High-power SiC MESFET using a dual p-buffer layer for an S-band power amplifier

A silicon carbide (SiC) based metal semiconductor field effect transistor (MESFET) is fabricated by using a standard SiC MESFET structure with the application of a dual p-buffer layer and a multi-recessed gate to the process for an S-band power amplifier. The lower doped upper-buffer layer serves to maintain the channel current, while the higher doped lower-buffer layer is used to provide excellent electron confinement in the channel layer. A 20-mm gate periphery SiC MESFET biased at a drain voltage of 85 V demonstrates a pulsed wave saturated output power of 94 W, a linear gain of 11.7 dB, and a maximum power added efficiency of 24.3% at 3.4 GHz. These results are improved compared with those of the conventional single p-buffer MESFET fabricated in this work using the same process. A radio-frequency power output greater than 4.7 W/mm is achieved, showing the potential as a high-voltage operation device for high-power solid-state amplifier applications.     

Application of superlattice gate and modulation-doped buffer for GaAs power MESFET grown by MBE

A new power GaAs MESFET (SGMBT), using the undoped superlattice gate and modulation-doped (MD) buffer, has been fabricated successfully by MBE. A much higher gate-drain breakdown voltage (30 V) and lower gate reverse leakage current have been obtained due to the existence of the undoped AlGaAs/GaAs superlattice gate insulator. The use of MD buffer structure introduces a high output resistance and low trap concentration at AlGaAs/GaAs interface. The degradation region at channel-buffer interface is estimated to be smaller than 40 Å. Thus the sharpness and smoothness between active channel and buffer is truly improved by the insertion of MD structure. The maximum output saturation current and output power of SGMBT are 300 mA/mm and 0.67 W/mm, respectively. By optimizing the device geometry and gate dimension, the output performance of SGMBT can be improved further.     

Effects of gate-buffer combined with a p-type spacer structure on silicon carbide metalben semiconductor field-effect transistors

An improved structure of silicon carbide metal-semiconductor field-effect transistors (MESFET) is proposed for high power microwave applications. Numerical models for the physical and electrical mechanisms of the device are presented, and the static and dynamic electrical performances are analysed. By comparison with the conventional structure, the proposed structure exhibits a superior frequency response while possessing better DC characteristics. A p-type spacer layer, inserted between the oxide and the channel, is shown to suppress the surface trap effect and improve the distribution of the electric field at the gate edge. Meanwhile, a lightly doped n-type buffer layer under the gate reduces depletion in the channel, resulting in an increase in the output current and a reduction in the gate-capacitance. The structural parameter dependences of the device performance are discussed, and an optimized design is obtained. The results show that the maximum saturation current density of 325 mA/mm is yielded, compared with 182 mA/mm for conventional MESFETs under the condition that the breakdown voltage of the proposed MESFET is larger than that of the conventional MESFET, leading to an increase of 79% in the output power density. In addition, improvements of 27% cut-off frequency and 28% maximum oscillation frequency are achieved compared with a conventional MESFET, respectively.     

Effects of gate-buffer combined with a p-type spacer structure on silicon carbide metal-semiconductor field-effect transistors

An improved structure of silicon carbide metal-semiconductor field-effect transistors (MESFET) is proposed for high power microwave applications. Numerical models for the physical and electrical mechanisms of the device are presented, and the static and dynamic electrical performances are analysed. By comparison with the conventional structure, the proposed structure exhibits a superior frequency response while possessing better DC characteristics. A p-type spacer layer, inserted between the oxide and the channel, is shown to suppress the surface trap effect and improve the distribution of the electric field at the gate edge. Meanwhile, a lightly doped n-type buffer layer under the gate reduces depletion in the channel, resulting in an increase in the output current and a reduction in the gate-capacitance. The structural parameter dependences of the device performance are discussed, and an optimized design is obtained. The results show that the maximum saturation current density of 325 mA/mm is yielded, compared with 182 mA/mm for conventional MESFETs under the condition that the breakdown voltage of the proposed MESFET is larger than that of the conventional MESFET, leading to an increase of 79% in the output power density. In addition, improvements of 27% cut-off frequency and 28% maximum oscillation frequency are achieved compared with a conventional MESFET, respectively.     

