质子引入的6T SRAM单粒子翻转截面预测模型

提出了一种基于SOI工艺6T SRAM单元质子辐射的单粒子饱和翻转截面的预测模型,该模型通过器件物理来模拟辐照效应,利用版图和工艺参数来预测质子引入的单粒子饱和翻转截面。该模型采用重离子的SPICE测试程序对质子辐射的翻转截面进行预测,该方法简单高效,测试实例表明在0.15μm SOI工艺下,预测的质子引入的单粒子翻转饱和截面和实际测试的翻转截面一致。     

单粒子翻转二维成像技术

为了给星用半导体器件不同区域的单粒子翻转(SEU)机理研究提供一种高效、可靠手段,基于北京HI-13串列加速器,从重离子微束辐照技术和存储器单粒子效应检测技术这2方面,对微电子器件SEU二维成像测试技术进行了研究,建立了基于虚拟技术的测试系统。利用该成像技术,对国产2 kbit静态随机存储器(SRAM)的SEU敏感区域进行了实验研究,结果与理论结果及以往手动测试实验结果一致。     

静态存储器的抗单粒子翻转效应研究

空间环境中存在大量的高能带电粒子,空天导弹自身的电子器件将会受到高能粒子的冲击影响,从而产生单粒子效应。研究分析了静态储存器在空间环境中最常发生的单粒子效应-单粒子翻转,采用修正海明码实现一个检错纠错模块,该模块可以检测数据存储单元的两位错误,检测定位并纠正数据存储单元的一位错误。通过仿真分析及计算,该方案可以很大程度上降低单粒子翻转效应对静态存储器的影响,具有很强的实用意义。     

温度对SRAM器件单粒子翻转重离子测试的影响

本文基于单粒子效应地面重离子模拟实验,选取体硅SRAM与SOI SRAM两种待测器件,在兰州重离子加速器上（HIRLF）研究了温度对单粒子翻转测试的影响。用12C粒子对体硅SRAM器件的温度实验显示,单粒子翻转截面易受温度的影响。对于SOI SRAM器件,12C粒子测得的单粒子翻转截面随温度升高有显著的增大,但209Bi 粒子测得的单粒子翻转截面却随温度保持恒定。用Monte Carlo的方法分析了温度对单粒子翻转测试的影响规律,发现在单粒子翻转阈值LET附近温度对单粒子翻转截面有大的影响,但是随着单粒子翻转的发生接近于饱和,单粒子翻转截面渐渐的表现出低的温度依赖性。基于该模拟结果,我们对实验数据进行了分析,同时提出了一种准确评估在轨翻转率的合理方法。     

抗单粒子翻转效应的SRAM研究与设计

在空间应用和核辐射环境中,单粒子翻转(SEU)效应严重影响SRAM的可靠性。采用错误检测与校正(EDAC)和版图设计加固技术研究和设计了一款抗辐射SRAM芯片,以提高SRAM的抗单粒子翻转效应能力。内置的EDAC模块不仅实现了对存储数据"纠一检二"的功能,其附加的存储数据错误标志位还简化了SRAM的测试方案。通过SRAM原型芯片的流片和测试,验证了EDAC电路的功能。与三模冗余技术相比,所设计的抗辐射SRAM芯片具有面积小、集成度高以及低功耗等优点。     

商用CMOS工艺SRAM脉冲中子辐射效应实验

为研究互补金属氧化物半导体(CMOS)工艺静态随机处理内存(SRAM)脉冲中子辐射效应机理,对SRAM翻转效应进行了蒙特卡罗模拟。该模拟基于脉冲中子辐照下SRAM翻转是单粒子翻转的叠加的假设,计算了单位翻转和伪多位翻转在总翻转数中的百分比。在西安脉冲反应堆上对3种特征尺寸商用SRAM开展了脉冲工况实验研究,得到了单位翻转和伪2位翻转数据,结合模拟结果分析了SRAM在脉冲中子作用下的翻转机制。     

用SOI技术提高CMOS SRAM的抗单粒子翻转能力

提高静态随机存储器（SRAM）的抗单粒子能力是当前电子元器件抗辐射加固领域的研究重点之一。体硅CMOS SRAM不作电路设计加固则难以达到较好抗单粒子能力,作电路设计加固则要在芯片面积和功耗方面做出很大牺牲。为了研究绝缘体上硅（SOI）基SRAM芯片的抗单粒子翻转能力,突破了SOI CMOS加固工艺和128kb SRAM电路设计等关键技术,研制成功国产128kb SOI SRAM芯片。对电路样品的抗单粒子摸底实验表明,其抗单粒子翻转线性传输能量阈值大于61．8MeV／（mg／cm^2）,优于未做加固设计的体硅CMOS SRAM。结论表明,基于SOI技术,仅需进行器件结构和存储单元的适当考虑,即可达到较好的抗单粒子翻转能力。     

