Picosecond-laser structuring of amorphous-silicon thin-film solar modules

Laser scribing with nanosecond (ns) diode pumped solid-state laser sources is the industry standard in the fabrication of silicon-based thin-film photovoltaic (TFPV) modules. Reducing the interconnection area is one of the on-going challenges for the next generation of TFPV modules. In this regard, replacing ns laser sources by picosecond (ps) laser sources is one of the logical steps. Ps-laser pulses reduce the heat-affected zones compared to ns pulses, and thus enable a reduction of the interconnection zone. This work describes the substrate-side ablation of fluorine-doped tin oxide, amorphous silicon (a-Si:H) and a-Si:H with an aluminum layer on top, using a 10-ps laser with a wavelength of 1064 nm. The investigation of single-pulse ablation and trench scribing demonstrates that the complete monolithic interconnection can be achieved at the fundamental wavelength. In addition, the evaluation of the ablation efficiency shows that the best trench quality is achieved at the efficiency maximum.     

Ultrafast laser ablation of indium tin oxide thin films for organic light-emitting diode application

Ultrafast laser ablation of ITO thin film coated on the glass has been investigated as a function of laser fluence as well as the number of laser pulses. The ablation threshold of ITO thin film was found to be 0.07 J/cm² that is much lower than that of glass substrate (about 1.2–1.6 J/cm²), which leads to a selective ablation of ITO film without damage on glass substrate. The changes in the electrical resistance and morphology of ablated trench of ITO electrode were found to be strongly dependent on the processing conditions. We present the performance of organic light-emitting diodes (OLED) fabricated with ITO electrode patterned by ultrafast laser ablation.     

Sub-picosecond UV-laser ablation of Ni films

Laser ablation of thin Ni films on fused silica by 0.5 ps KrF-excimer-laser pulses at 248 nm is reported. The onset of material removal from different film thicknesses (0.1, 0.3, 0.6 and 1.0 m) was measured in a laser ionization time-of-flight mass spectrometer by the amount of Ni atoms vs laser fluence. Significant amounts of metal atoms are already evaporated at laser fluences around 20 mJ/cm², a threshold up to 100 times smaller compared to the one for 14 ns pulses. In contrast to ns laser pulses, the ablation threshold for 0.5 ps pulses is independent of the film thickness. These results reflect the importance of thermal diffusion in laser ablation of strongly absorbing and thermally good conducting materials and prove that for ablation with short pulses, energy loss to the bulk is minimized.     

Femtosecond laser ablation from dielectric materials: Comparison to arc discharge erosion

After explosive ablation from sapphire crystals by linearly polarised laser pulses, regular structures are observed on the bottom of the ablation pit. These structures do not comply with conventional ripple patterns. Instead, they more nearly resemble wickerwork, aligned perpendicular to the laser beam polarisation. A similar morphology is obtained by arc discharge erosion at AgCdO electrodes, suggesting that an explosive laser ablation may be characterised by high electric field effects and self organisation in the ablation craters.     

Elimination of cracking during UV laser ablation of SrTiO3 single crystals by employing a femtosecond laser

We have performed a comparative study of UV laser ablation of SrTiO₃ with nanosecond- and sub-picosecond sources, respectively. The experiments were performed with lasers at a wavelength of 248 nm and pulse durations of 34 ns and 500 fs. Femtosecond ablation turns out to be more efficient by one order of magnitude and eliminated the known problem of cracking of SrTiO₃ during laser machining with longer pulses. In addition, the cavities ablated with femtosecond pulses display a smoother surface with no indication of melting and well-defined, sharp edges. These effects can be explained by the reduced thermal shock effect on the material by using ultrashort pulses.     

Microdrilling of metals with an inexpensive and compact ultra-short-pulse fiber amplified microchip laser

We have investigated the ultra-fast microdrilling of metals using a compact and cheap fiber amplified passively Q-switched microchip laser. This laser system delivers 100-ps pulses with repetition rates higher than 100 kHz and pulse energies up to 80 μJ. The ablation process has been studied on metals with quite different thermal properties (copper, carbon steel and stainless steel). The dependence of the ablation depth per pulse on the pulse energy follows the same logarithmic scaling laws governing laser ablation with sub-picosecond pulses. Structures ablated with 100-ps laser pulses are accompanied only by a thin layer of melted material. Despite this, results with a high level of precision are obtained when using the laser trepanning technique. This simple and affordable laser system could be a valid alternative to nanosecond laser sources for micromachining applications.     

