Micromechanistic origin of irradiation-assisted stress corrosion cracking

A multi-scale study of the micromechanics of dislocation–grain boundary interactions in proton and ion-irradiated stainless steels is presented. Interactions of dislocation channels with grain boundaries result in slip transfer, discontinuous slip without or with slip along the grain boundary. The presence of the irradiation damage enhances the importance of the magnitude of the resolved shear stress on the slip system activated by the grain boundary to transfer slip across it. However, the selected slip system is still determined by the minimization of the grain boundary strain energy density condition. These findings have implications for modelling the mechanical properties of irradiated metals as well as in establishing the mechanism for disrupting the grain boundary oxide, which is a necessary prerequisite for irradiation-assisted stress corrosion cracking.     

不锈钢焊接件不等强度激光冲击与应力腐蚀试验研究

针对不锈钢焊接接头应力及组织分布不均匀,容易导致应力腐蚀开裂的问题,采用不等强度激光冲击波对316奥氏体不锈钢焊接接头进行处理。通过应力腐蚀试验、残余应力测试及微观组织分析,研究了激光冲击强化对焊接接头应力腐蚀抗性的影响及其作用机理。试验结果表明：激光冲击强化将焊接件的应力腐蚀断裂时间提高了33.48%。激光冲击波的作用,在焊接接头部位引入了高数值的残余压应力,一方面消除了热影响导致的残余拉应力,同时抵消了拉伸工作载荷的作用,降低局部应力梯度,从而延缓表面钝化膜的破裂;另一方面,激光冲击使焊接接头不同区域之间的微观组织均匀和细化,提高了微裂纹萌生的条件,降低了金属发生阳极溶解的可能性。两种因素的共同作用,使得不锈钢焊接接头的抗应力腐蚀性能显著增强。     

Role of hydrogen in stress corrosion cracking of austenitic stainless steels

Effects of hydrogen charging on the stress corrosion cracking (SCC) behavior of 304 and 310 stainless steels under sustained load were investigated in boiling 42% MgCl₂ solution. The cracking was accelerated by the incorporation of hydrogen into the steel without altering the crack growth mechanism. The fact that the active dissolution is almost unaffected by the hydrogen charging and tensile stress indicates that the phenomenon of hydrogen-promoted SCC is unlikely a result of hydrogen-facilitated active dissolution. In contrast, hydrogen significantly promotes anodic dissolution in the potential range where the active-to-passive transition occurs. The electrochemical noise detected in the SCC process implies that the crack propagation process is discontinuous and hydrogen charging can raise the frequency of film breakdown at the crack tip. These observations suggest that the hydrogen-promoted SCC may result from the hydrogen-induced passivity degradation.     

Detection of stress corrosion cracking of high-strength steel used in prestressed concrete structures by acoustic emission technique

The stress corrosion cracking (SCC) of high-strength steel used in prestressed concrete structures was studied by acoustic emission technique (AE). A simulated concrete pore (SCP) solution at high-alkaline (pH ≈ 12) contaminated by sulphate, chloride, and thiocyanate ions was used. The evolution of the acoustic activity recorded during the tests shows the presence of several stages related respectively to cracks initiation due to the local corrosion imposed by corrosives species, cracks propagation and steel failure. Microscopic examinations pointed out that the wires exhibited a brittle fracture mode. The cracking was found to propagate in the transgranular mode. The role of corrosives species and hydrogen in the rupture mechanism of high-strength steel was also investigated. This study shows promising results for an potential use in situ of AE for real-time health monitoring of eutectoid steel cables used in prestressed concrete structures.     

Using transmission Kikuchi diffraction to study intergranular stress corrosion cracking in type 316 stainless steels

Transmission Kikuchi diffraction (TKD), also known as transmission-electron backscatter diffraction (t-EBSD) is a novel method for orientation mapping of electron transparent transmission electron microscopy specimen in the scanning electron microscope and has been utilized for stress corrosion cracking characterization of type 316 stainless steels. The main advantage of TKD is a significantly higher spatial resolution compared to the conventional EBSD due to the smaller interaction volume of the incident beam with the specimen.Two 316 stainless steel specimen, tested for stress corrosion cracking in hydrogenated and oxygenated pressurized water reactor chemistry, were characterized via TKD. The results include inverse pole figure (IPFZ) maps, image quality maps and misorientation maps, all acquired in very short time (<60 min) and with remarkable spatial resolution (up to 5 nm step size possible). They have been used in order to determine the location of the open crack with respect to the grain boundary, deformation bands, twinning and slip. Furthermore, TKD has been used to measure the grain boundary misorientation and establish a gauge for quantifying plastic deformation at the crack tip and other regions in the surrounding matrix. Both grain boundary migration and slip transfer have been detected as well.     

