Study on the spectral response of the Schottky photodetector of GaN

The Schottky photodetector was fabricated on GaN epilayers grown by metalorganic chemical vapour deposition (MOCVD). The spectral response of the Schottky photodetector was characterized. A new model is proposed to interpret the characteristic of the spectral response curve of the Schottky photodetectors by introducing a penetrating distance of an incident light at a certain wavelength in the current continuity equation and the interface recombination at the metal--semiconductor rectifying contact. The expressions for the spectral response of the Schottky photodetector are deduced and used successfully to fit the experimental data.     

不同封装方式对肖特基二极管高频性能的影响

肖特基二极管是太赫兹接收机的关键器件,通过在高频下对不同封装形式的肖特基二极管进行建模仿真,研究不同封装方式对肖特基二极管性能的影响。首先通过建立肖特基二极管的仿真模型,在高频结构仿真软件HFSS中对肖特基二极管在0~120GHz频段进行仿真,得到该肖特基二极管的S参数,并对S参数仿真结果和实测结果进行对比,证明了该二极管模型的准确性。然后分别建立肖特基二极管的普通封装模型和肖特基二极管的倒装芯片(flip-chip)封装模型,并对这两种封装模型进行仿真,得到其在两种不同封装结构下的S参数,进而对两种不同封装方式的S参数的-3dB带宽以及相位一致性进行对比分析。最终,对应用于太赫兹波段的肖特基二极管由于封装不同而带来的带宽以及相位的区别及其成因进行分析,论证了flipchip封装更适合应用于太赫兹波段的肖特基二极管,与普通封装相比,该封装在高频下对肖特基二极管的电性能有比较大的改进。     

Investigation on the barrier height and inhomogeneity of nickel silicide Schottky

The apparent Schottky barrier height (SBH) of the nickel silicide Schottky contacts annealed at different temperatures was investigated based on temperature dependence of I-V characteristic. Thermionic emission-diffusion (TED) theory, single Gaussian and double Gaussian models were employed to fit I-V experimental data. It is found the single Gaussian and double Gaussian SB distribution model can give a very good fit to the I-V characteristic of apparent SBH for different annealing temperatures. Also, the apparent SBH and the leakage current increase with annealing temperatures under reverse voltage. In addition, the homogeneity of interfaces for the samples annealed at temperatures of 500 and 600 °C is much better than that of the samples annealed at temperatures of 400, 700, and 800 °C. This may result from the phase transformation of nickel silicide due to the different annealing temperatures and from the low Schottky barrier (SB) patches.     

Analysis of thermionic emission from electrodeposited Ni–Si Schottky barriers

Ni–Si Schottky barriers are fabricated by electrodeposition using n on n+ Si substrates. I–V, C–V and low temperature I–V measurements are presented. A high-quality Schottky barrier with extremely low reverse leakage current is revealed. The results are shown to fit an inhomogeneous barrier model for thermionic emission over a Schottky barrier proposed by Werner and Guttler [J.H. Werner, H.H. Guttler, Barrier inhomogeneities at Schottky contacts, J. Appl. Phys. 69 (3) (1991) 1522–1533]. A mean value of 0.76 V and a standard deviation of 66 mV is obtained for the Schottky barrier height at room temperature with a linear bias dependence. X-ray diffraction and scanning electron microscopy measurements reveal a polycrystalline Ni film with grains that span from the Ni–Si interface to the top of the Ni layer. The variation in Ni orientation is suggested as a possible source of the spatial distribution of the Schottky barrier height.     

金红石结构TiO2晶体点缺陷形成能的经验途径计算

基于经验参数化途径,通过对晶体结构、晶格形成能、介电性质和弹性实验数据拟合确定金红石结构氧化物晶体TiO₂的电子壳模型参数和非Coulomb互作用势参数.计算点 缺陷形成能.论证Schottky缺陷是金红石结构TiO₂中的本征缺陷. 关键词： 2')" href="#">金红石TiO₂ 点缺陷形成能 电子壳模型 经验途径计算     

Pt/Au/n-InGaN肖特基接触的电流输运机理

基于热电子发射和热电子场发射模式,利用I-V方法研究了Pt/Au/n-InGaN肖特基接触的势垒特性和电流输运机理,结果表明,在不同背景载流子浓度下,Pt/Au/n-InGaN肖特基势垒特性差异明显.研究发现,较低生长温度制备的InGaN中存在的高密度施主态氮空位（V_N）缺陷导致背景载流子浓度增高,同时通过热电子发射模式拟合得到高背景载流子浓度的InGaN肖特基势垒高度和理想因子与热电子场发射模式下的结果差别很大,表明V_N缺陷诱发了隧穿机理并降低了肖特基势垒高度,相应的隧穿电流显著增大了肖特基势垒总的输运电流,证实热电子发射和缺陷辅助的隧穿机理共同构成了肖特基势垒的电流输运机理.低背景载流子浓度的InGaN肖特基势垒在热电子发射和热电子场发射模式下拟合的结果接近一致,表明热电子发射是其主导的电流输运机理.     