Improved performance of 4H-SiC metal-semiconductor field-effect transistors with step p-buffer layer

An improved 4H-SiC metal-semiconductor field-effect transistors (MESFETs) with step p-buffer layer is proposed, and the static and dynamic electrical performances are analysed in this paper. A step p-buffer layer has been applied not only to increase the channel current, but also to improve the transconductance. This is due to the fact that the variation in p-buffer layer depth leads to the decrease in parasitic series resistance resulting from the change in the active channel thickness and modulation in the electric field distribution inside the channel. Detailed numerical simulations demonstrate that the saturation drain current and the maximum theoretical output power density of the proposed structure are about 30% and 37% larger than those of the conventional structure. The cut-off frequency and the maximum oscillation frequency of the proposed MESFETs are 14.5 and 62 GHz, respectively, which are higher than that of the conventional structure. Therefore, the 4H-SiC MESFETs with step p-buffer layer have superior direct-current and radio-frequency performances compared to the similar devices based on the conventional structure.     

Experimental and numerical analysis of the multi-recessed gate structure for microwave silicon carbide power MESFETs

This paper reports that multi-recessed gate 4H-SiC MESFETs (metal semiconductor filed effect transistors) with a gate periphery of 5-mm are fabricated and characterized. The multi-recessed region under the gate terminal is applied to improve the gate--drain breakdown voltage and to alleviate the trapping induced instabilities by moving the current path away from the surface of the device. The experimental results demonstrate that microwave output power density, power gain and power-added efficiency for multi-finger 5-mm gate periphery SiC MESFETs with multi-recessed gate structure are about 29%, 1.1dB and 7% higher than those of conventional devices fabricated in this work using the same process.     

改进型异质栅对深亚微米栅长碳化硅MESFET特性影响

基于器件物理分析方法,结合高场迁移率、肖特基栅势垒降低、势垒隧穿等物理模型, 分析了改进型异质栅结构对深亚微米栅长碳化硅肖特基栅场效应晶体管沟道电势、 夹断电压以及栅下电场分布的影响.通过与传统栅结构器件特性的对比表明, 异质栅结构在碳化硅肖特基栅场效应晶体管的沟道电势中引入了多阶梯分布,加强了近源端电场; 另一方面,相比于双栅器件,改进型异质栅器件沟道最大电势的位置远离源端, 因此载流子在沟道中加速更快,在一定程度上屏蔽了漏压引起的电势变化,更好抑制了短沟道效应. 此外,研究了不同结构参数的异质栅对短沟道器件特性的影响,获得了优化的设计方案, 减小了器件的亚阈值倾斜因子.为发挥碳化硅器件在大功率应用中的优势,设计了非对称异质栅结构, 改善了栅电极边缘的电场分布,提高了小栅长器件的耐压.     

High output power Erbium-Ytterbium doped cladding pumped fiber amplifier

The performance of a high output power Erbium-Ytterbium doped fiber amplifier (EYDFA) pumped by a 927 nm laser diode are proposed and experimentally investigated. The EYDFA provides a flat gain and output power higher than 23 dBm in the wavelength region from 1545 to 1566 nm using a double-pass configuration. A broadband fiber Bragg grating is used in the double-pass EYDFA to allow a double-propagation of the test signal in the gain medium and thus improves the gain and output power characteristics of the amplifier. The maximum output power of 390 mW is obtained at the maximum 927 nm pump power of 4.1 W which translates to a power conversion efficiency of about 10%.     

18 W single-stage single-frequency acoustically tailored Raman fiber amplifier

A single-mode polarization-maintaining fiber doped to increase the Raman gain while suppressing stimulated Brillouin scattering (SBS) was utilized in a single-stage counter-pumped Raman fiber amplifier. The SBS suppression was achieved through the acoustic tailoring of the core. A pump probe experiment was conducted to characterize the Brillouin gain and indicated the existence of multiple Brillouin peaks. When the amplifier was seeded with approximately 15 mW of 1178 nm light, 11.5 W of cw output power was obtained with a linewidth ≤2 MHz. The application of a thermal gradient to further mitigate the SBS process increased the output power to 18 W, thus providing a net amplifier gain >30 dB.     

