and the design of products based on bio-inspired concepts.     

双材料界面断裂力学模型与实验方法

纤维增强聚合物(FRP)质轻、高强, 可提高结构的刚度、强度、抗震性能和耐久性, 近年来在结构加固及工程改造中得到广泛应用. FRP与传统复合材料之间形成双材料黏结界面, 界面断裂特性是决定双材料结构性能的关键因素. 对双材料界面裂纹尖端应力场理论、界面裂纹模型、黏结界面I型、II型及混合型断裂试验及理论研究现状进行综合评述和分析. 界面模型主要有经典梁/板理论和刚性节点模型、考虑剪切变形的双亚层理论和半刚性节点模型、基于双亚层理论的柔性节点模型、考虑剪切变形的多层亚层理论和多亚层柔性节点模型、弹性地基梁模型以及黏聚模型. 还介绍了双材料界面断裂力学在FRP-混凝土研究中的应用.      

压剪载荷作用下界面裂纹尖端场的研究

建立了弹性-幂律蠕变双材料界面裂纹准静态扩展的力学模型，求得了裂纹尖端应力、应变和位移场分离变量形式的解及其数值结果；讨论了材料性能参数对裂纹尖端场的影响；计算和分析了界面裂纹的摩擦效应，并且得出了给定条件下裂尖场的轮廓图形．     

Multiscale mechanics of noncovalent interface in graphene oxide layered nanocomposites

Noncovalent interfaces play a vital role in inelastic deformation and toughening mechanisms in layered nanocomposites due to their dynamical recoverability. When interfacial engineering is applied to design layered nanocomposites, shear-lag analysis is usually implemented to evaluate the capability of interfacial loading transfer. Here, we introduce a multiscale shear-lag model that correlates macroscale mechanical properties with the molecular mechanisms to quantify the effects of interfacial configuration in graphene oxide(GO) layered nanocomposites. By investigating the mechanical responses of commensurate and incommensurate interfaces, we identify that the commensurate interface exhibits a pronounced size effect due to the nucleation and propagation of interfacial defects, whereas the incommensurate interface displays uniform deformation. Our predictions are further validated through large-scale molecular dynamics simulations for GO layered nanocomposites. This work demonstrates how size effects and interfacial configurations can be exploited to fabricate layered nanocomposites with superior mechanical properties despite relying on weak noncovalent interfaces.     

3D printed,bio-inspired prototypes and analytical models for structured suture interfaces with geometrically-tuned deformation and failure behavior

Geometrically structured interfaces in nature possess enhanced, and often surprising, mechanical properties, and provide inspiration for materials design. This paper investigates the mechanics of deformation and failure mechanisms of suture interface designs through analytical models and experiments on 3D printed polymer physical prototypes. Suture waveforms with generalized trapezoidal geometries (trapezoidal, rectangular, anti-trapezoidal, and triangular) are studied and characterized by several important geometric parameters: the presence or absence of a bonded tip region, the tip angle, and the geometry. It is shown that a wide range (in some cases as great as an order of magnitude) in stiffness, strength, and toughness is achievable dependent on tip bonding, tip angle, and geometry. Suture interfaces with a bonded tip region exhibit a higher initial stiffness due to the greater load bearing by the skeletal teeth, a double peak in the stress–strain curve corresponding to the failure of the bonded tip and the failure of the slanted interface region or tooth, respectively, and an additional failure and toughening mechanism due to the failure of the bonded tip. Anti-trapezoidal geometries promote the greatest amplification of properties for suture interfaces with a bonded tip due the large tip interface area. The tip angle and geometry govern the stress distributions in the teeth and the ratio of normal to shear stresses in the interfacial layers, which together determine the failure mechanism of the interface and/or the teeth. Rectangular suture interfaces fail by simple shearing of the interfaces. Trapezoidal and triangular suture interfaces fail by a combination of shear and tensile normal stresses in the interface, leading to plastic deformation, cavitation events, and subsequent stretching of interface ligaments with mostly elastic deformation in the teeth. Anti-trapezoidal suture interfaces with small tip angles have high stress concentrations in the teeth and fail catastrophically by tooth failure, whereas larger tip angles exhibit a shear failure of the interfaces. Therefore, larger tip angles and trapezoidal or triangular geometries promote graceful failure, and smaller tip angles and anti-trapezoidal geometries promote more brittle-like failure. This dependence is reminiscent of biological systems, which exhibit a range of failure behaviors with limited materials and varied geometry. Triangular geometries uniquely exhibit uniform stress distributions in its teeth and promote the greatest amplification of mechanical properties. In both the bonded and unbonded cases, the predictions from the presented analytical models and experimental results on 3D printed prototypes show excellent agreement. This validates the analytical models and allows for the models to be used as a tool for the design of new materials and interfaces with tailored mechanical behavior.     

Coupled DDD–FEM modeling on the mechanical behavior of microlayered metallic multilayer film at elevated temperature

To investigate the mechanical behavior of the microlayered metallic thin films (MMMFs) at elevated temperature, an enhanced discrete-continuous model (DCM), which couples rather than superposes the two-dimensional climb/glide-enabled discrete dislocation dynamics (2D-DDD) with the linearly elastic finite element method (FEM), is developed in this study. In the present coupling scheme, two especial treatments are made. One is to solve how the plastic strain captured by the DDD module is transferred properly to the FEM module as an eigen-strain; the other is to answer how the stress field computationally obtained by the FEM module is transferred accurately to the DDD module to drive those discrete dislocations moving correctly. With these two especial treatments, the interactions between adjacent dislocations and between dislocation pile-ups and inter-phase boundaries (IBs), which are crucial to the strengthening effect in MMMFs, are carefully taken into account. After verified by comparing the computationally predicted results with the theoretical solutions for a dislocation residing in a homogeneous material and nearby a bi-material interface, this 2D-DDD/FEM coupling scheme is used to model the tensile mechanical behaviors of MMMFs at elevated temperature. The strengthening mechanism of MMMFs and the layer thickness effect are studied in detail, with special attentions to the influence of dislocation climb on them.     

Mechanical Testing of Solid–Solid Interfaces at the Microscale

In order to determine the influence of internal interfaces on the material’s global mechanical behavior, the strength of single interfaces is of great interest. The experimental framework presented here enables quantitative measurements of the initiation and propagation of interfacial cracks on the microscale. Cantilever beams are fabricated by focused ion beam milling out of a bulk sample, with an interface of interest placed close to the fixed end of the cantilever. Additionally, a U-notch is fabricated at the location of the interface to serve as a stress concentrator for the initiation of the crack. The cantilevers are then mechanically deflected using a nanoindentation system for high resolution load-displacement measurements. In order to determine the onset and propagation of damage, the stiffness of the cantilevers is recorded by partial unloads during the test as well as by making use of a continuous stiffness technique. A finite element model is used to normalize the load and stiffness in order to establish the framework for comparisons between different interfaces.