Be薄膜应力的X射线掠入射侧倾法分析

由于铍薄膜极易被X射线穿透, 传统的几何模式下很难获得有效的X射线衍射应力分析结果. 本文采用掠入射侧倾法分析SiO₂基底上Be薄膜残余应力, 相比其他衍射几何方法, 提高了衍射的信噪比, 获得的薄膜应力拟合曲线线形较好. 对Be薄膜的不同晶面分析, 残余应力结果相同, 表明其力学性质各向同性; 利用不同掠入射角下X射线的穿透深度不同, 获得应力在深度方向上的分布; 由薄膜面内不同方向的残余应力相同, 确定薄膜处于等双轴应力状态. 关键词： Be薄膜 X射线衍射 应力     

掺杂CVD金刚石薄膜的应力分析

在不同实验条件下，用微波等离子体化学气相沉积(MPCVD)技术在Si基体上制备了S掺杂和B-S共掺杂CVD金刚石薄膜，利用X射线衍射仪和拉曼光谱仪研究掺杂对CVD金刚石薄膜的应力影响.研究结果发现，随着S掺杂浓度的增加，薄膜中sp²杂化碳含量和缺陷增多，CVD金刚石薄膜压应力增加；小尺寸的B原子与大尺寸的S原子共掺杂时，微量B的加入改变了CVD金刚石薄膜的应力状态，共掺杂形成B-S复合体进入金刚石晶体后降低金刚石晶体的晶格畸变程度，减少S原子在晶界上偏聚数量和晶体中非金刚石结构相含量，降低由于杂质、缺陷及sp²杂化碳含量产生的晶格畸变和薄膜压应力，提高晶格完整性. 关键词： 金刚石薄膜 掺杂 应力     

Effect of porosity on the laser induced damage threshold of porous anodic alumina films

Thermal stress of porous alumina films has been simulated by finite element method based on thermal transfer equation and thermal stress formulas. The influence of equivalent thermal conductivity and elastic modulus on laser induced damage threshold (LIDT) has been studied. It was found that the biggest circumferential tensile stress will be small with the porosity from 15% to 35%, and it effectively improves the LIDT. The equivalent thermal conductivity and LIDT decreases with the increase of porosity. The equivalent elastic modulus decreases and LIDT increase with the increase of porosity.     

钛金属应力腐蚀机理电子理论研究

为从理论上揭示钛金属应力腐蚀行为的本质，建立了α钛晶粒及位错塞积形成的微裂纹原子 集团模型，利用递归法(recursion)计算了裂纹及晶粒内的电子结构参量(费米能级、结构能 、表面能、团簇能、环境敏感镶嵌能). 计算结果表明：氢在裂纹处的环境敏感镶嵌能较低 ，易于偏聚在裂纹处，且氢在钛金属裂纹处团簇能为正值不能形成团簇，具有有序化倾向， 趋于形成氢化物. 氢在裂纹处偏聚降低裂纹的表面能，使裂纹容易扩展. 裂纹尖端处费米能 级高于裂纹其他区域，使电子从裂纹尖端流向裂纹其他区域造成电位差，在电解质作用下裂 关键词： 递归法 电子结构 钛 应力腐蚀     

Stress corrosion cracking of alloy C-22 and Ti Gr-12 using double-cantilever-beam technique

Susceptibility to stress corrosion cracking (SCC) of two candidate alloys for the inner container of the multi-barrier nuclear waste package was evaluated by using wedge-loaded precracked double-cantilever-beam (DCB) specimens in deaerated acidic brine (pH≈2.70) at 90°C. Materials tested included Alloy C-22 and Ti Grade-12. Duplicate samples of each material were loaded at different initial stress intensity factor (K_I) values ranging between 22 and 43 MPa√m. Both metallography and the compliance methods were used to determine the final crack length. The final stress intensity for SCC (K_f) was computed from the measured final wedge load and the average crack length. The results indicate that, in general, the final crack lengths measured by metallography and compliance agreed well with one another, thus, providing very similar K_f values. The alloy C-22 showed higher susceptibility to SCC than Ti Grade-12 in terms of the average crack growth. Fractographic evaluation by scanning electron microscopy (SEM) of broken DCB specimens revealed three distinct regions showing the characteristics of fatigue precrack, SCC, and fast fracture.     

