衬底温度对含硅量子点的SiCx薄膜结构及其光学特性的影响

采用磁控共溅射沉积法,以Si靶和SiC靶为靶材,单晶Si(100)和石英为衬底,在不同衬底温度下沉积了富硅SiCx薄膜.在氮气氛下于1100 ℃退火,得到包含硅量子点的SiCx薄膜.采用傅立叶变换红外吸收光谱、拉曼光谱、掠入射X射线衍射和吸收谱对退火后的SiCx薄膜进行了表征.结果表明:当衬底温度从室温(25℃)升至300℃时,薄膜的晶化率增至71.3;,硅量子点尺寸增至8.9 nm,而光学带隙则减至2.42 eV;随着衬底温度进一步升高,薄膜的晶化率降至63.1;,硅量子点尺寸减小至7.3 nm,而光学带隙却增加至2.57 eV;当衬底温度从室温(25℃)升至400℃时,薄膜的吸收系数呈先增大后减小趋势.在本实验条件下,最佳衬底温度为300℃.     

电场辅助铝诱导晶化非晶硅薄膜

以氢气稀释的硅烷和氢气为反应气体,利用PECVD法先在玻璃衬底上生长非晶硅薄膜,然后利用磁控溅射法在非晶硅薄膜上镀制铝膜,最后将镀有铝膜的非晶硅薄膜样品置于快速热处理炉中,在外加电场辅助条件下,在氮气气氛下对薄膜样品进行退火制备多晶硅薄膜.本论文研究了不同外加电场强度和退火时间对非晶硅薄膜晶化的影响.利用XRD、SEM和Raman等测试方法对薄膜样品的晶相结构、表面形貌和晶化程度进行了表征.实验结果表明,在外加横向电场辅助铝诱导晶化的条件下,非晶硅薄膜在500 ℃低温下成功地转化成多晶硅薄膜,并且随着横向电场强度的增大以及退火时间的延长,薄膜的晶化程度增强,晶粒尺寸增大.     

铝层厚度对铝诱导非晶硅薄膜晶化过程的影响

基于铝诱导非晶硅薄膜固相晶化方法,利用直流磁控溅射离子镀技术制备了Al/Si/…Al/Si/glass周期性结构的薄膜.采用真空退火炉对Al/Si多层薄膜进行了500℃退火实验,通过透射电子显微镜(TEM)分析了退火前、后Al/Si多层薄膜截面形貌的变化规律,并结合扩散过程探讨了铝层厚度对铝诱导非晶硅薄膜晶化过程的本质影响机理.研究结果表明:在铝诱导非晶硅薄膜固相晶化过程中,随退火过程的进行,Al、Si原子会沿Al/si层间界面进行互扩散运动且在Si层中达到临界浓度Cs的Al原子所在区域整体呈线形平行于Al/Si界面逐渐向铝原子扩散距离增大的方向推进;随着Al层厚度的增加,Al在Si层中达到临界浓度Cs的区域整体向前推进速度加快,已扩散区域产生硅初始晶核的数量也随之增大;随Al/Si层厚比的增大,虽因铝诱导而晶化的硅薄膜均为多晶态,但非晶硅薄膜在晶化过程中的生长晶面数量增多,同时硅晶粒的尺寸有所减小.     

溶胶-凝胶法制备Mg掺杂ZnO薄膜的微结构与光学性质

采用溶胶-凝胶技术在Si(111)和石英玻璃衬底上制备了Mg掺杂ZnO薄膜.用X射线衍射仪(XRD)、原子力显微镜(AFM)、扫描电镜(SEM)和紫外-可见(UV-Vis)分光光度计测试薄膜的微结构、表面形貌和光学性质.结果表明:所得Mg掺杂ZnO薄膜仍为六角纤锌矿型结构,呈c轴方向择优生长,随着退火温度升高,薄膜的晶格常数c由0.5288 nm减小到0.5278 nm,粗糙度从3.8 nm增大到6.5 nm,光学带隙由3.26 eV增大到3.31 eV.     

Ge覆盖层诱导晶化多晶Si薄膜的晶化特性研究

采用电子束蒸发技术在衬底温度为180℃条件下生长具有Ge覆盖层的非晶Si薄膜,并于500℃、600℃、700℃真空退火5h.采用Raman散射、X射线衍射(XRD)、全自动数字式显微镜等对所制备薄膜的晶化特性进行研究.结果表明,Ge覆盖层具有诱导非晶Si薄膜晶化的作用,且随着退火温度的升高a-Si薄膜晶化越显著.具有Ge覆盖层非晶薄膜经500℃退火5h沿Si(400)方向开始晶化,对应晶粒尺寸约为4.9 nm.将退火温度升高到700℃时,非晶硅薄膜几乎全部晶化,晶化多晶Si薄膜在Si(400)方向表现出很强的择优取向特性,晶粒尺寸高达23.3μm.与相同条件下制备的无Ge覆盖层的非晶Si薄膜相比,晶化温度降低了300℃.     