Kondo entropy of δ-phase plutonium and its impact on Pu alloy phase diagrams

We present a new analysis of the heat capacity of δ-phase Pu-5 at.% Al with a fit using a single-ion Kondo term and a low-temperature Schottky anomaly in addition to the Debye and linear terms. The Kondo and Schottky terms together contribute 1.2 R to the entropy at 300?K. We show how the extra entropy could affect the alloy phase diagrams of δ-phase Pu.     

晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容散射机制

制备了晶格匹配In_(0.17)Al_(0.83)N/GaN异质结圆形平面结构肖特基二极管,通过测试和拟合器件的电容-频率曲线,研究了电容的频率散射机制.结果表明:在频率高于200 kHz后,积累区电容随频率出现增加现象,而传统的电容模型无法解释该现象.通过考虑漏电流、界面态和串联电阻等影响对传统模型进行修正,修正后的电容频率散射模型与实验结果很好地符合,表明晶格匹配In_(0.17)Al_(0.83)N/GaN异质结电容随频率散射是漏电流、界面态和串联电阻共同作用的结果.     

铝-金刚石界面电子特性与界面肖特基势垒的杂化密度泛函理论HSE06的研究

宽带隙半导体金刚石具有突出的电学与热学特性,近年来,基于金刚石的高频大功率器件受到广泛关注,对于金属-金刚石肖特基结而言,具有较高的击穿电压和较小的串联电阻,所以金属-金刚石这种金半结具有非常好的发展前景.本文通过第一性原理方法去研究金属铝-金刚石界面电子特性与肖特基势垒的高度.界面附近原子轨道的投影态密度的计算表明:金属诱导带隙态会在金刚石一侧产生,并且具有典型的局域化特征,同时可以发现电子电荷转移使得Fermi能级在金刚石一侧有所提升.电子电荷在界面的重新分布促使界面形成新的化学键,使得金属铝-氢化金刚石形成稳定的金半结.特别地,我们通过计算平均静电势的方法得到金属铝-氢化金刚石界面的势垒高度为1.03 eV,该值与金属诱导带隙态唯像模型计算的结果非常接近,也与实验值符合得很好.本文的研究可为金属-金刚石肖特基结二极管的研究奠定理论基础,也可为金刚石基金半结大功率器件的研究提供理论参考.     

Modeling of trap-assisted tunneling in AlGaN/GaN heterostructure field effect transistors with different Al mole fractions

Although significant progress has been achieved in GaN based high power/high frequency electronic devices, surface-related problems still need an immediate solution. In particular, leakage currents through Schottky contacts not only impede device reliability but also degrade power efficiency and noise performance in such devices. This article discusses the mechanism of leakage currents through GaN Schottky and AlGaN/GaN Schottky interfaces for both forward and reverse biases. A theoretical model for the calculation of currents based on trap-assisted tunneling is discussed. In the calculation the trap energy has been assumed as a fitting parameter which is about 0.48 eV for different Al mole fractions. The comparison of the results obtained with the existing experimental data in the literature shows a good agreement.     

基于I-V-T和C-V-T的GaN上Ni/Au肖特基接触特性研究

基于对制作在n-GaN上的肖特基二极管的变温I-V测试和C-V测试，采用表面势垒减薄模型对肖特基二极管的电流输运特性进行了研究.试验结果表明，肖特基接触的电流输运机理非常复杂，在不同的温度条件和偏压条件下有着不同的电流输运机理.在此基础上对肖特基接触I-V特性方程进行了修正，得到了很好的拟合曲线.试验表明，高温I-V法提取的势垒高度与常温C-V法提取的势垒高度接近于根据金属功函数得出的理论势垒高度值. 关键词： 氮化镓 肖特基二极管 表面势垒减薄模型 热电子场发射     

Suppression of persistent photoconductivity in high gain Ga2O3 Schottky photodetectors

The defect-related photoconductivity gain and persistent photoconductivity (PPC) observed in Ga₂O₃ Schottky photodetectors lead to a contradiction between high responsivity and fast recovery speed. In this work, a metal-semiconductor-metal (MSM) Schottky photodetector, a unidirectional Schottky photodetector, and a photoconductor were constructed on Ga₂O₃ films. The MSM Schottky devices have high gain (> 13) and high responsivity (> 2.5 A/W) at 230-250 nm, as well as slow recovery speed caused by PPC. Interestingly, applying a positive pulse voltage to the reverse-biased Ga₂O₃/Au Schottky junction can effectively suppress the PPC in the photodetector, while maintaining high gain. The mechanisms of gain and PPC do not strictly follow the interface trap trapping holes or the self-trapped holes models, which is attributed to the correlation with ionized oxygen vacancies in the Schottky junction. The positive pulse voltage modulates the width of the Schottky junction to help quickly neutralize electrons and ionized oxygen vacancies. The realization of suppression PPC functions and the establishment of physical models will facilitate the realization of high responsivity and fast response Schottky devices.     

