热丝化学气相沉积金刚石薄膜空间场的数值分析

由于热丝化学气相沉积(HFCVD)金刚石薄膜的反应气体利用率较低，生长速率慢，生长不均匀，从而限制了金刚石薄膜的大规模应用。因此，人们从实验和理论方面研究其生长工艺。实验能反映热丝化学气相沉积金刚石薄膜的真实情况，但实验受到许多因素的影响和制约而不能获得较全面信息，数值计算能弥补实验的不足。     

热丝和射频等离子体化学气相沉积法制备定向碳纳米管薄膜

采用热丝和射频等离子体复合化学气相沉积设备(PE-HF-CVD),以CH4、H2和N2为反应气体.在较低衬底温度下(500℃),用简单的催化剂制备方法--旋涂法在硅片上涂覆Ni(NO3)2溶液,经热处理及H2还原后的Ni颗粒为催化剂,在硅衬底上制备出了垂直于硅片且定向生长的碳纳米管薄膜.扫描电子显微镜(SEM)和透射电子显微镜(TEM)结果显示,1 mol/l的硝酸镍溶液旋涂硅片所得催化剂制得的碳纳米管管径为30～50 nm,长度超过4μm,定向性好.并用拉曼光谱(Raman)对不同摩尔浓度Ni(NO3)2溶液条件下制备的碳纳米管薄膜样品进行了表征.     

用热丝CVD技术制备场发射冷阴极金刚石薄膜

以甲烷和氢气的混合气体为原料,用热丝化学汽相淀积法,在(100)硅衬底上800℃温度时异质生长出适合场发射的金刚石薄膜.然后用扫描电子显微镜、X射线衍射仪、透射电子显微镜和喇曼光谱仪等对其进行了分析,结果表明,所制备的薄膜是多晶金刚石,而且在(111)晶相择优生长.在扫描电子显微镜下(111)晶粒的外形几乎都是四面体结构,具有很多尖端,可以加强一定电压下的电场,所以所制备的薄膜能够满足低压场发射的要求.     

热丝法气相沉积纳米金刚石薄膜

纳米金刚石薄膜的沉积实验在自行研制的热丝化学气相沉积系统上完成。基体为金刚石微粉研磨和酸蚀后的硬质合金片，反应气体为CH4和H2混合气，V（CH4）：V（H2）=1％-4％，基体温度800-1000℃，沉积时气压为0．8～2．0kPa。SEM观察表明，影响金刚石膜的表面形貌及粗糙度的关键参量是基体温度、反应气压及含炭气体的浓度，这些参数都会影响到薄膜的纯度、结晶习性和晶面完整性。沉积纳米金刚石薄膜工艺是通过高密度形核以及抑制金刚石膜在沉积过程中的晶粒长大来实现的。     

热丝法制备纳米晶硅薄膜结构及沉积机制的研究

用热丝法制备了纳米晶硅薄膜．通过Raman散射谱及X射线谱，系统地研究了沉积气压P_g、高H₂稀释及衬底与钨丝之间距离对沉积速率、纳米硅薄膜的形成和结构等的影响．计算了沉积过程中的温度场分布．讨论了沉积过程中反应基元的输运和相关的气相反应，以及H在薄膜生长中的作用，由此分析了沉积参量对薄膜结构的影响，得到了与实验相一致的结果． 关键词：     

氢气稀释比例对多晶硅薄膜微观结构和沉积特性的影响

利用电感耦合等离子体增强化学气相沉积法(ICP-PECVD)直接在普通玻璃衬底上低温沉积多晶硅薄 膜,主要研究了不同氢气稀释比例对薄膜沉积特性和微观结构的影响。采用 X 射线衍射仪(XRD)、拉曼光谱仪和 扫描电子显微镜(SEM)表征了在不同氢气比例条件下所制备多晶硅薄膜的微结构、形貌,并对不同条件下样品的 沉积速率进行了分析。实验结果表明：随着混合气体中硅烷比例的增加,薄膜的沉积速率不断增加;晶化率先增 加,后减小;当硅烷含量为4.8%时,晶化率达到最大值67.3%。XRD 和 SEM 结果显示多晶硅薄膜在普通玻璃衬 底上呈柱状生长,且晶粒排列整齐、致密,这种结构可提高载流子的纵向迁移率,有利于制备高效多晶硅薄膜太阳能电池。     

硅基籽晶上化学气相沉积金刚石薄膜及其场发射特性

通过控制电泳沉积(EPD)时间,在硅基片上沉积不同密度的金刚石籽晶。再用热丝化学气相沉积(HFCVD)设备,在硅基籽晶上合成多晶金刚石薄膜。薄膜中通常含有非金刚石相碳成分。用扫描电子显微镜(SEM)和Raman光谱对样品的表面形貌和成分进行了表征,测量了样品的场发射特性。比较并分析了样品的表面形貌和非金刚石成分上的差异对金刚石薄膜场发射特性的影响。     