AIC多晶硅薄膜的制备与其上HWCVD低温外延生长多晶硅薄膜的研究

铝诱导晶化法(AIC)是一种低温制备大晶粒多晶硅薄膜的重要方法.本文分别基于Al/Al2O3/a-Si叠层和a-Si/SiOx/Al叠层制备了AIC多晶硅薄膜,前者表面粗糙,后者表面光滑.以后者为籽晶层,在其上用HWCVD法300℃低温下外延生长了表面形貌与籽晶层相似的多晶硅薄膜.铝诱导晶化过程中,在原始非晶硅层中会形成多晶硅、非晶硅和铝的混合层,去除铝后残留的硅将使表面粗糙,而在原始铝层中则形成连续的多晶硅薄膜.Al/Al2O3/a-Si 叠层和a-Si/SiOx/Al叠层的上层分别是非晶硅层和铝层,发生层交换后,前者上层是硅铝混合层,因此表面粗糙,后者上层是连续的多晶硅薄膜,因此表面光滑.在AIC多晶硅薄膜表面外延生长多晶硅薄膜等效于铝诱导多晶硅的晶核在垂直于薄膜方向上的继续生长,因此外延生长的薄膜与AIC多晶硅薄膜呈现相似的枝晶状形貌.     

退火时间对铝诱导非晶硅薄膜晶化过程的影响

基于铝诱导非晶硅薄膜固相晶化方法,利用直流磁控溅射离子镀技术制备了Al/ Si…Al/ Si/ glass周期性结构的薄膜.采用真空退火炉对Al/ Si多层薄膜进行了500℃退火实验,通过透射电子显微镜(TEM)分析了不同退火时间下Al/ Si多层薄膜截面形貌的变化规律,并结合扩散过程探讨了退火时间对铝诱导非晶硅薄膜晶化过程的影响机理.研究结果表明:在铝诱导非晶硅薄膜固相晶化过程中,在退火过程的初期,晶态硅薄膜的生长主要来源于因Al的存在而形成的硅初始品核数量增加的贡献.随退火时间的延长,晶态硅薄膜的生长主要是依靠临界浓度线已推进区域中未参与形核的硅原子扩散至初始品核位置并进行外延生长来实现的.经500℃退火1 h后,Al/ Si薄膜的截面形貌巾出现了沿Si(111)晶面生长的栾品组织.     

衬底温度对氢化非晶硅薄膜特性的影响

采用等离子增强化学气相沉积(PECVD)系统,以乙硅烷和氢气为气源,石英玻璃和单晶硅片为衬底制备了氢化非晶硅(a-Si∶ H)薄膜.采用扫描电子显微镜、X-射线衍射仪、台阶仪、紫外可见分光光度计、傅里叶变换红外光谱仪和电子能谱仪等分别表征了a-Si∶H薄膜的表面形貌、结晶特性、沉积速率,光学带隙,键合结构和Si化合态等特性.结果表明:随着衬底温度的增加,a-Si∶H薄膜表面的颗粒尺寸减小,均匀性增加,沉积速率则逐渐降低;衬底温度从80℃增加到130℃时,光学带隙显著增加,而在130℃至230℃范围内,光学带隙基本不随衬底温度变化;以SiH键对应的伸缩振动的相对峰强度逐渐增加,而以SiH2或(SiH2)n键对应的伸缩振动的相对强度逐渐减小;a-Si∶H薄膜中Si0+态的相对含量增加.因此,衬底温度大于130℃有利于制备优质a-Si∶H薄膜,230℃是沉积a-Si∶H薄膜的最佳衬底温度.     

磁控溅射PbSe薄膜厚度对其结构及光学特性的影响

本文利用射频磁控溅射法在200℃的玻璃衬底上沉积了纳米晶PbSe薄膜,薄膜厚度分别为200 nm、250 nm、500 nm及600 nm.利用X射线衍射仪(XRD)、原子力显微镜(AFM)及紫外-可见分光光度计,分别研究了不同厚度PbSe薄膜的晶体结构、表面形貌和光学特性.结果表明:随膜厚增大,PbSe (200)晶面的择优取向显著增强,薄膜的结晶质量逐渐提高.此外,随薄膜厚度增加吸收边发生红移.膜厚为200nm、250 nm时,薄膜的禁带宽度为1.89 eV和1.60 eV;膜厚较大(500 nm及600 nm)时,带隙宽度减小至1.41 eV和1.34 eV,与太阳的光谱辐射更加匹配.因此,我们认为厚度较大的PbSe薄膜更适于用做太阳能电池的吸收层.     

