共查询到16条相似文献,搜索用时 62 毫秒
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采用化学镀方法对ICF空心玻璃微球靶丸进行处理,使其表面均匀包覆一层磁性Ni-P合金镀层,从而使得ICF玻璃靶丸具有一定的磁性,可望用于进行磁悬浮ICF定位打靶实验研究。用X射线衍射仪、扫描电子显微镜和振动样品磁强计对涂层的组成、结构、形貌及磁性能进行了表征。结果表明:对 ICF玻璃靶丸进行化学镀处理,其球形度、同心度和壁厚均匀性都与化学镀前未发生明显改变,其饱和磁化强度和矫顽力分别为3.883×10-3 A/g和1.046×-3 T。 相似文献
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ICF靶用泡沫铜的制备与表征 总被引:1,自引:1,他引:1
以次磷酸钠为还原剂的化学镀进行导电化处理,研究了ICF靶用泡沫铜的电沉积工艺。采用扫描电子显微境和X射线衍射仪对制备过程中各阶段泡沫铜的微观结构进行了表征。结果表明:经化学镀后可获得晶粒尺寸小、分布均匀的铜沉积层。电沉积后铜沉积层主要由0.55 μm的小颗粒组成,并且出现突出大颗粒的形貌特征。在氢气氛围下,经700 ℃热处理后,铜颗粒进一步长大,沉积层结晶致密。制备的泡沫铜呈3维网络状结构,分布均匀,密度为0.19 g/cm3,孔径分布为400~600 μm,孔隙率达97.9%。 相似文献
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由于DT或DD固态层的折射率很低,而且,其厚度只有几微米到几十微米。这使得光通过DT或DD燃料层时产生的光学路径也只有几微米到几十微米,远小于ICF靶丸。因此,尽管长期以来使用传统的光学干涉仪测定透明ICF靶丸的壁厚,它们却很难用来精确测定DT或DD固态层的厚度。相反,全息照相技术允许直接测定燃料层的厚度,而极大地忽略ICF靶丸的壁厚。在现在的研究中,已经建立全息照相装置,并且已用来测量ICF模拟靶丸的壁厚和气体的厚度。 相似文献
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Electroless preparation and characterization of magnetic Ni-P plating on polyurethane foam 总被引:1,自引:0,他引:1
Magnetic Ni-P plating was coated on surface of polyurethane (PU) foam by electroless plating technique. Morphology, composition, structure, thermal decomposing behavior and magnetic property of PU foam before and after plating were characterized by scanning electron microscopy (SEM), energy diffraction spectrum (EDS), X-ray photoelectron spectroscopy (XPS), infrared spectrometer (IR), X-ray diffraction (XRD), thermogrametric analysis (TG) and vibrating sample magnetometer (VSM), respectively. The results showed that the Ni-P plating was composed by particles whose diameters were in the range of 1-2 μm. Because of the Ni-P plating coated on surface of PU foam, peak intensity of the plated PU foam in IR and XRD were lower than those before plating. TG curves of PU foam before and after plating were composed of two decomposing stages. Because part of Ni in Ni-P plating was oxidized, TG curve of the plated PU foam was uptilt during 650-1000 °C. The plated PU foams are magnetic and can be used in some special application. 相似文献
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Fei Guan Miao Chen Wu Yang Jinqing Wang Shengrong Yong Qunji Xue 《Applied Surface Science》2005,240(1-4):24-27
Patterned gold microstructures on glass or Si wafers have been fabricated by a novel method which is composed of selective electroless plating and microcontact printing. This process may be widely used for the production of fine metal patterns in printed circuits or as a substrate to form patterned SAMs. In addition, these patterned metal microstructures can be readily transferred to adhesive tape surface to fabricate flexible metal microstructure, which may be applied in all-plastic circuit. 相似文献
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The electroless NiCoFeP films were deposited on a silicon substrate in a bath containing Ni2+, Co2+, and Fe2+ ions with a concentration ratio of 1:1.9:1.2. These films were characterized by using transmission electron microscope, energy dispersive X-ray spectrometer, and alternating gradient magnetometer for their microstructure, crystal structure, and magnetic properties. The result showed that the film deposited at the initial stage (about 10 s) consists of only one phase with a crystal structure of FCC Ni and a composition about Ni (69 at%), Co (19 at%), Fe (4 at%), and P (7 at%); The film deposited at the latter stage (about 30 s) consists of two phase, one is similar to that of initial stage and the other has crystal structure of HCP Co with a composition about Ni (35 at%), Co (44 at%), Fe (19 at%), and P (2 at%). The saturation magnetization and coercivity of electroless NiCoFeP films vary from 525 to 1546 emu/cm3 [0.68–2.01 T] and from 51.44 to 88.5 Oe [4.09–7.04 kA/m], respectively. 相似文献
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D.L. Gao 《Applied Surface Science》2009,255(7):4185-4191
Electroless copper plating on micron-scale acrylate rubber (ACM) microspheres was studied. The core-shell structured Cu-coated ACM microspheres with high conductivity and low density were fabricated by introducing a reaction control method. Via multi-times activating treatment, the acrylate rubber (ACM) microspheres were implanted with more Ag catalytic active centers on the surfaces to promote the formation of coatings. The surface-coating structures and the electrical properties of Cu-coated ACM microspheres were investigated. It was found that the Cu-coated ACM microspheres were a kind of elastic particles. The different coating structures could be produced by controlling the extent of plating reaction. The coated microspheres with different coating structures were conductive, and their volume resistivities decreased remarkably with the increasing of applied pressure and varied with the temperature according to their surface coating structures. 相似文献