一种超低功耗、容错的静态随机存储器设计

为了减轻辐射环境中静态随机存储器（SRAM）受单粒子翻转（SEU）的影响以及解决低功耗和稳定性的问题,采用TSMC 90nm工艺,设计了一款可应用于辐射环境中的超低功耗容错静态随机存储器。该SRAM基于双互锁存储单元（DICE）结构,以同步逻辑实现并具有1KB（1K×8b）的容量,每根位线上有128个标准存储单元,同时具有抗SEU特性,提高并保持了SRAM在亚阈值状态下的低功耗以及工作的稳定性。介绍了这种SRAM存储单元的电路设计及其功能仿真,当电源电压VDD为0.3V时,该SRAM工作频率最大可达到2.7MHz,此时功耗仅为0.35μW;而当VDD为1V时,最大工作频率为58.2MHz,功耗为83.22μW。     

静态存储器多比特翻转的概率失效模型

针对静态存储器出现的多比特翻转,提出了一种软错误失效模型.以生日重合理论作为多比特失效统计的基础,将常用加固方式纠错码和周期刷新作为分析条件得到累积错误和非累积错误的概率失效模型.前者为相同容量存储器的不同字长结构提供了失效概率的数值分析,并为实际测试结果提供了一个理论参考;后者量化了刷新周期的选取对于误码率改善程度.仿真结果显示90nm体硅工艺下,累积错误模型与低能量质子测试结果相符合;非累积错误模型分析的刷新周期略高于实际结果.     

北京正负电子对撞机次级束质子单粒子翻转计算和试验研究

北京正负电子对撞机(BEPC)电子直线加速器试验束打靶产生的次级束中包含质子,其中能量约为50MeV~100MeV的质子占有很大比例,这弥补了国内高能质子源的空白。本工作计算得到次级束中的质子能谱,建立质子单粒子翻转截面计算方法,在北京正负电子对撞机次级束质子辐射环境中,计算静态随机存取存储器的质子单粒子翻转截面,设计了SRAM质子单粒子翻转截面测试试验,发现SRAM单粒子翻转和注量有良好的线性,这是SRAM发生单粒子翻转的证据。统计得到不同特征尺寸下SRAM单粒子翻转截面,试验数据与计算结果相符,计算和试验结果表明随着器件特征尺寸的减小器件位单粒子翻转截面减小,但器件容量的增大,翻转截面依然增大,BEPC次级束中的质子束可以开展中高能质子单粒子效应测试。     

SRAM single event upset calculation and test using protons in the secondary beam in the BEPC

The protons in the secondary beam in the Beijing Electron Positron Collider(BEPC) are first analyzed and a large proportion at the energy of 50-100 MeV supply a source gap of high energy protons.In this study, the proton energy spectrum of the secondary beam was obtained and a model for calculating the proton single event upset(SEU) cross section of a static random access memory(SRAM) cell has been presented in the BEPC secondary beam proton radiation environment.The proton SEU cross section for different characteristic dimensions has been calculated.The test of SRAM SEU cross sections has been designed,and a good linear relation between SEUs in SRAM and the fluence was found,which is evidence that an SEU has taken place in the SRAM.The SEU cross sections were measured in SRAM with different dimensions.The test result shows that the SEU cross section per bit will decrease with the decrease of the characteristic dimensions of the device,while the total SEU cross section still increases upon the increase of device capacity.The test data accords with the calculation results,so the high-energy proton SEU test on the proton beam in the BEPC secondary beam could be conducted.     

Partial evaluation based triple modular redundancy for single event upset mitigation

We present a design technique, Partial evaluation-based Triple Modular Redundancy (PTMR), for hardening combinational circuits against Single Event Upsets (SEU). The basic ideas of partial redundancy and temporal TMR are used together to harden the circuit against SEUs. The concept of partial redundancy is used to eliminate the gates whose outputs can be determined in advance. We have designed a fault insertion simulator to evaluate partial redundancy technique on the designs from MCNC′91 benchmark. Experimental results demonstrate that we can reduce the area overhead by up to 39.18% and on average 17.23% of the hardened circuit when compared with the traditional TMR. For circuits with a large number of gates and less number of outputs, there is a significant savings in area. Smaller circuits or circuits with a large number of outputs also show improvement in area savings for increased rounding range.     

