2.0 μm 波段Sb基多量子阱材料的制备

采用分子束外延外延生长技术,优化InGaAsSb/AlGaAsSb多量子阱点材料的生长速率、生长温度和束流比等生长参数,获得了高质量的多量子阱材料。室温光荧光谱表明,材料的发光波长为2.0 m左右。该结果表明,通过优化生长条件和结构参数制备的量子阱材料,可以获得良好的结构质量和光学特性。所制备的器件室温条件下输出功率22 mW,阈值电流300 mA。     

长波长大应变InGaAs/InGaAsP分布反馈激光器的材料生长与器件制备

采用低压金属有机化合物气相沉积法(LP-MOCVD)生长并制作了1.6—1.7μm大应变InGaAs/InGaAsP分布反馈激光器.采用应变缓冲层技术，得到质量良好的大应变InGaAs/InP体材料.器件采用了4个大应变的量子阱，加入了载流子阻挡层改善器件的温度特性.1.66μm和1.74μm未镀膜的3μm脊型波导器件阈值电流低(小于15mA)，输出功率高(100mA时大于14mW).从10—40℃，1.74μm激光器的特征温度T₀=57K，和1.55μm InGaAsP分布反馈激光器的特征温度相当. 关键词： MOCVD InGaAs/InGaAsP 应变量子阱 分布反馈激光器     

1.3μm无致冷AlGaInAs/InP应变补偿量子阱激光器设计与制作

基于半导体量子阱激光器的基本理论,设计了合理的1.3μm无致冷AlGaInAs/InP应变补偿量子阱激光器结构,通过低压金属有机化学气相外延(LP-MOVPE)工艺在国内首次生长出了高质量的AlGaInAs/InP应变补偿量子阱结构材料,用此材料制作的器件指标为激射波长:1280nm≤λ≤1320nm,阈值电流:I_th(25℃)≤15mA,I_th(85℃)≤30mA,量子效率变化:Δη_ex(25℃～85℃)≤1.0dB,线性功率:P₀≥10mW     

850nm锥形半导体激光器的温度特性

采用激射波长为850 nm的AlGaInAs/AlGaAs梯度折射率波导分别限制增益量子阱结构的外延片,分别制备了具有锥形结构和条形结构的半导体激光器,并对比分析了两者的温度特性。结果显示,测试温度为20～70℃时,锥形结构器件的特征温度为164 K,远高于条形结构器件的96 K;占空比为0.5%（t=50μs,f=100 Hz）,1 000 mA脉冲电流注入条件下,锥形激光器和条形激光器的波长漂移系数分别为0.25和0.28 nm/K;测试温度〈50℃时,锥形激光器和条形激光器的光谱半高宽分别约为1.12和1.24 nm。实验结果表明：相同外延层结构条件下,锥形激光器比条形激光器拥有更高的特征温度。     

LP—MOCVD研制InGaAs/InP应变量子阱LD

本文指出在LP-MOCVD生长过程中,采用量子阱有源区和上限制层不同的生长温度以及生长非掺杂过渡层等技术能有效地控制InGaAs/InP量子阱激光器的p-n结结位,给出了采用DEZn和H₂S做掺杂源在InP材料中p型和n型杂质溶度和p-n结控制的条件,并研制出有源区阱层InGaAs与InP存在0.5%压缩应变量子阱激光器,这一结构LD实现室温脉冲激射,得到峰值功率为106mW以上,阈值电流密度为2.6kA/cm².     

980nm高功率列阵半导体激光器

本文分析了影响列阵半导体激光器输出功率的因素。利用分子束外延生长方法生长出InGaAs/GaAs应变量子阱激光器材料。利用该材料制作的应变量子阱列阵半导体激光器准连续（100Hz,100μs）输出功率达到80W（室温）,峰值波长为978－981nm。     

852 nm半导体激光器InGaAlAs、InGaAsP、 InGaAs和GaAs量子阱的温度稳定性

为了提高852 nm半导体激光器的温度稳定性,理论计算了InGaAlAs、InGaAsP、InGaAs和GaAs量子阱的增益,模拟对比并研究了不同量子阱的增益峰值和峰值波长随温度的漂移。结果显示,采用In_0.15Ga_0.74-Al_0.11As作为852 nm半导体激光器的量子阱可以使器件同时具有较高的增益峰值和良好的温度稳定性。使用金属有机化学气相沉积(MOCVD)外延生长了压应变In_0.15Ga_0.74Al_0.11As单量子阱852 nm半导体激光器,实验测得波长随温度漂移的数值为0.256 nm/K,实验测试结果验证了理论计算结果。     

941nm2%占空比大功率半导体激光器线阵列

计算了半导体激光器的激射波长与量子阱宽度以及有源层中In组分的关系,确定了941nm波长的量子阱宽度和In组分.并利用金属有机化合物气相淀积(MOCVD)技术生长了InGaAs/GaAs/AlGaAs分别限制应变单量子阱激光器材料.利用该材料制成半导体激光器线阵列的峰值波长为940.5 nm,光谱的FWHM为2.6 nm,在400 μs,50 Hz的输入电流下,输出峰值功率达到114.7 W(165 A),斜率效率高达0.81 W/A,阈值电流密度为103.7 A/cm2;串联电阻5 mΩ,最高转换效率可达36.9%.     