大气压等离子体辅助多晶硅薄膜化学气相沉积参数诊断

本文采用发射光谱法诊断了大气压下Ar气、SiCl₄及H₂气混合气体（Ar/SiCl₄/H₂）射频放电等离子体射流特性.利用Si原子谱线强度计算了电子激发温度并以此估算了Si原子数密度,研究了射频功率及气体流量对电子激发温度和Si原子数密度以及SiCl₄解离率的作用. 关键词： 大气压等离子体射流 发射光谱 电子激发温度 多晶硅薄膜沉积     

大气压等离子体辅助多晶硅薄膜化学气相沉积参数诊断

本文采用发射光谱法诊断了大气压下Ar气、SiCl₄及H₂气混合气体（Ar/SiCl₄/H₂）射频放电等离子体射流特性.利用Si原子谱线强度计算了电子激发温度并以此估算了Si原子数密度,研究了射频功率及气体流量对电子激发温度和Si原子数密度以及SiCl₄解离率的作用.     

等离子体化学气相沉积的实验与理论研究

对等离子体化学气相沉积(PCVD)过程进行了实验和理论研究,实验结果表明:实验条件和等离子体参数在PCVD过程中相互关联,等离子体参数直接影响PCVD过程,在此实验结果的基础上建立了一个二元动力学模型,假设PCVD过程是由等离子体参数决定,考虑了活性粒子与反应单体的扩散与对流.计算中使用了实际测量的电子参数.理论与实验结果基本符合. 关键词：     

Large-scale chemical vapor deposition growth of highly crystalline MoS2 thin films on various substrates and their optoelectronic properties

Large-scale growth of mostly monolayer molybdenum disulfide (MoS₂) on quartz, sapphire, SiO₂/Si, and waveguide substrates is demonstrated by chemical vapor deposition with the same growth parameters. Centimeter-scale areas with large flakes and films of MoS₂ on all the growth substrates are observed. The atomic force microscopy and Raman measurements indicate the synthesized MoS₂ is monolayer with high quality and uniformity. The MoS₂ field effect transistors based on the as-grown MoS₂ exhibit carrier mobility of 1–2 cm²V^?1s^?1 and On/Off ratio of ~10⁴ while showing large photoresponse. Our results provide a simple approach to realize MoS₂ on various substrates for electronics and optoelectronics applications.     

Structural properties of polycrystalline silicon films formed by pulsed rapid thermal processing

A novel pulsed rapid thermal processing (PRTP) method has been used for realizing solid-phase crystallization of amorphous silicon films prepared by plasma-enhanced chemical vapour deposition.The microstructure and surface morphology of the crystallized films were investigated using x-ray diffraction and atomic force microscopy.The results indicate that PRTP is a suitable post-crystallization technique for fabricating large-area polycrystalline silicon films with good structural quality,such as large grain size,small lattice microstrain and smooth surface morphology on low-cost glass substrates.     

Structural and photo-luminescence properties of nanocrystalline silicon films deposited at low temperature by plasma-enhanced chemical vapor deposition

Nanocrystalline silicon (nc-Si) films were prepared by a plasma-enhanced chemical vapor deposition method at a deposition temperature below 220 °C with different dynamic pressures (P_g), hydrogen flow rates ([H₂]), and RF powers, using SiH₄/H₂/SiF₄ mixtures. We examined the photo-luminescence (PL) spectra and the structural properties. We observed two stronger and weaker PL spectra with a peak energies around E_PL = 1.8 and 2.2-2.3 eV, respectively, suggesting that the first band was related to nanostructure in the films, and another band was associated with SiO-related bonds. The nc-Si films with rather large PL intensity was obtained for high [H₂] and/or low pressure values, However, effects of [H₂] are likely to be different from those of P_g. The average grain size (δ) and the crystalline volume fraction (ρ) at first rapidly increase, and then slowly increase, with increasing P_g. Other parameters exhibited opposite behaviors from those of δ or ρ. These results were discussed in connection with the changes in the PL properties with varying the deposition conditions.     