卫星光通信系统中单粒子翻转计算方法研究

高能带电粒子造成的单粒子翻转是影响卫星光通信系统性能的重要因素,给出了单粒子翻转的物理机制及主要研究方法。利用OMERE 3.4软件对星载CMOS 2164器件进行了单粒子翻转率计算,结果表明,通过对轨道倾角和轨道高度的优化设计可以有效减小卫星光通信系统中电子器件的单粒子翻转率。为了有效克服单粒子辐射效应,除了简单的增加屏蔽层厚度等防护方法外,还应考虑通过电子器件的选择来提高抗辐射性能。     

Impacts of test factors on heavy ion single event multiple-cell upsets in nanometer-scale SRAM

Single event multiple-cell upsets (MCU) increase sharply with the semiconductor devices scaling. The impacts of several test factors on heavy ion single event MCU in 65 nm SRAM are studied based on the buildup of MCU test data acquiring and processing technique, including the heavy ion LET, the tilt angle, the device orientation, the test pattern and the supply voltage; the MCU physical bitmaps are extracted correspondingly. The dependencies of parameters such as the MCU percentage, MCU mean and topological pattern on these factors are summarized and analyzed. This work is meaningful for developing a more reasonable single event test method and assessing the effectiveness of anti-MCU strategies on nanometer-scale devices.     

Review of FD-TD numerical modeling of electromagnetic wavescattering and radar cross section

Applications of the finite-difference time-domain (FD-TD) method for numerical modeling of electromagnetic wave interactions with structures are reviewed, concentrating on scattering and radar cross section (RCS). A number of two- and three-dimensional examples of FD-TD modeling of scattering and penetration are provided. The objects modeled range in nature from simple geometric shapes to extremely complex aerospace and biological systems. Rigorous analytical or experimental validations are provided for the canonical shapes, and it is shown that FD-TD predictive data for near fields and RCS are in excellent agreement with the benchmark data. It is concluded that, with continuing advances in FD-TD modeling theory for target features relevant to the RCS problem, and with continuing advances in vector and concurrent supercomputer technology, it is likely that FD-TD numerical modeling will occupy an important place in RCS technology in the 1990s and beyond     

Thermal modeling of single event burnout failure in semiconductor power devices

Experimental investigations of single event burnout (SEB) of power devices due to heavy ion impacts have identified the conditions required to produce device failure. A key feature observed in the data is an anomalistic secondary rise in current occurring shortly after the ion strike. To verify these findings including the thermally induced secondary plateau, simulations have been performed on the model single event burnout. The new models include additional thermally dependent electrical components to capture thermally induced physical effects. Through the inclusion of analytic temperature models coupled with the electrical model, the electrical response is predicted with reasonable accuracy. The simulations provide order-of-magnitude estimates as well as prediction of phenomenological features such as the secondary rise in current. This work represents a first attempt to characterize thermal failure of power devices due to heavy ion impacts by including temperature dependent components that until now have not been modeled. The thermal model in the present work produces qualitative agreement with experiments on SEB that have been previously unexplained.     

Line-edge roughness induced single event transient variation in SOI FinFETs

The impact of process induced variation on the response of SOI FinFET to heavy ion irradiation is studied through 3-D TCAD simulation for the first time. When FinFET biased at OFF state configuration (V_gs=0, V_ds=V_dd) is struck by a heavy ion, the drain collects ionizing charges under the electric field and a current pulse (single event transient, SET) is consequently formed. The results reveal that with the presence of line-edge roughness (LER), which is one of the major variation sources in nano-scale FinFETs, the device-to-device variation in terms of SET is observed. In this study, three types of LER are considered: type A has symmetric fin edges, type B has irrelevant fin edges and type C has parallel fin edges. The results show that type A devices have the largest SET variation while type C devices have the smallest variation. Further, the impact of the two main LER parameters, correlation length and root mean square amplitude, on SET variation is discussed as well. The results indicate that variation may be a concern in radiation effects with the down scaling of feature size.     

Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop

A newly integrated pulsed laser system has been utilized to investigate the effects of voltage stress on single event upset (SEU) of flip flop chain manufactured in 65 nm bulk CMOS technology. Laser mappings of the flip flop chain revealed that the SEU sensitive regions increased with laser energy. Post-processing of the data from the laser mapping facilitated the plotting of the cross-section versus laser energy curve. We found a clear shift in the cross-section curves after voltage stress of 130 h. Comparisons of data revealed at least a doubled increase in sensitive areas after voltage stress. During the voltage stress, various electrical parameters were monitored and changes were observed. It was found that the increase in SEU sensitivity is related to electrical parameter changes and SPICE simulation results concur likewise.