Low-energy EDX – A novel approach to study stress corrosion cracking in SUS304 stainless steel via scanning electron microscopy

Intergranular stress corrosion cracking (IGSCC) in type SUS304 stainless steels, tested under pressurized water reactor (PWR) primary water conditions, has been characterized with unprecedented spatial resolution using scanning electron microscopy (SEM) and novel low-energy (∼3 kV) energy dispersive X-ray spectroscopy (EDX). An advancement of the large area silicon drift detector (SDD) has enhanced its sensitivity for X-rays in the low-energy part of the atomic spectrum. Therefore, it was possible to operate the SEM at lower accelerating voltages in order to reduce the interaction volume of the beam with the material and achieve higher spatial resolution and better signal-to-noise ratio. In addition to studying the oxide chemistry at the surface of intergranular stress corrosion cracks, the technique has proven capable of resolving Ni enrichment ahead of some crack tips. Active cracks could be distinguished from inactive ones due to the presence of oxides in the open crack and Ni-rich regions ahead of the crack tip. Furthermore, it has been established that SCC features can be better resolved with low-energy (3 kV) than high-energy (12 kV) EDX. The low effort in sample preparation, execution and data analysis makes SEM the ideal tool for initial characterization and selection of the most important SCC features such as dominant cracks and interesting crack tips, later to be studied by transmission electron microscopy (TEM) and atom probe tomography (APT).     

红外薄膜中热应力的研究

由于红外薄膜材料和基板热膨胀系数显著不同,所以在高温基板上镀膜后降温将产生热应力,进而引起边界分层破裂现象,影响薄膜器件的牢固性.对薄膜厚度、杨氏模量和热膨胀系数对薄膜分层破裂的影响进行了研究,同时分析了薄膜设计对减小分层破裂的作用.这对减小红外薄膜系统因热应力引起的分层破裂现象具有实际应用价值. 关键词： 多层介质薄膜 红外 热应力 分层破裂     

激光冲击对不锈钢焊接接头残余应力场的影响

针对不锈钢焊接接头存在残余应力且分布不均匀、容易发生应力腐蚀的问题,采用激光冲击强化对其进行处理,探究激光功率密度和冲击次数对表面残余应力状态的优化作用,并通过应力腐蚀试验验证优化效果。结果表明：随着功率密度增加,表面残余应力明显下降,但下降幅度逐渐减小,功率密度4.24 GW/cm2与2.83 GW/cm2冲击产生的残余应力相差不大,熔合区还存在残余拉应力,说明高功率密度不足以消除表面残余拉应力;随着冲击次数增加,残余拉应力显著降低,2.83 GW/cm2冲击3次之后,残余拉应力完全消除,局部最高应力梯度从54.7 MPa/mm下降到11.7 MPa/mm,获得了高数值、分布均匀的残余压应力层。激光冲击强化后,焊接试样的应力腐蚀断裂时间提高了33.48%,激光冲击强化产生的残余压应力是其应力腐蚀抗性提高的重要原因。     

Residual stress and Curie temperature of Fe-N thin films prepared by dc magnetron sputtering at elevated temperature

Fe-N thin films were prepared by dc magnetron sputtering at elevated temperature of 80 °C. The residual stress of the thin film was characterized by means of grazing incidence X-ray diffraction method. The effect of magnetron sputtering parameter on residual stress was investigated. The results indicate that the nitrogen content in working gas has great effects on the residual stress in the Fe-N thin film, and the residual stress increases firstly and then decreases with the increasing of nitrogen content in working gas. Curie temperature measurement shows that tensile residual stress enhances the ferromagnetic-paramagnetic transition temperature of Fe-N thin films under the condition of same phase composition.     

