CrO2 (1 0 0) and TiO2 (1 0 0) film heteroepitaxy on a BaF2 (1 1 1)/Si (1 0 0) substrate

Multi-domained heteroepitaxial rutile-phase TiO₂ (1 0 0)-oriented films were grown on Si (1 0 0) substrates by using a 30-nm-thick BaF₂ (1 1 1) buffer layer at the TiO₂–Si interface. The 50 nm TiO₂ films were grown by electron cyclotron resonance oxygen plasma-assisted electron beam evaporation of a titanium source, and the growth temperature was varied from 300 to 600 °C. At an optimal temperature of 500 °C, X-ray diffraction measurements show that rutile phase TiO₂ films are produced. Pole figure analysis indicates that the TiO₂ layer follows the symmetry of the BaF₂ surface mesh, and consists of six (1 0 0)-oriented domains separated by 30° in-plane rotations about the TiO₂ [1 0 0] axis. The in-plane alignment between the TiO₂ and BaF₂ films is oriented as [0 0 1] TiO₂ || BaF₂ or [0 0 1] TiO₂ || BaF₂ . Rocking curve and STM analyses suggest that the TiO₂ films are more finely grained than the BaF₂ film. STM imaging also reveals that the TiO₂ surface has morphological features consistent with the BaF₂ surface mesh symmetry. One of the optimally grown TiO₂ (1 0 0) films was used to template a CrO₂ (1 0 0) film which was grown via chemical vapor deposition. Point contact Andreev reflection measurements indicate that the CrO₂ film was approximately 70% spin polarized.     

Properties of ZnO films grown on (0 0 0 1) sapphire substrate using H2O and N2O as O precursors by atmospheric pressure MOCVD

In this paper, we compare the properties of ZnO thin films (0 0 0 1) sapphire substrate using diethylzinc (DEZn) as the Zn precursor and deionized water (H₂O) and nitrous oxide (N₂O) as the O precursors, respectively in the main ZnO layer growth by atmospheric pressure metal–organic chemical vapor deposition (AP-MOCVD) technique. Surface morphology studied by atomic force microscopy (AFM) showed that the N₂O-grown ZnO film had a hexagonal columnar structure with about 8 μm grain diameter and the relatively rougher surface compared to that of H₂O-grown ZnO film. The full-widths at half-maximum (FWHMs) of the (0 0 0 2) and () ω-rocking curves of the N₂O-grown ZnO film by double-crystal X-ray diffractometry (DCXRD) measurement were 260 and 350 arcsec, respectively, indicating the smaller mosaicity and lower dislocation density of the film compared to H₂O-grown ZnO film. Compared to H₂O-grown ZnO film, the free exciton A (FX_A) and its three phonon replicas could be clearly observed, the donor-bound exciton A⁰X (I₁₀):3.353 eV dominated the 10 K photoluminescence (PL) spectrum of N₂O-grown ZnO film and the hydrogen-related donor-bound exciton D⁰X (I₄):3.363 eV was disappeared. The electron mobility (80 cm²/V s) of N₂O-grown ZnO film has been significantly improved by room temperature Hall measurement compared to that of H₂O-grown ZnO film.     

Formation of twinning-superlattice regions by artificial stacking of Si layers

We report about the formation of twinning-superlattice regions in Si epitaxial layers grown by molecular beam epitaxy on Si(1 1 1)()R30°-B surfaces. Twinning-superlattice regions were formed by periodical arrangement of 180° rotation twin boundaries along [1 1 1]-direction and are only separated by a few nanometers. The preparation method consists of repeating several growth, boron-deposition and annealing cycles on boron-predeposited undoped Si substrates. It is shown that the amount of subsurface boron and the growth mode influence the formation of twin boundaries. Only the nucleation of Si on the Si(1 1 1)()R30°-surface covered by at least ML boron results in the formation of 180° rotation twins. The size of superlattice regions is restricted by surface morphology. However, the presented technology should also be suitable to prepare a new type of semiconductor heterostructure based on Si polytypes.     

