Influence of Oxygen Vacancy on Transport Property in Perovskite Oxide Heterostructures

Effect of oxygen vacancy on transport property of perovskite microstructures is studied theoretically. Compared with calculated and measured I-V curves, it is revealed that electron conduction plays an important role in the oxygen nonstoichiometry perovskite heterostructures even with hole-doped or un-doped material due to the oxygen vacancies. In addition, a detailed understanding of the influence of oxygen vacancy concentration and temperature on the conduction characteristics of oxide heterojunction with both forward and reverse biases is obtained by calculation.     

Effect of interface states on negative capacitance characteristics in GaAs homojunction far-infrared detectors

Bias-, frequency- and temperature-dependent capacitance characteristics of p-GaAs homojunction interfacial work-function internal photoemission (HIWIP) far-infrared detectors are reported. A strong negative capacitance phenomenon has been observed. The origin of this effect is believed to be due to the carrier capture and emission at interface states, and has been confirmed by a comparison study of capacitance characteristics on p-GaAs HIWIP detectors with different interface state densities. A fitting data based on charging–discharging current and the inertial conducting current model show good agreement with the experimental observations. Received: 15 November 1999 / Accepted: 20 April 2000 / Published online: 5 October 2000     

A study of interface characteristics in HfAlO/p-Si by deep level transient spectroscopy

Deep level transient spectroscopy (DLTS) and high-frequency capacitance-voltage (HF-CV) measurement are used for the investigation of HfAlO/p-Si interface. The so-called “slow” interface states detected by HF-CV are obtained to be 2.68 × 10¹¹ cm⁻². Combined conventional DLTS with insufficient-filling DLTS (IF-DLTS), the true energy level position of interfacial traps is found to be 0.33 eV above the valance band maximum of silicon, and the density of such “fast” interfacial traps is 1.91 × 10¹² cm⁻² eV⁻¹. The variation of energy level position of such traps with different annealing temperatures indicates the origin of these traps may be the oxide-related traps very close to the HfAlO/Si interface. The interfacial traps’ passivation and depassivation effect of postannealing in forming gas are shown by comparing samples annealed at different temperatures.     

Electron transport with mobility above 10–3 cm2/Vs in amorphous film of co‐planar bipyridyl‐substituted oxadiazole

We demonstrate that a bipyridyl substituted oxadiazole (Bpy‐OXD) shows high electron mobility that reached above 10^–3 cm²/Vs. We believe that the high mobility results from both the hybrid molecular structure of the two electron‐accepting units: bipyridyl and oxadiazole, and the planar molecular structure based on its lack of sterically hindered bulky substituent. The computational analysis elucidates that the amorphous nature of Bpy‐OXD in thin‐film state probably results from the polymorphic effect in isolated state and the volume effect in solid state. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Novel transparent Yb-based cathodes for top-emitting organic light emitting devices with high performance

We have studied three kinds of transparent low-work-function Yb-based cathodes for the top-emitting organic light emitting devices (TEOLEDs) with a structure of ITO/NPB/Alq₃/cathodes and compared them with each other. For the Yb/Au cathodes, a series of Yb layers with various thicknesses have been tested and it is found that the Yb layer with a thickness of 4 nm is the optimum one. The Yb:Au (19 nm) and Yb:Ag (19 nm) co-evaporation cathodes possess very high transmittance but relative poor electron injection; whilst the Yb (4 nm)/Au (15 nm) cathode possess a little lower transmittance but much improved electron injection and the TEOLED with this cathode has the highest power efficiency among the TEOLEDs with the three kinds of Yb-based cathodes mentioned above.     