Improvements in reverse breakdown characteristics of THz GaAs Schottky barrier varactor based on metal–brim structure

The excellent reverse breakdown characteristics of Schottky barrier varactor(SBV) are crucially required for the application of high power and high efficiency multipliers. The SBV with a novel Schottky structure named metal–brim is fabricated and systemically evaluated. Compared with normal structure, the reverse breakdown voltage of the new type SBV improves from -7.31V to -8.75V. The simulation of the Schottky metal–brim SBV is also proposed. Three factors,namely distribution of leakage current, the electric field, and the area of space charge region are mostly concerned to explain the physical mechanism. Schottky metal–brim structure is a promising approach to improve the reverse breakdown voltage and reduce leakage current by eliminating the accumulation of charge at Schottky electrode edge.     

Capacitance of Organic Schottky Diodes Based on Copper Phthalocyanine （CuPc）

The capacitance of an organic Schottky diode based on copper phthalocyanine （CuPc） is investigated. Based on the organic small-signal equivalent model established, we calculate the reverse capacitance CMetal Of the organic Schottky diode with different kinds of metal cathodes （Mg, Al, Au）. It is found that the reverse capacitance of the organic Schottky diode shows behavior as CMg 〉 CAl 〉 CAu at the same frequency, and according to our analysis, the reverse Schottky junction capacitance Cj is expected to have little effect on the reverse capacitance of the organic Schottky diode, and the space-charge limited current capacitance Us is considered to dominate the reverse capacitance, which limits the improvement of frequency characteristics of organic Schottky diodes.     

AlGaN/GaN高电子迁移率晶体管肖特基高温退火机理研究

在不同应力条件下,研究了AlGaN/GaN高电子迁移率晶体管高温退火前后的电流崩塌、栅泄漏电流以及击穿电压的变化.结果表明,AlGaN/GaN高电子迁移率晶体管通过肖特基高温退火以后,器件的特性得到很大的改善.利用电镜扫描(SEM)和X射线光电子能谱(XPS)对高温退火前、后的肖特基接触界面进行深入分析,发现器件经过高温退火后,Ni和AlGaN层之间介质的去除,并且AlGaN材料表面附近的陷阱减少,使得肖特基有效势垒提高,从而提高器件的电学特性. 关键词： AlGaN/GaN高电子迁移率晶体管 肖特基接触 界面陷阱     

Layer-by-layer Au nanoparticles as a Schottky barrier in a water-based dye-sensitized solar cell

We fabricated layer-by-layer gold nanoparticles (Au NPs) onto an electrode as a Schottky barrier in a water-based dye-sensitized solar cell. The Maxwell–Garnett equation was used to fit the characteristics of the Au film. The short-circuit current for four layers of Au NPs in a water-based dye-sensitized solar cell (DSSC) ranges from 2.76 mA/cm² to 5.96 mA/cm², which is due to the Schottky barrier reducing the number of electrons going from the semiconductor back to either the dye or the electrolyte. The efficiency of photo-electric conversion for four layers of Au NPs in water-based DSSC can be enhanced from 0.26% up to 0.95%. PACS 85.30.Hi; 82.47.Jk; 73.63.-b; 81.16.-c; 78.67.Bf     

Theoretical investigation of thermionic and photoelectric emission from semiconductors in the region of schottky deviation

The properties of semiconductors are similar to those of metals at high temperature, a periodic deviation from the Schottky line in thermionic emission from semiconductors is presumedly expected. The theoretical equation derived based on a modified potential model, which contains a classical image force and exchange and correlation forces has proved successful in the analysis of the periodic deviation from the Schottky line in the thermionic emission from the metals. In this paper, the application of a similar approach to the problem of semiconductors is described. The solution has the same characteristics as that of metal, except that two new parameters, effective mass and dielectric constants, are also included. In the similar fashion, the periodic deviation from the Schottky line in the photoelectric emission from semiconductor is also derived. Although the solutions must be tested by comparison with reliable experimental measurements which are not available at present time. However, in view of the good agreement between the theoretical prediction and experimental data for the metal, present solutions might be a good approach.     

Ag/InP Schottky结热退化机理的研究

Ag/InP Schottky结是制作TE场助光电阴极的关键,本文利用Auger分析技术,详细地研究了热处理对Ag/InPSchottky结界面特性的影响。实验结果表明高温长时间热处理会导致严重界面相互扩散,同时使Schottky结的势垒高度降低,理想因子增大,泡利负电性理论很好地解释了扩散效应。势垒高度的降低及理想因子的增大也是由界面互扩散造成的,这种扩散导致界面特性由Schotthy特性向欧姆性质转化。为防止界面互扩散及Schottky结特性的退化,可选用负电性小的金属制作Schottky结,并在工艺上尽量减少热处理的温度和时间。     

Theoretical Analysis of Current Crowding Effect in Metal/AIGaN/GaN Schottky Diodes and Its Reduction by Using Polysilicon in Anode

There exists a current crowding effect in the anode of AIGaN/GaN heterojunction Schottky diodes, causing local overheating when working at high power density, and undermining their performance. The seriousness of this effect is illustrated by theoretical analysis. A method of reducing this effect is proposed by depositing a polysilicon layer on the Schottky barrier metal. The effectiveness of this method is provided through computer simulation. Power consumption of the polysilicon layer is also calculated and compared to that of the Schottky junction to ensure the applicability of this method.