Selective ablation of thin films with short and ultrashort laser pulses

Micromachining of CuInSe₂ (CIS)-based photovoltaic devices with short and ultrashort laser pulses has been investigated. Therefore, ablation thresholds and ablation rates of ZnO, Mo and CuInSe₂ thin films have been measured for irradiation with nanosecond laser pulses of ultraviolet and visible light and subpicosecond laser pulses of a Ti:sapphire laser. The experimental results were compared to the theoretical evaluation of the samples heat regime. In addition, the cells photo-electrical properties were measured before and after laser machining. Scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analyses were employed to characterise the laser-induced ablation channels. Using nanosecond laser pulses, two phenomena were found to limit the laser-machining process. Residues of Mo that were projected onto the walls of the ablation channel and the metallization of the CuInSe₂ semiconductor close to the channel lead to a shunt. The latter causes the decrease of the photovoltaic efficiency. As a consequence of these limiting effects, only subpicosecond laser pulses allowed the selective or complete ablation of the thin layers without a relevant change of the photo-electrical properties.     

Ablation and analysis of small cell populations and single cells by consecutive laser pulses

Laser ablation of single cells through a sharpened optical fiber is used for the detection of metabolites by laser ablation electrospray ionization (LAESI) mass spectrometry (MS). Ablation of the same Allium cepa epidermal cell by consecutive pulses indicates the rupture of the cell wall by the second shot. Intracellular sucrose heterogeneity is detected by subsequent laser pulses pointing to rupturing the vacuolar membrane by the third exposure. Ion production by bursts of laser pulses shows that the drying of ruptured A. cepa cells occurs in ∼50 s at low pulse rates (10 pulses/s bursts) and significantly faster at high pulse rates (100 pulses/s bursts). These results point to the competing role of cytoplasm ejection and evaporative drying in diminishing the LAESI-MS signal in ∼50 s or 100 laser pulses, whichever occurs first.     

Ablation experiments on polyimide with femtosecond laser pulses

Some applications of polymer films require the microstructuring of partly uneven substrates. This cannot be achieved by conventional photolithography, usually performed with ultraviolet short-pulse lasers (excimer, fourth harmonic Nd:YAG). When processing thermally sensitive or undoped polymers with low optical absorption, the use of femtosecond laser pulses can improve the ablation precision, also reducing the heat-affected zone. Therefore, a Ti:sapphire laser system was employed to perform ablation experiments on polyimide (PI). The irradiated areas were evaluated by means of optical and scanning electron microscopy. Highly oriented ripple structures, which are related to the polarization state of the laser pulses, were observed in the cavities. The relationship between the ablation threshold fluence and the number of laser pulses applied to the same spot is described in accordance with an incubation model.     

Numerical simulation of process dynamics during laser beam drilling with short pulses

In the last years, laser beam drilling became increasingly important for many technical applications as it allows the contactless production of high quality drill holes. So far, mainly short laser pulses are of industrial relevance, as they offer a good compromise between precision and efficiency and combine high ablation efficiency with low thermal damage of the workpiece. Laser beam drilling in this pulse length range is still a highly thermal process. There are two ablation mechanisms: evaporation and melt expulsion. In order to achieve high quality processing results, a basic process understanding is absolutely necessary. Yet, process observations in laser beam drilling suffer from both the short time scales and the restricted accessibility of the interaction zone. Numerical simulations offer the possibility to acquire additional knowledge of the process as they allow a direct look into the drill hole during the ablation process. In this contribution, a numerical finite volume multi-phase simulation model for laser beam drilling with short laser pulses shall be presented. The model is applied for a basic study of the ablation process with μs and ns laser pulses. The obtained results show good qualitative correspondence with experimental data.     