近800 nm波长张应变GaAsP/AlGaAs量子阱激光器有源区的设计

张应变GaAs_1-xP_x量子阱是高性能大功率半导体激光器的核心有源区,基于能带结构分析优化其结构参数具有重要的应用指导意义.首先,基于6×6 Luttinger-Kohn模型,采用有限差分法计算了张应变GaAs_1-xP_x量子阱的能带结构,得到了第一子带间跃迁波长固定为近800 nm时的阱宽-阱组分关系,即随着阱组分x的增加,需同时增大阱宽,且阱宽较大时靠近价带顶的是轻空穴第一子带lh₁,阱宽较小时靠近价带顶的是重空穴第一子带hh₁.计算并分析了导带第一子带c₁到价带子带lh₁和hh₁的跃迁动量矩阵元.针对808 nm量子阱激光器,模拟计算了阈值增益与阱宽的关系,得到大阱宽有利于横磁模激射,小阱宽有利于横电模激射.进一步考虑了自发辐射和俄歇复合之后,模拟计算了808 nm量子阱激光器的阱宽与阈值电流密度的关系,阱宽较大时载流子对高能级子带的填充使得阈值电流密度增加,而阱宽较小时则是低的有源区光限制因子导致阈值电流密度升高,因此存在一最佳的阱宽-阱组分组合,可使阈值电流密度达到最小.本文的模拟结果可对张应变GaAs_1-xP_x量子阱激光器的理论分析和结构设计提供理论指导.     

GaN量子点层厚度对太赫兹量子点级联激光器有源区优化设计的影响

近年来,随着太赫兹科学技术的兴起,Ga N基量子级联激光器成为进一步提高太赫兹源工作温度潜力的研究方向之一。半导体量子点由于其优越的量子限制效应对改善光电器件的特性有重要的作用。本文系统研究了引入Ga N量子点后,Ga N量子点层厚度对双阱结构周期的Al_xGa_1-xN/Al_yGa_1-yN太赫兹量子点级联激光器的有源区结构优化设计的影响,并考虑了各种不同掩埋量子点的阱层厚度的影响。发现该结构中量子点层厚度越小,跃迁发光能级的能量间隔越小,且处于太赫兹光能量范围内;反之量子点层厚度越大,明显超出了太赫兹范围,尤其超过2 nm后压电极化效应使量子点左侧的阱中的三角形势垒抬高,更加不利于发光跃迁的进行。因此量子点级联激光器要产生太赫兹波段的辐射需要量子点层厚度足够小,对该结构来说应小于等于1 nm。此外还发现总体上跃迁发光的能级间隔几乎不受掩埋量子点的阱层厚度的影响。这些研究结果可为引入Ga N量子点的Al_xGa_1-xN/Al_yGa_...     

Physical Analysis of a Possibility to Reach the 1.30-μm Emission from the GaAs-Based VCSELs with the InGaAs/GaAs Quantum-Well Active Regions and the Intentionally Detuned Optical Cavities

Physical aspects of an operation of the GaAs-based InGaAs/GaAs quantum-well (QW) VCSELs with the intentionally detuned optical cavities have been considered in the present paper using the comprehensive three-dimensional self-consistent optical–electrical–thermal-gain simulation. In GaAs-based structures, very good DBR resonator mirrors and a very efficient methods to confine radially both the current spreading and the electromagnetic field with the aid of oxide apertures may be applied. It has been found using the above simulation that even currently available immature technology enables manufacturing the above devices emitting radiation of wavelengths over 1.20 μm. In particular, while the room-temperature 1.30-μm lasing emission is still beyond possibilities of the InGaAs/GaAs QW VCSELs, these structures may offer analogous 1.25-μm emission, especially for the high-power and/or high-temperature operation.     