多晶硅薄膜结晶团晶化机理的研究

本文用PECVD法在石英玻璃上沉积非晶硅薄膜,然后用快速光退火和传统电阻炉退火方法晶化生长多晶硅薄膜,用拉曼光谱仪、XRD和场发射扫描电镜观察分析薄膜,发现在制备的多晶硅薄膜表面存在结晶团现象,并对这一现象的晶化机理进行了分析.     

利用快速热退火法制备多晶硅薄膜

为了制备优质的多晶硅薄膜,该论文研究了非晶硅薄膜的快速热退火(RTA)技术.先利用PECVD设备沉积非晶硅薄膜,然后把其放入快速热退火炉中进行退火.退火前后的薄膜利用X射线衍射(XRD)仪、Raman光谱仪及扫描电子显微镜(SEM)测试其晶体结构及表面形貌,利用电导率测试设备测试其暗电导率.研究表明退火温度、退火时间以及沉积时的衬底温度对非晶硅薄膜的晶化都有很大的影响.     

多晶Si薄膜表面金催化Si纳米线生长

以Au膜作为催化剂和大晶粒多晶Si薄膜为衬底,利用固-液-固生长机制,制备出直径在30～ 100 nm和长度为几百微米的高密度Si纳米线.实验研究了退火温度、生长时间和N2流量对Si纳米线生长的影响.结果表明,随着退火温度的升高,生长时间的延长和N2流量的增加,Si纳米线的长度和密度都显著增加.对不同生长时间下获得的Si纳米线样品进行了X射线衍射测量,结果显示随着生长时间的延长,多晶Si薄膜和表面的Au膜成分都在减少.光致发光谱则显示出弱的蓝光发射和强的红光发射特性,前者应是由非晶SiOx壳层中的氧空位发光中心引起,后者则应归因于Si纳米线芯部与非晶SiOx壳层之间界面区域附近中的Si =O双键态或非桥键氧缺陷中心.     

Optical properties of thermally evaporated CdS thin films

CdS thin films of varying thicknesses were deposited on cleaned glass substrates at room temperature by thermal evaporation technique in a vacuum of about 2 x 10^‐5 torr. UV‐VIS spectra of the films were studied using the optical transmittance measurements which were taken in the spectral region from 300 nm to 1100 nm. The absorbance and reflectance spectra of the films in the UV‐VIS region were also studied. Optical constants such as optical band gap, extinction coefficient, refractive index, optical conductivity and complex dielectric constant were evaluated from these spectra. All the films were found to exhibit high transmittance (∼ 60 ‐ 93 %), low absorbance and low reflectance in the visible/near infrared region from ∼ 500 nm to 1100 nm. The optical band gap energy was found to be in the range 2.28 – 2.53 eV. All the films annealed at 300°C for 4 hours in vacuum (∼ 10^‐2 torr) showed a decrease in the optical transmittance with its absorption edge shifted towards the longer wavelength, leading to the result that the optical band gap decreases on annealing the films. Also, on annealing crystallinity of the films improves, resulting in decrease in the optical transmittance. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effects of rapid thermal treatments on the electrical properties of thin SiO2 gate oxide for DRAM p-channel MOS transistors

Silicon oxide has been grown by rapid thermal processing. The growth rate, in the range of very thin films (<10 nm), has been studied as a function of the oxidation temperature. Combined films composed by conventional thermal silicon oxide growth over SiO₂ passivation layer deposited by rapid thermal processing onto Si(1 0 0) substrates have been used as gate oxide of p-channel metal-oxide semiconductor (p-MOS) transistors of dynamic random access memory (DRAM). The effect of rapid thermal annealing treatments on these films has also been experimented. Improvements in the electrical performances of transistors have been observed.     

Morphology,composition, structure and optical properties of thermally annealed Cu2O thin films prepared by reactive DC sputtering method

Abstract

Thin films copper oxides are perspective materials for many optoelectronic applications, including photovoltaics. The samples were deposited on glass and silicon substrates by magnetron sputtering method using Modular Platform PREVAC. After deposition the samples were thermally treated by annealing in oxygen atmosphere for 60?min at 450?°C. Morphology confirms that all the films have crystalline structure. Optical measurements show that the films have wide band gap within the range 2.20÷2.48?eV before and 2.03÷2.40?eV after annealing. The article presents the discussion about the influence of annealing on Cu₂O thin film parameters.     