用SiCl4/H2气源沉积多晶硅薄膜光照稳定性的研究

对以SiH₄/H₂及SiCl₄/H₂为源气体、采用 等离子体增强化学气相沉积技术制备的非晶硅薄膜和多晶硅薄膜进行了光照稳定性的研究.实验表明，制备的多晶硅薄膜并没有出现 非晶硅中的光致衰减现象，其光电导、暗电导在光照过程中没有下降反而有所上升且电导率 变化快慢受氢稀释度的制约.多晶硅薄膜的光照稳定性可能来源于高的晶化度及Cl元素的存在. 关键词： 多晶硅薄膜 稳恒光电导效应 晶界 光致衰退效应     

金属有机物化学气相沉积生长GaN薄膜的室温热电特性研究

采用金属有机物化学气相沉积技术生长了不同掺杂浓度的GaN薄膜, 并且通过霍尔效应测试和塞贝克效应测试, 表征了室温下GaN薄膜的载流子浓度、迁移率和塞贝克系数. 在实验测试的基础上, 计算了GaN薄膜的热电功率因子, 并且结合理论热导率确定了室温条件下GaN薄膜的热电优值(ZT). 研究结果表明: GaN薄膜的迁移率随着载流子浓度的增加而减小, 电导率随着载流子浓度的增加而增加; GaN 薄膜材料的塞贝克系数随载流子浓度的增加而降低, 其数量级在100–500 μV/K范围内; GaN薄膜材料在载流子浓度为1.60×10¹⁸ cm^-3时, 热电功率因子出现极大值4.72×10^-4 W/mK²; 由于Si杂质浓度的增加, 增强了GaN薄膜中的声子散射, 使得GaN薄膜的热导率随着载流子浓度的增加而降低. GaN薄膜的载流子浓度为1.60×10¹⁸ cm^-3时, 室温ZT达到极大值0.0025.     

Polycrystalline silicon films obtained by hot-wire chemical vapour deposition

Silicon films were deposited at moderate substrate temperatures (280–500° C) from pure silane and a silane-hydrogen mixture (10% SiH₄, 90% H₂) in a hotwire CVD reactor. The morphology, structure and composition of the samples were studied with scanning electron microscopy, transmission electron microscopy, transmission electron diffraction, X-ray diffraction, Raman spectroscopy and secondary ion mass spectrometry. The sample deposited at 500° C with pure silane has an amorphous structure, whereas the samples obtained from silane diluted in hydrogen have a polycrystalline structure, even that grown at the lowest temperature (280° C). Polycrystalline samples have a columnar structure with 0.3–1 m crystallite sizes with preferential orientation in [220] direction. Deposition rates depend on the filament-substrate distance and range from 9.5 to 37 Å/s for the polycrystalline samples. The high quality of the polycrystalline samples obtained makes the hot-wire technique very promising. Moreover, it is expected to be easily scaled up for applications to large-area optoelectronic devices and to photovoltaic solar cells.     

Improvement of transport properties for polycrystalline silicon prepared by plasma-enhanced chemical vapor deposition

The carrier transport property of polycrystalline silicon (poly-Si:H:F) thin films was studied in relation to film microstructure, impurity, in situ or post-annealing treatments to obtain better carrier transport properties. Poly-Si:H:F films were prepared from SiF₄ and H₂ gas mixtures at temperatures <300 °C. Dark conductivity of the films prepared at high SiF₄/H₂ gas flow ratio (e.g., 60/3 sccm) exhibits a high value for intrinsic silicon and its Fermi level is located near the conduction band edge. The carrier incorporation is suppressed well, either by in situ hydrogen plasma treatment or by post-annealing with high-pressure hot-H₂O vapor. It is confirmed that weak-bonded hydrogen atoms are removed by the hot-H₂O vapor annealing. In addition, evident correlation between impurity concentrations and dark conductivity is not found for these films. It is thought that the carrier incorporation in the films prepared at high SiF₄/H₂ gas flow ratios is related to grain-boundary defects such as weak-bonded hydrogen. By applying hot-H₂O vapor annealing at 310 °C to a 1-μm-thick p-doped (400)-oriented poly-Si:H:F film, Hall mobility was improved from 10 cm²/Vs to 17 cm²/Vs. Received: 7 August 2000 / Accepted: 2 March 2001 / Published online: 20 June 2001     

Rapid nucleation of diamond films by pulsed laser chemical vapor deposition

The nucleation of diamond films could be greatly enhanced on mirror-polished Si substrate by a pulsed Nd:YAG laser beam without any thermal- and plasma-assisted processes during a very short time. The nucleation density increased with decreasing laser power density from 1.38×10¹⁰ to 1.17×10⁹ W/cm² and deposition pressure from 1013 to 4 mbar. The pulsed laser beam made no contribution to enhance nucleation at substrate temperature as low as 650°C. X-ray diffraction measurements showed the (1 1 1) diffraction peak of diamond for the samples obtained using only pulsed laser during 40 min. The enhanced nucleation and growth of diamond crystallites were attributed to effective excitation of reactive gases and etching of non-diamond carbon phases by the pulsed laser beam.