Nucleation of AlN on SiC substrates by seeded sublimation growth

The nucleation of aluminum nitride (AlN) on silicon carbide (SiC) seed by sublimation growth was investigated. Silicon-face, 8 off-axis 4H-SiC (0 0 0 1) and on-axis 6H-SiC (0 0 0 1) were employed as seeds. Initial growth for 15 min and extended growth for 2 h suggested that 1850 °C was the optimum temperature of AlN crystal growth: on an 8 off-axis substrate, AlN grew laterally forming a continuous layer with regular “step” features; on the on-axis substrate, AlN grew vertically as well as laterally, generating an epilayer with hexagonal sub-grains of different sizes. The layer's c-lattice constant was larger than pure AlN, which was caused by the compression of the AlN film and impurities (Si, C) incorporation. Polarity sensitive and defect selective etchings were performed to examine the surface polarity and dislocation density. All the samples had an Al-polar surface and no N-polar inversion domains were observed. Threading dislocations were present regardless of the substrate misorientation. Basal plane dislocations (BPDs) were revealed only on the AlN films on the 8 off-axis substrates. The total dislocation density was in the order of when the film was 20– thick.     

Diffusion of Zn in stoichiometric LiTaO3

As stoichiometric LiTaO₃ (LT) draws a considerable attention for integrated optical waveguide devices, we have investigated Zn diffusion into this material by diffusing 70- nm-thick ZnO films deposited on y-cut LT substrates at 700–900 °C under various atmospheres. It was observed that the surface quality was very sensitive to pressure, but weakly affected by other diffusion conditions such as temperature and atmosphere. While the surface degraded, being covered with some residuals after heat treatment at the atmospheric pressure, it was very smooth and clear when the pressure was lowered below about 10 Torr. Another feature of Zn-diffused stoichiometric LT is that the crystal maintains its transparency even after diffusion at a pressure as low as 0.1 Torr, thus without a post-annealing step required. The diffusion coefficient varied from D=1.1×10^-2 to 5.5×10⁻¹ μm²/h in the given temperature range, with an activation energy of .     

Mechanochemical–hydrothermal synthesis of hydroxyapatite from nonionic surfactant emulsion precursors

Nanocrystalline hydroxyapatite [HA, Ca₁₀(PO₄)₆(OH)₂] powders were synthesized by the mechanochemical–hydrothermal method using emulsion systems consisting of aqueous phase, petroleum ether (PE) as the oil phase and biodegradable Tomadol 23–6.5 as the nonionic surfactant. (NH₄)₂HPO₄ and Ca(NO₃)₂ or Ca(OH)₂ were used as the phosphorus and calcium sources, respectively. The calcium source and emulsion composition had significant effects on the stoichiometry, crystallinity, thermal stability, particle size and morphology of final products. Disperse HA crystals with a 160 nm length and aspect ratio of ca. 6 were formed in an emulsion system containing 10 wt% PE, 60 wt% water and 30 wt% surfactant. The HA particles had needle morphology with a specific surface area of . With this technique, HA nanopowders with specific surface areas in the range of 72– were produced.     

Low-temperature Si epitaxy on large-grained polycrystalline seed layers by electron–cyclotron resonance chemical vapor deposition

The epitaxial thickening of polycrystalline Si films on glass substrates is of great interest for the realization of crystalline Si thin film solar cells and other large-area thin film devices. In this paper we report on the epitaxial growth of Si at temperatures below on polycrystalline seed layers using electron–cyclotron resonance chemical vapor deposition. The Si seed layers were prepared by aluminum-induced crystallization. The quality of the ECRCVD-grown films strongly depends on the orientation of the underlying seed layer grains. Due to a mainly favorable orientation of the seed layers more than 73% of the substrate area were epitaxially thickened. It turned out that a (1 0 0) preferential orientation is favorable for epitaxial thickening. This, however, is not the only requirement for successful low-temperature epitaxial growth of Si.     

ZnO hexagonal prisms grown onto p-Si (1 1 1) substrate from poly (vinylpyrrolidone) assisted electrochemical assembly

Nonionic polymer poly (vinylpyrrolidone) (PVP) was firstly mixed into oxygenated zinc chloride electrolyte to modulate the crystal growth and morphology of ZnO from electrodeposition. Arrays of ZnO hexagonal prisms with well-defined (0 0 0 1) end facets and side facets were grown perpendicularly onto p-type Si substrates using the simple and economic route. It was observed that the concentration of PVP played an important role in the final morphology and size of ZnO crystals. The optical studies indicated that the addition of PVT not only influenced crystal growth habit but also improved the optical properties of ZnO.     