高温合金不同脉宽超快激光作用下多脉冲去除阈值

实验研究了激光脉冲宽度和脉冲个数对镍基高温合金材料去除阈值的影响,分别在290 fs,1 ps和7 ps脉宽的激光下,使用1,10,50,100,300,500和1000个不同能量的激光脉冲辐照高温合金样品表面。实验结果表明,烧蚀坑尺寸会随脉冲数的增加而增加,而脉冲宽度的增加会加大脉冲个数对烧蚀坑直径的影响。通过烧蚀坑直径的平方值与激光脉冲能量之间存在的对数关系,得到了不同脉冲宽度下镍基高温合金的多脉冲材料阈值。3种不同脉宽下的高温合金多脉冲去除阈值都存在显著的累积效应。根据去除阈值计算得到290 fs,1 ps和7 ps脉宽下的累积效应系数分别为0.88,0.86和0.78。     

Minimization of cavitation effects in pulsed laser ablation illustrated on laser angioplasty

Cavitation effects in pulsed laser ablation can cause severe deformation of tissue near the ablation site. In angioplasty, they result in a harmful dilatation and invagination of the vessel walls. We suggest to reduce cavitation effects by dividing the laser pulse energy into a pre-pulse with low and an ablation pulse with high energy. The pre-pulse creates a small cavitation bubble which can be filled by the ablation products of the main pulse. For suitable energy ratios between the pulses, this bubble will not be enlarged by the ablation products, and the maximal bubble size remains much smaller than after a single ablation pulse. The concept was analyzed by numerical calculations based on the Gilmore model of cavitation dynamics and by high-speed photography of the effects of single and double pulses performed with a silicone tube as vessel model. The use of double pulses prevents the deformation of the vessel walls. The concept works with an energy ratio of up to about 1:30 between the pulses. For the calculated optimal ratio of 1:14.6, the bubble volume is reduced by a factor of 17.7. The ablation pulse is best applied when the pre-pulse bubble is maximally expanded, but the timing is not very critical.     

PMP泡沫的飞秒激光烧蚀及切割方法

对密度为90 mg/cm3的PMP泡沫材料的飞秒激光烧蚀结果进行了分析,推导出该材料在脉宽50 fs、波长800 nm、重复频率为1000 Hz的飞秒激光作用下的蚀除阈值为0.91 J/cm2（100个激光脉冲）,获得了烧蚀直径分别随激光功率、脉冲数及聚焦物镜数值孔径的变化规律。相同飞秒激光加工系统下,对比了铜箔上获得的烧蚀形状,确定了PMP泡沫材料本身的多孔洞及其分布不均匀是造成烧蚀区域的形状不规则的重要因素。PMP泡沫在较高能量或是较长时间的飞秒激光作用下,烧蚀区域发生碳化的原因是由热作用引发的。提出了一种基于激光束耦合的飞秒激光切割厚度大于1 mm的薄膜-泡沫材料的方法,并获得了切割厚度大于1.5 mm、切割侧壁与光束光轴夹角小于5、切割面整洁的薄片。     

Laser ablation of silicon in water with nanosecond and femtosecond pulses

We describe laser ablation of Si under water by 5 ns, 355 nm and 100 fs, 800 nm pulses. Compared to that in air, an approximately twofold improvement in the ablation rate is found in water for femtosecond and nanosecond pulses. For higher laser irradiances, the plasma that forms at the water-air interface hampers further improvement of the ablation rate. We investigated the enhanced ablation process in water and found that the cavity-confinement geometry that increases the laser energy coupling to the target and allows more energy to be transferred to the cavity sidewalls plays an important role in the escalated material removal process. In addition, we show that the water layer that effectively reduces the oxidation and redeposition of the ablated debris is also responsible for improvements in the ablation process.     

Background gas collisional effects on expanding fs and ns laser ablation plumes

The collisional effects of a background gas on expanding ultrafast and short pulse laser ablation plumes were investigated by varying background pressure from vacuum to atmospheric pressure levels. For producing Cu ablation plumes, either 40 fs, 800 nm pulses from a Ti: Sapphire laser or 6 ns, 1,064 nm pulses from a Nd:YAG laser were used. The role of background pressure on plume hydrodynamics, spectral emission features, absolute line intensities, signal to background ratios and ablation craters was studied. Though the signal intensities were found to be maximum near to atmospheric pressure levels, the optimum signal to background ratios are observed ~20–50 Torr for both ns and fs laser ablation plumes. The differences in laser–target and laser–plasma couplings between ns and fs lasers were found to be more engraved in the crater morphologies and plasma hydrodynamic expansion features.     