Bandgap tuning of semiconductor quantum well structures using ion implantation

Ion induced QW intermixing using broad area and focused ion beam (FIB) implantation was investigated at low energy (32 and 100 keV respectively) in three different material systems (GaAs/AlGaAs, InGaAs/GaAs, and lattice matched InGaAs/InP). Repeated sequential ion implants and rapid thermal anneals (RTAs) were successful in delivering several times the maximum QW bandgap shift achievable by a single implant/RTA cycle. The effectiveness of broad area high energy implantation (8 MeV As⁴⁺) on QW intermixing was also established for GRINSCH (graded-index separate confinement heterostructure) QW laser structures grown in InGaAs/GaAs. Lastly, preliminary work illustrating the effects of implant temperature and ion current density was carried out for InGaAs/GaAsQWs.     

高速850 nm垂直腔面发射激光器的优化设计与外延生长

利用传输矩阵理论和TFCalc薄膜设计软件分析了分布布拉格反射镜和垂直腔面发射激光器(VCSEL)的反射率谱特性,对比了从谐振腔入射与从表面入射时反射率谱的差异,为白光反射谱表征VCSEL外延片提供了依据.利用Crosslight软件模拟了InGaAs/AlGaAs应变量子阱的增益谱随温度的变化特性及VCSEL器件内部温度分布,设计了增益-腔模调谐的VCSEL.采用金属有机物化学气相淀积设备外延生长了顶发射VCSEL,制作了氧化孔径为7.5μm的氧化限制型VCSEL器件,测试了器件的直流特性、光谱特性和眼图特性;6 mA,2.5 V偏置条件下输出光功率达5 mW,4级脉冲幅度调制传输速率达50 Gbit/s.     

高In组分InGaNAs/GaAs量子阱的生长及发光特性

采用分子束外延技术(MBE)在Ga As衬底上外延生长高In组分(40%)In Ga NAs/Ga As量子阱材料,工作波长覆盖1.3~1.55μm光纤通信波段。利用室温光致发光(PL)光谱研究了N原子并入的生长机制和In Ga NAs/Ga As量子阱的生长特性。结果表明:N组分增加会引入大量非辐射复合中心;随着生长温度从480℃升高到580℃,N摩尔分数从2%迅速下降到0.2%;N并入组分几乎不受In组分和As压的影响,黏附系数接近1;生长温度在410℃、Ⅴ/Ⅲ束流比在25左右时,In_(0.4)Ga_(0.6)N_(0.01)As_(0.99)/Ga As量子阱PL发光强度最大,缺陷和位错最少;高生长速率可以获得较短的表面迁移长度和较好的晶体质量。     

Passively mode-locked Tm,Ho:YVO4 laser based on a semiconductor saturable absorber mirror

We report the demonstration of passively continuous-wave mode-locking(CWML) of diode-pumped Tm,Ho:YV04 laser using an InGaAs/GaAs multiple quantum-well(MQW) structure semiconductor as the saturable absorber.Stable mode-locking pulses at the central wavelength of 2 041 nm are obtained. The maximum output power is 151 mW.The pulse duration is 10.5 ps at the repetition rate of 64.3 MHz.     

A low-threshold and high-power oxide-confined 850-nm AlInGaAs strained quantum-well vertical-cavity surface-emitting laser

A low-threshold and high-power oxide-confined 850-nm AlInGaAs strained quantum-well (QW) vertical-cavity surface-emitting laser (VCSEL) based on an intra-cavity contacted structure is fabricated. A threshold current of 1.5 mA for a 22 μm oxide aperture device is achieved, which corresponds to a threshold current density of 0.395 kA/cm². The peak output optical power reaches 17.5 mW at an injection current of 30 mA at room temperature under pulsed operation. While under continuous-wave (CW) operation, the maximum power attains 10.5 mW. Such a device demonstrates a high characteristic temperature of 327 K within a temperature range from -12℃ to 96℃ and good reliability under a lifetime test. There is almost no decrease of the optical power when the device operates at a current of 5 mA at room temperature under the CW injection current.     

Beam profile characteristics of InGaAs sub-monolayer quantum-dot photonic-crystal VCSELs

An InGaAs sub-monolayer (SML) quantum dot photonic crystal vertical-cavity surface-emitting laser (QD PhC-VCSEL) for fiber-optic applications is first time demonstrated. The active region of the device contains 3 InGaAs SML QD layers. Each of the InGaAs SML QD layer is formed by alternate deposition of InAs (<1 ML) and GaAs. Single fundamental mode CW output power of 3.8 mW at 28 mA has been achieved in the 990 nm range, with a threshold current of 0.9 mA. Side-mode suppression ratio (SMSR) larger than 35 dB has been demonstrated over entire current operation range. The beam profile study of the PhC-VCSEL indicates that the laser beam is well confined by the photonic crystal structure of the device. The divergence angle of the devices remains almost unchanged with increasing current.