Growth of single crystals of the new double perovskite Ba2HoRu1−xCuxO6 from high temperature solutions

Single crystals of Ba₂HoRu_1−xCu_xO₆ have been grown from high temperature solutions using PbO–PbF₂ as solvent in the temperature range 1150–1250 °C. Crystals with a six sided plate like morphology measuring up to 3 mm across and 0.5 mm thick and polyhedral habit measuring up to 2 and 1 mm in thick mass were obtained. Powder X-ray diffraction patterns obtained on the crystals were indexed to give a monoclinic space group P2₁/n with lattice parameters a=5.875(2), b=5.874(3), c=8.960(1) and β=89.995(2)°. The crystals with x=0 show a single anomaly at 6.5 K corresponding to an antiferromagnetic phase with . The crystals containing Cu show additional anomalies at 18 and 48 K. The SEM and EDS analysis reveals a 2116 phase.     

Direct observation of sublimation process on a CdTe(1 1 1) surface using an ultrafine particle

A particle with a CdTe core and carbon mantle was produced by the advanced carbon-coating method which enables direct coverage with a carbon layer using an electron microscope. The coagulated particles containing approximately 30–200 CdTe particles produced by the gas evaporation method were covered with a carbon layer of about 7 nm thickness at 300°C. By heating these particles above 500°C, the sublimation process of a part of the CdTe particle can be directly captured by high-resolution transmission electron microscopy and recorded in real time on videotape. Sublimation on the CdTe(1 1 1) surfaces occurred in the step flow mode of two (1 1 1) layers. It was observed that two (1 1 1) zinc-blende layers changed to the (0 0 0 2) würtzite configuration unit just before sublimation. The condensation of CdTe on the sublimated particle surface and growth of CdTe in the carbon layers were also captured in the video image. These sublimation processes were discussed in terms of the existence of the polarity of II–VI compounds.     

MOCVD growth of GaN on Si(1 1 1) substrates using an ALD-grown Al2O3 interlayer

GaN thin films have been grown on Si(1 1 1) substrates using an atomic layer deposition (ALD)-grown Al₂O₃ interlayer. This thin Al₂O₃ layer reduces strain in the subsequent GaN layer, leading to lower defect densities and improved material quality compared to GaN thin films grown by the same process on bare Si. XRD ω-scans showed a full width at half maximum (FWHM) of 549 arcsec for GaN grown on bare Si and a FWHM as low as 378 arcsec for GaN grown on Si using the ALD-grown Al₂O₃ interlayer. Raman spectroscopy was used to study the strain in these films in more detail, with the shift of the E₂(high) mode showing a clear dependence of strain on Al₂O₃ interlayer thickness. This dependence of strain on Al₂O₃ thickness was also observed via the redshift of the near bandedge emission in room temperature photoluminescence (RT-PL) spectroscopy. The reduction in strain results in a significant reduction in both crack density and screw dislocation density compared to similar films grown on bare Si. Screw dislocation density of the films grown on Al₂O₃/Si substrates approaches that of typical GaN layers on sapphire. This work shows great promise for the use of oxide interlayers for growth of GaN-based LEDs on Si.     

Some aspects on thermodynamic properties, phase diagram and alloy formation in the ternary system BAs–GaAs—Part I: Analysis of BAs thermodynamic properties

Owing to the lack of available thermodynamic data based on experimental measurements of heat capacity, decomposition reaction or vapour pressure measurements, the problem of BAs stability is considered. We propose a new set of thermodynamic data for enthalpy of formation, entropy and Gibbs free energy of Bas compound. By using thermodynamic database, our approach is based on the semi-empirical trends and analogy in the variation of those quantities for several binary series in different III–V systems like arsenides, nitrides and phosphides. Thus, the values for BAs were derived by extrapolation from Al to boron-based compounds (BAs, BP and, BN). For pure BAs(s), we predict a low enthalpy of formation in the standard state of at 300 K and a Gibbs free energy of indicating a lower stability of this compound than GaAs. Those values are contradictory discussed with trends in the cohesive energy of several III–V systems. A cohesive energy of 900 kJ/mol (9.4 eV) is proposed in agreement with Philips's rule.     