Low‐voltage,high‐gain,and high‐mobility organic complementary inverters based on N,N′‐ditridecyl‐3,4,9,10‐perylenetetracarboxylic diimide and pentacene

The authors describe an organic complementary inverter with N,N′‐ditridecyl‐3,4,9,10‐perylenetetracarboxylic diimide as an n‐type semiconductor and pentacene as a p‐type semiconductor. Each transistor of the inverter exhibited high carrier mobility: 1.62 cm²/Vs for an n‐type drive transistor and 0.57 cm²/Vs for a p‐type switch transistor. The gain of the inverter reached 125. Another inverter using Ta₂O₅ as a high κ gate dielectric performed well with a gain of 500 and an operation voltage of only 5 V.

     

Temperature‐dependent electroluminescence intensity in green and blue (In,Ga)N multiple‐quantum‐well diodes

The electroluminescence (EL) intensity has been investigated of green and blue (In,Ga)N multiple‐quantum‐well diodes grown on c ‐plane sapphire over a wide temperature range and as a function of current between 0.01 mA and 10 mA. The EL intensity of the green diode with p‐(Al,Ga)N electron blocking layer does not show low‐temperature quenching, especially at low injection levels, previously observed for the blue (In,Ga)N quantum‐well diodes. This finding rules out possi‐ bilities that the freeze‐out of holes at deep Mg acceptor levels and the failure of hole injections through the p‐(Al,Ga)N layer are directly responsible for the EL quenching at temperatures below 100 K. Variations of the EL efficiency with current level suggest that capture/escape efficiencies of injected carriers by the wells play an important role for the determination of EL external quantum efficiency. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effect of thickness on the stability of transparent conducting impurity‐doped ZnO thin films in a high humidity environment

The resistivity of transparent conducting Al‐ and Ga‐doped ZnO (AZO and GZO) thin films prepared with a thickness in the range from 20 to 200 nm on glass substrates at a temperature below 200 °C was found to increase with exposure time when tested in a high humidity environment (air at 90% relative humidity and 60 °C). The resistivity stability (resistivity increase) was considerably affected by the thin film thickness. In particular, thin films with a thickness below about 50 nm were very unstable. The increase in resistivity is interpreted as carrier transport being dominated by grain boundary scattering resulting from the trapping of free electrons due to oxygen adsorption on the grain boundary surface. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Rectifying properties and photoresponse of CVD diamond p(i)n‐junctions

The current–voltage characteristics and photoresponse of mesa structured {111}‐oriented homoepitaxial CVD diamond p(i)n‐junctions with different intrinsic layer thickness are investigated. When a sufficiently thick intrinsic layer is present, a rectification ratio of 10⁸ at ±10 V could be obtained. Good rectifying diodes show a high photoresponse ratio between 210 nm (above bandgap) and 500 nm (below bandgap), making them suitable for UV detection purposes. The results are compared with similar measurements carried out on polycrystalline CVD diamond pn‐junctions.

     

Band bending of n‐InN epilayers and exact solution of the classical Thomas–Fermi equation

The exact solution of the Thomas–Fermi equation for a planar accumulation layer of a degenerate semiconductor is presented. The obtained results are compared with theoretical literature data. The applicability of the solution is demonstrated by using results of electrochemical capacitance–voltage measurements and photoluminescence data for n‐InN epilayers. It has been found that the difference between the electron concentrations estimated from the Hall and photoluminescence measurements is a measure of the electron content in the accumulation layer with acceptable accuracy. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Temperature dependence of the current-voltage characteristics of the Al/Rhodamine-101/p-Si(1 0 0) contacts

The current-voltage (I-V) characteristics of Al/Rhodamine-101/p-Si/Al contacts have been measured at temperatures ranging from 280 to 400 K at 20 K intervals. A barrier height (BH) value of 0.817 eV for the Al/Rh101/p-Si/Al contact was obtained at the room temperature that is significantly larger than the value of 0.58 eV of the conventional Al/p-Si Schottky diode. While the barrier height Φ_b0 decreases the ideality factors (n) become larger with lowering temperature. The high values of n depending on the sample temperature may be ascribed to decrease of the exponentially increase rate in current due to space-charge injection into Rh101 thin film at higher voltage. Therefore, at all temperatures, it has been seen that the I-V characteristics show three different regions, the ohmic behavior at low voltages, and the space charge limited current with an exponential distribution of traps at high voltages.     