栅漏间表面外延层对4H-SiC功率MESFET击穿 特性的改善机理与结构优化

本文提出了一种带栅漏间表面p型外延层的新型MESFET结构并整合了能精确描述4H-SiC MESFET工作机理的数值模型,模型综合考虑了高场载流子饱和、雪崩碰撞离化以及电场调制等效应. 利用所建模型分析了表面外延层对器件沟道表面电场分布的改善作用,并采用突变结近似法对p型外延层参数与器件输出电流(I_ds)和击穿电压(V_B)的关系进行了研究.结果表明,通过在常规MESFET漏端处引入新的电场峰来降低栅极边缘的强电场峰并在栅漏之间的沟道表面引入p-n结内建电场进一步降低电场峰值,改善了表面电场沿电流方向的分布.通过与常规结构以及场板结构SiC MESFET的特性对比表明,本文提出的结构可以明显改善SiC MESFET的功率特性.此外,针对文中给定的器件结构,获得了优化的设计方案,选择p型外延层厚度为0.12 μupm,掺杂浓度为5× 10¹⁵ cm^-3,可使器件的V_B提高33%而保持I_ds基本不变.     

A novel 4H–SiC MESFET with modified channel depletion region for high power and high frequency applications

In this paper, a novel 4H–SiC metal semiconductor field effect transistor (MESFET) with modified depletion region is introduced. The key idea in this work is modifying the depletion region in the channel for improving the electrical performances. The proposed structure consists of upper and lower gates. Also, the lower gate is divided into a number (N) of smaller step-shaped sections. Therefore, we have called the proposed structure multiple-recessed 4H–SiC MESFET (MR-MESFET). DC and RF characteristics of the MR-MESFET structure with various lower gate segments are analyzed by 2D numerical simulation. The simulated results show that as the number of the lower gate sections increases, the channel depletion region is modified and the drain current (I_D) enhances. Also, by increasing the number of the lower gate sections, the breakdown voltage (V_BR) enhances, too. Improvement of the I_D and V_BR leads to a further increase in the output power density of the device. Also, cut-off frequency (f_T), maximum oscillation frequency (f_max), and maximum available gain (MAG) improvements are achieved for the MR-MESFET structure with further number of the lower gate sections. The results show that the MR-MESFET structure with higher number of the lower gate segments has superior electrical characteristics and performances in comparison with the MR-MESFET structure with fewer number of the lower gate sections.     

4H-SiC射频功率MESFET的自热效应分析

采用载流子速度饱和理论,建立了包含“自热效应”影响的适用于4HSiCMESFET的大信号输出IV特性解析模型,在模型中引入了温度变化的因素,提出了非恒定衬底环境温度T0的热传导模型,模拟结果与实验值一致,证明基于这种模型的理论分析符合器件测试及应用的实际情况 关键词： 4H-SiC 射频 MESFET 直流I-V特性 自热效应     

SiC功率金属-半导体场效应管的陷阱效应模型

针对4H-SiC射频大功率MESFET，建立了一个解析的陷阱效应模型，该模型采用简化参数描述方法，并结合自热效应分析，从理论上完善了SiC MESFET大信号直流I-V特性的解析模型，且避免了数值方法模拟陷阱效应的巨大计算量. 关键词： 碳化硅 陷阱效应 金属-半导体场效应晶体管 深能级陷阱 界面态     

国产30/600μm掺镱光纤实现4.1kW激光输出

采用化学气相沉积结合气相/液相复合掺杂方式制备30/600 μm掺镱双包层光纤,石英纤芯中的掺杂组分为Yb₂O₃, Al₂O₃,P₂O₅。基于976 nm发光二极管反向抽运方式,构建全光纤化的主控振荡器功率放大器结构对增益光纤进行测试。实验中,种子源功率为189 W,当泵浦总功率为4747 W时,激光输出功率为4120 W,放大级光光效率为85%,3 dB带宽为1.6 nm。激光器连续工作1 h,激光功率稳定在4100 W,未发生明显的功率衰退现象。     

New 4H silicon carbide metal semiconductor field-effect transistor with a buffer layer between the gate and the channel layer

A new 4H silicon carbide metal semiconductor field-effect transistor (4H-SiC MESFET) structure with a buffer layer between the gate and the channel layer is proposed in this paper for high power microwave applications. The physics-based analytical models for calculating the performance of the proposed device are obtained by solving one- and two-dimensional Poisson's equations. In the models, we take into account not only two regions under the gate but also a third high field region between the gate and the drain which is usually omitted. The direct-current and the alternating-current performances for the proposed 4H-SiC MESFET with a buffer layer of 0.2 μ m are calculated. The calculated results are in good agreement with the experimental data. The current is larger than that of the conventional structure. The cutoff frequency (f_T) and the maximum oscillation frequency (f_max) are 20.4 GHz and 101.6 GHz, respectively, which are higher than 7.8 GHz and 45.3 GHz of the conventional structure. Therefore, the proposed 4H-SiC MESFET structure has better power and microwave performances than the conventional structure.     