Investigations on the effect of InSb and InAsSb step-graded buffer layers in InAs0.5Sb0.5 epilayers grown on GaAs (0 0 1)

We report the structural and electrical properties of InAsSb epilayers grown on GaAs (0 0 1) substrates with mid-alloy composition of 0.5. InSb buffer layer and InAs_xSb_1−x step-graded (SG) buffer layer have been used to relax lattice mismatch between the epilayer and substrate. A decrease in the full-width at half-maximum (FWHM) of the epilayer is observed with increasing the thickness of the InSb buffer layer. The surface morphology of the epilayer is found to change from 3D island growth to 2D growth and the electron mobility of the sample is increased from 5.2×10³ to 1.1×10⁴ cm²/V s by increasing the thickness of the SG layers. These results suggest that high crystalline quality and electron mobility of the InAs_0.5Sb_0.5 alloy can be achieved by the growth of thick SG InAsSb buffer layer accompanied with a thick InSb buffer layer. We have confirmed the improvement in the structural and electrical properties of the InAs_0.5Sb_0.5 epilayer by quantitative analysis of the epilayer having a 2.09 μm thick InSb buffer layer and 0.6 μm thickness of each SG layers.     

High-temperature growth of very high germanium content SiGe virtual substrates

We have first of all studied (in reduced pressure–chemical vapour deposition) the high-temperature growth kinetics of SiGe in the 0–100% Ge concentration range. We have then grown very high Ge content (55–100%) SiGe virtual substrates at 850 °C. We have focused on the impact of the final Ge concentration on the SiGe virtual substrates’ structural properties. Polished Si_0.5Ge_0.5 virtual substrates were used as templates for the growth of the high Ge concentration part of such stacks, in order to minimize the severe surface roughening occurring when ramping up the Ge concentration. The macroscopic degree of strain relaxation increases from 99% up to values close to 104% as the Ge concentration of our SiGe virtual substrates increases from 50% up to 100% (discrepancies in-between the thermal expansion coefficients of Si and SiGe). The surface root mean square roughness increases when the Ge concentration increases, reaching values close to 20 nm for 100% of Ge. Finally, the field (the pile-up) threading dislocations density (TDD) decreases as the Ge concentration increases, from 4×10⁵ cm⁻² (1–2×10⁵ cm⁻²) for [Ge]=50% down to slightly more than 1×10⁵ cm⁻² (a few 10⁴ cm⁻²) for [Ge]=88%. For [Ge]=100%, the field TDD is of the order of 3×10⁶ cm⁻², however.     

Growth and optical absorption spectra of ZnO films grown by pulsed laser deposition

ZnO films on Al₂O₃ substrate were grown by using a pulsed laser deposition method. Through photoluminescence (PL) and X-ray diffraction (XRD) measurements, the optimum growth conditions for the ZnO growth were calculated. The results of the XRD measurement indicate that ZnO film was strongly oriented to the c-axis of hexagonal structure and epitaxially crystallized under constraints created by the substrate. The full-width half-maximum for a theta curve of the (0 0 0 2) peak was 0.201°. Also, from the PL measurement, the grown ZnO film was observed to be a free exciton, which indicates a high quality of epilayer. The Hall mobility and carrier density of the ZnO film at 293 K were estimated to be 299 cm²/V sec and , respectively. The absorption spectra revealed that the temperature dependence of the optical band gap on the ZnO films was − .     

Crystallization of calcium oxalate monohydrate at dipalmitoylphosphatidylcholine monolayers in the presence of chondroitin sulfate A

The growth and aggregation of calcium oxalate monohydrate (COM) crystals beneath dipalmitoylphosphatidylcholine (DPPC) monolayers in the presence of chondroitin sulfate A (C₄S) was systematically examined under different surface pressure. The results indicated that the addition of C₄S can inhibit the crystal growth and prevent the aggregation of COM crystals. Under a DPPC monolayer, well-defined three-dimensional hexagonal prisms and three-dimensional rhombus prisms with sharply angled tips were obtained. The DPPC monolayer at a surface pressure of 10 mN/m can match the Ca²⁺ distance of the face of COM better than at 20 mN/m. The addition of C₄S could cooperatively modulate the interaction strength between the monolayer (or itself) with the specific morphology determining faces such as and (0 2 0), and thus results in remarkable stabilization of the faces. The dramatic changes in morphological details were due to the strong electrostatic interactions between the Ca²⁺-rich crystal faces of COM and the polyanionic polysaccharide C₄S together with the negatively charged sites of the zwitterionic DPPC monolayers. The increase of the concentration of C₄S can further enhance the stabilization of the face.     