Involvement of small carbon clusters in the enhancement of high-order harmonic generation of ultrashort pulses in the plasmas produced during ablation of carbon-contained nanoparticles

Various carbon-based nanoparticles ablated at the conditions suitable for efficient harmonic generation during propagation of ultrashort pulses through the laser-produced plasmas were studied. The transmission electron microscopy of ablated debris and the time-of-flight mass-spectroscopy studies of plasmas are presented. The conditions of laser ablation of the carbon-contained nanoparticles (fullerenes, graphene, carbon nanotubes, carbon nanofibers, and diamond nanoparticles) were varied to define the impeding processes restricting the harmonic yield from such laser-produced plasmas. These studies show that the enhancement of harmonics during ablation of nanoparticle targets was related with the appearance of small carbon clusters at the moment of propagation of the ultrashort laser pulses though such plasmas.     

Femtosecond uv excimer laser ablation

Experiments on the ablation of polymethylmethacrylate (PMMA) with 300 fs uv excimer laser pulses at 248 nm are reported for the first time. With these ultrashort pulses, ablation can be done at fluences up to five times lower than the threshold fluence for 16 ns ablation of PMMA, and the surface morphology is improved, also for several other materials. A model for ablation is proposed, assuming a non-constant absorption coefficient _eff depending on the degree of incubation of the irradiated material and the intensity of the incoming excimer laser pulse. The agreement between our model and our experimental observations is excellent for 16 ns excimer laser pulses, also predicting perfectly the shape of a pulse transmitted through a thin PMMA sample under high fluence irradiation. Qualitative agreement for 300 fs excimer laser pulses is obtained so far.     

Measurement of femtosecond laser-induced damage and ablation thresholds in dielectrics

The paper is focused on the importance of accurate determination of surface damage/ablation threshold of a dielectric material irradiated with femtosecond laser pulses. We show that different damage characterization techniques and data treatment procedures from a single experiment provide complementary physical results characterizing laser–matter interaction. We thus compare and discuss two regression techniques, well adapted to the measurement of laser ablation threshold, and a statistical approach giving the laser damage threshold and further information concerning the deterministic character of femtosecond damage. These two measurements are crucial for laser micromachining processes and high peak-power laser technology in general.     

Simulation of laser ablation in aluminum: the effectivity of double pulses

Lasers are becoming a more and more important tool in cutting and shaping materials. Improving precision and effectivity is an ongoing demand in science and industry. One possibility is double pulses. Here, we study laser ablation of aluminum by the two-temperature model. There the laser is modeled as a source in a continuum heat conduction equation for the electrons, whose temperature then is transferred to a molecular dynamics particle model by an electron–phonon coupling term. The melting and ablation effectivity is investigated depending on the relative intensity and the time delay between two Gaussian shaped laser pulses. It turns out that at least for aluminum the optimal pulse shapes are standard Gaussian pulses. For double pulses with delay times up to 200 ps, we find a behavior as observed in experiment: The ablation depth decreases beyond a delay of 10 ps even if one does not account for the weakening at the second pulse due to laser–plasma interaction.     

Theoretical studies of ultrafast ablation of metal targets dominated by phase explosion

Ultrashort pulse laser ablation of metallic targets is investigated theoretically through establishing a modified two-temperature model that takes into account both the temperature dependent electron–lattice coupling and the electron–electron-collision dominated electron diffusion processes for higher electron temperature regime. The electron–lattice energy coupling rate is found to reduce only slowly with increasing pulse duration, but grow rapidly with laser fluence, implying that the melting time of metallic materials decreases as the laser intensity increases. By taking phase explosion as the primary ablation mechanism, the predicted dependences of ablation rates on laser energy fluences for different laser pulse widths match very well with the experimental data. It is also found that during phase explosion the ablation rate is almost independent of the pulse width, whereas the ablation threshold fluence increases with the pulse duration even for femtosecond pulses. These theoretical results should be useful in having proper understanding of the ablation physics of ultrafast micromachining of metal targets. PACS 52.50.Jm; 61.80.Az; 72.15.Cz; 79.20.Ap; 79.20.Ds