导通孔和通孔填孔镀用的CuSO4电镀工艺“Cu-BRITE TFⅡ”

概述了CuSO4电镀工艺＂CU-BRITE TFⅡ＂的开发和特性,适用于镀铜层填充导通孔和贯通孔。     

利用镀液组成改善镀层厚度均匀性

概述了利用CuSO4镀液组成控制PCB的贯通孔镀层均匀性和导通孔填充镀层均匀性。     

导通孔填充镀铜技术

概述了导通孔填充镀铜技术的应用和工艺条件,贯通孔填充和Si贯通电极（TSV）填充等其它的填充镀铜技术和今后的展望。     

导通孔电镀铜填充技术

概述了下一代PCB用镀铜层导通孔填充技术。     

电镀铜导通孔填充工艺

概述了MacDermid利用电镀铜微盲导通孔填充工艺,可以防止焊接时的孔隙,洞生成和组装时的释气(爆孔),显著的改善了微盲导通孔填充的可靠性。     

贯通导通孔填充用导电性Cu胶

概述了填孔用导电性Cu胶和贯通导通孔填充工艺,可以制造具有高可靠性和高散热性的高密度PWB。     

印制板用硫酸铜电镀技术

概述了PCB用CuSO4电镀技术及其课题以及贯通孔电镀的课题和对策。     

PCB表面处理技术的最新动向

概述了PCB表面处理技术的最新动向：PCB制造工艺和特性;铜和树脂的粘结;微细图形电镀;堆积导通孔构造和无芯积层板;化学镀铜用催化剂等。     

垂直电镀线盲孔填充技术探究

电镀填盲孔工艺由于其特殊性,对设备的要求较高,行业内大多采用VCP、水平电镀线等先进的设备来完成。但该类设备造价昂贵、普及率较低,造成其推广应用十分受限。文章主要介绍一种通过对传统垂直电镀线进行一定的改造,并对相关项目进行有效控制,从而达到了较好填充效果。     

应用电化学技术监控镀铜层性质的实用方法

概述了应用电化学技术监控镀铜层性质的实用方法。它适用于镀层填充导通孔的镀铜监控。     

Copper plating for 3D interconnects

In this paper we report on Cu plating of through-silicon-vias (TSV-s) using in-house made acidic Cu bath with model additives (SPS, PEG, and JGB). Although the model additives might not be as potent as commercial additives, they have been studied in detail, and their role in Cu plating has been described extensively in scientific literature. This in turn allows deeper insight into how changes in bath composition affect the plating mechanism and Cu via-fill.     

IC封装基板的新一代过孔互连技术

文章主要介绍封装基板芯板通孔的电镀填孔技术及其特点。     

微波印制电路板加工工艺探索

本文主要结合当下微波通讯技术的迅猛发展——微波通讯设备日趋模块化、小型化、高密度化,简要阐述了微波印制电路板及其制作优势和缺点,如基材选用多样化、设计与制造的高精度化等.就微波印制电路板加工工艺,分别从选材、对生产环境适应性的要求、合理选用工艺流程、工程材料的处理和下料、钻孔和导通孔接地、图形转移、蚀刻与涂镀以及成型等方面进行了详细探讨.     

Research on applying direct plating to additive process for printed circuit board

The feasibility of applying direct-metallization as an additive process for printed circuit board was explored. Pd/Sn catalyst was used in the activation step and the content of Pd adsorption was found to be the controlling factor. The Pd content was affected by the conditions of various steps including condition, activation, acceleration, and promotion. The sequence of applying photoresist and activation with Pd/Sn catalyst plus promotion with Na₂S solution was also studied. It was found that a well-defined pattern could be obtained by applying the Pd/Sn catalyst layer before applying the photo-resist film. If the photoresist was applied before the activation step, copper deposition tended to develop beyond the desired pattern region on the surface. We also found that the lateral growth rate of copper deposition was inversely affected by the concentration of copper sulfate. This can be explained by a deposition model in which the lateral growth of copper deposition is caused by the charge transfer of the sulfur atom as a bridging ligand.     

多层印制电路板边缘辐射的一种精确计算方法

研究了精确评估多层印制电路板电源分布网络辐射发射的计算方法.采用高效的两维边界元法计算出信号返回电流经过电源/地平面的阻抗,将过孔转换结构的等效物理电路模型与外部电路连接成整体电路,采用电路仿真的方法获得精确的辐射发射激励电流.由边界元法计算出激励电流在电源/地平面边缘产生的场分布,进而由边缘场的等效磁流求出远区的辐射场.计算了不同频率时的辐射发射激励电流及最大辐射值.研究结果表明：在反谐振频率处辐射场达到极大值.计算结果与全波有限元电磁场仿真的结果基本吻合.     

厚铜PCB用高填充性半固化片的研制

一般地,106半固化片的树脂含量（简称RC）只能达到75％左右。因厚铜（铜厚达到105μm及以上）印制电路板的线路间需要更多的树脂来填充,故普通工艺制造的半固化片就很难满足厚铜印制线路板的填胶性。因此,本文研究了提高半固化片RC的新工艺方法,从而改善半固化片对厚铜印制线路板的填胶性能。     

浅议印制电路板蚀刻废液实用再生技术

目前印制电路板蚀刻废液的再生及循环利用,已受到工业界的广泛关注。简要介绍、分析了两种蚀刻废液实用的再生技术。酸性蚀刻废液膜电解技术可同时实现酸性蚀刻废液再生和铜回收,节约大量的氧化剂和盐酸;碱性蚀刻废液萃取-电积技术再生的同时,也可以回收铜。蚀刻废液再生可实现资源最高效的循环利用,预计具有较广阔的应用前景。     

Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives

In this contribution we show experimental investigations regarding Periodic Pulse Reverse (PPR) plating for the filling of Through Silicon Vias that are aimed for the use in 3D integration applications. The purpose of this method is to prevent the use of plating additives that induce high process complexity in terms of process control and high process costs due to the high consumption of those additives. We therefore compare the effect of PPR plating without additives to that effect of PPR plating with additives. In first results with non-optimized PPR plating we already show the large gain in step coverage during TSV filling compared to standard DC plating.     

印制电路板光电图像边缘信息提取

针对印制电路板(printed circuit board, PCB)光电图像模糊且含噪声的具体情况,提出了改进的边缘信息提取算法。首先分别对自适应模糊集增强算法与数学形态学边缘检测算法(edge detection algorithm of mathematical morphology, EDAMM)实施改进,并分析了其基本原理。然后结合这两种算法对PCB光电图像进行预处理及边缘信息提取。最后对两幅由不同成像系统获取的PCB光电图像进行了边缘信息提取实验。结果表明：用本文算法获得的PCB光电图像明暗对比度较高,并提取了精确且清晰的图像边缘信息,明显减少了噪声,所得图像的优质系数较高,两幅图像的优质系数分别是0.885 2、0.874 9,均高于本文中所提到的另外4种算法的结果。可见,采用本文算法可以更好地去除PCB光电图像中的模糊与噪声,并精确地提取出PCB光电图像的边缘信息。