p‐type conduction in stacking‐fault‐free m ‐plane GaN

Transport measurements of p‐type m ‐plane GaN films grown on low extended‐defect density, free‐standing m ‐plane (10 0) GaN substrates are presented. No significant anisotropy in in‐plane mobility was found for hole concentrations between 2.45 × 10¹⁷ and 8.7 × 10¹⁸ cm^–3. Since faulted, heteroepitaxial m ‐plane films showed significant anisotropy in electron and hole mobility a microstructural feature with anisotropic distribution (basal plane stacking faults) is discussed as a possible source of anisotropic scattering in non‐polar and semi‐polar films. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Effective surface passivation of crystalline silicon using ultrathin Al2O3 films and Al2O3/SiNx stacks

We measure surface recombination velocities (SRVs) below 10 cm/s on p‐type crystalline silicon wafers passivated by atomic–layer–deposited (ALD) aluminium oxide (Al₂O₃) films of thickness ≥10 nm. For films thinner than 10 nm the SRV increases with decreasing Al₂O₃ thickness. For ultrathin Al₂O₃ layers of 3.6 nm we still attain a SRV < 22 cm/s on 1.5 Ω cm p‐Si and an exceptionally low SRV of 1.8 cm/s on high‐resistivity (200 Ω cm) p‐Si. Ultrathin Al₂O₃ films are particularly relevant for the implementation into solar cells, as the deposition rate of the ALD process is extremely low compared to the frequently used plasma‐enhanced chemical vapour deposition of silicon nitride (SiN_x). Our experiments on silicon wafers passivated with stacks composed of ultrathin Al₂O₃ and SiN_x show that a substantially improved thermal stability during high‐temperature firing at 830 °C is obtained for the Al₂O₃/SiN_x stacks compared to the single‐layer Al₂O₃ passivation. Al₂O₃/SiN_x stacks are hence ideally suited for the implementation into industrial‐type silicon solar cells where the metal contacts are made by screen‐printing and high‐temperature firing of metal pastes. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

On the improvement of the electroluminescent signal of organic light emitting diodes by the presence of an ultra‐thin metal layer at the interface organic/ITO

The electroluminescent (EL) signal of organic light emitting diodes (OLEDs) based on simple “hole transporting layer/electron transporting layer” (HTL/ETL) structures has been studied as a function of the anode/HTL interface, the anode being an indium tin oxide (ITO) film. It is shown that the electroluminescent (EL) signal increases when a metal ultra‐thin layer is introduced between the anode and the HTL. Experimental results show that the work function value of the metal is only one of the factors which allow improving the EL signal via better hole injection efficiency. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Passivation of InP-based HBTs

The surface effects, the (NH₄)₂S and low-temperature-deposited SiN_x passivations of InP-based heterostructure bipolar transistors (HBTs) have been investigated. The surface recombination current of InP-based HBTs is related to the base structures. The (NH₄)₂S treatment for InGaAs and InP removes the natural oxide layer and results in sulfur-bonded surfaces. This can create surface-recombination-free InP-based HBTs. Degradation is found when the HBTs were exposed to air for 10 days. The low-temperature-deposited SiN_x passivation of InGaAs/InP HBTs causes a drastic decrease in the base current and a significant increase in the current gain. The improvement in the HBT performance is attributed to the low deposition temperature and the effect of N₂ plasma treatment in the initial deposition process. The SiN_x passivation is found to be stable. S/SiN_x passivation of InGaAs/InP HBTs results in a decrease in the base current and an increase in the current gain. The annealing process can cause the base current to decrease further and the current gain increase.     