High-power Tm-doped fiber distributed-feedback laser at 1943 nm

We report on high-power operation of a fiber distributed-feedback (DFB) laser fabricated from Tm-doped photosensitive alumino-silicate fiber and in-band pumped by an Er/Yb fiber laser at 1565 nm. The fiber DFB laser yielded up to 875 mW of single-ended output at 1943 nm on two orthogonally polarized modes for 3.5 W of absorbed pump power. Further scaling of the DFB laser output power was achieved with the aid of a simple Tm-doped fiber amplifier stage spliced directly to the DFB fiber without the need of an optical isolator. The maximum output power from the DFB laser and fiber amplifier was >3 W for a combined absorbed pump power of 8.1 W. The influence of thermal loading, owing to quantum defect heating in the Tm-doped core, on the output power and longitudinal mode behavior is discussed, and the prospects for further improvement in performance are considered.     

高功率宽带射频调制连续激光源

射频强度调制激光作为激光雷达系统的载波可以有效提高系统的抗干扰和抗散射能力,高功率宽带射频强度调制光源是实现高分辨率远距离探测的关键.本文采用在Nd:YAG激光器的耦合腔中插入一对四分之一波片的方法实现了频差调谐范围为30 MHz—1.5 GHz的双频激光输出,结合光纤振荡功率放大技术,将双频信号光功率放大为50 W.耦合腔双频种子源具有良好的功率和频率稳定性,输出功率为9.5 mW时,功率标准差为0.145 mW,稳定性为1.52%,输出双频激光的频差为250 MHz时,拍频的标准差为1.6144 MHz.种子光进行三级光纤功率放大,得到50 W双频激光输出.放大后的双频激光功率波动范围小于0.1 W,双频拍频的标准差为1.777 MHz,很好地保持了放大之前的功率稳定性和双频频差稳定性.     

二次耦合直流输出的金属氧化物TFT行驱动电路

为了弥补现有氧化物TFT的行驱动电路输出模块在功率消耗、响应速度、输出摆幅等方面的不足,提出了基于二次耦合的直流输出模块,并由此研究设计新的行驱动电路拓扑。仿真结果表明,该输出模块具有驱动能力强、响应速度快等优点。最后,基于刻蚀阻挡层(ESL)结构的氧化物TFT工艺,在玻璃衬底上成功制备了该行驱动电路,实测单级功耗为325μW。     

新型低功耗金属氧化物TFT集成行驱动电路

金属氧化物薄膜晶体管(TFT)属于耗尽型器件,其集成的TFT的行驱动电路一般采用双负电源方案,存在与外围驱动芯片的匹配困难和功耗较大的不足。本文设计了一种新型耦合电路结构,可以产生比负电源更低的电压从而完全关闭输出模块的下拉晶体管,防止氧化物TFT耗尽模式引起的电流泄露问题,并由此设计了新型氧化物TFT行驱动电路拓扑。由于只采用一个负电源,其电源电压范围比采用双负电源方案的小,从而节省了功耗且有利于与外围驱动芯片的匹配连接。实验结果表明,基于刻蚀阻挡层(ESL)结构的氧化物TFT工艺,在玻璃衬底上成功制备了该行驱动电路,在电阻负载R_L=3 kΩ和容性负载C_L=30 pF下,所设计的行驱动电路在33.3 kHz时钟频率下实现脉宽10μs的全摆幅输出,每级功耗仅为160μW。基于新型耦合电路结构的行驱动电路能够满足60 Hz的刷新频率的1 980×1 080分辨率的显示需求。     

Tunable characteristic of phase-locked quantum cascade laser arrays

A multimode interference(MMI) structure is designed to simplify the fabrication of quantum cascade laser(QCL)phase-locked arrays. The MMI geometry is optimized with a sufficient output channel distance to accommodate conventional photolithography and wet etching process by which power amplifier array is fabricated without using the complicated two-step etching-regrowth or dry etching technique. The far-field pattern with periodically modulated peaks reveals that the beams from the arrays are phase-locked. Furthermore, the frequency tuning performance of the MMI-based phase-locked arrays is studied using the Littrow-configuration external cavity structure. A wavelength tuning range of more than 60 cm~(-1) is demonstrated, which will eventually realize the high power, frequency tunable, large-scale phase-locked arrays, and their application in spectroscopy.