Thermal stress induced band gap variation of ZnO thin films

The growth temperature and post annealing-dependent optical and structural effect of RF magnetron sputtered ZnO thin films were examined. As the growth temperature increased, the lattice constant increased and approached the bulk value, suggesting a decrease in interfacial strain between the substrate and thin film. For the post annealed samples, the interfacial strain decreased further and was close to the bulk value regardless of the post annealing environments (in air and O₂). The optical properties of all ZnO thin films examined and revealed higher transparency (>90%). Furthermore, the optical band gap varied according to the growth temperature and post annealing environments due to a decrease in the interfacial strain effect.     

Nd-Fe-B永磁合金腐蚀产物的拉曼光谱研究

本文应用拉曼光谱法,研究了Nd—Fe—B永磁合金在NaCl,NaHSO_4水溶液及大气环境中的腐蚀产物组成及其变化。测定结果表明,Nd—Fe—B合金大气腐蚀产物的主要组成为:Nd(OH)_3,γ—FeOOH,α—FeOOH,Fe_3O_4及B_2O_3,在NaCl溶液中则有NdCl_3生成。在不同PH值的NaHSO_4溶液中,锈层的组成有所变化。据此,对Nd—Fe—B合金的腐蚀过程与机理进行了探讨。     

Electronic and optical properties in ZnO:Ga thin films induced by substrate stress

The effects of biaxial stress in ZnO:Ga thin films on different substrates, e.g., sapphire(0001), quartz, Si(001), and glass have been investigated by X-ray diffraction, atomic force microscopy, and electrical transport and ellipsometric measurements. A strong dependence of orientation, crystallite size, transport, and electronic properties upon the substrate-induced stress has been found. The structural properties indicate that a tensile stress exists in epitaxial ZnO:Ga films grown on sapphire, Si, and quartz, while a compressive stress appears in films grown on glass. The resistivity of the films decreased with increasing biaxial stress, which is inversely proportional to the product of the carrier concentration and Hall mobility. The refractive index n was found to decrease with increasing biaxial stress, while the optical band gap E₀ increased with stress. These behaviors are attributed to lattice contraction and the increase in the carrier concentration that is induced by the stress. Our experimental data suggest that the mechanism of substrate-induced stress is important for understanding the properties of ZnO:Ga thin films and for the fabrication of devices which use these materials.     

Al2O3陶瓷衬底碳离子预注入对金刚石薄膜应力的影响研究

通过对Al2O3陶瓷衬底进行碳离子预注入，大大降低了Al2O3陶瓷衬底上金刚石薄膜的应力，且金刚石薄膜中的压应力随碳离子注入剂量的增加而线性下降.通过对Al2O3陶瓷衬底注入前后的对比分析表明，高能量的碳离子注入Al2O3陶瓷衬底以后，并没有产生过渡层性质的新相，而是大量累积在Al2O3晶格的间隙位，使Al2O3晶格发生畸变.而且，随着碳离子注入剂量的增加，Al2O3基体内晶格畸变加剧，注入层残余压应力也随之上升.当金刚石薄膜沉积以后，在降温的过程中衬底这部分残余应力得到释放，从而部分弛豫了金刚石薄膜中的 关键词： 金刚石薄膜 应力 离子注入 Al2O3陶瓷     

沉积温度对HfO2薄膜残余应力的影响

 用电子束蒸发方法制备了HfO₂薄膜，根据镀膜前后基片曲率半径的变化，用Stoney公式计算了薄膜应力，讨论了沉积温度对薄膜残余应力的影响。结果发现，HfO₂薄膜的残余应力均为张应力，应力值随沉积温度的升高先增大后减小，在280 ℃左右出现极大值。对样品进行了XRD测试，从微观结构上对实验结果进行了分析，发现微结构演变引起的内应力变化是引起薄膜残余应力改变的主要因素，HfO2薄膜在所选沉积温度60~350 ℃内出现了晶态转变，堆积密度随温度升高而增大。     

用横场伊辛模型研究应力对铁电薄膜的热力学性质的影响

用横场伊辛模型研究了铁电薄膜的热力学性质.在体系的哈密顿量中引入一个两维的在平面内的应力，并假设应力从基底材料和薄膜材料之间的界面层到薄膜的表面层是呈指数形式衰减的.结果显示：压应力有利于极化，使居里温度向高温区移动，而张应力对极化和居里温度的影响正好相反.扩散长度对铁电薄膜的热力学性质有很大的影响. 关键词： 铁电薄膜 应力 横场伊辛模型