Substrate temperature effect on the optical properties of amorphous Sb2S3 thin films

Sb₂S₃ amorphous thin films were prepared by thermal evaporation of corresponding powder on thoroughly cleaned glass substrates held at temperature in the range 300‐473 K. X‐ray diffraction and atomic force microscopy have been used to order to identify the structure and morphology of surface thin films. The optical constants of the deposition films were obtained from the analysis of the experimental recorded transmission data over the wavelength range 400‐1400 nm. An analysis of the absorption coefficient values revealed an optical indirect transition with the estimation of the corresponding band gap values. It was found that the optical band gap energy decrease with substrate temperature from 1.67 eV at 300 K to 1.48 eV at 473K. (© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Influence of annealing on the physical properties of filtered vacuum arc deposited tin oxide thin films

Tin oxide (SnO₂) thin films were deposited on UV fused silica (UVFS) substrates using filtered vacuum arc deposition (FVAD). During deposition, the substrates were at room temperature (RT). As-deposited films were annealed at 400 and 600 °C in Ar for 30 min. The film structure, composition, and surface morphology were determined as function of the annealing temperature using X-ray diffraction (XRD), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The XRD patterns of the SnO₂ thin films deposited on substrates at RT indicated that the films were amorphous, however, after the annealing the film structure became polycrystalline. The grain size of the annealed films, obtained from the XRD analysis, increased with the annealing temperature, and it was in the range 8-34 nm. The AFM analysis of the surface revealed an increase in the film surface average grain size from 15 nm to 46 nm, and the surface roughness from 0.2 to 1.8 nm, as function of the annealing temperature. The average optical transmission of the films in the visible spectrum was >80%, and increased by the annealing ∼10%. The films’ optical constants in the 250-989 nm wavelength range were determined by variable angle spectroscopic ellipsometry (VASE). The refractive indexes of as-deposited and annealed films were in the range 1.83-2.23 and 1.85-2.3, respectively. The extinction coefficients, k(λ), of as-deposited and annealed films were in the range same range ∼0-0.5. The optical energy band gap (E_g), as determined by the dependence of the absorption coefficient on the photon energy at short wavelengths, increased with the annealing temperature from 3.90 to 4.35 eV. The lowest electrical resistivity of the as-deposited tin oxide films was 7.8 × 10⁻³ Ω cm, however, film annealing resulted in highly resistive films.     

Temperature dependent formation of microcrystal and amorphous silicon by vacuum evaporation

In silicon films deposited in vacuum by electron beam evaporation of solid silicon, the substrate temperature dependence of the formation temperature of amorphous silicon and crystalline silicon is determined. On steel and alumina substrates, below 520°C, the silicon film is amorphous. Above this temperature, the film is crystalline with a pronounced optical band gap of 1.7 eV. With thermal treatment in vacuum, a transformation from an amorphous to a crystalline state is observed at 650°C.     

十二烷基苯磺酸钠与聚乙烯吡咯烷酮复配表面活性剂对单晶硅制绒的影响

本文采用十二烷基苯磺酸钠(SDBS)与聚乙烯吡咯烷酮(PVP)的复配溶液作为单晶硅制绒添加剂,取代目前常用碱醇制绒液中的异丙醇,不仅降低了绒面的反射率、缩短了制绒时间,而且具有成本低、制绒过程中不需要定时补充等特点.本文研究了SDBS与PVP复配添加剂的比例、浓度、反应时间、反应温度等对单晶硅制绒效果的影响,实验发现当...     

Thermal annealing of a-Si/Au superlattice thin films

The superlattice films, which consist of amorphous silicon (a-Si) and amorphous gold (Au), were prepared by ultra-high vacuum evaporation system. The first layer was grown a-Si with a thickness of 4.2 nm and the second layer was grown Au with a thickness of 0.8 nm. Thermal annealing was performed at 473, 673, and 873 K, respectively. The structural properties of the films were investigated using transmission electron microscope (TEM), X-ray diffraction (XRD), and Raman scattering spectroscopy. The electrical property was assessed by the temperature dependence of electrical conductivity. A crystallization of Si and a forming of Au nanoparticles were observed in all of the annealing films. The crystalline volume fraction reached 70% by annealing time for 15 min. An average diameter of the Au nanoparticles embedded in Si matrix also increased with increasing the annealing temperature. At annealing temperature above 873 K, Au atoms migrated toward the film surface. It was observed that the electrical conductivity changed in several temperatures.