A study of the degree of relaxation of AlGaN epilayers on GaN template

The strain state of 570 nm Al_xGa_1−xN layers grown on 600 nm GaN template by metal organic chemical vapor deposition was studied using Rutherford backscattering (RBS)/channeling and triple-axis X-ray diffraction measurements. The results showed that the degree of relaxation (R) of Al_xGa_1−xN layers increased almost linearly when x0.42 and reached to 70% when x=0.42. Above 0.42, the value of R varied slowly and Al_xGa_1−xN layers almost full relaxed when x=1 (AlN). In this work the underlying GaN layer was in compressive strain, which resulted in the reduction of lattice misfit between GaN and Al_xGa_1−xN, and a 570 nm Al_xGa_1−xN layer with the composition of about 0.16 might be grown on GaN coherently from the extrapolation. The different shape of (0 0 0 4) diffraction peak was discussed to be related to the relaxation.     

Enhanced two-dimensional growth of MOVPE InN films on sapphire (0 0 0 1) substrates

MOVPE growth of InN on sapphire substrates is compared using two different designs of horizontal reactor. The major difference between the two designs is a variation in the reactant-gas flow-spacing between the substrate and the ceiling of the quartz chamber: 33 mm for the Type A reactor and 14 mm for Type B. Compared with the Type A reactor, the Type B reactor brings about InN films with a larger grain size. This is especially true when InN is grown at 600°C using the Type B reactor, in which case the two-dimensional (2D) growth of InN is found to be extremely enhanced. An investigation of the NH₃/TMIn molar ratio dependence of the surface morphology of grown InN films using the two reactors suggests that the enhanced 2D growth is attributed to the decrease in the effective NH₃/TMIn ratio in the growth atmosphere. Even using the Type A reactor, a film with enhanced 2D growth can be obtained when the NH₃/TMIn ratio is considerably low (1.8×10⁴). The enhanced 2D growth results in a smaller XRC-FWHM (full-width at half maximum of the X-ray rocking curve) (1500 arcsec), than that for a 3D-grown film (5000 arcsec).     

Porous crystal structures obtained from directionally solidified eutectic precursors

Interconnecting cage-like porous structures of several halide compounds were prepared by the selective leaching of one eutectic phase method. The binary eutectic precursors were prepared by directional solidification using the Bridgman crystal growth technique. Porous NaMgF₃ (40% pore volume), CaF₂ (57% pore volume) and BaF₂ (43% pore volume) crystals were obtained after water leaching the NaF component of the directionally solidified NaF/NaMgF₃, NaF/CaF₂ and NaF/BaF₂ eutectics with the appropriate entangled microstructure. The growth conditions for eutectic-coupled growth and the morphology of the eutectics have been determined. In the coupled growth regime, the size of the eutectic phases “λ” is fairly uniform and varies with the eutectic growth rate “v” as λ²v=constant, which allows us to control the pore size within the 0.5–10 μm range. The simplicity and versatility of the eutectic growth also allows us to fabricate highly aligned porous structures at relatively high production rates.     

Defect reduction in GaN epilayers and HFET structures grown on (0 0 0 1)sapphire by ammonia MBE

The quality of GaN epilayers grown by molecular beam epitaxy on substrates such as sapphire and silicon carbide has improved considerably over the past few years and in fact now produces AlGaN/GaN HEMT devices with characteristics among the best reported for any growth technique. However, only recently has the bulk defect density of MBE grown GaN achieved levels comparable to that obtained by MOVPE and with a comparable level of electrical performance. In this paper, we report the ammonia-MBE growth of GaN epilayers and HFET structures on (0 0 0 1)sapphire. The effect of growth temperature on the defect density of single GaN layers and the effect of an insulating carbon doped layer on the defect density of an overgrown channel layer in the HFET structures is reported. The quality of the epilayers has been studied using Hall effect and the defect density using TEM, SEM and wet etching. The growth of an insulating carbon-doped buffer layer followed by an undoped GaN channel layer results in a defect density in the channel layer of 2×10⁸ cm⁻². Mobilities close to 490 cm²/Vs at a carrier density of 8×10¹⁶ cm⁻³ for a 0.4 μm thick channel layer has been observed. Growth temperature is one of the most critical parameters for achieving this low defect density both in the bulk layers and the FET structures. Photo-chemical wet etching has been used to reveal the defect structure in these layers.