Study of metal-semiconductor interface states using deep level transient spectroscopy

This paper describes the principle of the determination of interface-state parameters by deep level transient spectroscopy (DLTS) and presents a new, simple and exact method to discriminate the DLTS signal due to the emission from interface states from that from bulk traps. The n-type Au-GaAs and Cr-GaAs interfaces have been investigated by the technique. The results obtained in the investigation have revealed the dependences of the energy position, density and capture cross section for the interface states on the metal deposited onto the semiconductor surface, which is consistent with the theoretical prediction by Yndurain and the experimental results obtained by other authors.     

Observation of ferromagnetic ordering in Mn‐doped 8‐hydroxy‐quinoline aluminum

The ferromagnetic property of Mn‐doped 8‐hydroxy‐quinoline aluminum (Alq₃), synthesized by thermal co‐evaporation of pure Mn metals and Alq₃ powders, was investigated. The weak ferromagnetic property was observed in 5%‐doped Alq₃, with saturation magnetization of around 0.05μ_B/Mn. The doped Mn chemically interacted with O atoms, producing a new gap state at 0.34 eV above the highest occupied molecular orbital and reducing the effective electron concentration. This led to the decrease of the electron affinity and increase of the optical bandgap, resulting in the reduction of the hole‐injection barrier in comparison with the electron‐injection barrier to the Alq₃ layer. From these, the origin of the observed ferromagnetism is suggested. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

A study of electronic states near the interface in ferroelectric-semiconductor heterojunction prepared by rf sputtering of PbTiO3

Interface states in the ferroelectric-semiconductor junction have been investigated from analyses of DLTS andC-V data. Two trap levels are located at 0.21 and 0.36 eV below the conduction band near the silicon side of the interface in the MFS (Metal-Ferroelectric-Semiconductor) structure. The interface states density has been drastically reduced by putting an oxide layer between ferroelectric and semiconductor with certain heat treatment in H₂ atmosphere at 500 °C. It has been found that the MFMOS (Metal-Ferroelectric-Metal-Oxide-Semiconductor) structure shows the least interface states density (less than 10¹¹cm^–2eV^–1) with the maximal dielectric constant of PbTiO₃ thin films.     

Comparison of InGaN/GaN light emitting diodes grown on m ‐plane and a ‐plane bulk GaN substrates

InGaN/GaN‐based light emitting diodes (LEDs) grown on m ‐plane, a ‐plane and off‐axis between m ‐ and a ‐plane GaN bulk substrates were investigated. A smooth surface was obtained when a ‐plane substrate was applied; however, large amounts of defects were observed. Photoluminescence measurements of the LEDs with a well thickness of 2.5 nm revealed that all the LEDs showed the peak emission wavelength at 389 nm. The PL intensity of the a ‐plane LED is one order of magnitude lower than that of the m ‐plane LED. The a ‐plane LEDs showed significant lower electroluminescence output powers than m ‐plane LEDs, suggesting that excitons are trapped by the defects, which act as non‐radiative recombination centers. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Homoepitaxy of ZnO by pulsed‐laser deposition

ZnO thin films were grown homoepitaxially on O‐face ZnO single crystals by pulsed‐laser deposition. The ZnO substrates grown by the hydrothermal method were heat‐treated in oxygen ambient at 1000 °C for 2 h prior to deposition. After the thermal treatment the substrates show bilayer steps between 200–400 nm wide terraces and a considerably improved crystalline structure. Thin film surfaces exhibit closed loop spirals and show steps of c /2 or c. The FWHM of the (0002) rocking curve of the best sample is 29″. Similar to the substrates used, Al is contained in the thin films (<10¹⁴ cm^–3) as photoluminescence (PL) and thermal admittance spectroscopy suggest. However, deep levels between 200 and 400 meV below the conduction band are the dominant donors at room temperature. Low temperature PL is dominated by (Al⁰,X) (I6, FWHM: 200 µeV) and extremely homogeneous (σ ≈ 1%).